TRIQUINT TQP3M9035-PCB

TQP3M9035
High Linearity LNA Gain Block
Applications
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Repeaters
Mobile Infrastructure
LTE / WCDMA / CDMA / GSM
General Purpose Wireless
TDD or FDD systems
2x2 mm 8 Pin DFN Package
Product Features
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Functional Block Diagram
Pin 1 Reference Mark
50−4000 MHz Operating Range
0.65 dB Noise Figure @ 1900 MHz
16.5 dB Gain @ 1900 MHz
+37 dBm Output IP3
+22.5 dBm P1dB
Shut-down capability
Unconditionally stable
50 Ohm Cascadable Gain Block
+5V Single Supply, 115 mA Current
2x2 mm 8 Pin DFN plastic package
NC
1
8
NC
RF In
2
7
RF Out
NC
3
6
Shut Down
NC
4
5
NC
Backside Paddle - RF/DC GND
General Description
Pin Configuration
The TQP3M9035 is a high-linearity, low noise gain
block amplifier in a low-cost surface-mount package. At
1900 MHz, the amplifier typically provides 16.5 dB
gain, +37 dBm OIP3, and 0.65 dB Noise Figure. The
LNA is also designed to be broadband without the
requirement for external matching. The device is
housed in a lead-free/green/RoHS-compliant industrystandard 2x2 mm package.
The TQP3M9035 has the benefit of having high
linearity while also providing very low noise across a
broad range of frequencies. This allows the device to
be used in both receive and transmit chains for high
performance systems.
The amplifier is internally
matched using a high performance E-pHEMT process
and only requires an external RF choke and
blocking/bypass capacitors for operation from a single
+5V supply. The low noise amplifier integrates a shutdown biasing capability to allow for operation for TDD
applications.
The TQP3M9035 covers the 50−4000 MHz frequency
band and is targeted for wireless infrastructure or other
applications requiring high linearity and/or low noise
figure.
Pin #
Symbol
Backside Paddle
RF/DC GND
1, 3, 4, 5, 8
2
6
7
No Connect or GND
RF In
Shut Down
RF Out
Ordering Information
Part No.
TQP3M9035
TQP3M9035-PCB
Description
High Linearity LNA Gain Block
500−4000 MHz Eval. Board
Standard T/R size = 2500 pieces on a 7” reel.
Data Sheet: Rev E 10/29/2012
© 2012 TriQuint Semiconductor, Inc.
- 1 of 9 -
Disclaimer: Subject to change without notice
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TQP3M9035
High Linearity LNA Gain Block
Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Parameter
Storage Temperature
Supply Voltage (VDD)
RF Input Power, CW, 50Ω,T = 25°C
Rating
Supply Voltage (VDD)
TCASE
TJ (for >106 hours MTTF)
−65 to 150°C
+6 V
+23 dBm
Operation of this device outside the parameter ranges
given above may cause permanent damage.
Min Typ Max Units
+4.75
−40
+5
+5.25
+85
190
V
°C
°C
Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all
recommended operating conditions.
Electrical Specifications
Test conditions unless otherwise noted: +25°C, VDD =+5V, 50 Ω system.
Parameter
Operational Frequency Range
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
Noise Figure
Power Shutdown Control
(Pin 6)
Current, IDD
Shutdown pin current, ISD
Thermal Resistance, θjc
Conditions
Min
50
15
Pout=+4 dBm/tone, Δf=1 MHz
On state
Off state (Power down)
On state
Off state (Power down)
VPD ≥ 3 V
channel to case
Data Sheet: Rev E 10/29/2012
© 2012 TriQuint Semiconductor, Inc.
