A Business Partner of Renesas Electronics Corporation. Preliminary PS9306L,PS9306L2 Data Sheet R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 0.6 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 6-PIN SDIP PHOTOCOUPLER DESCRIPTION The PS9306L and PS9306L2 are optical coupled isolators containing a GaAlAs LED on the input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip. The PS9306L and PS9306L2 are in 6-pin plastic SDIP (Shrink Dual In-line Package). The PS9306L2 has 8 mm creepage distance. The mount area of 6-pin plastic SDIP is half size of 8-pin DIP. The PS9306L and PS9306L2 are designed specifically for high common mode transient immunity (CMR) and high switching speed. It is suitable for driving IGBTs and MOS FETs. The PS9306L is lead bending type (Gull-wing) for surface mounting. The PS9306L2 is lead bending type for long creepage distance (Gull-wing) for surface mount. FEATURES Long creepage distance (8 mm MIN.: PS9306L2) Half size of 8-pin DIP Peak output current (0.6 A MAX., 0.4 A MIN.) High speed switching (tPLH, tPHL = 0.4 μs MAX.) High common mode transient immunity (CMH, CML = ±25 kV/μs MIN.) Embossed tape product : PS9306L-E3, PS9306L2-E3: 2 000 pcs/reel Pb-Free product Safety standards • UL approved: No. E72422 • CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950) • SEMKO approved: No. 1115598 • DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option) PIN CONNECTION (Top View) 6 5 4 SHIELD <R> • • • • • • • • 1 2 1. Anode 2. NC 3. Cathode 4. VEE 5. VO 6. VCC 3 APPLICATIONS • IGBT, Power MOS FET Gate Driver • Industrial inverter • IH (Induction Heating) The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 1 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 Chapter Title PACKAGE DIMENSIONS (UNIT: mm) Lead Bending Type (Gull-wing) For Surface Mount PS9306L 4.58±0.3 6.8±0.25 (0.82) 9.7±0.3 0.25±0.15 0.2±0.15 3.5±0.2 3.7±0.25 7.62 1.27 0.4±0.1 0.8±0.25 0.25 M Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount) PS9306L2 4.58±0.3 6.8±0.25 (0.82) 11.5±0.3 1.27 0.4±0.1 R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 0.25±0.15 0.2±0.15 3.5±0.2 3.7±0.25 7.62 0.75±0.25 0.25 M Page 2 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 Chapter Title PHOTOCOUPLER CONSTRUCTION Parameter Air Distance (MIN.) Outer Creepage Distance (MIN.) Isolation Distance (MIN.) <R> PS9306L 7 mm 7 mm 0.4 mm PS9306L2 8 mm 8 mm 0.4 mm MARKING EXAMPLE R 9306 N131 Company Initial Type Number Assembly Lot No. 1 pin Mark N 1 31 Week Assembled Year Assembled (Last 1 Digit) Rank Code R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 3 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 <R> Chapter Title ORDERING INFORMATION Part Number Order Number PS9306L PS9306L-E3 PS9306L-AX PS9306L-E3-AX PS9306L2 PS9306L2-E3 PS9306L2-AX PS9306L2-E3-AX PS9306L-V PS9306L-V-E3 PS9306L-V-AX PS9306L-V-E3-AX PS9306L2-V PS9306L2-V-AX PS9306L2-V-E3 PS9306L2-V-E3-AX Note: Solder Plating Specification Pb-Free (Ni/Pd/Au) Packing Style 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel Safety Standard Approval Application Part *1 Number PS9306L Standard products (UL, CSA, SEMKO approved) PS9306L2 DIN EN60747-5-2 (VDE0884 Part2) approved (Option) PS9306L PS9306L2 *1. For the application of the Safety Standard, following part number should be used. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 4 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 Chapter Title ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Forward Current Diode Peak Transient Forward Current (Pulse Width < 1 μs) Reverse Voltage Power Dissipation *1 Detector High Level Peak *2 Output Current Low Level Peak *2 Output Current Supply Voltage Output Voltage Power Dissipation *3 Isolation Voltage *4 Operating Frequency *5 Operating Ambient Temperature Storage Temperature Symbol IF IF (TRAN) Ratings 25 1.0 Unit mA A VR PD IOH (PEAK) 5 45 0.6 V mW A IOL (PEAK) 0.6 A (VCC−VEE) VO PC BV f TA Tstg 0 to 35 0 to VCC 250 5 000 50 −40 to +110 −55 to +125 V V mW Vr.m.s. kHz °C °C Notes: *1. *2. *3. *4. Reduced to 1.2 mW/°C at TA = 85°C or more. Maximum pulse width = 10 μs, Maximum duty cycle = 0.2% Reduced to 4.5 mW/°C at TA = 65°C or more. AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output. Pins 1-3 shorted together, 4-6 shorted together. *5. IOH (PEAK) ≤ 0.4 A (≤ 2.0 μs), IOL (PEAK) ≤ 0.4 A (≤ 2.0 μs) RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Forward Current (ON) Forward Voltage (OFF) Operating Ambient Temperature R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Symbol (VCC−VEE) IF (ON) VF (OFF) TA MIN. 10 8 −2 −40 TYP. MAX. 30 12 0.8 110 Unit V mA V °C Page 5 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 Chapter Title ELECTRICAL CHARACTERISTICS (TA = −40 to +110°C, VCC = 10 to 30 V, IF (ON) = 8 to 12 mA, VF (OFF) = −2 to 0.8 V, VEE = GND, unless otherwise specified) Diode Detector <R> <R> Coupled Notes: *1. *2. *3. *4. Parameter Forward Voltage Reverse Current Input Capacitance High Level Output Current Symbol VF IR CIN IOH Low Level Output Current IOL High Level Output Voltage Low Level Output Voltage High Level Supply Current Low Level Supply Current VOH VOL ICCH ICCL Threshold Input Current (L → H) IFLH Conditions MIN. TYP.*1 MAX. IF = 10 mA, TA = 25°C 1.2 1.56 1.8 VR = 3 V, TA = 25°C 10 f = 1 MHz, VF = 0 V, TA = 25°C 30 VO = (VCC − 4 V) *2 0.2 *3 VO = (VCC − 10 V) 0.4 0.5 VO = (VEE + 2.5 V) *2 0.2 0.4 *3 VO = (VEE + 10 V) 0.4 0.5 IO = −100 mA *4 VCC − 4.0 VCC − 1.8 IO = 100 mA 0.4 1.0 IF = 10 mA, IO = 0 mA 0.7 3.0 IF = 0 mA, IO = 0 mA 1.2 3.0 IO = 0 mA, VO > 5 V 7.0 Threshold Input Voltage (H → L) Isolation Capacitance VFHL IO = 0 mA, VO < 5 V CI-O VF = 0 V, f = 1 MHz, TA = 25°C 0.8 Unit V μA pF A A V V mA mA mA V 0.7 pF Typical values at TA = 25°C, VCC − VEE = 30 V. Maximum pulse width = 50 μs, Maximum duty cycle = 0.5%. Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%. VOH is measured with the DC load current in this testing. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 6 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 Chapter Title SWITCHING CHARACTERISTICS (TA = −40 to +110°C, VCC = 10 to 30 V, IF (ON) = 8 to 12 mA, VF (OFF) = −2 to 0.8 V, VEE = GND, unless otherwise specified) Parameter Symbol Propagation Delay Time (L → H) tPLH Propagation Delay Time (H → L) tPHL Pulse Width Distortion (PWD) |tPHL−tPLH| tPHL−tPLH Propagation Delay Time (Difference Between Any Two Products) Rise Time tr Fall Time tf |CMH| Common Mode Transient Immunity at High Level Output Common Mode Transient Immunity at Low Level Output |CML| Conditions Rg = 47 Ω, Cg = 3 nF, f = 10 kHz, Duty Cycle = 50%*2, MIN. 0.05 0.05 IF = 10 mA, VCC = 30 V −0.3 TYP.*1 0.18 0.18 MAX. 0.4 0.4 0.25 0.3 50 50 Unit μs μs μs μs TA = 25°C, IF = 10 mA, VCC = 30 V, VCM = 1.5 kV, VO (MIN.) = 26 V 25 ns ns kV/μs TA = 25°C, IF = 0 mA, VCC = 30 V, VCM = 1.5 kV, VO (MAX.) = 1 V 25 kV/μs Notes: *1. Typical values at TA = 25°C, VCC − VEE = 30 V. *2. This load condition is equivalent to the IGBT load at 1 200 V/25 A. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 7 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 Chapter Title TEST CIRCUIT Fig. 2 IOL Test Circuit Fig. 1 IOH Test Circuit 1 6 2 5 3 4 IF = 8 to 12 mA VCC = 10 to 30 V 0.1 μ F SHIELD 4V IOH 1 6 2 5 3 4 0.1 μ F SHIELD Fig. 3 VOH Test Circuit 1 6 2 5 3 IF = 8 to 12 mA <R> 0.1 μ F SHIELD 4 IF 6 2 5 3 VCC = 10 to 30 V VOH 100 mA 4 2.5 V 1 6 2 5 VCC = 10 to 30 V 0.1 μ F 3 SHIELD VOL 100 mA 4 Fig. 6 ICCH/ICCL Test Circuit VCC = 10 to 30 V 0.1 μ F SHIELD IOL Fig. 4 VOL Test Circuit Fig. 5 IFLH Test Circuit 1 VCC = 10 to 30 V VO > 5 V 1 6 2 5 3 SHIELD VCC = 10 to 30 V 0.1 μ F 4 ICCL: IF = 0 mA ICCH: IF = 10 mA R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 8 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 Chapter Title <R> Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms IF = 10 mA 10 kHz 50% DUTY CYCLE 1 VCC = 10 to 30 V 6 0.1 μ F 3 <R> 47 Ω 3 nF 4 SHIELD tr VO 5 2 IF VOUT tf 90% 50% 10% tPLH tPHL Fig. 8 CMR Test Circuit and Wave Forms IF A B 1 6 0.1 μ F 2 5 3 4 SHIELD + − VCM = 1.5 kV VCC = 30 V VO VCM 1 500 V 90% 10% VO (Switch A: IF = 10 mA) VO (Switch B: IF = 0 mA) tr tf VOH 26 V 1V VOL Remarks 1. Common Mode Transient Immunity at High Level Output is the maximum value of dVCM/dt at which the output remains High Level (e.g. VO > 26 V). 2. Common Mode Transient Immunity at Low Level Output is the maximum value of dVCM/dt at which the output remains Low Level (e.g. VO < 1.0 V). R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 9 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE Diode Power Dissipation PD (mW) 45 40 35 30 25 20 15 10 5 Forward Current IF (mA) 100 25 50 75 100 50 0 0 25 50 75 100 125 FORWARD CURRENT vs. FORWARD VOLTAGE THRESHOLD INPUT CURRENT vs. AMBIENT TEMPERATURE 7 TA = +110°C +100°C +85°C +50°C +25°C 0°C –40°C 1.2 1.4 1.6 1.8 2.0 2.2 VCC = 30 V, VO > 5 V, IO = 0 mA 6 5 4 3 2 1 0 –50 2.4 –25 0 25 50 75 100 125 Forward Voltage VF (V) Ambient Temperature TA (°C) OUTPUT VOLTAGE vs. FORWARD CURRENT HIGH LEVEL OUTPUT VOLTAGE – SUPPLY VOLTAGE vs. AMBIENT TEMPERATURE 0 High Level Output Voltage – Supply Voltage VOH – VCC (V) VCC = 30 V 25 20 15 10 5 0 100 Ambient Temperature TA (°C) 0.1 30 150 Ambient Temperature TA (°C) 1 35 200 125 10 0.01 1.0 250 Threshold Input Current IFLH (mA) 0 0 DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE 300 Detector Power Dissipation PC (mW) 50 Output Voltage VO (V) <R> Chapter Title 2 4 6 7 Forward Current IF (mA) VCC = 30 V, IF = 10 mA, IO = –100 mA –0.5 –1 –1.5 –2 –2.5 –3 –3.5 –4 –50 –25 0 25 50 75 100 125 Ambient Temperature TA (°C) Remark The graphs indicate nominal characteristics. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 10 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 Chapter Title 1 VCC = 30 V, 0.9 IF = 10 mA, 0.8 (VCC – VOH) = 4 V Low Level Output Current IOL (A) 0.6 0.5 0.4 0.3 0.2 0.1 1 Low Level Output Voltage VOL (V) 1 0.7 0 –50 –25 0 LOW LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE 25 50 75 100 VCC = 30 V, IF = 0 mA, VOL = 2.5 V 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 –50 125 25 50 75 100 LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE SUPPLY CURRENT vs. AMBIENT TEMPERATURE VCC = 30 V, IF = 0 mA, IO = 100 mA 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 –50 –25 0 25 50 75 100 125 3 2.5 2 1.5 ICCL (IF = 0 mA) 1 ICCH (IF = 10 mA) 0.5 0 –50 –2 –3 VCC = 30 V, IF = 10 mA 0.2 0.3 0.4 0.5 25 50 75 100 125 4 Low Level Output Voltage VOL (V) –1 0.1 0 LOW LEVEL OUTPUT VOLTAGE vs. LOW LEVEL OUTPUT CURRENT 0 0 –25 Ambient Temperature TA (°C) HIGH LEVEL OUTPUT VOLTAGE – SUPPLY VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT –4 125 VCC = 30 V, VO = OPEN Ambient Temperature TA (°C) High Level Output Voltage – Supply Voltage VOH – VCC (V) 0 Ambient Temperature TA (°C) 0.9 –5 –25 Ambient Temperature TA (°C) High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) High Level Output Current IOH (A) HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE 0.6 High Level Output Current IOH (A) VCC = 30 V, IF = 0 mA 3 2 1 0 0 0.1 0.2 0.3 0.4 0.5 0.6 Low Level Output Current IOL (A) Remark The graphs indicate nominal characteristics. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 11 of 19 A Business Partner of Renesas Electronics Corporation. SUPPLY CURRENT vs. SUPPLY VOLTAGE VO = OPEN 2.5 2 1.5 ICCL (IF = 0 mA) 1 ICCH (IF = 10 mA) 0.5 0 10 400 15 25 20 30 250 200 150 tPLH tPHL 50 400 10 250 tPHL 200 150 tPLH 100 PWD 50 0 –50 –25 0 25 50 75 100 20 25 400 350 300 250 200 tPHL 150 tPLH 100 50 0 10 15 20 25 Supply Voltage VCC (V) PROPAGATION DELAY TIME vs. LOAD CAPACITANCE PROPAGATION DELAY TIME vs. LOAD RESISTANCE VCC = 30 V, IF = 10 mA, Rg = 47 Ω, f = 10 kHz, Duty cycle = 50% 300 250 200 tPHL 150 tPLH 100 50 0 50 100 Load Capacitance Cg (nF) 125 IF = 10 mA, Rg = 47 Ω, Cg = 3 nF, f = 10 kHz, Duty cycle = 50% Forward Current IF (mA) 350 0 300 PROPAGATION DELAY TIME vs. SUPPLY VOLTAGE 300 0 VCC = 30 V, IF = 10 mA, Rg = 47 Ω, Cg = 3 nF, f = 10 kHz, Duty cycle = 50% 350 PROPAGATION DELAY TIME vs. FORWARD CURRENT 350 0 400 Ambient Temperature TA (°C) VCC = 30 V, Rg = 47 Ω, Cg = 3 nF, f = 10 kHz, Duty cycle = 50% 100 PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. AMBIENT TEMPERATURE Supply Voltage VCC (V) Propagation Delay Time tPHL, tPLH (ns) 3 Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) Chapter Title Propagation Delay Time tPHL, tPLH (ns) Propagation Delay Time tPHL, tPLH (ns) Propagation Delay Time tPHL, tPLH (ns) High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) PS9306L,PS9306L2 400 350 30 VCC = 30 V, IF = 10 mA, Cg = 3 nF, f = 10 kHz, Duty cycle = 50% 300 250 200 tPHL 150 tPLH 100 50 0 0 50 100 Load Resistance Rg (Ω) Remark The graphs indicate nominal characteristics. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 12 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 TAPING SPECIFICATIONS (UNIT: mm) 7.5±0.1 1.5 +0.1 –0 4.5 MAX. 10.2±0.1 4.0±0.1 16.0±0.3 2.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 1.5 +0.1 –0 8.0±0.1 0.35 5.08±0.1 4.05±0.1 Tape Direction PS9306L-E3 Outline and Dimensions (Reel) 2.0±0.5 13.0±0.2 R 1.0 21.0±0.8 100±1.0 2.0±0.5 330±2.0 <R> Chapter Title 17.5±1.0 21.5±1.0 Packing: 2 000 pcs/reel R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 15.9 to 19.4 Outer edge of flange Page 13 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 Chapter Title 11.5±0.1 1.5 +0.1 –0 4.5 MAX. 12.0±0.1 4.0±0.1 24.0±0.3 2.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 2.0 +0.1 –0 0.35 5.08±0.1 4.05±0.1 8.0±0.1 Tape Direction PS9306L2-E3 Outline and Dimensions (Reel) R 1.0 21.0±0.8 100±1.0 2.0±0.5 13.0±0.2 330±2.0 2.0±0.5 25.5±1.0 29.5±1.0 Packing: 2 000 pcs/reel R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 23.9 to 27.4 Outer edge of flange Page 14 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) C D B <R> Chapter Title A Part Number Lead Bending A B C D PS9306L lead bending type (Gull-wing) for surface mount 9.2 1.27 0.8 2.2 PS9306L2 lead bending type (Gull-wing) for long creepage distance (surface mount) 10.2 1.27 0.8 2.2 R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 15 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering • Peak reflow temperature • Time of peak reflow temperature • Time of temperature higher than 220°C • Time to preheat temperature from 120 to 180°C • Number of reflows • Flux 260°C or below (package surface temperature) 