TQP3M9008 High Linearity LNA Gain Block Applications Repeaters Mobile Infrastructure LTE / WCDMA / EDGE / CDMA General Purpose Wireless 3-pin SOT-89 Package Product Features Functional Block Diagram 50-4000 MHz 20.6 dB Gain @ 1.9 GHz +36 dBm Output IP3 1.3 dB Noise Figure @ 1.9 GHz 50 Ohm Cascadable Gain Block Unconditionally stable High input power capability +5V Single Supply, 85 mA Current SOT-89 Package GND 4 General Description 1 2 3 RF IN GND RF OUT Pin Configuration The TQP3M9008 is a cascadable, high linearity gain block amplifier in a low-cost surface-mount package. At 1.9 GHz, the amplifier typically provides 20.6 dB gain, +36 dBm OIP3, and 1.3 dB Noise Figure while only drawing 85 mA current. The device is housed in a leadfree/green/RoHS-compliant industry-standard SOT-89 package using a NiPdAu plating to eliminate the possibility of tin whiskering. Pin # Symbol 1 3 2, 4 The TQP3M9008 has the benefit of having high gain across a broad range of frequencies while also providing very low noise. This allows the device to be used in both receiver and transmitter chains for high performance systems. The amplifier is internally matched using a high performance E-pHEMT process and only requires an external RF choke and blocking/bypass capacitors for operation from a single +5V supply. The internal active bias circuit also enables stable operation over bias and temperature variations. RF Input RF Output / Vcc Ground Ordering Information Part No. The TQP3M9008 covers the 0.05-4 GHz frequency band and is targeted for wireless infrastructure or other applications requiring high linearity and/or low noise figure. Description TQP3M9008 High Linearity LNA Gain Block TQP3M9008-PCB_IF TQP3M9008 EVB 0.05-0.5 GHz TQP3M9008-PCB_RF TQP3M9008 EVB 0.5-4 GHz Standard T/R size = 1000 pieces on a 7” reel. Data Sheet: Rev. J © 2012 TriQuint Semiconductor, Inc. - 1 of 10- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network ® TQP3M9008 High Linearity LNA Gain Block Specifications Absolute Maximum Ratings Recommended Operating Conditions Parameter Rating Parameter Storage Temperature -65 to +150 °C Vdd RF Input Power, CW,50 Ω,T = 25°C +23 dBm T(case) Device Voltage,Vdd +7 V Reverse Device Voltage -0.3V Min +3 Typ Max Units +5 +5.25 V 85 °C 190 °C -40 6 Tj (for>10 hours MTTF) Operation of this device outside the parameter ranges given above may cause permanent damage. Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Test conditions unless otherwise noted: +25°C, +5V Vsupply, 50 Ω system. Parameter Conditions Operational Frequency Range Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 © 2012 TriQuint Semiconductor, Inc. Typical 50 19 Pout= 3 dbm/tone, Δf= 1 MHz Noise Figure Vdd Current, Idd Thermal Resistance (junction to base) θjb Data Sheet: Rev. J Min +32.5 1900 20.6 Units 4000 MHz MHz dB 22 16 17 +20 +36 1.3 +5 85 - 2 of 10- Max dB dB dBm dBm dB V 100 mA 38.7 °C/W Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network ® TQP3M9008 High Linearity LNA Gain Block Device Characterization Vdd = +5 V, Idd = 85 mA, T = +25 °C, calibrated to device leads Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 -12.52 -170.01 23.61 172.94 -26.71 0.57 -9.82 177.18 100 -11.90 -175.09 23.48 167.73 -26.65 -1.85 -9.88 171.87 200 -11.41 177.96 23.07 159.45 -26.63 -5.51 -10.01 162.15 400 -11.36 166.96 22.66 144.06 -26.65 -12.85 -10.48 145.49 600 -11.58 154.05 22.31 129.39 -26.65 -19.62 -10.67 129.34 800 -11.76 147.21 21.98 114.61 -26.71 -26.09 -11.30 111.77 1000 -12.33 139.09 21.71 99.52 -26.78 -33.35 -12.37 94.27 1200 -12.65 132.05 21.41 85.59 -26.92 -39.92 -13.06 77.75 1400 -13.27 126.25 21.02 70.96 -27.11 -47.72 -14.33 58.69 1600 -13.58 116.91 20.78 56.21 -27.39 -56.48 -15.41 36.83 1800 -13.92 110.23 20.45 41.84 -27.60 -63.31 -16.28 15.29 2000 -14.30 103.50 20.30 27.87 -28.05 -71.56 -17.53 -11.21 2200 -15.07 94.63 19.92 13.81 -28.50 -80.24 -18.03 -39.05 2400 -15.75 85.16 19.71 -1.08 -28.73 -88.86 -17.43 -65.92 2600 -16.78 72.66 19.45 -15.98 -29.42 -96.81 -16.62 -94.17 