- 2 of 9 -
+20
+32.5
Typ
1900
16.5
13
10
+23
+37
0.65
0
3
115
3
100
Max
4000
18
1.0
0.8
VDD
150
50
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dB
V
V
mA
mA
µA
°C/W
Disclaimer: Subject to change without notice
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TQP3M9035
High Linearity LNA Gain Block
Device Characterization Data
S-Parameters
Test conditions unless otherwise noted: VDD=+5 V, IDD=115 mA (typ.), Temp=+25°C, 50 Ohm system
Freq (GHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
100
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000
3200
3400
3600
3800
4000
-11.5
-13.8
-14.8
-15.0
-15.0
-14.9
-15.0
-15.0
-15.1
-15.2
-15.4
-15.6
-15.8
-15.9
-16.1
-16.1
-16.5
-16.4
-16.0
-15.4
-14.8
-14.2
-43.9
-43.3
-50.7
-74.6
-93.2
-106.9
-117.2
-125.4
-131.8
-137.5
-142.3
-147.1
-151.7
-156.6
-161.5
-166.5
-174.6
179.5
176.3
173.5
170.9
169.0
28.8
28.2
27.6
26.1
24.5
23.0
21.6
20.4
19.4
18.5
17.6
16.9
16.2
15.6
15.0
14.5
14.0
13.6
13.2
12.8
12.5
12.2
165.0
161.3
151.4
132.1
116.9
104.8
94.8
86.1
78.2
71.0
64.2
57.7
51.4
45.4
39.5
33.6
27.9
22.3
16.8
11.2
5.6
-0.1
-31.8
-31.5
-31.4
-31.4
-31.3
-30.9
-30.3
-29.7
-29.0
-28.3
-27.6
-27.0
-26.4
-25.9
-25.4
-25.0
-24.6
-24.2
-23.8
-23.5
-23.2
-22.9
13.5
8.5
6.5
9.2
13.3
17.6
21.5
23.5
25.1
25.8
25.5
25.1
24.4
22.8
21.2
19.3
17.4
15.1
12.8
10.3
7.9
4.7
-22.0
-26.5
-20.1
-14.9
-13.1
-12.2
-11.8
-11.6
-11.4
-11.2
-11.0
-10.7
-10.4
-10.1
-9.7
-9.3
-8.7
-8.3
-8.0
-7.8
-7.6
-7.4
-106.8
172.1
99.9
57.7
35.6
19.5
6.5
-5.1
-16.0
-26.4
-36.2
-45.5
-54.5
-62.8
-70.6
-77.8
-82.9
-88.4
-94.5
-100.7
-106.8
-113.2
Noise Parameters
Test conditions unless otherwise noted: VDD=+5 V, IDD=115 mA (typ.), Temp=+25°C, 50 Ohm system
Freq (MHz)
700
1100
1500
1900
2300
2700
NFmin (dB)
0.41
0.50
0.59
0.49
0.59
0.74
MagOpt (mag)
0.100
0.127
0.113
0.229
0.267
0.300
Data Sheet: Rev E 10/29/2012
© 2012 TriQuint Semiconductor, Inc.
AngOpt (deg)
118
140
165
166
179
-166
- 3 of 9 -
Rn (Ω)
0.046
0.048
0.060
0.045
0.048
0.051
Disclaimer: Subject to change without notice
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TQP3M9035
High Linearity LNA Gain Block
TQP3M9035-PCB Evaluation Board
J5
C4
J3
J4
J3 VDD
1 uF
R
3
J4 GND
C3
C4
C3
100 pF
L1
68 nH
(0603) C2
L1
U1
C1
C2
J1
R2
R1
RF
Input
C1
2
6
100 pF
1,3,4,5,8
J2
7
Q1
100 pF
RF
Output
R2
33k Ω
J5 PD
R1
See note 6. Resistors are
10k Ω not needed if shut-down
C5
functionality is not used.
C6
Notes:
1. See Evaluation Board PCB Information section for material and stack-up.
2. R3 (0 Ω jumper) is not shown on the schematic and may be replaced with copper trace in the target application layout.
3. All components are of 0402 size unless stated on the schematic.
4. C1, C2, and C3 are non-critical values. The reactive impedance should be as low as possible at the frequency of
operation for optimal performance.
5. The L1 value is non-critical and needs to provide high reactive impedance at the frequency of operation.
6. R1 and R2 are optional and do not need to be loaded if the shut-down functionality is not needed; i.e. FDD applications. If
R1 and R2 are not loaded, the LNA will operate in its standard “ON” state.
7. A through line is included on the evaluation board to de-embed the board losses.
Bill of Material - TQP3M9035-PCB
Reference Des.
N/A
Value
N/A
Description
Printed Circuit Board
Manuf.
