ONSEMI NCP380HMUAJAATBG

NCP380, NCV380
Fixed / Adjustable CurrentLimiting Power-Distribution
Switches
The NCP380 is a high side power−distribution switch designed for
applications where heavy capacitive loads and short−circuits are likely
to be encountered. The device includes an integrated 55 mW (DFN
package), P−channel MOSFET. The device limits the output current to
a desired level by switching into a constant−current regulation mode
when the output load exceeds the current−limit threshold or a short is
present. The current−limit threshold is either user adjustable between
100 mA and 2.1 A via an external resistor or internally fixed. The
power−switch rise and fall times are controlled to minimize current
ringing during switching.
An internal reverse−voltage detection comparator disables the
power−switch if the output voltage is higher than the input voltage to
protect devices on the input side of the switch.
The FLAG logic output asserts low during over current,
reverse−voltage or over temperature conditions. The switch is
controlled by a logic enable input active high or low.
Features
• 2.5 V – 5.5 V Operating Range
• 70 mW High−Side MOSFET
• Current Limit:
User adjustable from 100 mA to 2.1 A
♦ Fixed 500 mA, 1 A, 1.5 A, 2 A and 2.1 A
Under Voltage Lock−out (UVLO)
Built−in Soft−start
Thermal Protection
Soft Turn−off
Reverse Voltage Protection
Junction Temperature Range: −40°C to 125°C
Enable Active High or Low (EN or EN)
Compliance to IEC61000−4−2 (Level 4)
♦ 8.0 kV (Contact)
♦ 15 kV (Air)
UL Listed − File No. E343275
AEC−Q100 Qualified and PPAP Capable
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
These are Pb−Free Devices
♦
•
•
•
•
•
•
•
•
•
•
•
•
http://onsemi.com
MARKING
DIAGRAMS
1
6
2 XX M 5
3
4
UDFN6
MU SUFFIX
CASE 517AB
5
5
XXXAYWG
G
1
TSOP−5
SN SUFFIX
CASE 483
1
TSOP−6
SN SUFFIX
CASE 318G
XXX
A
M
Y
W
G
1
XXXAYWG
G
1
= Specific Device Code
=Assembly Location
= Date Code
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 21 of this data sheet.
Typical Applications
• Laptops
• USB Ports/Hubs
• TVs
© Semiconductor Components Industries, LLC, 2012
February, 2012 − Rev. 10
1
Publication Order Number:
NCP380/D
NCP380, NCV380
USB
DATA
USB INPUT
5V
IN
Rfault
100 kW *
1 mF
D+
D−
USB
VBUS Port
GND
OUT
NCP380
FLAG
FLAG
EN
120 mF
ILIM*
EN
Rlim
GND
*For adjustable version only.
Figure 1. Typical Application Circuit
OUT 1
ILIM* 2
FLAG
PAD1
6 IN
OUT
1
5 GND
GND
2
FLAG
3
4 EN
3
IN
5
4
EN
TSOP−5
UDFN6
(Top view)
IN
1
6
OUT
GND
2
5
ILIM*
EN
3
4
FLAG
TSOP−6
Figure 2. Pin Connections
*For adjustable version only, otherwise not connected.
PIN FUNCTION DESCRIPTION
Pin Name
Type
Description
EN
INPUT
GND
POWER
Ground connection;
IN
POWER
Power−switch input voltage; connect a 1 mF or greater ceramic capacitor from IN to GND as close as
possible to the IC.
FLAG
OUTPUT
Active−low open−drain output, asserted during overcurrent, overtemperature or reverse−voltage conditions. Connect a 10 kW or greater resistor pull−up, otherwise leave unconnected.
OUT
OUTPUT
Power−switch output; connect a 1 mF ceramic capacitor from OUT to GND as close as possible to the IC
is recommended. A 1 mF or greater ceramic capacitor from OUT to GND must be connected if the USB
requirement (i.e.120 mF capacitor minimum) is not met.
ILIM*
INPUT
PAD1**
THERMAL
Enable input, logic low/high (i.e. EN or EN) turns on power switch
External resistor used to set current−limit threshold; recommended 5 kW < RILIM < 250 kW.
