TWL6030 SWCS051B – AUGUST 2010 – REVISED DECEMBER 2012 www.ti.com Fully Integrated Power Management with Switch Mode Charger FEATURES 1 • • • • • • • • • • • Seven highly efficient 6-MHz buck converters – Two 0.6 to 2.1 V @ 1.5 A (up to 2.0 A with some limitations) – Five 0.6 to 2.1 V @ 0.8 A (up to 1.0 A with some limitations) 11 General-purpose LDOs – Six 1.0 to 3.3 V @ 0.2 A with battery or preregulated supply (One can be used as a vibrator driver.) – One 1.0 to 3.3 V @ 50 mA with battery or preregulated supply – One low noise 1.0 to 3.3 V @ 50 mA with battery or preregulated supply – 3.3 V @ 35 mA USB LDO – One LDO for TWL6030 internal use – One LDO for internal and external use USB OTG module Backup battery charger 10-bit ADC with 17 input channels 13-bit Coulomb counter with four programmable integration periods Low power consumption – 5 µA in backup mode – 20 µA in wait-on mode – 110 µA in deep sleep, with two DCDCs active RTC with alarm wake-up mechanism SIM and MMC card detections Two digital PWM outputs Thermal monitoring – High-temperature warning – Thermal shutdown • • • • Control – Configurable power-up and power-down sequences (OTP memory) – Three output signals that can be included in the start-up sequence – Two I2C™ interfaces – All resources configurable by I2C Clock management 32-kHz output Battery charger 1.5 A – Charger for single-cell Li-Ion and Li-Polymer battery packs – Switched mode charger with integrated power FET for up to 1.5-A current – High-accuracy voltage and current regulation – Safety timer and reset control – Thermal regulation protection – Input/output overvoltage protection – Charging indicator LED driver – Boost mode operation for USB OTG – Compliant with: – USB 2.0 – OTG and EH 2.0 – YD/T 1591-2006 – USB battery charging 1.2 – Japanese battery charging requirements (JEITA) Package 7 mm x 7 mm 187-pin nFBGA APPLICATIONS • • • • • • Mobile phones and smart phones Gaming handsets Portable media players Portable navigation systems Handheld devices Tablets 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2012, Texas Instruments Incorporated TWL6030 SWCS051B – AUGUST 2010 – REVISED DECEMBER 2012 www.ti.com DESCRIPTION The TWL6030 device is an integrated power-management integrated circuit (IC) for applications powered by a rechargeable battery. The device provides seven configurable step-down converters with up to 2.0-A capability for memory, processor core, I/O, auxiliary, preregulation for LDOs, etc. The device also contains 11 LDO regulators that can be supplied from a battery or a preregulated supply. Power-up/power-down controller is configurable and can support any power-up/power-down sequences (programmed in OTP memory). The real-time clock (RTC) provides a 32-kHz output buffer, second/minute/hour/day/month/year information, and alarm wake up. The TWL6030 supports 32-kHz clock generation based on a crystal oscillator. The device integrates a switched-mode charger allowing faster battery charge, higher efficiency, and less power dissipation. The TWL6030 device generates power supplies for OMAP™ 4 processors and operates together with the TWL6040 device, which includes all audio and related detection features. For audio IC parameters, see the TWL6040 datasheet. The TWL6030 is available in an nFBGA package, 7.0 mm x 7.0 mm, with a 0.4-mm ball pitch. Figure 1 shows the TWL6030 block diagram. 