TI TPA2025D1

YZG
TPA2025D1
SLOS717A – AUGUST 2011 – REVISED FEBRUARY 2012
www.ti.com
2 W Constant Output Power Class-D Audio Amplifier with Class-G Boost Converter and
Battery Tracking AGC
Check for Samples: TPA2025D1
FEATURES
DESCRIPTION
•
The TPA2025D1 is a high efficiency Class-D audio
power amplifier with battery tracking AGC technology
and an integrated Class-G boost converter that
enhances efficiency at low output power. It drives up
to 1.9 W into an 8 Ω speaker (1% THD+N). With 85%
typical efficiency, the TPA2025D1 helps extend
battery life when playing audio.
1
•
•
•
•
•
•
•
Built-In Enhanced Battery Tracking Automatic
Gain Control (AGC)
– Limits Battery Current Consumption
1.9 W into 8 Ω Load from 3.6 V Supply (1%
THD+N)
Integrated Adaptive Boost Converter
– Increases Efficiency at Low Output Power
Low Quiescent Current of 2 mA from 3.6 V
Thermal and Short-Circuit Protection with
Auto Recovery
20 dB Fixed Gain
Similar Performance to TPA2015D1
Available in 1.53 mm × 1.982 mm,
0.5 mm pitch 12-ball WCSP Package
The built-in boost converter generates a 5.75 V
supply voltage for the Class-D amplifier. This
provides a louder audio output than a stand-alone
amplifier directly connected to the battery. The battery
tracking AGC adjusts the Class-D gain to limit battery
current at lower battery voltage.
The TPA2025D1 has an integrated low-pass filter to
improve the RF rejection and reduce DAC
out-of-band noise, increasing the signal-to-noise ratio
(SNR).
APPLICATIONS
•
•
•
The TPA2025D1 is available in a space saving
1.53 mm × 1.982 mm, 0.5 mm pitch WCSP
package (YZG).
Cell Phones
PDA, GPS
Portable Electronics and Speakers
SIMPLIFIED APPLICATION DIAGRAM
2.2 mH
Connected to Supply
2.2 mF
VBAT
+
Audio
Input
-
6.8 mF - 22 mF
PVDD
IN+
BGND
IN-
Enable
SW
TPA2025D1
OUT+
EN
OUT-
AGC
AGC AGND
PGND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2012, Texas Instruments Incorporated
TPA2025D1
SLOS717A – AUGUST 2011 – REVISED FEBRUARY 2012
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTIONAL BLOCK DIAGRAM
EN
Bias
Control
VBAT
SW
VBAT
Monitor
Adaptive
Boost
Converter
PVDD
Oscillator
AGC
PVDD
IN+
+
AGC
PWM
IN-
–
AGND
HBridge
OUT+
OUTPGND
BGND
DEVICE PINOUT
YZG PACKAGE
(TOP VIEW)
2
A1
A2
A3
PVDD
SW
BGND
B1
B2
B3
OUT+
AGC
VBAT
C1
C2
C3
OUT-
EN
IN+
D1
D2
D3
PGND
AGND
IN-
Copyright © 2011–2012, Texas Instruments Incorporated
TPA2025D1
SLOS717A – AUGUST 2011 – REVISED FEBRUARY 2012
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PIN FUNCTIONS
PIN
INPUT/ OUTPUT/
POWER
(I/O/P)
DESCRIPTION
NAME
WCSP
PVDD
A1
O
Boost converter output and Class-D power stage supply voltage.
SW
A2
I
Boost converter switch input; connect boost inductor between VBAT and SW.
BGND
A3
P
Boost converter power ground.
OUT+
B1
O
Positive audio output.
AGC
B2
I
AGC inflection point select. Connect to VDD, GND or Float. Voltage at AGC pin is only
read at device power-up. A power cycle is required to change inflection points.
VBAT
B3
P
Supply voltage.
OUT–
C1
O
Negative audio output.
EN
C2
I
Device enable; set to logic high to enable.