2800 -18.00 55.24 19.22 -31.32 -29.90 -105.73 -14.89 -115.00 3000 -19.76 25.52 18.95 -46.86 -30.63 -117.08 -14.06 -131.67 3200 -19.90 -16.80 18.64 -63.51 -31.00 -128.03 -13.12 -148.29 3400 -17.79 -58.97 18.31 -80.47 -31.77 -139.44 -12.40 -160.20 3600 -14.26 -90.75 17.71 -98.47 -32.84 -154.36 -11.92 -173.86 3800 -11.29 -114.34 16.98 -117.12 -33.98 -168.14 -11.23 174.45 4000 -8.73 -132.65 16.09 -135.80 -34.80 173.11 -10.66 167.57 Data Sheet: Rev. J © 2012 TriQuint Semiconductor, Inc. - 3 of 10- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network ® TQP3M9008 High Linearity LNA Gain Block Application Circuit Configuration J3 GND Vdd B1 C1 C2 L2 C1 Q1 L2 C6 J1 C2 C6 J2 Q1 RF Input RF Output Backside Paddle Ground Notes: 1. See PC Board Layout, page 8 for more information. 2. Components shown on the silkscreen but not on the schematic are not used. 3. B1 (0 Ω jumper) may be replaced with copper trace in the target application layout. 4. The recommended component values are dependent upon the frequency of operation. 5. All components are of 0603 size unless stated on the schematic. Bill of Material Frequency (MHz) TQP3M9008-PCB_IF TQP3M9008-PCB_RF 50 - 500 500 - 4000 Reference Designation Q1 TQP3M9008 C2, C6 1000 pF 100 pF C1 0.01 uF 0.01 uF L2 330 nH 68 nH D1 Do Not Place B1 0Ω Performance can be optimized at frequency of interest by using recommended component values shown in the table below. Reference Designation C2, C6 L2 500 100 pF 82 nH Data Sheet: Rev. J © 2012 TriQuint Semiconductor, Inc. Frequency (MHz) 2000 2500 3500 22 pF 22 nH 22 pF 15 nH - 4 of 10- 22 pF 18 nH Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network ® TQP3M9008 High Linearity LNA Gain Block Typical Performance TQP3M9008-PCB_RF Test conditions unless otherwise noted: +25°C, +5V, 85 mA, 50 Ω system. Frequency MHz 500 900 1900 2700 3500 4000 Gain Input Return Loss Output Return Loss Output P1dB dB dB dB dBm 22.8 10 9.5 +20.9 22.3 12 12 +19.7 20.6 16 17 +19.9 19.0 18 13 +19.4 17.6 10 12.4 +19.7 16.0 7.3 14 +18.5 OIP3 [1] Noise Figure [2] dBm dB +37.5 1.1 +37.6 1.1 +36 1.3 +35.3 1.6 +34.7 2 +33.7 2.5 Notes: 1. OIP3 measured with two tones at an output power of +3 dBm / tone separated by 1 MHz. 2. Noise figure data shown in the table above is measured on evaluation board which includes board losses of around 0.1dB @ 2 GHz. RF Performance Plots Gain vs. Frequency over Temp -40 C -20 C +25 C +85⁰C +85 C +25 C -40 C -20⁰C -10 18 -15 16 -20 14 1500 2000 2500 3000 3500 4000 -20 500 1000 1500 2500 3000 3500 OIP3 vs. Pout/tone over Temp Noise Figure vs. Frequency over Temp 4 OIP3 (dBm) 2 1 0 2500 3000 3500 Frequency (MHz) Data Sheet: Rev. J © 2012 TriQuint Semiconductor, Inc. 4000 3500 4000 1 MHz tone spacing, 3 dBm/tone +25 C +85 C -40 C +25 C +85 C -40 C 40 35 35 30 25 2000 2000 2500 3000 Frequency (MHz) OIP3 vs. Frequency over Temp 30 1500 1500 45 40 +85 C +25 C -40 C 1000 1000 F=1900 MHz, 1 MHz tone spacing 45 500 500 4000 Frequency (MHz) Frequency (MHz) 3 2000 OIP3 (dBm) 1000 -10 -15 -25 500 -40 C -20 C +25 C +85⁰C -5 S22 (dB) 20 0 -5 S11 (dB) Gain (dB) 22 NF (dB) S22 vs. Frequency over Temp S11 vs. Frequency over Temp 0 24 25 0 3 6 Pout/tone (dBm) - 5 of 10- 9 12 500 1000 1500 2000 2500 3000 Frequency (MHz) 3500 4000 Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network ® TQP3M9008 High Linearity LNA Gain Block RF Performance Plots Idd vs. Temperature P1dB vs. Frequency over Temp 22 90 20 85 CW Signal OIP2 vs. Frequency 55 Pout = 3 dBm / tone, 1 MHz spacing, +5V, +25C 18 -40 C +25 C +85 C 16 OIP2 (dBm) Idd (mA) P1dB (dBm) 50 80 35 70 1000 1500 2000 2500 3000 3500 4000 30 -40 -15 10 Frequency (MHz) 45 35 60 85 0 1000 1500 2000 2500 3000 3500 4000 Frequency (MHz) P1dB vs. Vdd 30 Noise Figure vs. Vdd 3.0 Pout/tone = 3dBm Tone spacing = 1MHz 2.5 25 35 30 1900 MHz 900 MHz 2.0 NF (dB) 1900MHz 900MHz P1dB (dBm) OIP3 (dBm) 500 Temperature (°C) OIP3 vs. Vdd 40 40 75 14 500 45 20 1900MHz 900MHz 1.5 1.0 15 0.5 25 10 3 4 5 6 7 0.0 3 4 Vdd (Volts) 5 6 7 Vdd (Volts) 3 4 5 6 7 