TI TPS22908

TPS22908
www.ti.com
SLVSBI7A – JULY 2012 – REVISED AUGUST 2012
Ultra Small, Low-Input Voltage, Low RON Load Switch
Check for Samples: TPS22908
FEATURES
APPLICATIONS
•
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1
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Low Input Voltage: 1.0 V to 3.6 V
Ultra-Low ON-State Resistance (RON)
– RON = 28 mΩ at VIN = 3.6 V
– RON = 33 mΩ at VIN = 2.5 V
– RON = 42 mΩ at VIN = 1.8 V
– RON = 70 mΩ at VIN = 1.2 V
1-A Maximum Continuous Switch Current
Quiescent Current <1 µA
Shutdown Current <1 µA
Low Control Input Thresholds Enable Use of
Low-Voltage Logic
Controlled Slew Rate to Avoid Inrush Currents
Ultra Small CSP-4 Package 0.9 mm × 0.9 mm,
0.5-mm Pitch, 0.5-mm Height
Quick Output Discharge (QOD)
Battery Powered Equipment
Portable Industrial Equipment
Portable Medical Equipment
Portable Media Players
Point of Sales Terminal
GPS Devices
Digital Cameras
Portable Instrumentation
Smartphones / Tablets
Power
Supply
VOUT
VIN
ON
CIN
CL
ON
RL
OFF
TPS22908
GND
GND
Figure 1. Typical Application
DESCRIPTION
The TPS22908 is an ultra small, low RON load switch with controlled turn on. The device contains a P-channel
MOSFET that operates over an input voltage range of 1.0 V to 3.6 V. The switch is controlled by an on/off input
(ON), which is capable of interfacing directly with low-voltage control signals.
The TPS22908 is available in a space-saving 4-terminal WCSP with 0.5-mm pitch (YZT). The device is
characterized for operation over the free-air temperature range of –40°C to 85°C.
FEATURE LIST
(1)
DEVICE
RON (typical)
AT 3.6 V
RISE TIME (typical)
AT 3.6 V
QUICK OUTPUT
DISCHARGE (1)
MAXIMUM
CURRENT
ENABLE
TPS22908
28 mΩ
105 µs
Yes
1000 mA
Active high
This feature discharges the output of the switch to ground through an 80-Ω resistor, preventing the output from floating.
ORDERING INFORMATION
TA
–40°C to 85°C
PACKAGE
4-YZT
ORDERABLE PART NUMBER
Reel of 250
TPS22908YZTT
Tape of 3000
TPS22908YZTR
TOP MARKING
AT
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
TPS22908
SLVSBI7A – JULY 2012 – REVISED AUGUST 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted) (1)
VALUE
UNIT (2)
VIN
Supply voltage range
–0.3 to 4
V
VOUT
Output voltage range
–0.3 to (VIN + 0.3)
V
VON
Input voltage range
–0.3 to 4
V
IMAX
Maximum Continuous Switch Current for VIN >= 1.2V
1000
Maximum Continuous Switch Current at VIN = 1.0V
600
TA
Operating free-air temperature range (3)
TJ
Maximum junction temperature
TSTG
Storage temperature range
TLEAD
Maximum lead temperature (10-s soldering time)
ESD
Electrostatic discharge
protection
(1)
(2)
(3)
mA
–40 to 85
°C
125
°C
–65 to 150
°C
300
°C
Human-Body Model (HBM)
2000
Charged-Device Model (CDM)
1000
V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)],
the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max))
THERMAL INFORMATION
THERMAL METRIC (1) (2)
TPS22908
YZT (4 PINS)
ΘJA
Junction-to-ambient thermal resistance
ΘJC(top)
Junction-to-case(top) thermal resistance
2
ΘJB
Junction-to-board thermal resistance
33
ΨJT
Junction-to-top characterization parameter
9.1
ΨJB
Junction-to-board characterization parameter
33
ΘJC(bottom)
Junction-to-case(bottom) thermal resistance
N/A
(1)
(2)
UNITS
188
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953
For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
1.0
3.6
V
ON voltage range
0
3.6
V
VOUT
Output voltage range
0
VIN
V
VIH
High-level input voltage, ON
0.85
3.6
V
VIL
Low-level input voltage, ON
0
0.4
CIN
Input capacitor
VIN
Input voltage range
VON
(1)
2
1 (1)
UNIT
V
µF
Refer to application section.
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ELECTRICAL CHARACTERISTICS
Unless otherwise noted the specification applies over the operating ambient temp –40°C ≤ TA ≤ 85°C. Typical values are for
VIN = 3.6V, and TA = 25°C unless otherwise noted.