IN+
C3
I
Positive audio input.
PGND
D1
P
Class-D power ground.
AGND
D2
P
Analog ground.
IN–
D3
I
Negative audio input.
ORDERING INFORMATION
PACKAGED DEVICES (1)
PART NUMBER (2)
SYMBOL
12-ball, 1.53 mm × 1.982 mm WSCP
TPA2025D1YZGR
TPA2025D1
12-ball, 1.53 mm × 1.982 mm WSCP
TPA2025D1YZGT
TPA2025D1
TA
–40°C to 85°C
(1)
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
The YZG package is only available taped and reeled. The suffix “R” indicates a reel of 3000, the suffix “T” indicates a reel of 250.
ABSOLUTE MAXIMUM RATINGS
Over operating free–air temperature range, TA= 25°C (unless otherwise noted) (1)
MIN
MAX
UNIT
Supply voltage VBAT
–0.3
6
V
Input Voltage,
VI
–0.3
VBAT + 0.3
V
IN+, IN–
Output continuous total power dissipation
See the Thermal
Information Table
Operating free-air temperature range, TA
–40
85
°C
Operating junction temperature range, TJ
–40
150
°C
Storage temperature range, TSTG
–65
150
°C
Minimum load resistance
3.2
ESD
Protection
(1)
Ω
HBM
2000
V
CDM
500
V
MM
100
V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
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THERMAL INFORMATION
TPA2025D1
THERMAL METRIC (1)
YZG
UNITS
12 PINS
θJA
Junction-to-ambient thermal resistance
97.3
θJC(top)
Junction-to-case(top) thermal resistance
36.7
θJB
Junction-to-board thermal resistance
55.9
ψJT
Junction-to-top characterization parameter
13.9
ψJB
Junction-to-board characterization parameter
49.5
(1)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
Supply voltage, VBAT
2.5
5.2
UNIT
VIH
High–level input voltage, EN
1.3
VIL
Low–level input voltage, EN
0.6
V
TA
Operating free-air temperature
–40
85
°C
TJ
Operating junction temperature
–40
150
°C
MAX
UNIT
V
V
ELECTRICAL CHARACTERISTICS
VBAT = 3.6 V, TA = 25°C, RL = 8 Ω + 33 μH (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VBAT supply voltage range
Class-D supply voltage
range
MIN
EN = VBAT, boost converter active
Boost converter disabled (in bypass mode)
5.75
V
V
V
EN = VBAT = 3.6 V
2.0
5
EN = VBAT = 5.2V
2.5
6
0.2
1
μA
1.3
V
10
ms
IN+, IN–
0.6
Start-up time
4
5.2
2.2
Shutdown quiescent current VBAT = 2.5 V to 5.2 V, EN = GND
Input common-mode
voltage range
5.2
2.5
Supply under voltage
shutdown
Operating quiescent current
TYP
2.5
6
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OPERATING CHARACTERISTICS
VBAT= 3.6 V, EN = VBAT, AGC = GND, TA = 25°C, RL = 8 Ω + 33 μH (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
5.4
5.75
6.4
UNIT
BOOST CONVERTER
PVDD
Boost converter output voltage range
Boost converter input current limit
IBOOST = 0 mA
IBOOST = 700 mA
5.6
Power supply current
Boost converter start-up current limit
fBOOST
V
1800
Boost converter starts up from full shutdown
IL
V
600
Boost converter wakes up from auto-pass through
mode
mA
1000
Boost converter frequency
1.2
MHz
CLASS-D AMPLIFIER
PO
Output power
THD = 1%, VBAT = 2.5 V, f = 1 kHz
1440
THD = 1%, VBAT = 3.0 V, f = 1 kHz
1750
THD = 1%, VBAT = 3.6 V, f = 1 kHz
1900