Exposed Thermal Pad: Must be soldered to PCB Ground plane
*(For adjustable version only, otherwise not connected.
**For DFN version only.
http://onsemi.com
2
NCP380, NCV380
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN , VOUT
−7.0 to +7.0
V
VEN, VILIM, VFLAG, VIN, VOUT
−0.3 to +7.0
V
FLAG sink current
ISINK
1
mA
ILIM source current
ILIM
1
mA
ESD IEC
15 Air, 8 contact
kV
Human Body Model (HBM) ESD Rating (Note 2)
ESD HBM
2000
V
Machine Model (MM) ESD Rating (Notes 2 and 3)
ESD MM
200
V
From IN to OUT Pins: Input/Output (Note 1)
IN, OUT, EN, ILIM, FLAG, Pins: Input/Output (Note 1)
ESD Withstand Voltage (IEC 61000−4−2) (output only, when
bypassed with 1.0 mF capacitor minimum)
Latch−up protection (Note 4)
− Pins IN, OUT, EN, ILIM, FLAG
LU
Maximum Junction Temperature Range (Note 6)
100
mA
TJ
−40 to +TSD
°C
Storage Temperature Range
TSTG
−40 to +150
°C
Moisture Sensitivity (Note 5)
MSL
Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. According to JEDEC standard JESD22−A108.
2. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) $2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) $200 V per JEDEC standard: JESD22−A115 for all pins.
3. Except EN pin, 150 V.
4. Latch up Current Maximum Rating: $100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
6. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
http://onsemi.com
3
NCP380, NCV380
OPERATING CONDITIONS
Symbol
Parameter
VIN
Operational Power Supply
VEN
Enable Voltage
Conditions
Min
Max
Unit
2.5
Typ
5.5
V
0
5.5
TA
Ambient Temperature Range
−40
25
+85
°C
TJ
Junction Temperature Range
−40
25
+125
°C
RILIM
Resistor from ILIM to GND pin
5.0
250
kW
ISINK
FLAG sink current
1.0
mA
CIN
Decoupling input capacitor
COUT
Decoupling output capacitor
RqJA
Thermal Resistance Junction−to−Air
IOUT
PD
Maximum DC current
Power Dissipation Rating (Note 9)
USB port per Hub
1.0
mF
120
mF
UDFN−6 package (Notes 7 and 8)
120
°C/W
TSOP−5 package (Notes 7 and 8)
305
°C/W
TSOP−6 package (Notes 7 and 8)
280
°C/W
UDFN−6 package
2.1
A
TSOP−5, TSOP−6 package
1.0
A
TA v 25°C
TA = 85°C
UDFN−6 package
830
mW
TSOP−5 package
325
mW
TSOP−6 package
350
mW
UDFN−6 package
325
mW
TSOP−5 package
130
mW
TSOP−6 package
145
mW
7. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
8. The RqJA is dependent of the PCB heat dissipation. Board used to drive this data was a 2” x 2” NCP380EVB board. It is a 2 layers board
with 2−once copper traces on top and bottom of the board. Exposed pad is connected to ground plane for UDFN−6 version only.
