SMD MOSFET Formosa MS FMS2301 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2~ 3 Rating and characteristic curves........................................................ 4~ 5 Pinning information........................................................................... 6 Marking........................................................................................... 6 Suggested solder pad layout............................................................. 6 Packing information.......................................................................... 7 Reel packing.................................................................................... 8 Suggested thermal profiles for soldering processes............................. 8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date DS-231129 2009/02/10 2011/07/21 Revision C Page. 8 SMD MOSFET Formosa MS FMS2301 Package outline 20V P-Channel Enhancement Mode MOSFET SOT-23 GS DS(ON) GS 0.020 (0.50) DS(ON) .084(2.10) .068(1.70) 0.120 (3.04) 0.110 (2.80) DS(ON) (B) 0.012 (0.30) 0.045 (1.15) •R ≦110mΩ@V =-4.5V •R ≦150mΩ@V =-2.5V • Super high density cell design for extremely low R • In compliance with EU RoHS 2002/95/EC directives. • Suffix "-H" indicates Halogen-free part, ex.FMS2301-H. 0.034 (0.85) Features (C) (A) 0.063 (1.60) 0.027 (0.67) 0.013 (0.32) 0.047 (1.20) 0.108 (2.75) 0.051 (1.30) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOT-23 • Terminals : Solder plated, solderable per 0.003 (0.09) 0.007 (0.18) 0.083 (2.10) Mechanical data 0.035 (0.89) Dimensions in inches and (millimeters) MIL-STD-750, Method 2026 • Mounting Position : Any • Weight : Approximated 0.008 gram M aximum ratings (AT T o A =25 C unless otherwise noted) PARAMETER CONDITIONS Drain-source voltage Symbol -20 V DSS O Drain current-continue V -2.7 T A = 25 C ID O T A = 70 C -pulsed Gate- source voltage-continue -2 . 1 I DM -11 V GS ±8.0 O Maximum power dissipation UNIT Limit T A = 25 C A V 1.3 W PD O T A = 70 C Thermal resistance-junction to ambient* Operation junction temperature Storage temperature 0.8 o R θJA 100 TJ -55 to +150 o T STG -65 to +150 o C/W C C 2 * The device mounted on 1in FR4 board with 2 oz copper http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date Revised Date DS-231129 2009/02/10 2011/07/21 Revision C Page. 8 SMD MOSFET Formosa MS FMS2301 Electrical characteristics (At T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MIN. V GS = 0V, I D = -250uA BV DSS -20 TYP. MAX. UNIT STATIC Drain-source breakdown voltage Zero gate voltage drain current O V DS = -20V, V GS = 0V, T J = 25 C I DSS Gate-body leakage current-forward V GS = 8V, V DS =0 I GSSF Gate-body leakage current-reverse V GS = -8V, V DS =0 I GSSR Static drain-source on-resistance V GS(th) V DS = V GS , I D = -250uA Gate threshold voltage a Diode Forward Voltage V GS = -4.5V, I D = -2.8A V GS = -2.5V, I D = -2.0A V GS =0V, I S = -1.0A, T J =25 C -1.0 μA 100 nA -100 nA -1.0 V 90 110 110 150 mΩ -0.7 -1.4 V -0.4 R DS(ON) O V V SD DYNAMIC Intput capacitance Output capacitance V DS = -15V, V GS = 0V, f=1.0MHz Reverse transfer capacitance Total gate charge Gate-source charge V DS = -6.0V, I D = -2.8A V GS =-4.5V Gate-drain charge C iss 510 C oss 53 C rss 17 Qg 5.8 Q gs 1.7 Q gd 1.2 T d(on) 53 Tr 32 T d(off) 47 Tf 7 pF nC Turn-On Delay Time V DS = -6.0V, R L =6.0Ω, R GEN =6Ω V GS =-4.5V ns Turn-Off Delay Time Notes : a . Pulse test : pulse width≦ 300us , duty cycle≦ 2 % , Guaranteed by design , not subject to production testing . http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date DS-231129 2009/02/10 2011/07/21 Revision C Page. 8 Rating and characteristic curves (FMS2301) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date DS-231129 2009/02/10 2011/07/21 Revision C Page. 8 Rating and characteristic curves (FMS2301) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date DS-231129 2009/02/10 2011/07/21 Revision C Page. 8 SMD MOSFET Formosa MS FMS2301 Pinning information Pin Simplified outline Symbol D PinD PinG PinS Drain Drain Gate Source Gate G Source S Marking Type number Marking code 2301, 01 FMS2301 WAG0A (Note 1) Note: 1. P / N： “WAG” is FMS2301-H “WA” shown on the 1st~2rd position on --- FMS2301 “G” shown on the 3th position on --- Green product-Halogen free D / C： 0A is the sequence of “0-9” & “A~Z” 0~9 shown on the 4th position on ---2010~2019 A~Z shown on the5th position on ---1week~26week A ~ Z shown on the 5th position on ---27week~52week Suggested solder pad layout SOT-23 0.037(0.95) 0.037(0.95) 0.079(2.0) 0.035(0.90) 0.031(0.80) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date DS-231129 2009/02/10 2011/07/21 Revision C Page. 8 SMD MOSFET Formosa MS FMS2301 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-23 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.15 2.77 1.22 1.50 178.00 55.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 12.0 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date DS-231129 2009/02/10 2011/07/21 Revision C Page. 8 SMD MOSFET Formosa MS FMS2301 Reel packing PACKAGE REEL SIZE SOT-23 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3000 4.0 30,000 183*183*123 178 CARTON SIZE (m/m) CARTON (pcs) 383*262*387 APPROX. GROSS WEIGHT (kg) 11.6 240,000 Suggested thermal profiles for soldering processes o o 1.Storage environment: Temperature=5 C ~40 C Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Page 8 Document ID Issued Date Revised Date DS-231129 2009/02/10 2011/07/21 Revision C Page. 8