THD = 1%, VBAT = 2.5 V, f = 1 kHz,
RL = 4 Ω + 33 µH
1460
THD = 1%, VBAT = 3.0 V, f = 1 kHz,
RL = 4 Ω + 33 µH
1800
THD = 1%, VBAT = 3.6 V, f = 1 kHz,
RL = 4 Ω + 33 µH
2280
THD = 1%, VBAT = 3.6 V, f = 1 kHz, 6 dB crest
factor sine burst, no clipping
5.45
mW
VO
Peak output voltage
AV
Voltage gain
20
20.5
dB
|VOOS |
Output offset voltage
2
10
mV
Short-circuit protection threshold
current
2
19.5
Input impedance (per input pin)
AV = 20 dB
RIN
Input impedance in shutdown (per
input pin)
EN = 0 V
ZO
Output impedance in shutdown
24
2
kΩ
2
VRMS
Boost converter auto-pass through
threshold
Class-D output voltage threshold when boost
converter automatically turns on
2
VPK
η
Class-D and boost combined
efficiency
EN
Noise output voltage
Signal-to-noise ratio
275
PO = 1 W, VBAT = 3.6 V
Total harmonic distortion plus
noise (1)
A-weighted
49
Unweighted
65
1.7 W, RL = 8 Ω + 33 µH. A-weighted
97
1.7 W, RL = 8 Ω + 33 µH. Unweighted
95
2 W, RL = 4 Ω + 33 µH. A-weighted
95
(1)
325
kHz
μVRMS
dB
93
PO = 100 mW, f = 1 kHz
0.06%
PO = 500 mW, f = 1 kHz
0.07%
PO = 1.7 W, f = 1 kHz, RL = 8 Ω + 33 µH
0.07%
PO = 2 W, f = 1 kHz, RL = 4 Ω + 33 µH
0.15%
THD+N added to other audio signal
connected at amplifier input during
shutdown
AC-Power supply ripple rejection
(output referred)
300
82%
2 W, RL = 4 Ω + 33 µH. Unweighted
AC PSRR
kΩ
1300
EN = 0 V
Class-D switching frequency
THD+N
A
Maximum input voltage swing
fCLASS-D
SNR
V
0.02%
200 mVPP square ripple, VBAT = 3.8 V, f = 217 Hz
62.5
200 mVPP square ripple, VBAT = 3.8 V, f = 1 kHz
62.5
dB
A-weighted
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OPERATING CHARACTERISTICS (continued)
VBAT= 3.6 V, EN = VBAT, AGC = GND, TA = 25°C, RL = 8 Ω + 33 μH (unless otherwise noted)
PARAMETER
AC CMRR
TEST CONDITIONS
AC-Common mode rejection ratio
(output referred)
MIN
TYP
200 mVPP square ripple, VBAT = 3.8 V, f = 217 Hz
71
200 mVPP square ripple, VBAT = 3.8 V, f = 1 kHz
71
MAX
UNIT
dB
AUTOMATIC GAIN CONTROL
AGC maximum attenuation
10
AGC attenuation resolution
0.5
dB
AGC attack time (gain decrease)
20
µs/dB
AGC release time (gain increase)
1.6
s/dB
7.5
dB/V
Gain vs VBAT slope
VBAT < inflection point
AGC inflection point
(Note: AGC pin voltage is read only
at device power-up. A device power
cycle is required to change AGC
inflection points.)
AGC = Float
3.25
AGC = GND
3.55
AGC = VBAT
3.75
dB
V
TEST SET-UP FOR GRAPHS
6
(1)
The 1 µF input capacitors on IN+ and IN- were shorted for input common-mode voltage measurements.
(2)
A 33 µH inductor was placed in series with the load resistor to emulate a small speaker for efficiency measurements.
(3)
The 30 kHz low-pass filter is required even if the analyzer has an internal low-pass filter. An R-C low-pass filter
(100 Ω, 47 nF) is used on each output for the data sheet graphs.
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TYPICAL CHARACTERISTICS
VBAT = 3.6 V, CI = 1 µF, CBOOST = 22 µF, LBOOST = 2.2 µH, EN = VBAT, and Load = 8 Ω + 33 µH, no ferrite bead unless otherwise
specified.
