DIODES ZXTP4003GTA

A Product Line of
Diodes Incorporated
ZXTP4003G
100V PNP LED DRIVING TRANSISTOR IN SOT223
Features
Mechanical Data
•
•
•
•
•
•
•
•
BVCEO > -100V
Maximum continuous current IC = -1A
hFE > 100 @ IC = -150mA, VCE = -0.2V
Lead Free, RoHS Compliant (Note 1)
Halogen and Antimony Free "Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
•
•
•
Case: SOT223
Case material: Molded Plastic. “Green” Molding Compound.
UL Flammability Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish
Weight: 0.112 grams (Approximate)
Applications
•
LED TV backlight
SOT223
C
B
E
Top View
Device Symbol
Top View
Pin-Out
Ordering Information
Product
ZXTP4003GTA
Notes:
Marking
ZXTP4003
Reel size (inches)
7
Tape width (mm)
12
Quantity per reel
1,000
1. No purposefully added lead.
2. “Green” devices, Halogen and Antimony Free, Diodes Inc’s “Green” Policy can be found on our website at http://www.diodes.com
Marking Information
ZXTP
4003
ZXTP4003G
Datasheet Number: DS35459 Rev 1 - 2
ZXTP4003 = Product type Marking Code
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A Product Line of
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ZXTP4003G
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Current (Note 4)
Base Current
Symbol
VCBO
VCEO
VEBO
IC
ICM
IB
Value
-100
-100
-7
-1
-3
-500
Unit
V
V
V
A
A
mA
Value
2
62.5
28.75
-55 to +150
Unit
W
°C/W
°C/W
°C
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Power Dissipation (Note 3)
Thermal Resistance, Junction to Ambient (Note 3)
Thermal Resistance, Junction to Leads (Note 5)
Operating and Storage Temperature Range
Notes:
Symbol
PD
RθJA
RθJL
TJ, TSTG
3. For a device surface mounted on 25mm X 25mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions
4. Measured under pulsed conditions. Pulse width = 300µs. Duty cycle ≤ 2%.
5. Thermal resistance from junction to solder-point (on the exposed collector pad).
Thermal Characteristics and Derating Information
T amb=25°C
60
50
40
D=0.5
30
20
Single Pulse
D=0.2
D=0.05
10
D=0.1
0
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Max Power Dissipation (W)
Thermal Resistance (°C/W)
70
2.0
1.6
1.2
0.8
0.4
0.0
0
40
60
80
100 120 140 160
Temperature (°C)
Derating Curve
Transient Thermal Impedance
Maximum Power (W)
20
Single Pulse
T amb=25°C
100
10
1
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Pulse Power Dissipation
ZXTP4003G
Datasheet Number: DS35459 Rev 1 - 2
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A Product Line of
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ZXTP4003G
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Collector-Emitter Breakdown Voltage (Note 6)
Collector Cut-off Current
Emitter Cut-off Current
Symbol
BVCEO
ICBO
IEBO
Static Forward Current Transfer Ratio (Note 6)
hFE
Base-Emitter Turn-On Voltage (Note 6)
Delay Time
Rise Time
Storage Time
Fall Time
Storage Time
Fall Time
Notes:
Min
-100
60
100
-
VBE(on)
t(d)
t(r)
t(s)
t(f)
t(s)
t(f)
Typ
-170
133
112
-0.71
378
388
1348
382
75
363
Max
-50
-50
Unit
V
nA
nA
-
-
-
-0.95
-
V
ns
ns
ns
ns
ns
ns
Test Condition
IC = -10mA
VCB = -100V
VEB = -7V
IC = -85mA, VCE = -0.15V
IC = -150mA, VCE = -0.2V
IC = -150mA, VCE = -0.2V
VCC = -80V, IC = -150mA,
-IB2 = 1.5mA, VCE(ON) = -0.2V
VCC = -80V, IC = -150mA,
-IB2 = 1.5mA, VCE(ON) = -4V
6. Measured under pulsed conditions. Pulse width = 300µs. Duty cycle ≤ 2%
Electrical Characteristics @TA = 25°C unless otherwise specified
1.0
400
300
VCE= -0.2V
125°C
-55°C
VCE= -0.2V
25°C
0.8
85°C
-VBE(on) (V)
Typical Gain (hFE)
500
25°C
200
-55°C
100
0
100µ
0.6
0.4
125°C
85°C
1m
10m
100m
0.2
100µ
1
-IC Collector Current (A)
1m
10m
100m
1
-IC Collector Current (A)
hFE v IC
VBE(on) v IC
Capacitance (pF)
50
f = 1MHz
40
30
20
Cobo
10
0
100m
1
10
100
-Voltage(V)
Capacitance v Voltage
ZXTP4003G
Datasheet Number: DS35459 Rev 1 - 2
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© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXTP4003G
Package Outline Dimensions
SOT223
Dim Min Max Typ
A
1.55 1.65 1.60
A1 0.010 0.15 0.05
b1
2.90 3.10 3.00
b2
0.60 0.80 0.70
C
0.20 0.30 0.25
D
6.45 6.55 6.50
E
3.45 3.55 3.50
E1
6.90 7.10 7.00
e
—
—
4.60
e1
—
—
2.30
L
0.85 1.05 0.95
Q
0.84 0.94 0.89
All Dimensions in mm
A
A1
Suggested Pad Layout
X1
Y1
C1
Y2
Dimensions
X1
X2
Y1
Y2
C1
C2
Value (in mm)
3.3
1.2
1.6
1.6
6.4
2.3
C2
X2
ZXTP4003G
Datasheet Number: DS35459 Rev 1 - 2
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December 2011
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXTP4003G
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
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hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
ZXTP4003G
Datasheet Number: DS35459 Rev 1 - 2
5 of 5
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December 2011
© Diodes Incorporated