HLMP-3707, HLMP-3907, HLMP-3750, HLMP-3850, HLMP-3950, HLMP-3960, HLMP-3390, HLMP-3490, HLMP-3590, HLMP-1340, HLMP-1440, HLMP-1540, HLMP-K640 T-13/4 (5 mm), T-1 (3 mm), Ultra‑Bright LED Lamps Data Sheet Description Features These non-diffused lamps out-perform conventional LED lamps. By utilizing new higher intensity material, we achieve superior product performance. • Improved brightness The HLMP‑3750/‑3390/‑1340 Series Lamps are Gallium Arsenide Phosphide on Gallium Phosphide red light emitting diodes. The HLMP‑3850/‑3490/‑1440 Series are Gallium Arsenide Phosphide on Gallium Phosphide yellow light emitting diodes. The HLMP‑3950/3590/3960/1540/ K640 Series Lamps are Gallium Phosphide green light emitting diodes. • Improved color performance • Available in popular T-1 and T-13/4 packages • New sturdy leads • IC compatible/low current capability • Reliable and rugged • Choice of 3 bright colors - High Efficiency Red - High Brightness Yellow - High Performance Green Applications • Lighted switches • Backlighting front panels • Light pipe sources • Keyboard indicators Selection Guide Luminous Intensity Iv (mcd) @ 20mA Package Description Color Device HLMP- Min. Typ. Max.2q1/2 Degree Package Outline T-13/4 3707-L00xx90.2 Red - 24 F 90.2 125.0- 24 A 125.0 - 24 A 96.2 140.0- 24 A 3750 3750-L00xx90.2 3850 Yellow - 3850-K00xx96.2 140.0 - 24 A 3850-KL0xx 96.2 150.0 294.024 A 3907-K00xx111.7 - - 24 F 3914-K00xx111.7 - - 24 D 3950 111.7 265.0- 24 A 3950-K00xx111.7 265.0 - 24 A 3950-LM0xx170.0 300.0 490.0 24 A 3960-K0xxx111.7 265.0 - 24 E T-13/4 Low Profile Red 3390 35.2 32 B Yellow 3490 37.6 55.0- 32 B Green 3590 43.6 55.0- 32 B T-1 Red 1340 35.2 55.0- 45 C 45 C Green 55.0 1340-H00xx13.8 1340-J00xx35.2 55.0 - 45 C 1440 45 C 45 C 45 C Yellow - 23.5 45.0- 1440-H00xx23.5 1540 Green - - 45.0 - 27.3 45.0- 1540-H00xx27.3 45.0 - 45 C 1540-IJ0xx 43.6 60.0 139.645 C K640 21.0 - C 20.0 34.0 45 Emerald Green 2 4.2 K640-FGNxx10.6 45 C Package Dimensions Ø 3.17 (.125) 2.67 (.105) 3.43 (.135) 2.92 (.115) 4.70 (.185) 4.19 (.165) 1.14 (.045) 0.51 (.020) 6.35 (.250) 5.58 (.220) 0.65 (0.026) max. 24.1(.95) min. 1.52 (.060) 1.02 (.040) (0.022) 0.55 SQ. TYP. (0.016) 0.40 9.19 (0.362) 8.43 (0.332) 0.65 MAX. (0.026) 5.08 (0.200) 4.78 (0.188) 5.08 (0.200) 4.78 (0.188) 5.08 (0.200) 4.57 (0.180) 12.47 (0.491) 11.71 (0.461) 1.02 (0.040) MAX. 9.07 (0.357) 8.56 (0.337) 9.07 (0.357) 8.56 (0.337) 13.11 (0.516) 12.34 (0.486) 0.89 (0.035) 0.64 (0.025) 0.89 (0.035) 0.64 (0.025) 0.89 (0.035) 0.64 (0.025) 2.79 (.110) 2.29 (.090) 0.8 (0.031) 25.40 (1.00) MIN. 1.32 (0.052) 1.02 (0.040) 1.27 (0.050) NOM. 23.0 MIN. (0.900) 22.86 (0.900) MIN. CATHODE LEAD (NOTE 1) 0.46 (0.018) SQUARE NOM. 6.10 (0.240) 5.59 (0.220) 1.52 (0.060) 1.02 (0.040) CATHODE FLAT 2.54 (0.100) NOM. PACKAGE OUTLINE "D" HLMP-3914 0.74 (0.029) 0.58 (0.023) SQUARE Ø 6.10 (0.240) 5.60 (0.220) 2.54 (0.100) NOM. PACKAGE OUTLINE "E" HLMP-3960 Notes: 1. All dimensions are in millimeters (inches). 2. An epoxy meniscus may extend about 1 mm (0.40") down the leads. 3. For PCB hole recommendations, see the Precautions section. 