Figure 1. Output Power vs Supply Voltage
Figure 2. Output Power vs Supply Voltage
Figure 3. Total Supply Current vs Output Power
Figure 4. Total Supply Current vs Output Power
Figure 5. Total Harmonic Distortion + Noise vs Frequency
Figure 6. Total Harmonic Distortion + Noise vs Frequency
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TYPICAL CHARACTERISTICS (continued)
VBAT = 3.6 V, CI = 1 µF, CBOOST = 22 µF, LBOOST = 2.2 µH, EN = VBAT, and Load = 8 Ω + 33 µH, no ferrite bead unless
otherwise specified.
8
Figure 7. Total Harmonic Distortion + Noise vs Output
Power
Figure 8. Total Harmonic Distortion + Noise vs Output
Power
Figure 9. Gain vs Supply Voltage
Figure 10. Gain vs Supply Voltage
Figure 11. Maximum Peak Output Voltage vs Supply
Voltage
Figure 12. Maximum Peak Output Voltage vs Supply
Voltage
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TYPICAL CHARACTERISTICS (continued)
VBAT = 3.6 V, CI = 1 µF, CBOOST = 22 µF, LBOOST = 2.2 µH, EN = VBAT, and Load = 8 Ω + 33 µH, no ferrite bead unless
otherwise specified.
Figure 13. Supply Current vs Supply Voltage
Figure 14. Supply Current vs Supply Voltage
Figure 15. Total Efficiency vs Output Power
Figure 16. Total Efficiency vs Output Power
Figure 17. Total Power Dissipation vs Output Power
Figure 18. Total Power Dissipation vs Output Power
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TYPICAL CHARACTERISTICS (continued)
VBAT = 3.6 V, CI = 1 µF, CBOOST = 22 µF, LBOOST = 2.2 µH, EN = VBAT, and Load = 8 Ω + 33 µH, no ferrite bead unless
otherwise specified.
10
Figure 19. Quiescent Supply Current vs Supply Voltage
Figure 20. Supply Ripple Rejection vs Frequency
Figure 21. Common Mode Rejection Ratio vs Frequency
Figure 22. Input Impedance vs Gain
Figure 23. Boost Startup Current vs Time
Figure 24. A-Weighted Noise vs Frequency
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TYPICAL CHARACTERISTICS (continued)
VBAT = 3.6 V, CI = 1 µF, CBOOST = 22 µF, LBOOST = 2.2 µH, EN = VBAT, and Load = 8 Ω + 33 µH, no ferrite bead unless
otherwise specified.
Figure 25. Startup Timing
Figure 26. Shutdown Timing
Figure 27. EMC Performance Po = 750 mW with 2 Inch Speaker Cable
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BATTERY TRACKING AUTOMATIC GAIN CONTROL (AGC)
TPA2025D1 monitors the battery voltage and automatically reduces the gain when the battery voltage is below a
certain threshold voltage, which is defined as inflection point. Although battery tracking AGC lowers the audio
loudness, it prevents high battery current at end-of-charge battery voltage. The inflection point is selectable at
AGC pin. When the amplifier is turned on, the gain is set according to battery voltage and selected inflection
point.
Figure 28 shows the plot of gain as a function of battery supply voltage. The default slope is 7.5 dB/V. When
battery voltage drops below inflection point by 1 V, AGC reduces the gain by 7.5 dB. For custom slope options
and other AGC settings, contact a Texas Instruments sales representative or distributor. The TPA2025D1 can
only operate at one slope.
Figure 28. Gain vs Battery voltage
Figure 29 shows the operation of AGC in time domain.
Battery Voltage
Inflection point voltage
0.5 dB
Gain
10 µs
Attack Time
20 µs/ dB
Release Time
1.6 s/ dB
Release time counter starts
Phase 1
Phase 2
Phase 3
Phase 4
Phase 5
Phase 6
Phase 7
Phase 8
Zoom -in time scale
Figure 29. Relationship Between Supply Voltage and Gain in Time Domain
Phase 1
Battery discharging normally; supply voltage is above inflection point; audio gain remains at 20 dB.