Vdd (Volts) Idd vs Vdd 90 Idd (mA) 85 80 75 70 65 3 4 5 6 7 Vdd (Volts) Data Sheet: Rev. J © 2012 TriQuint Semiconductor, Inc. - 6 of 10- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network ® TQP3M9008 High Linearity LNA Gain Block Typical Performance TQP3M9008-PCB_IF Test conditions unless otherwise noted: +25ºC, +5V, 85 mA, 50 Ω system. Frequency MHz 70 100 200 500 Gain Input Return Loss Output Return Loss Output P1dB OIP3 [1] dB dB dB dBm dBm 23.2 10 9 +19.8 +37 23.2 11 9 +20.2 +37 22.9 11 10 +19.9 +37 22.3 11 10 +19.9 +37 dB 1.2 1.1 0.8 1.1 Noise Figure [2] Notes: 1. OIP3 measured with two tones at an output power of +3 dBm / tone separated by 1 MHz. 2. Noise figure data shown in the table above is measured on evaluation board which includes board losses of around 0.1 dB @ 2 GHz. IF Performance Plots Gain vs. Frequency over Temp -40 ⁰C -20 C +25 C +85 C 21 -40 C -20 C +25 C +85⁰C 19 -10 15 -20 -20 100 200 300 400 500 0 100 200 300 Frequency (MHz) Frequency (MHz) 45 3 40 OIP3 (dBm) +85 C +25 C -40 C 1 0 200 300 400 Frequency (MHz) Data Sheet: Rev. J © 2012 TriQuint Semiconductor, Inc. 500 200 300 400 500 P1dB vs. Frequency over Temp 1 MHz tone spacing, 3 dBm/tone 22 -40 C +25 C +85 C 20 35 18 -40 C +25 C +85 C 16 14 25 100 100 Frequency (MHz) 30 0 0 500 OIP3 vs. Frequency over Temp Noise Figure vs. Frequency over Temp 4 2 400 P1dB (dBm) 0 -10 -15 -15 17 -20 C -40 C +25 C +85⁰C -5 S22 (dB) -5 S11 (dB) Gain (dB) 0 0 23 NF (dB) S22 vs. Frequency over Temp S11 vs. Frequency over Temp 25 0 100 200 300 Frequency (MHz) - 7 of 10- 400 500 0 100 200 300 400 500 Frequency (MHz) Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network ® TQP3M9008 High Linearity LNA Gain Block Pin Description GND 4 1 2 3 RF IN GND RF OUT Pin Symbol Description 1 RF IN Input, matched to 50 ohms. External DC Block is required. 2, 4 GND RF/DC Ground Connection 3 RFout / Vdd Output, matched to 50 ohms, External DC Block is required and supply voltage Evaluation Board PCB PC Board Layout TriQuint PCB 1075825 Material and Stack Up 1 oz. Cu top layer 0.014" Nelco N-4000-13 1 oz. Cu inner layer 0.062 ± 0.006 Finished Board Thickness Nelco N-4000-13 εr=3.7 typ. 1 oz. Cu inner layer 0.014" Nelco N-4000-13 1 oz. Cu bottom layer Data Sheet: Rev. J © 2012 TriQuint Semiconductor, Inc. - 8 of 10- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network ® TQP3M9008 High Linearity LNA Gain Block Mechanical Information Package Information and Dimensions Markings: Part number: 3M9008 Assembly code: ‘Y’ is last digit of part manufacture year. ‘XXX’ is lot code. 3M9008 YXXX PCB Mounting Pattern All dimensions are in millimeters (inches). Angles are in degrees. Notes: 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. RF trace width depends upon the PC board material and construction. 4. Use 1 oz. Copper minimum. Data Sheet: Rev. J © 2012 TriQuint Semiconductor, Inc. - 9 of 10- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network ® TQP3M9008 High Linearity LNA Gain Block Product Compliance Information ESD Sensitivity Ratings Solderability Compatible with both lead-free (260°C max. reflow temp.) and lead (245°C max. reflow temp.) soldering processes. ESD Rating: Value: Test: Standard: 1A Passes 250V to < 500 V Human Body Model (HBM) JEDEC Standard JESD22-A114 Package lead plating: NiPdAu RoHs Compliance This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). ESD Rating: IV Value: Passes 1000 V Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br402) Free PFOS Free SVHC Free MSL Classification MSL Rating: Floor Life: Test: Standard: 3 168 hours max. at ≤ 30 C / 60% RH +260 °C convection reflow JEDEC standard IPC/JEDEC J-STD-020 Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: Fax: +1.503.615.9000 +1.503.615.8902 For technical questions and application information: Email:[email protected] Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Data Sheet: Rev. J © 2012 TriQuint Semiconductor, Inc. - 10 of 10- Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network ®