Cree XLamp MC-E LED ® ® MC-E White MC-E Dynamic White MC-E Color Product Description FEATURES The XLamp MC-E LED is a family • Available in white (2600 K – Table of Contents Characteristics of lighting-class, multi-chip LEDs 10,000 K CCT), EasyWhite®, Complete Package................... 2 that provides high lumen output Dynamic White, or color Per LED Die (White)................. 2 in (RGBW) to a small discrete package. LEDs, Compared XLamp MC-E • LEDs reduce the distance between ANSI-compatible neutral & Per LED Die (Color).................. 2 Flux Characteristics warm white chromaticity bins White..................................... 3 EasyWhite.............................. 4 LED die, creating a small optical • Individually addressable LEDs source for excellent optical control • MC-E Dynamic White LEDs Relative Spectral Power and efficient color mixing. XLamp have two cool-white (6500 K) Distribution MC-E LEDs can reduce LED system and two warm-white (2700 K) White..................................... 5 complexity by reducing the number LED die Color...................................... 5 XLamp LEDs MC-E EasyWhite LEDs Relative Flux Output vs available in 2 and 4-step bins, Junction Temperature.................. 6 up to 85 CRI Electrical Characteristics.............. 7 Maximum drive current: Relative Intensity vs. Current....... 7 700 mA per LED die Typical Spatial Radiation Pattern... 8 Reflow solderable – JEDEC Reflow Soldering Characteristics... 9 J-STD-020 Notes.......................................10 Electrically neutral thermal Mechanical Dimensions..............12 path Tape and Reel...........................13 • RoHS-compliant Packaging.................................14 • UL-recognized component • of components required. Cree bring high performance and quality of light to a • wide range of lighting applications, including color-changing lighting, portable and personal • lighting, outdoor lighting, indoor directional • lighting, and entertainment lighting. www.cree.com/Xlamp CLD-DS16 Rev 11A Product family data sheet (E349212) Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 xlamp MC-e leds Characteristics - Complete Package The following table lists the product characteristics for the XLamp MC-E LED package. Characteristics Unit Thermal Resistance, junction to solder point - white °C/W Thermal Resistance, junction to solder point - color Minimum Typical Maximum 3 °C/W 4 Viewing Angle (FWHM) - white degrees 110 Viewing Angle (FWHM) - color degrees 115 ESD withstand voltage (HBM per Mil-Std-883D) V 8000 LED Junction Temperature °C 150 Characteristics - Per LED Die (White, EasyWhite, Dynamic White) The following table lists the product characteristics of each individual LED die within the XLamp MC-E White LED package. Characteristics Unit Temperature Coefficient of Voltage Minimum Typical mV/°C DC Forward Current Maximum -4 mA 700 Reverse Voltage V 5 Forward Voltage (@ 350 mA) V 3.1 Forward Voltage (@ 700 mA) V 3.4 3.9 Characteristics - Per LED Die (Color) The following table lists the product characteristics for each LED die within the XLamp MC-E Color LED package. Characteristics Temperature Coefficient of Voltage DC Forward Current Reverse Voltage Unit Red Green Blue White Typical -2 -4 -4 -4 mA Maximum 700 700 700 700 V Maximum 5 5 5 5 Typical 2.1 3.4 3.2 3.1 Maximum 2.5 3.9 3.9 3.9 Typical 2.3 3.7 3.5 3.5 mV/°C Forward Voltage (@ 350 mA) V Forward Voltage (@ 700 mA) V Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 2 xlamp MC-e leds Flux Characteristics - White, Dynamic White, Color (TJ = 25 °C) The following tables provide several base order codes for XLamp MC-E. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp MC-E Binning and Labeling document. Part White Dynamic White Color Color CCT / Dominant Wavelength Range Min. Max. Cool White 5000 K 10,000 K Neutral White 3700 K 5000 K Warm White 2600 K 3700 K Base order codes Min. Luminous Flux @ 350 mA* Order Code Group Flux (lm) K 370 MCE4WT-A2-0000-000K01 M 430 MCE4WT-A2-0000-000M01 J 320 MCE4WT-A2-0000-000JE4 K 370 MCE4WT-A2-0000-000KE4 G 240 MCE4WT-A2-0000-000GE7 H 280 MCE4WT-A2-0000-000HE7 J 320 MCE4WT-A2-0000-000JE7 2 cool-white die 6500 K K 100 2 warm-white die 2700 K G 70 2 cool-white die 6000 K K 100 2 warm-white die 2700 K G 70 Red 620 nm 630 nm Green 520 nm 535 nm Blue 450 nm 465 nm 8.2 Cool White 5700 K 7000 K 100 Red 620 nm 630 nm 30.6 Green 520 nm 535 nm Blue 450 nm 465 nm Neutral White 3700 K 4300 K MCEDWT-A1-0000-0000A1001 MCEDWT-A1-0000-0000A1002 30.6 A5 A4 67.2 67.2 8.2 MCE4CT-A2-0000-00A5AAAA1 MCE4CT-A2-0000-00A4AAAB1 80 Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements, ±2 on CRI measurements and ± 1 nm on dominant wavelength measurements. • Typical CRI for cool white and neutral white (3700 K - 10,000 K CCT) is 75. • Typical CRI for warm white (2600 K - 3700 K CCT) is 80. • Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA. The flux and chromaticity of XLamp MC-E White are measured with all LEDs lit simultaneously. The flux and color of each LED in XLamp MC-E Dynamic White and MC-E Color are measured individually. Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 3 xlamp MC-e leds Flux Characteristics - EasyWhite MC-E LEDs (TJ = 25 °C) The following table provides order codes for XLamp MC-E EasyWhite LEDs. For a complete description of the order-code nomenclature, please consult the XLamp MC-E Binning and Labeling document. Color CCT Range 4000 K Standard CRI EasyWhite 3500 K 3000 K 2700 K 4000 K 80-CRI Minimum EasyWhite 3500 K 3000 K 2700 K 85-CRI Minimum EasyWhite 3000 K 2700 K Base Order Codes Min. Luminous Flux @ 350 mA, 25 ° C Group Flux (lm) K 370 J 320 J 320 H 280 J 320 H 280 J 320 H 280 K 370 J 320 J 320 H 280 J 320 H 280 J 320 H 280 H 280 G 240 H 280 G 240 2-Step Order Code Chromaticity Region 40H 35H 30H 27H 40H 35H 30H 27H 30H 27H 4-Step Order Code Chromaticity Region MCEEZW-A1-0000-0000K040H MCEEZW-A1-0000-0000J040H MCEEZW-A1-0000-0000J035H MCEEZW-A1-0000-0000H035H MCEEZW-A1-0000-0000J030H MCEEZW-A1-0000-0000H030H MCEEZW-A1-0000-0000J027H MCEEZW-A1-0000-0000H027H MCEEZW-H1-0000-0000K040H MCEEZW-H1-0000-0000J040H MCEEZW-H1-0000-0000J035H MCEEZW-H1-0000-0000H035H MCEEZW-H1-0000-0000J030H MCEEZW-H1-0000-0000H030H MCEEZW-H1-0000-0000J027H MCEEZW-H1-0000-0000H027H MCEEZW-P1-0000-0000H030H MCEEZW-P1-0000-0000G030H MCEEZW-P1-0000-0000H027H MCEEZW-P1-0000-0000G027H 40F 35F 30F 27F 40F 35F 30F 27F 30F 27F MCEEZW-A1-0000-0000K040F MCEEZW-A1-0000-0000J040F MCEEZW-A1-0000-0000J035F MCEEZW-A1-0000-0000H035F MCEEZW-A1-0000-0000J030F MCEEZW-A1-0000-0000H030F MCEEZW-A1-0000-0000J027F MCEEZW-A1-0000-0000H027F MCEEZW-H1-0000-0000K040F MCEEZW-H1-0000-0000J040F MCEEZW-H1-0000-0000J035F MCEEZW-H1-0000-0000H035F MCEEZW-H1-0000-0000J030F MCEEZW-H1-0000-0000H030F MCEEZW-H1-0000-0000J027F MCEEZW-H1-0000-0000H027F MCEEZW-P1-0000-0000H030F MCEEZW-P1-0000-0000G030F MCEEZW-P1-0000-0000H027F MCEEZW-P1-0000-0000G027F Notes: • For Standard CRI parts, the typical CRI is 80 for 4000 and 3500 K CCT parts and typical CRI is 82 for 3000 and 2700 K CCT. • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. • Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA and with all LEDs lit simultaneously. Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 4 xlamp MC-e leds Relative Spectral Power Distribution (If -=White 350 mA per LED) Relative Spectral Power Distribution (IF = 350 mA per LED) The following graph represents typical spectral output of the XLamp MC-E White LED with all four LEDs on sim The following graph represents typical spectral output of the XLamp MC-E White LED with all four LEDs on simultaneously. Relative Radiant Power (%) 100 80 60 5000K - 10000K CCT 3700K - 5000K CCT 40 2600K - 3700K CCT 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) Relative Spectral Power Distribution (If = 350 mA per LED) - C Relative Spectral Power Distribution (IF = 350 mA per LED) Color The following graph represents typical spectral output of the XLamp MC-E -Color LED with all four LEDs on simul The following graph represents typical spectral output of the XLamp MC-E Color LED with all four LEDs on simultaneously. Relative Radiant Power (%) 100 80 RGBW (6000K) 60 RGBW (4000K) 40 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 5 xlamp MC-e leds Relative Spectral Power Distribution (IF = of 350 mA per MC-E LED)Color - Color (continued) The following graph represents typical spectral output the XLamp LED with each LED on independe The following graph represents typical spectral output of the XLamp MC-E Color LED with each LED on independently. Relative Radiant Power (%) 100 80 Red 60 Green Blue 40 White (6000K) White (4000K) 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) Relative Flux Output vs Junction Temperature (I = 350 mA) Relative Flux Output vs. Junction Temperature (If = 350 m F The graphrepresents represents typical performance of each LED the XLamp MC-E LED Thefollowing following graph typical performance of each LED die in die the in XLamp MC-E LED. 100% Relative Luminous Flux 90% 80% 70% White 60% Red 50% Green 40% Blue 30% 20% 10% 0% 25 50 75 100 125 150 Junction Temperature (ºC) Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 6 xlamp MC-e leds Electrical Characteristics (Tj = 25ºC) Electrical (TJ performance = 25 ˚C) of each LED die in the XLamp MC-E LED The following Characteristics graph represents typical The following graph represents typical performance of each LED die in the XLamp MC-E LED. 700 Forward Current (mA) 600 500 400 White, Blue 300 Red Green 200 100 0 1.5 2.0 2.5 3.0 3.5 4.0 Forward Voltage (V) Relative Intensity vs. Current (Tj = 25ºC) Relative Intensity vs. Current (T = 25 ˚C) J The following graph represents typical performance of each LED die in the XLamp MC-E LED. Relative Luminous Flux (%) 200 180 160 140 120 White, Blue 100 Red 80 Green 60 40 20 0 0 100 200 300 400 500 600 700 Forward Current (mA) Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 7 xlamp MC-e leds Typical Spatial Radiation Pattern Typical Spatial Radiation Pattern The following graph represents typical spectral of the LED with all four LEDs on simultan The following graph represents typical output of the XLampoutput MC-E LED withXLamp all four MC-E LEDs on simultaneously. Relative Luminous Intensity (%) 120 100 80 White 60 Color 40 20 0 -90 -60 -30 0 30 60 90 Angle (º) Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 8 xlamp MC-e leds Reflow Soldering Characteristics In testing, Cree has found XLamp MC-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 t 25˚C to Peak Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Time Lead-Based Solder Lead-Free Solder 3 °C/second max. 3 °C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C 60-120 seconds 60-180 seconds 183 °C 217°C 60-150 seconds 60-150 seconds 215 °C 260 °C 10-30 seconds 20-40 seconds 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 9 xlamp MC-e leds Notes Lumen Maintenance Projections Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/LM80_results. Moisture Sensitivity XLamp MC-E LEDs are shipped in sealed, moisture-barrier Maximum Percent Relative Humidity bags (MBB) designed for long shelf life. If XLamp MC-E LEDs Temperature 30% 40% 50% 60% 70% 80% are exposed to moist environments after opening the MBB 30 ºC 9 5 4 3 1 1 1 packaging but before soldering, damage to the LED may 25 ºC 12 7 5 4 2 1 1 occur during the soldering operation. The derating table 20 ºC 17 9 7 6 2 2 1 90% at right defines the maximum exposure time (in days) for an XLamp MC-E LED in the listed humidity and temperature conditions. LEDs with exposure time longer than the time specified below must be baked according to the baking conditions listed here. Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately after use. Baking Conditions It is not necessary to bake all XLamp MC-E LEDs. Only the LEDs that meet all of the following criteria must be baked: • LEDs that have been removed from the original MBB packaging. • LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above. • LEDs that have not been soldered. LEDs should be baked at 80 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from MBB packaging before baking. Do not bake parts at temperatures higher than 80 ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity section above. Storage Conditions XLamp MC-E LEDs that have been removed from original MBB packaging but not soldered yet should be stored in a room or cabinet that will maintain an atmosphere of 25 ± 5 ºC and no greater than 10% RH. For LEDs stored in these conditions, storage time does not add to exposure time as defined in the above Moisture Sensitivity section. RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Ecology section of www.cree.com. Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 10 xlamp MC-e leds UL Recognized Component Level 1 enclosure consideration. The LED package or a portion thereof has not been investigated as a fire enclosure or a fire and electrical enclosure per ANSI/UL 8750. Vision Advisory Claim WARNING. Do not look at exposed LED lamps in operation. Eye injury can result. For more information about LEDs and eye safety, please refer to the Cree LED Eye Safety Application Note (www.cree.com/xlamp_app_notes/led_eye_safety). Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 11 A Initial Release 10/16/07 RC B Change height due to new lens 10/23/2007 RC C Change recommended solder pad footprint 11/26/2007 RC D Height change due to new lens (was 3.86) 12/26/2007 RC E - Change package height FROM 1.5 TO 1.45 - Add LED reference designators - Delete Series Configuration schematic - Add tabs to recommended PCB footprint 5/12/2008 5 4 xlamp MC-e leds .80 TYP. 3 6 NOTICE RC CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. D 4 4.48±.20 D Mechanical Dimensions 1.45 All measurements are ±.1mm unless otherwise indicated. .05±.05 D3 6 D4 5 4 6 6 REV Bottom View C Top View 5 4 3 .05±.05 .05±.05 B 1 D .80 +.2 9.0 TYP. 1 2.0 +.13 .75 -.03 1 B 2 3 3 .25 4 5/12/2 Color D1: D2 Red D3 D2: D1 Green D4 D3: Blue D4: White 7.50 4 3 2 R3.18 - Change package height FROM 1.5 TO 1.45 - Add LED reference designators - Delete Series Configuration schematic - Add tabs to recommended PCB footprint .80 TYP. +.13 .75 -.03 A 2.60 COMMENTS Initial Release REVISIONS .80 Change height due to new lens TYP. - Change height FROM 1.5 TO 1.45 Change recommended solderpackage pad footprint 11/26/ - Add LED reference designators E Series Configuration schematic Height change due -toDelete new lens (was 3.86) 12/26/ - Add tabs to recommended PCB footprint C E .05±.05 INK COMMENTS A 4.48±.20 A B DAT C Change recommended solder pad footprint Initial Release 10/16 D Height change due to new lens (was 3.86) Change height due to new lens 10/23/ REV 5.40 1.45 REV 2 +.13 .75 -.03 1.454.48±.20 E 2 1.45 HEATSINK D REVISIO 4.48±.20 C B C 3 4 N ARE THE PROPRIETARY AND FORMATION OF CREE, INC. THIS PLOT PIED, REPRODUCED OR DISCLOSED TO ANY OT AND THE INFORMATION .00 .10 ERSON WITHOUT THE WRITTEN CONSENT PROPRIETARY AND OF CREE, INC. THIS PLOT ODUCED OR DISCLOSED TO ANY HOUT THE WRITTEN CONSENT A A 2.60 5 1.50 BSC NOTICE AL. THIS D PLOT AND THE INFORMATION PITCH 5 4 7090 C A 2.60 Side View .25 +.2 1.16 9.0 .0 B 5.40 A 2.60 R3.18 5.60 +.2 9.0 .0 DRAWN BY UNLESS OTHERWISE SPECIFIED R.Chaloupecky DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. CHECK Ban Loh TOLERANCE UNLESS SPECIFIED: APPROVED .X ± 0.3 .XX ± .13 ± 1° 1.16 MATERIAL FOR SHEET B METAL PARTS ONLY .X ± .25 .XX ± .10 X° 5.60 8 7 DATE 10/16/07 TITLE SIZE C FINAL PROTECTIVE FINISH SCALE 3.85 DRAWING NO. 20:1 2 1.00 TYP. 2610-00005 2.00 A 1.50 BSC PITCH REV. NEGATIVE (-) 1 A 2.75 7.70 10.02 8 8 1.30 NEGATIVE (-) 2 NEGATIVE (-) 2 7.70 10.02 1 NEGATIVE (-) 3 D1 1.30 Tolerances: .10 Recommended PCB Solder Pad Solder mask windows must be .05 mm bigger than 1.30PCB Solder Pad. NEGATIVE (-) 4 C D1 1 6 2 NEGATIVE (-) 4 D2 D6 2 5 POSITIVE (+) 2 3 D3 D3 D7 POSITIVE (+) 1 D2 D6 6 6 NEGATIVE (-) 4 D5 D5 7 7 NEGATIVE (-) 3 2.84 7.70 10.02 RECOMMENDED PCB SOLDERNEGATIVE PAD (-) 3 1. 2. 5 1.50 BSC PITCH 2.84 7.00 7.70 10.02 NEGATIVE (-) 3 .10 8 D7 3 5 NEGATIVE (-) 4 1 D1 4 D4 D8 4 olerances: .10 NDED PCBwindows SOLDER PAD older mask must be .05 mm bigger han PCB Solder Pad. 5 D5 D2 2 6 POSITIVE (+) 1 D3 3 D7 5 POSITIVE (+) 2 POSITIVE (+) 2 POSITIVE (+) 3 5 D4 4 4 POSITIVE (+) 4 D8 DRA UNLESS OTHERWISE SPECIFIED R.C DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. CHE Ba TOLERANCE UNLESS SPECIFIED: APPR .X ± 0.3 .XX ± .13 POSITIVE (+) 3 POSITIVE (+) 4 THIRD ANGLE PROJECTION POSITIVE (+) 4 Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to registered trademarks6of Cree, Inc. 5 ECOMMENDED PCB SOLDER PAD 6 SOLDER PAD DRAWN BY D8 7 POSITIVE (+) 1 POSITIVE (+) 3 D4 8 .10 NEGATIVE (-) 2 1. Tolerances: .10 1 7090MC PARALLEL / INDEPENDENT 2. Solder mask windows must be .05 mm bigger D6 CONFIGURATION than PCB Solder Pad. NEGATIVE (-) 1 2.84 6 7090MC PARALLEL / INDEPENDENTPCB RECOMMENDED CONFIGURATION 7 NEGATIVE (-) 1 2.00 1.50 BSC PITCH 6 7.00 E SHEET 1 OF 1 2.84 2.75 2.00 5 2.00 7 7090MC PARALLEL / INDEPENDENT CONFIGURATION 1.30 2.75 OUTLINE DRAWING, 7090MC PACKAGE 1.00 TYP. Dynamic White NEGATIVE (-) 1 7.00 D1: Cool White .10 D2: Warm White NEGATIVE (-) 2 D3: Cool White D4: Warm White A DATE ± 2° 5.60 4600 Silicon Drive Durham, N.C 27703 5.60 DATE 5 1.50 BSC PITCH 8 1.50 BSC PITCH .25 5.40 X° R3.18 .25 5.40 6 Top View D1 D4 3.85 7 D1 D4 D2 D3 1.00 TYP. 7.50 8 D2 D3 7.50 R3.18 0 TYP. 75 3 HEATSINK NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. X° ± 1° FOR SHEET METAL PARTS ONLY .X ± .25 .XX ± .10 DATE UNLESS OTHERWISE SPECIFIED 10/16/07 R.Chaloupecky DIMENSIONS ARE IN XLamp® and EasyWhite X° ®± 2° change without notice. Cree , the Cree logo, are DATE MILLIMETERS & BEFORE FINISH. CHECK DRAWN BY DATE Ban Loh 4 UNLESS OTHERWISETOLERANCE SPECIFIED UNLESS SPECIFIED: 3 10/16/07 R.Chaloupecky APPROVED DATE DIMENSIONS ARE IN .X ± 0.3 DATE TITLE MILLIMETERS & BEFORE FINISH. .XX ± CHECK .13 Ban Loh TOLERANCE UNLESS SPECIFIED: THIRD ANGLE PROJECTION MATERIAL X° ± 1° APPROVED DATE .X ± 0.3 TITLE .XX ± .13 FOR SHEET METAL PARTS ONLY MATE FINAL ®v 12 O 7 xlamp MC-e leds Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All measurements in mm. 4.0±.1 1.5±.1 12.0±.1 1.75±.10 5.5±.1 Cathode Side +.3 16.0 .0 Anode Side (denoted by chamfer) User Feed Direction END START Loaded Pockets (200 Lamps) Trailer 160mm (min) of empty pockets sealed with tape (13 pockets min.) Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (34 empty pockets min.) User Feed Direction Cover Tape Pocket Tape 13mm 7" Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 13 xlamp MC-e leds Packaging Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Packaged Reel Patent Label Dessicant (inside bag) Label with Customer Order Label with Cree Order Code, Code, Qty, Reel ID, PO # Qty, Reel ID, PO # Humidity Indicator Card (inside bag) Label with Cree Bin Code, Qty, Reel ID Boxed Reel Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Patent Label (on bottom of box) Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®v, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. 14