Phase 2
Battery voltage decreases below inflection point. AGC responses in 10 µs and reduces gain by one
step (0.5 dB)
Phase 3
Battery voltage continues to decrease. AGC continues to reduce gain. The rate of gain decrease is
defined as attack time. TPA2025D1’s attack time is 20 µs/dB.
12
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Phase 4
Battery voltage is constant. AGC stops reducing gain.
Phase 5
Battery voltage decreases suddenly. AGC reduces gain multiple steps. (time scale from this phase
is longer) Release time counter resets every end of attack event.
Phase 6
Release time has elapsed. Battery voltage returns to previous level. AGC increases gain by one
step. TPA2025D1’s release time is 1.6 s/dB
Phase 7
Battery voltage remains constant. AGC continues to increase gain until it reaches steady state gain
value defined in Figure 28.
Phase 8
Battery voltage is recharged to above inflection point. AGC continues to increase gain until it
reaches 20 dB.
BOOST CONVERTER AUTO PASS THROUGH (APT)
The TPA2025D1 consists of an adaptive boost converter and a Class-D amplifier. The boost converter operates
from the supply voltage, VBAT, and generates a higher output voltage PVDD at 5.75 V. PVDD drives the supply
voltage of the Class-D amplifier. This improves loudness over non-boosted solutions. The boost converter has a
“Pass Through” mode in which it turns off automatically and PVDD is directly connected to VBAT through an
internal bypass switch.
The boost converter is adaptive and operates between pass through mode and boost mode depending on the
output audio signal amplitude. When the audio output amplitude exceeds the “auto pass through” (APT)
threshold, the boost converter is activated automatically and goes to boost mode. The transition time from normal
mode to boost mode is less than 3 ms. TPA2025D1’s APT threshold is fixed at 2 Vpk. When the audio output
signal is below APT threshold, the boost converter is deactivated and goes to pass through mode. The adaptive
boost converter maximizes system efficiency in lower audio output level.
The battery AGC is independent of APT threshold. The AGC operates in both boost-active and APT modes.
Figure 30 shows how the adaptive boost converter behaves with a typical audio signal.
spacer
Figure 30. Adaptive Boost Converter with Typical Music Playback
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BOOST CONVERTER COMPONENT SECTION
The critical external components are summarized in the following table:
PARAMETER
TEST CONDITIONS
Boost converter inductor
At 30% rated DC bias current of the inductor
MIN
Boost converter input
capacitor
Boost converter output
capacitor
Working capacitance biased at boost output voltage, if 4.7µH inductor is chosen,
then minimum capacitance is 10 µF
TYP MAX
UNIT
4.7
µH
4.7
10
µF
4.7
22
µF
1.5
2.2
Boost Terms
The following is a list of terms and definitions used in the boost equations found later in this document.
C
Minimum boost capacitance required for a given ripple voltage on PVDD.
L
Boost inductor
fBOOST
Switching frequency of the boost converter.
IPVDD
Current pulled by the Class-D amplifier from the boost converter.
IL
Average current through the boost inductor.
PVDD
Supply voltage for the Class-D amplifier. (Voltage generated by the boost converter output)
VBAT
Supply voltage to the IC.
ΔIL
Ripple current through the inductor.
ΔV
Ripple voltage on PVDD.
Inductor Equations
Inductor current rating is determined by the requirements of the load. The inductance is determined by two
factors: the minimum value required for stability and the maximum ripple current permitted in the application. Use
Equation 1 to determine the required current rating. Equation 1 shows the approximate relationship between the
average inductor current, IL, to the load current, load voltage, and input voltage (IPVDD, PVDD, and VBAT,
respectively). Insert IPVDD, PVDD, and VBAT into Equation 1 and solve for IL. The inductor must maintain at least
90% of its initial inductance value at this current.
