SLVS418 − JANUARY 2002 DBV PACKAGE (TOP VIEW) features D D D D D D D D D D D Low Dropout Voltage Regulator, 1.2-V 150-mA Load Current Capability Power Okay (POK) Function Load Independent, Low Ground Current,150-µA Current Limiting Thermal Shutdown Low Sleep State Current (Off Mode) Fast Transient Response Low Variation Due to Load and Line Regulation Output Stable With Low ESR Capacitors TTL Logic Controlled Enable Input VI 1 GND 2 EN 3 5 VO 4 POK applications D Processor Powerup Sequencing D Palmtop Computers, Laptops, and Notebooks description The SN105125 is a low dropout voltage regulator with an output tolerance of ±2% over the operating range. The device is optimized for low noise applications and has a low quiescent current (enable <0.8 V). The device has a low dropout voltage at full load (150 mA). The power okay function monitors the output voltage and indicates when an error occurs in the system (active low). In the event of an output fault such as overcurrent, thermal shutdown, or dropout, the power okay output is pulled low (open drain). The SN105125 has a fast transient response recovery capability in the event of load transition from heavy load to light load. The device also minimizes overshoot during this condition. During power down, the output capacitor and load are de-energized through the internal active shutdown clamp, which is turned on when the device is disabled. The SN105125 requires a small output capacitor for stability with low ESR. An input capacitor is not required unless the bulk ac capacitor is placed away from the device or the power supply is a battery. In this situation, a 1-µF capacitor is recommended for the application. Low ESR ceramic capacitors may be used with the device to reduce board space in power applications, a key concern in hand-held wireless devices. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2002, Texas Instruments Incorporated !"# $"%&! '#( '"! ! $#!! $# )# # #* "# '' +,( '"! $!#- '# #!#&, !&"'# #- && $##( POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLVS418 − JANUARY 2002 functional block diagram VI EN Voltage Reference Enable/Disable Control Fault Gate Drive Control and Current Amplifier Error Amplifier Thermal Sensor VO Active Shutdown Undervoltage Lockout Voltage Supervisor With Delay Timer POK Fault Overcurrent Detection and Dropout Voltage Detection Power Okay Control GND Terminal Functions TERMINAL NAME NO. I/O DESCRIPTION EN 3 I Enable/shutdown input (active high) GND 2 I Ground POK 4 I Power okay indicator VI VO 1 I Input supply voltage 5 O Output voltage 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLVS418 − JANUARY 2002 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Main input voltage range, VI (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 7 V Enable input voltage range, V(EN) (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V − VI Power okay output voltage range V(POK), (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V − VI Regulated output current limit, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA Continuous power dissipation, PD, TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 W Electrostatic discharge susceptibility, V(HBMESD), (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV Junction temperature, TJ, . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C Lead temperature (soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values are with respect to GND. 2. Absolute negative voltage on these terminals should not go below –0.5 V. 3. The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each terminal. Devices are ESD sensitive. Handling precautions are recommended. recommended operating conditions MIN TYP MAX UNIT Main input voltage, VI (see Notes 1 and 2) 3 5.25 V Enable input voltage, V(EN) (see Notes 1 and 2) 0 V Power okay voltage, V(POK) (see Notes 1 and 2) 0 VI VI 0 70 °C Operating ambient temperature, TA NOTES: 1. All voltage values are with respect to GND. 2. Absolute negative voltage on these terminals should not go below –0.5 V. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 V 3 SLVS418 − JANUARY 2002 electrical characteristics, TA= 25°C, VI =5 V, V(EN) = VI, IO = 100 µA, CL = 1 µF(unless otherwise noted) regulator VO PARAMETER TEST CONDITIONS Output voltage VO IO = 25 mA IO = 0 Output voltage accuracy Quiescent supply current I(GND) Ground terminal current (see Note 5) IL I(Limit) Output load current ∆V(LNR) ∆V(LDR) Line regulation CL Load capacitance I(REV) NOTES: 4. 5. 6. −1% V 2% µA 1 150 µA A 150 160 IO = 0.1 mA to150 mA, See Note 6 IO = 100 µA UNITS 1% −2% IO = 0 IO = 150 mA VO = 0 VI = 3 V to 5.25 V Load regulation Dropout voltage MAX 150 Output current limit VI − VO TYP 1.2 IO = 50 mA, TA = 0°C to 70°C (see Note 4) V(EN) ≤ 0.8 V IQ MIN mA 300 mA 10 mV 2% 3% 1 IO = 150 mA ESR and capacitance tradeoffs V 1 µF 1 VI = GND, VO = regulated voltage 50 µA Assured by design, not tested in production. Ground terminal current is the regulator quiescent current drawn from the supply to support the load current. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Devices are tested for load regulation in the load range from 0.1 mA to 150 mA. Reverse output current on VI enable input PARAMETER VIL VIH I(EN) TEST CONDITIONS Regulated shutdown VI = 3 V to 5.25 V regulated shutdown VI = 3 V to 5.25 V regulated enabled Regulated enabled Enable input current Resistance discharge MIN TYP MAX 0.8 2 UNITS V V Shutdown, VIL ≤ 0.8 V 0.01 Enabled, VIH ≥ 2 V 0.01 V(EN) ≤ 0.8 V 500 µA A Ω thermal protection (see Note 4) PARAMETER T(SD) T(SDHYS) TEST CONDITIONS MIN Thermal shutdown Hysteresis TYP MAX UNITS 165 °C 15 °C NOTE 4: Assured by design, not tested in production. power okay (see Note 7) PARAMETER TEST CONDITIONS V(POKLO) V(POKTH) Low threshold Output falls % of VO (power NOT okay) High threshold Output reaches % of VO, starts delay timer (power okay) VOL Ilkg VO out of regulation Leakage current Fault condition, IOL = 100 µA MIN TYP MAX UNITS 85% 90% 0.4 V VI = 5 V 1 µA NOTE 7: Power okay is a function of the output voltage being 5% lower than the specified range. The function is a detection of one of the following: over current, over temperature, or dropout. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLVS418 − JANUARY 2002 switching characteristics (see Note 4),TA = 25°C, VI = 5 V, V(EN) = VI, IO = 100 µA, CL = 1 µF(unless otherwise noted) PARAMETER t(STEP) TEST CONDITIONS Power up overshoot Maximum voltage overshoot allowed on output during powerup Output transient time limit Time for output to return within specified regulation range Output transient voltage limit Voltage that load step can affect the nominal output voltage I(SR) tr Load step current slew rate IL = 0.1 mA to 150 mA tf td(POK) Power down fall time MIN TYP MAX UNIT 1% µs 5 1% Power up rise time Discharge resistance = 500 Ω, VO < 1.08 V Power okay delay time VI > V(POKTH) until POK↑ NOTE 4: Assured by design, not tested in production. 10 mA/µs 50 µs 60 µs 2.5 ms thermal resistance PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RθJC Thermal impedance, junction-to-case 145 °C/W RθJA Thermal impedance, junction-to-ambient 235 °C/W POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SLVS418 − JANUARY 2002 PARAMETER MEASUREMENT INFORMATION V(POKTH) 90% VO td(POK) POK Figure 1. Power Okay Timing During Power Up EN VI 85% min 90% max VO POK Delay 2.5 ms typ POK Figure 2. Power Okay Delay Timing and Output Voltage Supervisory 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLVS418 − JANUARY 2002 TYPICAL CHARACTERISTICS VO IL Figure 3. Load Regulation, 50-mA Dynamic Load Step (VI = 3 V) VO IL Figure 4. Load Regulation, 150-mA Dynamic Load Step (VI = 3 V) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SLVS418 − JANUARY 2002 TYPICAL CHARACTERISTICS VO IL Figure 5. Load Regulation, 50-mA Dynamic Load Step (VI = 5 V) VO IL Figure 6. Load Regulation, 150-mA Dynamic Load Step (VI = 5 V) 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLVS418 − JANUARY 2002 TYPICAL CHARACTERISTICS VO POK EN Figure 7. Power Okay Delay During Power Up Condition VO POK Figure 8. Power Okay Delay During Power Down Condition POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 SLVS418 − JANUARY 2002 THERMAL INFORMATION The SN105125 is designed to provide a continuous load current of 150 mA when the maximum power dissipation of the package is not exceeded in the application. To determine the maximum power dissipation of the package, use the junction-to-ambient thermal resistance of the device. The basic equation is as follows: Maximum power dissipation (W) PD(MAX) = (TJ(MAX) − TA) / RθJA (maximum power dissipation limit) Where: TJ(MAX) is the maximum junction temperature of the die (less than 150°C, minimum thermal shutdown) TA is the operating ambient temperature RθJA is the thermal resistance and is layout dependent The recommended minimum footprint offers a RθJA of 235°C/W. To determine the actual power dissipation of the regulator, use the following equation: PD = (VI − VO) IO + VI I(GND) (Watts) Power dissipation resulting from quiescent current is negligible. When the power dissipation is excessive, the thermal protection circuit is triggered. 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLVS418 − JANUARY 2002 APPLICATION INFORMATION 47 kΩ 1 VO 5 VI SN105125 2 GND Optional: EN May Be Connected to VI Enable 3 EN POK 1.2 V 1 µF 4 Shutdown Figure 9. Typical Application Schematic VCC3_3 VCC1_2 1 VO 5 VI SN105125 2 GND 3 EN POK 10 kΩ 4 1 µF 1 µF Figure 10. Typical Application For Processor VID Code Power Sequencing Schematic POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 PACKAGE OPTION ADDENDUM www.ti.com 21-Apr-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp SN105125DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN105125DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Apr-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN105125DBVR Package Package Pins Type Drawing SPQ SOT-23 3000 DBV 5 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 178.0 9.0 Pack Materials-Page 1 3.23 B0 (mm) K0 (mm) P1 (mm) 3.17 1.37 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 20-Apr-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN105125DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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