9. The maximum power dissipation (PD) is given by the following formula:
*T
T
PD +
http://onsemi.com
4
JMAX
R qJA
A
NCP380, NCV380
ELECTRICAL CHARACTERISTICS Min & Max Limits apply for TA between −40°C to +85°C and TJ up to + 125°C for VIN between
2.5 V to 5.5V (Unless otherwise noted). Typical values are referenced to TA = + 25°C and VIN = 5 V.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
55
75
mW
POWER SWITCH
RDS(on)
Static drain−source on−state
resistance
DFN Package
TSOP Package
TR
Output rise time
VIN = 5 V
–40°C < TJ < 125°C
2.5 V < VIN < 5.5 V
–40°C < TJ < 125°C
VIN = 5 V
–40°C < TJ < 125°C
2.5 V < VIN < 5.5 V
–40°C < TJ < 125°C
VIN = 5 V
CLOAD = 1 mF,
RLOAD = 100 W (Note 10)
VIN = 2.5 V
TF
Output fall time
110
70
95
mW
135
0.3
1.0
1.5
0.2
0.65
1.0
VIN = 5 V
0.1
0.5
VIN = 2.5 V
0.1
0.5
ms
ENABLE INPUT EN OR EN
VIH
High−level input voltage
1.2
VIL
Low−level input voltage
IEN
Input current
VEN = 0 V, VEN = 5 V
−0.5
TON
Turn on time
CLOAD = 1 mF, RLOAD = 100 W (Note 11)
2.0
TOFF
Turn off time
V
3.0
1.0
0.4
V
0.5
mA
4.0
ms
3.0
ms
A
CURRENT LIMIT
IOCP
Current−limit threshold
(Maximum DC output current
IOUT delivered to load)
VIN = 5 V
RILIM = 20 kW (Note 11)
1.02
1.20
1.38
RILIM = 40 kW
(Notes 11 and 13)
0.595
0.700
0.805
Fixed 0.5 A (Note 12)
0.5
0.58
0.65
Fixed 1.0 A (Note 12)
1.0
1.15
1.3
Fixed 1.5 A (Note 12)
1.5
1.75
1.9
Fixed 2.0 A (Note 12)
2.0
2.25
2.5
Fixed 2.1 A (Note 12)
2.1
2.25
2.5
VIN = 5 V
2.0
A
TDET
Response time to short circuit
TREG
Regulation time
1.8
3.0
4.0
ms
TOCP
Overcurrent protection time
14
20
26
ms
ms
REVERSE−VOLTAGE PROTECTION
VREV
Reverse−voltage comparator trip
point (VOUT – VIN)
TREV
Time from reverse−voltage
condition to MOSFET switch off
& FLAG low
TRREV
Re−arming Time
100
VIN = 5 V
mV
4.0
6.0
9.0
ms
7.0
10
15
ms
2.0
2.3
2.4
V
UNDERVOLTAGE LOCKOUT
VUVLO
IN pin low−level input voltage
VIN rising
VHYST
IN pin hysteresis
TJ = 25°C
TRUVLO
Re−arming Time
25
7.0
60
mV
10
15
ms
1.0
2.1
mA
SUPPLY CURRENT
IINOFF
Low−level output supply current.
VIN = 5 V, No load on OUT, Device OFF
VEN = 0 V or VEN = 5 V
http://onsemi.com
5
NCP380, NCV380
ELECTRICAL CHARACTERISTICS Min & Max Limits apply for TA between −40°C to +85°C and TJ up to + 125°C for VIN between
2.5 V to 5.5V (Unless otherwise noted). Typical values are referenced to TA = + 25°C and VIN = 5 V.
Symbol
Parameter
Conditions
Min
IINON
High−level output supply current.
VIN = 5 V, device enable
2 A and 2.1 A versions
1 A and 1.5 A current versions
0.5 A current version
IREV
Reverse leakage current
Typ
Max
Unit
SUPPLY CURRENT
VOUT = 5 V, VIN = 0 V
90
80
70
TJ = 25°C
mA
1.0
mA
FLAG PIN
VOL
FLAG output low voltage
IFLAG = 1 mA
400
mV
ILEAK
Off−state leakage
VFLAG = 5 V
1.0
mA
TFLG
FLAG deglitch
FLAG de−assertion time due to overcurrent or
reverse voltage condition
4.0
6.0
9.0
ms
TFOCP
FLAG deglitch
FLAG assertion due to overcurrent
6.0
8.0
12
ms
THERMAL SHUTDOWN
TSD
Thermal shutdown threshold
140
°C
TSDOCP
Thermal regulation threshold
125
°C
TRSD
Thermal shutdown rearming
threshold
115
°C
10. Parameters are guaranteed for CLOAD and RLOAD connected to the OUT pin with respect to the ground, See Figure 3.
11. Adjustable current version, RILIM tolerance ±1%.
12. Fixed current version.
13. Not production test, guaranteed by characterization.
VIN
IN
OUT
NCP380
1 mF
C LOAD
R LOAD
GND
Figure 3. Test Configuration
VEN
50%
TR
VEN
VOUT
TOFF
TON
VOUT
90%
10%
Figure 4. Voltage Waveform
http://onsemi.com
6
TF
90%
10%
10%
NCP380, NCV380
BLOCK DIAGRAM
Blocking control
IN
ILIM*
GND
OUT
Current
Limiter
Vref
TSD
Gate Driver
UVLO
Osc
Flag
EN
EN block
Control logic
and timer
Figure 5. Block Diagram
*For adjustable version only, otherwise not connected.