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX
UNIT
POWER SUPPLIES AND CURRENTS
IIN
Quiescent current
IOUT = 0, VIN = VON
Full
0.19
1
µA
IIN(OFF)
OFF-state supply current
VON = GND, VOUT = Open
Full
0.12
1
µA
IIN(LEAK)
OFF-state supply current
VON = GND, VOUT = 0 V
Full
0.12
1
µA
ION
ON pin input leakage current
VON = 1.1 V to 3.6 V
Full
0.01
0.1
µA
25°C
28.2
32.1
RESISTANCE AND SWITCH CHARACTERISTICS
VIN = 3.6 V
VIN = 2.5 V
RON
ON-state resistance
IOUT = –200 mA
VIN = 1.8 V
VIN = 1.2 V
VIN = 1.0 V
RPD
Output pulldown resistance
VIN = 3.3V, VON = GND, IOUT = 30 mA
Full
25°C
34.9
33.1
Full
25°C
40.6
41.5
Full
25°C
69.7
87.3
91.2
112
Full
25°C
50.3
54.0
Full
25°C
37.5
155
156
80
100
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mΩ
mΩ
mΩ
mΩ
mΩ
Ω
3
TPS22908
SLVSBI7A – JULY 2012 – REVISED AUGUST 2012
www.ti.com
SWITCHING CHARACTERISTIC MEASUREMENT INFORMATION
VIN
VOUT
CIN = 1µF
ON
+
-
CL
ON
(A)
RL
OFF
GND
TPS22908
GND
GND
TEST CIRCUIT
VON
50%
50%
tOFF
tON
VOUT
50%
tf
tr
90%
VOUT
50%
10%
90%
10%
t ON/t OFF WAVEFORMS
A.
Rise and fall times of the control signal is 100 ns.
Figure 2. Test Circuit and tON/tOFF Waveforms
SWITCHING CHARACTERISTICS
PARAMETER
TEST CONDITION
TPS22908
MIN
TYP
MAX
UNIT
VIN = 3.6 V, TA = 25°C (unless otherwise noted)
tON
Turn-ON time
RL=10 Ω, CL = 0.1 µF
tOFF
Turn-OFF time
RL=10 Ω, CL = 0.1 µF
5
tR
VOUT Rise time
RL=10 Ω, CL = 0.1 µF
105
tF
VOUT Fall time
RL=10 Ω, CL = 0.1 µF
2
493
110
µs
VIN = 1.0 V, TA = 25°C (unless otherwise noted)
tON
Turn-ON time
RL=10 Ω, CL = 0.1 µF
tOFF
Turn-OFF time
RL=10 Ω, CL = 0.1 µF
7
tR
VOUT Rise time
RL=10 Ω, CL = 0.1 µF
442
tF
VOUT Fall time
RL=10 Ω, CL = 0.1 µF
2
4
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µs
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SLVSBI7A – JULY 2012 – REVISED AUGUST 2012
FUNCTIONAL BLOCK DIAGRAM and PINOUT DESCRIPTION
VIN
ON
Control
Logic
VOUT
GND
Figure 3. Functional Block Diagram
YZT PACKAGE
B
B
A
A
2
1
Laser Marking View
1 2
Bump View
Table 1. FUNCTIONAL TABLE
ON
VIN to VOUT
VOUT to GND
L
Off
On
H
On
Off
PIN DESCRIPTIONS
TPS22908
YZT
PIN NAME
B2
ON
B1
GND
A2
VIN
A1
VOUT
DESCRIPTION
Switch control input, active high. Do not leave floating.
Ground
Switch input, bypass this input with an optional ceramic capacitor to ground. See Application Information.
Switch output
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SLVSBI7A – JULY 2012 – REVISED AUGUST 2012
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TYPICAL DC CHARACTERISTICS
VIN vs. QUIESCENT CURRENT (IIN)
VIN vs. IIN(LEAK)
0.35
0.25
25C
−40C
85C
25C
−40C
85C
0.3
0.2
VON = GND, VOUT = 0V
IIN_LEAK (µA)
0.25
IIN (µA)
0.15
0.1
0.2
0.15
0.1
0.05
0.05
VOUT = Open, VIN = VON
0
1
1.5
2
2.5
VIN (V)
3
3.5
0
4
1
1.5
2
2.5
VIN (V)
3
3.5
4
G003
G004
Figure 4.
Figure 5.