PVDD
æ
ö
IL = IPVDD ´ ç
÷
è VBAT ´ 0.8 ø
(1)
Ripple current, ΔIL, is peak-to-peak variation in inductor current. Smaller ripple current reduces core losses in the
inductor and reduces the potential for EMI. Use Equation 2 to determine the value of the inductor, L. Equation 2
shows the relationship between inductance L, VBAT, PVDD, the switching frequency, fBOOST, and ΔIL. Insert the
maximum acceptable ripple current into Equation 2 and solve for L.
VBAT ´ (PVDD - VBAT)
L=
DIL ´ ¦BOOST ´ PVDD
(2)
ΔIL is inversely proportional to L. Minimize ΔIL as much as is necessary for a specific application. Increase the
inductance to reduce the ripple current. Do not use greater than 4.7 μH, as this prevents the boost converter
from responding to fast output current changes properly. If using above 3.3 µH, then use at least 10 µF
capacitance on PVDD to ensure boost converter stability.
The typical inductor value range for the TPA2025D1 is 2.2 μH to 3.3 µH. Select an inductor with less than 0.5 Ω
dc resistance, DCR. Higher DCR reduces total efficiency due to an increase in voltage drop across the inductor.
14
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Table 1. Sample Inductors
L
(µH)
SUPPLIER
COMPONENT CODE
SIZE
(LxWxH mm)
DCR
TYP
(mΩ)
ISAT
MAX
(A)
2.2
Chilisin Electronics Corp.
CLCN252012T-2R2M-N
2.5 x 2.0 x 1.2
105
1.2
2.2
Toko
1239AS-H-2R2N=P2
2.5 x 2.0 x 1.2
96
2.3
2.2
Coilcraft
XFL4020-222MEC
4.0 x 4.0 x 2.15
22
3.5
3.3
Toko
1239AS-H-3R3N=P2
2.5 x 2.0 x 1.2
160
2.0
3.3
Coilcraft
XFL4020-332MEC
4.0 x 4.0 x 2.15
35
2.8
C RANGE
4.7 - 22 µF / 16 V
6.8 - 22 µV / 10 V
10 - 22 µF / 10 V
Boost Converter Capacitor Selection
The value of the boost capacitor is determined by the minimum value of working capacitance required for stability
and the maximum voltage ripple allowed on PVDD in the application. Working capacitance refers to the available
capacitance after derating the capacitor value for DC bias, temperature, and aging. Do not use any component
with a working capacitance less than 4.7 µF. This corresponds to a 4.7 μF/16 V capacitor, or a 6.8 μF/10 V
capacitor.
Do not use above 22 μF capacitance as it will reduce the boost converter response time to large output current
transients.
Equation 3 shows the relationship between the boost capacitance, C, to load current, load voltage, ripple voltage,
input voltage, and switching frequency (IPVDD, PVDD, ΔV, VBAT, and fBOOST respectively).
Insert the maximum allowed ripple voltage into Equation 3 and solve for C. The 1.5 multiplier accounts for
capacitance loss due to applied dc voltage and temperature for X5R and X7R ceramic capacitors.
I
´ (PVDD - VBAT)
C = 1.5 ´ PVDD
DV ´ ¦BOOST ´ PVDD
(3)
COMPONENTS LOCATION AND SELECTION
Decoupling Capacitors
The TPA2025D1 is a high-performance Class-D audio amplifier that requires adequate power supply decoupling.
Adequate power supply decoupling to ensures that the efficiency is high and total harmonic distortion (THD) is
low.
Place a low equivalent-series-resistance (ESR) ceramic capacitor, typically 0.1 µF, within 2 mm of the VBAT ball.
This choice of capacitor and placement helps with higher frequency transients, spikes, or digital hash on the line.
Additionally, placing this decoupling capacitor close to the TPA2025D1 is important, as any parasitic resistance
or inductance between the device and the capacitor causes efficiency loss. In addition to the 0.1 μF ceramic
capacitor, place a 2.2 µF to 10 µF capacitor on the VBAT supply trace. This larger capacitor acts as a charge
reservoir, providing energy faster than the board supply, thus helping to prevent any droop in the supply voltage.