http://onsemi.com
7
/FLAG
NCP380, NCV380
Ton + TR
Figure 6. Ton Delay and Trise Time
Toff + Tfall
Figure 7. Toff Delay and Tfall
http://onsemi.com
8
NCP380, NCV380
Figure 8. Turn On a Short
TSD
Warning
Treg
TOCP
Figure 9. 2 W Short on Output. Complete Regulation Sequence
http://onsemi.com
9
NCP380, NCV380
TFOCP
TSD Warning
VIN
VOUT
IIN
/FLAG
Figure 10. OCP Regulation and TSD Warning Event
TOCP
Treg
Figure 11. Timer Regulation Sequence During 2 W Overload
http://onsemi.com
10
NCP380, NCV380
Figure 12. Direct Short on OUT Pin
Figure 13. From Timer Regulation to Load Removal Sequence
http://onsemi.com
11
NCP380, NCV380
TFOCP
VOUT
IOUT
/FLAG
Figure 14. From No Load to Direct Short Circuit
VREV
VOUT
VIN
TFREV
/FLAG
Figure 15. Reverse Voltage Detection
http://onsemi.com
12
NCP380, NCV380
T RREV
UVLO (V)
Figure 16. Reverse Voltage Removal
TEMPERATURE (°C)
Figure 17. Undervoltage Threshold (Falling) and Hysteresis
http://onsemi.com
13
NCP380, NCV380
Low−Level Output Supply Current vs Vin
−40°C
25°C
85°C
125°C
2.0
1.8
1.6
IINOFF (mA)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.4
2.9
3.4
3.9
4.4
4.9
5.4
Vin(V)
Figure 18. Standby Current vs Vin
High−Level Output Supply Current vs Vin
−40°C
25°C
85°C
125°C
100
90
80
IINON (mA)
70
60
50
40
30
20
10
0
2.4
2.9
3.4
3.9
4.4
Vin(V)
Figure 19. Quiescent Current vs Vin
http://onsemi.com
14
4.9
5.4
NCP380, NCV380
Figure 20. RDS(on) vs Temperature, TSOP Package
Figure 21. RDS(on) vs Temperature, mDFN Package
http://onsemi.com
15
NCP380, NCV380
FUNCTIONAL DESCRIPTION
VOUT
Overview
The NCP380 is a high side P channel MOSFET power
distribution switch designed to protect the input supply
voltage in case of heavy capacitive loads, short circuit or
over current. In addition, the high side MOSFET is turned
off during under voltage, thermal shutdown or reverse
voltage condition. Adjustable version allows the user to
program the current limit threshold using an external
resistor. Thanks to the soft start circuitry, NCP380 is able to
limit large current and voltage surges.
Thermal
Regulation
Threshold
Timer
Regulation
Mode
IOUT
IOCP
TOCP
Overcurrent Protection
TREG
Figure 24. Short circuit
NCP380 switches into a constant current regulation mode
when the output current is above the IOCP threshold.
Depending on the load, the output voltage is decreased
accordingly.
− In case of hot plug with heavy capacitive load, the
output voltage is brought down to the capacitor voltage.
The NCP380 will limit the current to the IOCP threshold
value until the charge of the capacitor is completed.
Then, the device enters in timer regulation mode, described
in 2 phases:
− Off−phase: Power MOSFET is off during TOCP to allow
the die temperature to drop.
− On−phase: regulation current mode during TREG. The
current is regulated to the IOCP level.
The timer regulation mode allows the device to handle
high thermal dissipation (in case of short circuit for
example) within temperature operating condition.
NCP380 stays in on−phase/off−phase loop until the over
current condition is removed or enable pin is toggled.
Remark: Other regulation modes can be available for
different applications. Please contact our On Semiconductor
representative for availability.