3 1.02 (0.040) MAX. EPOXY MENISCUS 1.52 (0.060) 1.02 (0.040) 0.53 (0.021) SQ. 0.43 (0.017) 6.10 (0.240) 5.60 (0.220) CATHODE FLAT 2.79 (0.110) 2.29 (0.090) PACKAGE OUTLINE "F" HLMP-3707/3907 Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk 01: Tape & Reel, Crimped Leads 02, Bx: Tape & Reel, Straight Leads A1, B1: Right Angle Housing, Uneven Leads A2, B2: Right Angle Housing, Even Leads Dx, Ex: Ammo Pack, Straight Leads FH: 2 Iv Bin Select with Inventory Control Vx: Ammo Pack, Crimped Leads Color Bin Options 0: Full Color Bin Distribution N: Color Bin 6 & 7 Only Maximum Iv Bin Options 0: Open (No. Max. Limit) Others: Please Refer to the Iv Bin Table Minimum Iv Bin Options Please Refer to the Iv Bin Table Color Options 3, 7: GaP HER 4, 8: GaP Yellow (except K4xx series) 5, 9: GaP Green 6: GaP Emerald Green Package Option 1, K: T-1 (3 mm) 3: T-13/4 (5 mm) Absolute Maximum Ratings at TA = 25°C Parameter Red Yellow Green/Emerald Green Units Peak Forward Current 90 60 90 mA Average Forward Current[1] 25 20 25 mA DC Current[2] 30 20 30 mA Transient Forward Current[3] 500 500 500 mA Reverse Voltage (IR = 100 µA) 5 5 5 V LED Junction Temperature 110 110 110 °C Operating Temperature Range -40 to +100 -40 to +100 -20 to +100 °C Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 °C (10 µs Pulse) Notes: 1. See Figure 2 to establish pulsed operating conditions. 2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C. 3. The transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the LED die and wire bonds. It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current. 4 Electrical/Optical Characteristics at TA = 25°C T-13/4 SymbolDescription T-13/4 Low Dome T-1 Min. Typ. Max. Units Test Conditions λPEAK Peak 37xx 3390 Wavelength 38xx 3490 39xx 3590 1340 1440 1540 K640 635 nm 583 565 558 Measurement at Peak λd Dominant 37xx 3390 Wavelength 38xx 3490 39xx 3590 1340 1440 1540 K640 626 585 569 560 nm Note 1 ∆λ3/4 Spectral Line 37xx 3390 Halfwidth 38xx 3490 39xx 3590 1340 1440 1540 K640 40 36 28 24 nm τs Speed of 37xx 3390 Respond 38xx 3490 39xx 3590 1340 1440 1540 K640 90 90 500 3100 ns C Capacitance 37xx 3390 38xx 3490 39xx 3590 1340 1440 1540 K640 11 pF 15 18 35 VF = 0, f = 1 MHz RθJ-PIN Thermal 37xx 3390 210 °C/W Resistance 38xx 3490 210 39xx3590 210 510 1340 290 1440 290 1540 290 K640 290 Junction to Cathode Lead VF Forward 37xx 3390 Voltage 38xx 3490 39xx 3590 1340 1.5 1440 1.5 1540 1.5 K640 IF = 20 mA (Figure 3) VR Reverse 37xx 3390 Breakdown38xx 3490 Voltage 39xx3590 13405.0 1440 1540 K640 V IF = 100 µA ηv Luminous 37xx 3390 Efficacy 38xx 3490 39xx 3590 1340 1440 1540 K640 lumens watt Note 2 Notes: 1.9 2.1 2.2 2.2 2.6 V 2.6 3.0 3.0 145 500 595 655 1. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = IV/hV , where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens/watt. 5 Red, Yellow, and Green 1.0 EMERALD GREEN T A= 25° C RELATIVE INTENSITY GREEN HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 650 700 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. Figure 2. Maximum tolerable peak current vs. pulse duration. (IDC MAX as per MAX ratings). Figure 3. Forward current vs. forward voltage. Figure 4. Relative luminous intensity vs. forward current. Figure 5. Relative efficiency (luminous intensity per unit current) vs. peak current. 6 Figure 6. Relative luminous intensity vs. angular displacement. T-13/4 lamp. Figure 7. Relative luminous intensity vs. angular displacement. T-13/4 low profile lamp. Intensity Bin Limits Intensity Range (mcd) ColorBin Min.Max. RedG 9.715.5 Figure 8. Relative luminous intensity vs. angular displacement. T-1 lamp. H 15.524.8 I 24.839.6 J 39.663.4 K 63.4101.5 L 101.5162.4 M 162.4234.6 N 234.6340.0 O 340.0540.0 P 540.0850.0 Q 850.01200.0 R 1200.01700.0 S 1700.02400.0 T 2400.03400.0 U 3400.04900.0 V 4900.07100.0 W 7100.010200.0 X 10200.014800.0 Y 14800.021400.0 Z 21400.030900.0 Maximum tolerance for each bin limit is ±18%. 