2 Copyright © 2010–2012, Texas Instruments Incorporated TWL6030 REFGND VBG VAUX2 VAUX1 Control Ols VPP VMMC VUSIM REFS TESTV VCORE1_IN VCORE1_SW VCORE1 VCORE1_FDBK SR bus Events bus VCORE1_GND VCORE2_IN VCORE2_SW Events detect SRI2C_SCL SRI2C_SDA MSECURE VCORE2 I2C SmartReflex VCORE2_FDBK OCP bus OSC32KIN OSC32KCAP OSC32KOUT IREF VAUX2_IN VAUX1 VAUX1_IN VUSIM_IN1 VUSIM VMMC VMMC_IN1 VPP VPP_IN VIO GND_DIG_VIO BOOT0 BOOT1 BOOT2 BOOT3 RESPWRON NRESWARM PWRON RPWRON PREQ1 PREQ2A PREQ2B PREQ2C PREQ3 INT SYSEN REGEN1 REGEN2 TESTEN VAUX2 SWCS051B – AUGUST 2010 – REVISED DECEMBER 2012 www.ti.com Xtal 32K RC 32K RC 6M VCORE2_GND VCORE3_IN Power control VCORE3_SW CLK32KAO CLK32KG CLK32KAUDIO VCORE3 VCORE3_FDBK ID USB SRP CTLI2C_SCL I2C control RTC VCORE3_GND VMEM_IN VMEM_SW CTLI2C_SDA VMEM VMEM_FDBK I2C to OCP SIM MMC BATREMOVAL PWM1 PWM2 VMEM_GND V1V8_IN Card detect and PWM V1V8_SW V1V8 V1V8_FDBK MUX Scalers GPADC_IN0 GPADC_IN1 GPADC_VREF1 GPADC_IN2 GPADC_IN3 GPADC_IN4 GPADC_VREF4 GPADC_IN5 GPADC_IN6 V1V8_GND V1V2_IN Control, data, and test logic 10-bit ADC V2V1_SW V 2V1 V2V1_FDBK GPADC_START GGAUGE_RESP V2V1_GND V1V29_IN Auto calib GGAUGE_RESN 13-bit SD ADC Digital filter V1V29_SW V1V29 V1V29_FDBK Interrupt handler CHRG_EXTCHRG_ENZ CHRG_EXTCHRG_STATZ VAC Ext charger ctl V1V29_GND VANA_IN OSC 3 MHz VANA VANA VBUS CHRG_PMID VRTC_IN USB charger and VBUS OTG VAUX3 VCXIO CHRG_GND VRTC VRTC VUSB CHRG_CSOUT VDAC CHRG_SW CHRG_CSIN CHRG_AUXPWR GND_DIG_VRTC VAUX3_IN GND_ANA_B1 GND_ANA_B2 GND_ANA_B3 GND_ANA_B4 GND_ANA_B5 GND_ANA_B6 GND_ANA_B7 VDD_B1 VDD_B2 VDD_B4 VAUX3 VCXIO_IN VCXIO VDAC_IN VDAC VDD_B3 CHRG_PMID VUSB CHRG_LED_IN CHRG_LED_TEST CHRG_VREF CHRG_DET_N VBAT SWCS045-001 Figure 1. TWL6030 Block Diagram Copyright © 2010–2012, Texas Instruments Incorporated 3 TWL6030 SWCS051B – AUGUST 2010 – REVISED DECEMBER 2012 www.ti.com space For the complete TWL6030 data sheet, contact your TI sales representative. The document is internally available for download on ESP under the corresponding TWL6030 product folders and can be shared with customers. 4 Copyright © 2010–2012, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 15-Jun-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) TWL6030B107CMR ACTIVE FCBGA CMR 187 260 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR -40 to 85 6030B107 TWL6030B107CMRR ACTIVE FCBGA CMR 187 2500 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR -40 to 85 6030B107 TWL6030B1A0CMR ACTIVE FCBGA CMR 187 260 TBD Call TI Call TI 6030B1A0 TWL6030B1A0CMRR ACTIVE FCBGA CMR 187 2500 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR 6030B1A0 TWL6030B1A4CMR ACTIVE FCBGA CMR 187 260 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR -40 to 85 6030B1A4 TWL6030B1A4CMRR ACTIVE FCBGA CMR 187 2500 Green (RoHS & no Sb/Br) Call TI Level-3-260C-168 HR -40 to 85 6030B1A4 TWL6030B1AACMR ACTIVE FCBGA CMR 187 260 TBD Call TI Call TI 6030B1AA TWL6030B1AACMRR ACTIVE FCBGA CMR 187 2500 TBD Call TI Call TI 6030B1AA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Jun-2013 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Jun-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TWL6030B107CMRR FCBGA CMR 187 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q1 TWL6030B1A0CMRR FCBGA CMR 187 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q1 TWL6030B1A4CMRR FCBGA CMR 187 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q1 TWL6030B1AACMRR FCBGA CMR 187 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Jun-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TWL6030B107CMRR FCBGA CMR 187 2500 336.6 336.6 31.8 TWL6030B1A0CMRR FCBGA CMR 187 2500 336.6 336.6 31.8 TWL6030B1A4CMRR FCBGA CMR 187 2500 336.6 336.6 31.8 TWL6030B1AACMRR FCBGA CMR 187 2500 336.6 336.6 31.8 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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