VOUT
Drop due to
capacitor charge
IOUT
IOCP
FLAG Indicator
The FLAG pin is an open−drain MOSFET asserted low
during over current, reverse−voltage or over temperature
conditions. When an over current or a reverse voltage fault
is detected on the power path, FLAG pin is asserted low at
the end of the associate deglitch time (see electrical
characteristics). Thanks to this feature, the FLAG pin is not
tied low during the charge of a heavy capacitive load or a
voltage transient on output. Deglitch time is TFOCP for over
current fault and TREV for reverse voltage. The FLAG pin
remains low until the fault is removed. Then, the FLAG pin
goes high at the end of TFGL.
Figure 22. Heavy capacitive load
− In case of overload, the current is limited to the IOCP
value and the voltage value is reduced according to the
load by the following relation:
V OUT + R LOAD
I OCP
(eq. 1)
VOUT
IOCP x RLOAD
IOUT
Undervoltage Lock−out
Thanks to a built−in under voltage lockout (UVLO)
circuitry, the output remains disconnected from input until
VIN voltage is below VUVLO. When VIN voltage is above
VUVLO, the system try to reconnect the output after a
rearming time. TRUVLO. This circuit has a VHYST hysteresis
witch provides noise immunity to transient.
IOCP
Figure 23. Overload
− In case of short circuit or huge load, the current is
limited to the IOCP value within TDET time until the
short condition is removed. If the output remains
shorted or tied to a very low voltage, the junction
temperature of the chip exceeds TSDOCP value and the
device enters in thermal shutdown (MOSFET is
turned−off).
Thermal Sense
Thermal shutdown turns off the power MOSFET if the die
temperature exceeds TSD. A Hysteresis prevents the part
from turning on until the die temperature cools at TRSD.
http://onsemi.com
16
NCP380, NCV380
Reverse Voltage Protection
on EN or low on EN turns off device and reduces the current
consumption down to IINOFF.
When the output voltage exceeds the input voltage by
VREV voltage during TREV, the reverse voltage circuitry
disconnects the output in order to protect the power supply.
The same time TREV is needed to turn on again the power
MOS plus a rearming time TRREV.
Blocking Control
The blocking control circuitry switches the bulk of the
power MOS. When the part is off, the body diode limits the
leakage current IREV from OUT to IN. In this mode, anode
of the body diode is connected to IN pin and cathode is
connected to OUT pin. In operating condition, anode of the
body diode is connected to OUT pin and cathode is
connected to IN pin preventing the discharge of the power
supply.
Enable Input
Enable pin must be driven by a logic signal (CMOS or
TTL compatible) or connected to the GND or VIN. A logic
low on EN or high on EN turns−on the device. A logic high
http://onsemi.com
17
NCP380, NCV380
APPLICATION INFORMATION
Power Dissipation
PD
VIN
RLOAD
IOCP
The junction temperature of the device depends on
different contributing factors such as board layout, ambient
temperature, device environment, etc... Yet, the main
contributor in terms of junction temperature is the power
dissipation of the power MOSFET. Assuming this, the
power dissipation and the junction temperature in normal
mode can be calculated with the following equations:
R D + R DS(on)
PD
RDS(on)
IOUT
ǒIOUTǓ
2
Adjustable Current-Limit Programming (for adjustable
version only)
The NCP380xMUAJAA and NCP380xSNAJAA,
respectively mDFN and TSOP6 packages, are proposed to
have current limit flexibility for end Customer. Indeed, Ilim
pin is available to connect pull down resistor to ground,
which participate to the current threshold adjustment. It’s
strongly recommended to use 0.1 or 1% resistor tolerance to
keep the over current accuracy.
For this resistance selection, Customer should define first
of all, the USB current to sustain, without the device enters
in the protection sequence. Main rule is to select this pull
down resistor in order to make sure min current limit is
above the USB current to provide continuously to the
upstream accessory.
Following, the main table selection contains the USB
current port for the accessory, the standard resistor selection
and typical /max over current threshold.