10 seconds or less 60 seconds or less 120±30 s Th ree Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Recommended Temperature Profile of Infrared Reflow Package Surface Temperature T (°C) <R> Chapter Title (heating) to 10 s 260°C MAX. 220°C to 60 s 180°C 120°C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature • Time • Preheating conditions • Number of times • Flux 260°C or below (molten solder temperature) 10 seconds or less 120°C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron • Peak Temperature (lead part temperature) 350°C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 16 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 <R> Chapter Title USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. Board designing (1) By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close to the input block pattern of the photocoupler. If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics. (If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the range of the recommended operating conditions, and be sure to thoroughly evaluate operation.) (3) Pin 2 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open. Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may degrade the internal noise environment of the device. Note: *1. NC: Non-Connection (No Connection). 3. Make sure the rise/fall time of the forward current is 0.5 μs or less. 4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less. 5. Avoid storage at a high temperature and high humidity. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 17 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 <R> Chapter Title SPECIFICATION OF VDE MARKS LICENSE DOCUMENT Parameter Climatic test class (IEC 60068-1/DIN EN 60068-1) Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) Upr = 1.6 × UIORM., Pd < 5 pC Test voltage (partial discharge test, procedure b for all devices) Upr = 1.875 × UIORM., Pd < 5 pC Highest permissible overvoltage Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) Material group (DIN EN 60664-1 VDE0110 Part 1) Storage temperature range Operating temperature range Isolation resistance, minimum value VIO = 500 V dc at TA = 25°C VIO = 500 V dc at TA MAX. at least 100°C Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Package temperature Current (input current IF, Psi = 0) Power (output or total power dissipation) Isolation resistance VIO = 500 V dc at TA = Tsi R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Symbol Spec. 40/110/21 Unit UIORM Upr 1 130 1 808 Vpeak Vpeak Upr 2 119 Vpeak UTR Vpeak Tstg TA 8 000 2 175 III a –55 to +125 –40 to +110 Ris MIN. Ris MIN. 1012 11 10 Ω Ω Tsi Isi Psi 175 400 700 °C mA mW Ris MIN. 109 Ω CTI °C °C Page 18 of 19 A Business Partner of Renesas Electronics Corporation. PS9306L,PS9306L2 Caution GaAs Products Chapter Title This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 19 of 19 Revision History PS9306L,PS9306L2 Data Sheet Rev. Date Page Description Summary 0.01 1.00 Aug 20, 2010 Nov 10, 2011 − Throughout Throughout p.3 p.6 p.8 p.9 pp.10 to 12 pp.13, 14 p.15 p.16 p.17 p.18 First edition issued Preliminary Data Sheet → Data Sheet Safety standards approved Modification of MARKING EXAMPLE Modification of ELECTRICAL CHARACTERISTICS Addition of TEST CIRCUIT Fig. 6 Modification of TEST CIRCUIT Fig. 7, 8 Addition of TYPICAL CHARACTERISTICS Addition of TAPING SPECIFICATIONS Addition of RECOMMENDED MOUNT PAD DIMENSIONS Modification of NOTES ON HANDLING Modification of USAGE CAUTIONS Addition of SPECIFICATION OF VDE MARKS LICENSE DOCUMENT All trademarks and registered trademarks are the property of their respective owners. C-1