TriQuint
Part Number
1084112
U1
n/a
High Linearity LNA Gain Block
TriQuint
TQP3M9035
R1
10K Ω
Resistor, Chip, 0402, 5%, 1/16W
various
various
R2
33K Ω
Resistor, Chip, 0402, 5%, 1/16W
various
various
R3
0Ω
Resistor, Chip, 0402, 5%, 1/16W
various
various
L1
68 nH
Inductor, 0603, 5%, Ceramic
various
various
C4
1.0 uF
Cap., Chip, 0402, 10%, 10V, X5R
various
various
C1, C2, C3, C5, C6
100 pF
Cap., Chip, 0402, 5%, 50V, NPO/COG
various
various
Solder Turret
various
various
J3, J4, J5
n/a
Data Sheet: Rev E 10/29/2012
© 2012 TriQuint Semiconductor, Inc.
- 4 of 9 -
Disclaimer: Subject to change without notice
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TQP3M9035
High Linearity LNA Gain Block
Typical Performance TQP3M9035-PCB VDD = 5 V
Test conditions unless otherwise noted: VDD=+5 V, IDD=110 mA (typ.), Temp=+25°C
Parameter
Conditions
Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
Noise figure (1)
900
22.0
14
13
+23
+37.2
0.55
Pout= +4 dBm/tone, Δf=1 MHz
Typical Value
1900
16.5
13
10
+23
+37.0
0.65
Units
2600
14.0
15
8
+23
+37.3
1.0
MHz
dB
dB
dB
dBm
dBm
dB
Notes:
1. Noise figure data shown in the table above is de-embedded from the eval board loss.
Performance Plots - TQP3M9035-PCB VDD = 5 V
Gain vs. Frequency
Input Return Loss (dB)
20
15
10
5
0
500
1000
1500
2000
2500
Frequency (MHz)
3000
3500
P1dB vs. Frequency
25
23
22
21
-15
-15
-20
-20
0
500
1000
1500
2000
2500
Frequency (MHz)
3000
3500
-25
4000
OIP3 vs. Pout/tone
500
1000
1500
2000
2500
Frequency (MHz)
3000
3500
4000
500
1000
1500
2000
2500
Frequency (MHz)
3000
3500
4000
Noise Figure vs. Frequency
900 MHz
1900 MHz
1.5
2600 MHz
40
35
25
0
2
1
0.5
30
0
Temp.=+25°C
-5
-10
45
OIP3 (dBm)
P1dB (dBm)
-10
50
24
20
-5
-25
4000
Output Return Loss vs. Frequency
0
Temp.=+25°C
NF (dB)
Gain (dB)
25
0
Input Return Loss vs. Frequency
0
Temp.=+25°C
Output Return Loss (dB)
30
0
1
2
3
4
5
Pout/Tone (dBm)
6
7
0
8
0
500
1000
1500
2000
2500
Frequency (MHz)
3000
3500
4000
Idd vs. Shutdown Voltage
140
120
+85 C
Idd (mA)
100
+25 C
- 40 C
80
60
40
20
0
-20
Data Sheet: Rev E 10/29/2012
© 2012 TriQuint Semiconductor, Inc.
0
1
2
3
Shutdown Voltage (V)
- 5 of 9 -
4
5
Disclaimer: Subject to change without notice
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TQP3M9035
High Linearity LNA Gain Block
Typical Performance − TQP3M9035-PCB VDD = 3.3 V
Test conditions unless otherwise noted: VDD=+3.3 V, IDD=67 mA (typ.), Temp=+25°C
Parameter
Conditions
Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
Noise figure (1)
Units
Typical Value
900
21.2
11.4
15.6
+19
+32.7
0.55
Pout= +5 dBm/tone, Δf=1 MHz
1900
15.8
11.9
10.6
+18.8
+33
0.65
MHz
dB
dB
dB
dBm
dBm
dB
Notes:
1. Noise figure data shown in the table above is de-embedded from the eval board loss.
Performance Plots - TQP3M9035-PCB VDD = 3.3 V
Test conditions unless otherwise noted: VDD =+3.3 V, IDD = 67 mA, TCASE = +25°C, 50 Ω system
Gain vs. Frequency
30
Input Return Loss vs. Frequency
0
Temp.=+25°C
Output Return Loss vs. Frequency
0
Temp.=+25°C
Temp.=+25°C
25
15
-5
|S22| (dB)
|S11| (dB)
Gain (dB)
-5
20
-10
-10
10
-15
-15
5
0
0
1000
2000
Frequency (MHz)
3000
-20
4000
0
1000
3000
4000
-20
0
1000
2000
Frequency (MHz)
3000
4000
OIP3 vs. Pout/tone
34
Temp.=+25°C
1 MHz tone spacing
OIP3 (dBm)
2000
Frequency (MHz)
1900 MHz
900 MHz
33
32
31
0
1
2
Data Sheet: Rev E 10/29/2012
© 2012 TriQuint Semiconductor, Inc.
3
4
5
Pout/Tone (dBm)
6
7
8
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TQP3M9035
High Linearity LNA Gain Block
Pin Configuration and Description
Pin 1 Reference Mark
NC
1
8
NC
RF In
2
7
RF Out
NC
3
6
Shut Down
NC
4
5
NC
Backside Paddle - RF/DC GND
Pin No.
Symbol
Description
2
RF In
RF Input pin. A DC Block is required.
6
Shut Down
A high voltage turns off the device. If the pin is not connected or is less than 1V,
then the device will operate under its normal operating condition.
7
RF Out /
DCBias
RF Output pin. DC bias will also need to be injected through a RF bias
choke/inductor for operation.
1, 3, 4, 5, 8
NC
No electrical connection. Provide grounded land pads for PCB mounting integrity.
Backside Paddle
RF/DC
GND
RF/DC ground. Use recommended via pattern to minimize inductance and
thermal resistance; see PCB Mounting Pattern for suggested footprint.
Evaluation Board PCB Information
TriQuint PCB 1084112 Material and Stack-up
50 ohm line dimensions: width = .031”, spacing = .035”
Data Sheet: Rev E 10/29/2012
© 2012 TriQuint Semiconductor, Inc.
- 7 of 9 -
Disclaimer: Subject to change without notice
®
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TQP3M9035
High Linearity LNA Gain Block
Mechanical Information
Package Marking and Dimensions
Marking: Part number – 9035
Lot Code – XXXX
9035
XXXX
NOTES:
1. All dimensions are in millimeters. Angles are in degrees.
2. Except where noted, this part outline conforms to JEDEC standard MO-220, Issue E (Variation VGGC) for thermally
enhanced plastic very thin fine pitch quad flat no lead package (QFN).
3. Dimension and tolerance formats conform to ASME Y14.4M-1994.
4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
PCB Mounting Pattern
NOTES:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We
recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Data Sheet: Rev E 10/29/2012
© 2012 TriQuint Semiconductor, Inc.
- 8 of 9 -
Disclaimer: Subject to change without notice
®
Connecting the Digital World to the Global Network
TQP3M9035
High Linearity LNA Gain Block
Product Compliance Information
ESD Sensitivity Ratings
Solderability
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes ≥ 250 V to < 500 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Package contact plating: NiPdAu
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes ≥ 1000 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Compatible with both lead-free (260 °C max. reflow
temperature) and tin/lead (245 °C max. reflow
temperature) soldering processes.
RoHs Compliance
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain
Hazardous Substances in Electrical and Electronic
Equipment).
MSL Rating
MSL Rating: Level 1
Test:
260°C convection reflow
Standard:
JEDEC Standard IPC/JEDEC J-STD-020
This product also has the following attributes:
• Lead Free
• Halogen Free (Chlorine, Bromine)
• Antimony Free
• TBBP-A (C15H12Br402) Free
• PFOS Free
• SVHC Free
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and
information about TriQuint:
Web: www.triquint.com
Email: [email protected]
Tel:
Fax:
For technical questions and application information:
+1.503.615.9000
+1.503.615.8902
Email: [email protected]
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained
herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein.
The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated
with such information is entirely with the user. All information contained herein is subject to change without notice.
Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The
information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any
patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or
anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe
personal injury or death.
Data Sheet: Rev E 10/29/2012
© 2012 TriQuint Semiconductor, Inc.
- 9 of 9 -
Disclaimer: Subject to change without notice
®
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