VIN vs. IIN(OFF)
TEMPERATURE vs. RON
120
0.35
25C
−40C
85C
0.3
100
VON = GND, VOUT = Open
0.25
Ron (mOhm)
IIN_OFF (µA)
80
0.2
0.15
60
40
0.1
20
0.05
IOUT = −200mA
0
1
1.5
2
2.5
VIN (V)
3
3.5
4
0
−40
−15
Vin = 1V
Vin = 1.2V
Vin = 1.8V
10
35
Temperature (°C)
G005
Figure 6.
6
Vin = 2.5V
Vin = 3.3V
Vin = 3.6V
60
85
G002
Figure 7.
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SLVSBI7A – JULY 2012 – REVISED AUGUST 2012
TYPICAL DC CHARACTERISTICS (continued)
RON vs. Load Current
(Various VIN @ TA = 25°C)
VIN vs. RON
120
140
25C
−40C
85C
100
Temp = 25C
VIN = 1.0V
VIN = 1.2V
VIN = 1.8V
VIN = 2.5V
VIN = 3.6V
130
120
110
100
Ron (mOhm)
RON (mΩ)
80
60
40
90
80
70
60
50
20
40
30
IOUT = −200mA
0
0.5
1
1.5
2
2.5
Vin (V)
3
3.5
20
4
0
0.1
0.2
0.3
0.4 0.5 0.6
Load Current (A)
0.7
0.8
0.9
G001
1
G001
Figure 8.
Figure 9.
IOUT vs. RPD
VIN vs. RPD
120
100
25C
−40C
85C
25C
−40C
85C
110
90
100
RPD (Ω)
RPD (Ω)
80
70
90
80
70
60
60
VIN = 3.6V
IOUT = 1mA
50
0
5
10
15
IOUT (mA)
20
25
30
50
1
1.5
2
2.5
Vin (V)
3
3.5
G006
Figure 10.
4
G007
Figure 11.
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TYPICAL DC CHARACTERISTICS (continued)
VON threshold vs. VOUT
(ON pin voltage increasing)
4
4
3
3
2
2
VOUT (V)
VOUT (V)
VON threshold vs. VOUT
(ON pin voltage decreasing)
1
1
0
0
25C, Falling Edge
−1
0
0.6
1.2
Vin = 1V
Vin = 1.2V
Vin = 1.8V
1.8
VON (V)
2.4
Vin = 2.5V
Vin = 3.3V
Vin = 3.6V
3
25C, Rising Edge
3.6
−1
0
0.6
1.2
Vin = 1V
Vin = 1.2V
Vin = 1.8V
1.8
VON (V)
G009
Figure 12.
8
2.4
Vin = 2.5V
Vin = 3.3V
Vin = 3.6V
3
3.6
G008
Figure 13.
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SLVSBI7A – JULY 2012 – REVISED AUGUST 2012
TYPICAL AC CHARACTERISTICS
RISE TIME vs. TEMPERATURE
(VIN = 3.6V)
RISE TIME vs. TEMPERATURE
(VIN = 1.0V)
120
600
115
550
110
tR (µs)
tR (µs)
500
105
450
100
400
95
VIN = 3.6V, CL = 0.1uF, RL = 10Ohm
90
−40
−15
10
35
Temperature (°C)
VIN = 1V, CL = 0.1uF, RL = 10Ohm
60
350
−40
85
−15
10
35
Temperature (°C)
60
G013
G018
Figure 14.
Figure 15.
FALL TIME vs. TEMPERATURE
(VIN = 3.6V)
FALL TIME vs. TEMPERATURE
(VIN = 1.0V)
2.5
2.3
2.3
2.1
2.1
tF (µs)
2.5
tF (µs)
85
1.9
1.9
1.7
1.7
VIN = 3.6V, CL = 0.1uF, RL = 10Ohm
1.5
−40
−15
10
35
Temperature (°C)
VIN = 1V, CL = 0.1uF, RL = 10Ohm
60
85
1.5
−40
−15
10
35
Temperature (°C)
60
G024
Figure 16.
85
G019
Figure 17.
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TYPICAL AC CHARACTERISTICS (continued)
TURN-ON TIME vs. TEMPERATURE
(VIN = 3.6V)
TURN-ON TIME vs. TEMPERATURE
(VIN = 1.0V)
130
600
120
550
tON (µs)
650
tON (µs)
140
110
500
100
450
VIN = 3.6V, CL = 0.1uF, RL = 10Ohm
90
−40
−15
10
35
Temperature (°C)
VIN = 1V, CL = 0.1uF, RL = 10Ohm
60
400
−40
85
−15
10
35
Temperature (°C)
60
G001
G006
Figure 18.
Figure 19.