Input Capacitors
Input audio DC decoupling capacitors are recommended. The input audio DC decoupling capacitors prevents the
AGC from changing the gain due to audio DAC output offset. The input capacitors and TPA2025D1 input
impedance form a high-pass filter with the corner frequency, fC, determined in Equation 4.
Any mismatch in capacitance between the two inputs will cause a mismatch in the corner frequencies. Severe
mismatch may also cause turn-on pop noise. Choose capacitors with a tolerance of ±10% or better.
1
fc =
(2 x p x RICI )
(4)
SHORT CIRCUIT AUTO-RECOVERY
When a short circuit event happens, the TPA2025D1 goes to low duty cycle mode and tries to reactivate itself
every 1.6 seconds. This auto-recovery continues until the short circuit event stops. This feature protects the
device without affecting its long term reliability.
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15
TPA2025D1
SLOS717A – AUGUST 2011 – REVISED FEBRUARY 2012
www.ti.com
THERMAL PROTECTION
It is important to operate the TPA2025D1 at temperatures lower than its maximum operating temperature. The
maximum ambient temperature depends on the heat-sinking ability of the PCB system. Given θJA of 97.3°C/W,
the maximum allowable junction temperature of 150°C, and the internal dissipation of 0.5 W for 1.9 W, 8 Ω load,
3.6 V supply, the maximum ambient temperature is calculated as:
TA,MAX = TJ,MAX – θJA PD = 150°C – (97.3°C/W × 0.5W) = 101.4°C
The calculated maximum ambient temperature is 101.4°C at maximum power dissipation at 3.6 V supply and 8 Ω
load. The TPA2025D1 is designed with thermal protection that turns the device off when the junction temperature
surpasses 150°C to prevent damage to the IC.
OPERATION WITH DACS AND CODECS
Large noise voltages can be present at the output of ΔΣ DACs and CODECs, just above the audio frequency
(e.g: 80 kHz with a 300 mVP-P). This out-of-band noise is due to the noise shaping of the delta-sigma modulator
in the DAC. Some Class-D amplifiers have higher output noise when used in combination with these DACs and
CODECs. This is because out-of-band noise from the CODEC/DAC mixes with the Class-D switching
frequencies in the audio amplifier input stage. The TPA2025D1 has a built-in low-pass filter with cutoff frequency
at 55 kHz that reduces the out-of-band noise and RF noise, filtering out-of-band frequencies that could degrade
in-band noise performance. This built-in filter also prevents AGC errors due to out-of-band noise. The
TPA2025D1 AGC calculates gain based on input signal amplitude only. If driving the TPA2025D1 input with
4th-order or higher ΔΣ DACs or CODECs, add an R-C low pass filter at each of the audio inputs (IN+ and IN-) of
the TPA2025D1 to ensure best performance. The recommended resistor value is 100 Ω and the capacitor value
of 47 nF.
SPEAKER LOAD LIMITATION
Speakers are non-linear loads with varying impedance (magnitude and phase) over the audio frequency. A
portion of speaker load current can flow back into the boost converter output via the Class-D output H-bridge
high-side device. This is dependent on the speaker's phase change over frequency, and the audio signal
amplitude and frequency content. Most portable speakers have limited phase change at the resonant frequency,
typically no more than 40 or 50 degrees. To avoid excess flow-back current, use speakers with limited phase
change. Otherwise, flow-back current could drive the PVDD voltage above the absolute maximum recommended
operational voltage.
Confirm proper operation by connecting the speaker to the TPA2025D1 and driving it at maximum output swing.