(eq. 2)
= Power dissipation (W)
= Power MOSFET on resistance (W)
= Output current (A)
TJ + PD
R qJA ) T A
(eq. 3)
TJ
= Junction temperature (°C)
RqJA
= Package thermal resistance (°C/W)
= Ambient temperature (°C)
TA
Power dissipation in regulation mode can be calculated by
taking into account the drop VIN −VOUT link to the load by
the following relation:
P D + ǒV IN * R LOAD
I OCPǓ
I OCP
= Power dissipation (W)
= Input Voltage (V)
= Load Resistance (W)
= Output regulated current (A)
(eq. 4)
Table 1. RESISTOR SELECTION FOR ADJUSTABLE CURRENT LIMIT VERSION
Min Current
Limit Value
(A)
Theoric Resistor Value
(kW)
Selected Resistor Value
(kW)
1% or 0.1%
Typical OCP Target Value
(A)
Maximum Current
Value
(A)
0.5
44.2
44.2
0.59
0.67
0.6
37.5
37.4
0.71
0.81
0.7
32.2
31.6
0.825
0.95
0.8
27.7
27.4
0.94
1.08
0.9
24.0
23.7
1.06
1.22
1.0
21.0
21
1.18
1.35
1.1
18.5
18.2
1.3
1.49
1.2
16.6
16.5
1.41
1.62
1.3
14.6
14.3
1.53
1.76
1.4
13.0
13
1.65
1.9
1.5
11.4
11.3
1.78
2.05
1.6
10.4
10.2
1.88
2.17
1.7
9.2
9.09
2.01
2.31
1.8
8.3
8.25
2.12
2.438
1.9
7.4
7.32
2.23
2.56
2.0
6.5
6.49
2.36
2.7
2.1
5.6
5.49
2.48
2.85
The “Min current limit Value” column, represents the DC
current to provide to the accessory without over current
activation.
Second column is the theoretical resistor value obtained
with following formula to achieve typical current target:
http://onsemi.com
18
NCP380, NCV380
Rlim + −5.2959 * ILIM 5 ) 45.256 * ILIM 4 * 155.25 * ILIM 3 ) 274.39 * ILIM 2 * 267.6 * ILIM ) 134.21
Figure 25. Rlim Curve versus Current Limit
When the resistor is choosing to fit with the Customer
application, the limits of the over current threshold can be
calculated with the following formula:
IOCP min + 1.6915129 * 0.0330328
) 0.0000009
Rlim ) 0.0011207(Rlim * 22.375) 2 * 0.0000451
(Rlim * 22.375) 3
(Rlim * 22.375) 4
IOCP max + 2.2885175 * 0.0446914 Rlim ) 0.0015163(Rlim * 22.375) 2 * 0.000061
) 0.0000012 (Rlim * 22.375) 4
(Rlim * 22.375) 3
IOCPtyp + 1.9900152 * 0.0388621 Rlim ) 0.0013185(Rlim * 22.375) 2 * 0.0000531
) 0.0000011 (Rlim * 22.375) 4
(Rlim * 22.375)3
http://onsemi.com
19
NCP380, NCV380
The minimum, typical and maximum current curves are described in the following graph:
Figure 26. Current Threshold vs Rlim Resistor
the current threshold is lower than 500 mA, so in this case
degraded accuracy can be observed.
That is recommended to respect 6 kW − 47 kW resistor
range for two reasons.
For the low resistor values, the current limit is pushed up
to high current level. Due to internal power dissipation
capability, a maximum of 2.4 A typical can be set for the
mDFN package if thermal consideration are respected. For
the TSOP6 version 1.2 A is the maximum recommended
value because the part could enter in thermal shutdown
mode before constant current regulation mode.
In the other side, if we want to keep 15% of accuracy, high
resistor values can be used up to 50 kW. With higher value,
PCB Recommendations
The NCP380 integrates a PMOS FET rated up to 2 A, and
the PCB design rules must be respected to properly evacuate
the heat out of the silicon. The UDFN6 PAD1 must be
connected to ground plane to increase the heat transfer if
necessary. This pad must be connected to ground plane. By
increasing PCB area, the RqJA of the package can be
decreased, allowing higher power dissipation.