TURN-OFF TIME vs. TEMPERATURE
(VIN = 3.6V)
TURN-OFF TIME vs. TEMPERATURE
(VIN = 1.0V)
8
16
6
12
tOFF (µs)
20
tOFF (µs)
10
4
8
2
4
VIN = 3.6V, CL = 0.1uF, RL = 10Ohm
0
−40
−15
10
35
Temperature (°C)
VIN = 1V, CL = 0.1uF, RL = 10Ohm
60
85
0
−40
−15
10
35
Temperature (°C)
G012
Figure 20.
10
85
60
85
G007
Figure 21.
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TYPICAL AC CHARACTERISTICS (continued)
RISE TIME vs. VIN
(CL = 0.1µF)
RISE TIME vs. VIN
(CL = 1µF)
800
800
CL = 0.1uF, RL = 10Ohm, VON=1.8V
25C
−40C
85C
600
600
500
500
400
400
300
300
200
200
100
100
0
1
1.5
2
2.5
Vin (V)
3
25C
−40C
85C
700
tR (µs)
tR (µs)
700
CL = 1uF, RL = 10Ohm, VON=1.8V
0
3.5
1
1.5
2
2.5
Vin (V)
3
G025
Figure 22.
3.5
G026
Figure 23.
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TYPICAL AC SCOPE CAPTURES AT TA = 25°C
12
TURN-ON RESPONSE TIME
(VIN = 3.6V, CIN = 10µF, CL = 1µF, RL = 10Ω)
TURN-ON RESPONSE TIME
(VIN = 1.0V, CIN = 10µF, CL = 1µF, RL = 10Ω)
Figure 24.
Figure 25.
TURN-ON RESPONSE TIME
(VIN = 3.6V, CIN = 1µF, CL = 0.1µF, RL = 10Ω)
TURN-ON RESPONSE TIME
(VIN = 1.0V, CIN = 1µF, CL = 0.1µF, RL = 10Ω)
Figure 26.
Figure 27.
TURN-OFF RESPONSE TIME
(VIN = 3.6V, CIN = 10µF, CL = 1µF, RL = 10Ω)
TURN-OFF RESPONSE TIME
(VIN = 1.0V, CIN = 10µF, CL = 1µF, RL = 10Ω)
Figure 28.
Figure 29.
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TYPICAL AC SCOPE CAPTURES AT TA = 25°C (continued)
(VIN
TURN-OFF RESPONSE TIME
= 3.6V, CIN = 1µF, CL = 0.1µF, RL = 10Ω)
TURN-OFF RESPONSE TIME
(VIN = 1.0V, CIN = 1µF, CL = 0.1µF, RL = 10Ω)
Figure 30.
Figure 31.
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APPLICATION INFORMATION
ON/OFF CONTROL
The ON pin controls the state of the switch. Asserting ON high enables the switch. ON is active high and has a
low threshold making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard
GPIO logic threshold. It can be used with any microcontroller with 1.2-V or higher GPIOs.
INPUT CAPACITOR (OPTIONAL)
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor can be placed between VIN and GND. A 1-µF ceramic
capacitor, CIN, placed close to the pins, is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop during high-current application. When switching heavy loads, it is recommended to have an
input capacitor about 10 times higher than the output capacitor to avoid excessive voltage drop.
OUTPUT CAPACITOR (OPTIONAL)
Due to the integrated body diode of the PMOS switch, a CIN greater than CL is highly recommended. A CL
greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current
flow through the body diode from VOUT to VIN. A CIN to CL ratio of at least 10 to 1 is recommended for minimizing
VIN dip caused by inrush currents during startup; however, a 10 to 1 ratio for capacitance is not required for
proper functionality of the device. A ratio smaller than 10 to 1 (such as 1 to 1) could cause slightly more VIN dip
upon turn due to inrush currents.
BOARD LAYOUT
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects
along with minimizing the case to ambient thermal impedance.
14
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PACKAGE OPTION ADDENDUM
www.ti.com
6-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPS22908YZTR
ACTIVE
DSBGA
YZT
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS22908YZTT
ACTIVE
DSBGA
YZT
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPS22908YZTR
DSBGA
YZT
4
3000
180.0
8.4
TPS22908YZTT
DSBGA
YZT
4
250
180.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
0.99
0.99
0.69
4.0
8.0
Q1
0.99
0.99
0.69
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Aug-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS22908YZTR
DSBGA
YZT
4
3000
210.0
185.0
35.0
TPS22908YZTT
DSBGA
YZT
4
250
210.0
185.0
35.0
Pack Materials-Page 2
D: Max = 0.918 mm, Min =0.858 mm
E: Max = 0.918 mm, Min =0.858 mm
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