7 Intensity Bin Limits (continued) Color Categories Intensity Range (mcd) Color BinMin. Max. Color Cat # Lambda (nm) Min. Max. YellowF 10.3 Emerald Green 9 552.5 555.5 16.6 G16.6 26.5 8 555.5558.5 H26.5 42.3 7 558.5561.5 I42.3 67.7 6 561.5564.5 J67.7 108.2 Green 6 561.5564.5 K108.2173.2 5 564.5567.5 L 173.2250.0 4 567.5570.5 M250.0 360.0 3 570.5573.5 N360.0510.0 2 573.5576.5 O510.0800.0 Yellow 1 582.0584.5 P800.01250.0 3 584.5587.0 Q 1250.01800.0 2 587.0589.5 R 1800.02900.0 4 589.5592.0 S 2900.04700.0 5 592.0593.0 T 4700.07200.0 Orange 1 597.0599.5 U 7200.011700.0 2 599.5602.0 V 11700.018000.0 3 602.0604.5 W 18000.027000.0 4 604.5607.5 Green/A 1.1 1.8 5 607.5610.5 EmeraldB 2.9 6 610.5613.5 GreenC 2.9 4.7 7 613.5616.5 D4.7 7.6 8 616.5619.5 E7.6 12.0 F12.0 19.1 G19.1 30.7 H30.7 49.1 I49.1 78.5 J78.5 125.7 K125.7201.1 L 201.1289.0 M289.0 417.0 N417.0680.0 O680.01100.0 P 1100.01800.0 Q 1800.02700.0 R 2700.04300.0 S 4300.06800.0 T 6800.010800.0 U 10800.016000.0 V W 25000.040000.0 1.8 16000.025000.0 Maximum tolerance for each bin limit is ±18%. 8 Maximum tolerance for each bin limit is ±0.5 nm. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 01 Tape & Reel, crimped leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1 02 Tape & Reel, straight leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1 A1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag A2 T-1, Right Angle Housing, even leads, minimum increment 500 psc/bag B1T-13/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag B2T-13/4, Right Angle Housing, even leads, minimum increment 500 psc/bag BJ T-1, Tape & Reel, straight leads, minimum increment 2000 pcs/bag EG Ammo Pack, straight leads in 5 K increment FH Devices that require inventory control and 2 Iv bin select VR Ammo Pack, crimped leads, min. increment 2 k for T-13/4 and T-1 Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. 9 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59 mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Manual Solder Soldering[1],[2]Dipping Pre-heat Temperature 105°C Max. – Pre-heat Time 60 sec Max. – Peak Temperature 250°C Max. 260°C Max. Dwell Time 3 sec Max. 5 sec Max. Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. 10 • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads: LED Component Lead Size Diagonal Plated ThroughHole Diameter Lead size (typ.) 0.45 × 0.45 mm (0.018 × 0.018 in.) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) Dambar shear- 0.65 mm off area (max.) (0.026 in) 0.919 mm (0.036 in) Lead size (typ.) 0.50 × 0.50 mm (0.020 × 0.020 in.) 0.707 mm (0.028 in) Dambar shear- 0.70 mm off area (max.) (0.028 in) 0.99 mm (0.039 in) 1.05 to 1.15 mm (0.041 to 0.045 in) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) 100 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 50 PREHEAT 0 10 20 30 Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 40 50 60 TIME (MINUTES) 70 80 90 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Lamps Baby Label (1P) PART #: Part Number 11 RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes 5989-4254EN AV02-1556EN -June 14, 2013