Figure 27. USB Host Typical Application
http://onsemi.com
20
NCP380, NCV380
ORDERING INFORMATION
Active
Enable
Level
Over
Current
Limit
UL
Listed
CB
Scheme
NCP380LSNAJAG
EVB
Y
Y
0.5 A
NCP380LSN05AG
EVB
Y
Y
AC6
1.0 A
NCP380LSN10AG
EVB
Y
Y
NCP380LMUAJAATBG
AAC
Adj.
NCP380LMUAJA
GEVB
N
Y
NCP380LMU05AATBG
AE
0.5 A
NCP380LMU05A
GEVB
Y
Y
NCP380LMU10AATBG
AF
1.0 A
NCP380LMU10A
GEVB
Y
Y
NCP380LMU15AATBG
AG
1.5 A
NCP380LMU15A
GEVB
Y
Y
NCP380LMU20AATBG
AL
2.0 A
NCP380LMU20A
GEVB
N
N
NCP380HSNAJAAT1G
AAD
Adj.
NCP380HSNAJA
GEVB
Y
Y
NCP380HSN05AAT1G
AC7
0.5 A
NCP380HSN05A
GEVB
Y
Y
NCP380HSN10AAT1G
ADA
1.0 A
NCP380HSN10A
GEVB
Y
Y
NCP380HMUAJAATBG
AC
Adj.
NCP380HMUAJA
GEVB
N
Y
NCP380HMU05AATBG
AH
0.5 A
NCP380HMU05A
GEVB
Y
Y
NCP380HMU10AATBG
AJ
1.0 A
NCP380HMU10A
GEVB
Y
Y
NCP380HMU15AATBG
AK
1.5 A
NCP380HMU15A
GEVB
Y
Y
NCP380HMU20AATBG
AM
2.0 A
NCP380HMU20A
GEVB
N
N
NCP380HMU21AATBG
AU
2.1 A
NCP380HMU21A
GEVB
N
N
Device
Marking
NCP380LSNAJAAT1G
AAC
Adj.
NCP380LSN05AAT1G
AC5
NCP380LSN10AAT1G
Low
High
Evaluation Board
Package
Shipping†
TSOP−6
(Pb−Free)
TSOP−5
(Pb−Free)
UDFN6
(Pb−Free)
TSOP−6
(Pb−Free)
3000
Tape / Reel
TSOP−5
(Pb−Free)
UDFN6
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements.
http://onsemi.com
21
NCP380, NCV380
PACKAGE DIMENSIONS
UDFN6 2x2, 0.65P
CASE 517AB
ISSUE B
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
PIN ONE
REFERENCE
0.10 C
2X
2X
ÍÍÍ
ÍÍÍ
ÍÍÍ
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
E
0.10 C
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.25
0.35
2.00 BSC
1.50
1.70
2.00 BSC
0.80
1.00
0.65 BSC
0.20
--0.25
0.35
A3
0.10 C
SOLDERING FOOTPRINT*
A
6X
0.08 C
A1
C
6X
e
L
0.40
1
D2
6X
6X
0.47
0.95
SEATING
PLANE
4X
3
1
1.70
E2
6X
K
6
4
BOTTOM VIEW
6X
b
0.10 C A
0.05 C
2.30
B
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
22
NCP380, NCV380
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE H
D 5X
NOTE 5
2X
0.10 T
2X
0.20 T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
0.20 C A B
M
5
1
4
2
L
3
B
S
K
DETAIL Z
G
A
DIM
A
B
C
D
G
H
J
K
L
M
S
DETAIL Z
J
C
0.05
SEATING
PLANE
H
T
SOLDERING FOOTPRINT*
0.95
0.037
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
23
NCP380, NCV380
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE U
D
H
6
E1
5
ÉÉÉ
1
NOTE 5
2
L2
4
GAUGE
PLANE
E
3
L
b
C
DETAIL Z
e
0.05
M
A
SEATING
PLANE
c
A1
DETAIL Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
DIM
A
A1
b
c
D
E
E1
e
L
L2
M
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
2.75
3.00
1.50
1.70
0.95
1.05
0.40
0.60
0.25 BSC
10°
−
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
6X
3.20
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
24
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCP380/D