Observe the PVDD voltage with an oscilloscope. In the unlikely event the PVDD voltage exceeds 6.5 V, add a
6.8 V Zener diode between PVDD and ground to ensure the TPA2025D1 operates properly. The amplifier has
thermal overload protection and deactivates if the die temperature exceeds 150°C. It automatically reactivates
once die temperature returns below 150°C. Built-in output over-current protection deactivates the amplifier if the
speaker load becomes short-circuited. The amplifier automatically restarts 1.6 seconds after the over-current
event. Although the TPA2025D1 Class-D output can withstand a short between OUT+ and OUT-, do not connect
either output directly to GND, VDD, or VBAT as this could damage the device.
PACKAGE DIMENSIONS
The TPA2025D1 uses a 12-ball, 0.5 mm pitch WCSP package. The die length (D) and width (E) correspond to
the package mechanical drawing at the end of the datasheet.
Table 2. TPA2025D1 YZG Package Dimensions
16
Dimension
D
E
Max
2012 µm
1560 µm
Typ
1982 µm
1530 µm
Min
1952 µm
1500 µm
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Product Folder Link(s): TPA2025D1
TPA2025D1
SLOS717A – AUGUST 2011 – REVISED FEBRUARY 2012
www.ti.com
BOARD LAYOUT
TPA2025D1 has AGND, BGND and PGND for analog circuit, boost converter and Class-D amplifier respectively.
These three ground pins should be connected together through a solid ground plane with multiple ground VIAs.
In making the pad size for the WCSP balls, it is recommended that the layout use non-solder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 31 shows the appropriate diameters for a WCSP layout.
show a typical 4-layer PCB layout example used in the Mini EVM.
Copper Trace Width
Solder Pad Width
Solder Mask Opening
Copper Trace Thickness
Solder Mask Thickness
M0200-01
Figure 31. Land Pattern Dimensions
Table 3. Land Pattern Dimensions (1)
SOLDER PAD
DEFINITIONS
COPPER
PAD
Nonsolder mask
defined (NSMD)
275 μm
(+0.0, -25 μm)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
SOLDER MASK
OPENING
(5)
375 μm (+0.0, -25 μm)
(2) (3) (4)
COPPER
THICKNESS
STENCIL (6) (7)
OPENING
STENCIL
THICKNESS
1 oz max (32 μm)
275 μm x 275 μm Sq.
(rounded corners)
125 μm thick
Circuit traces from NSMD defined PWB lands should be 75 μm to 100 μm wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
Recommend solder paste is Type 3 or Type 4.
For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.
Solder mask thickness should be less than 20 μm on top of the copper circuit pattern
Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
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17
TPA2025D1
SLOS717A – AUGUST 2011 – REVISED FEBRUARY 2012
www.ti.com
REVISION HISTORY
NOTE: Page numbers of current version may differ from previous versions.
Changes from Original (August 2011) to Revision A
Page
•
Changed Operating quiescent current TYP value from "3.5" to "2.0" for VBAT = 3.6 V; and, TYP value from "4" to
2.5" for VBAT = 5.2 V ........................................................................................................................................................... 4
•
Changed Shutdown quiescent current MAX value from "3" to "1" ....................................................................................... 4
•
Changed from "110 ms" to "1.6 seconds" in the SHORT CIRCUIT AUTO-RECOVERY description. ............................... 15
•
Changed from "within 200 ms" to "1.6 seconds" in the SPEAKER LOAD LIMITATION description. ................................. 16
18
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Product Folder Link(s): TPA2025D1
PACKAGE OPTION ADDENDUM
www.ti.com
31-Mar-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPA2025D1YZGR
ACTIVE
DSBGA
YZG
12
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPA2025D1YZGT
ACTIVE
DSBGA
YZG
12
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Feb-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPA2025D1YZGR
DSBGA
YZG
12
3000
180.0
8.4
TPA2025D1YZGT
DSBGA
YZG
12
250
180.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.63
2.08
0.69
4.0
8.0
Q1
1.63
2.08
0.69
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Feb-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPA2025D1YZGR
DSBGA
YZG
12
3000
210.0
185.0
35.0
TPA2025D1YZGT
DSBGA
YZG
12
250
210.0
185.0
35.0
Pack Materials-Page 2
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