XC8107 Series ETR33003-002 85mΩ High Function Power Switch ■GENERAL DESCRIPTION The XC8107 series is a P-channel MOSFET power switch IC with a low ON resistance. A current limit, reverse current prevention (prevents reverse current from VOUT to VIN), soft start, thermal shutdown, and an under voltage lockout (UVLO) are incorporated as protective functions. A flag function monitors the power switch status. The flag output has N-channel open drain configuration, and it outputs Low level signal when over-current or overheating is detected, or when the reverse current prevention is operated. The voltage level which is fed to CE pin determines the status of XC8107. The logic level of CE pin is selectable between either one of active high or active low. ■APPLICATIONS ■FEATURES ●Set Top Boxes Input Voltage : 2.5V～5.5V ●Digital TVs Output Current ON Resistance : 2A : 85mΩ@VIN=5.0V (TYP.) *USP-6C 100mΩ@VIN=5.0V (TYP.) *SOT-25 : 40μA@ VIN=5.0V ●PCs ●USB Ports/USB Hubs Supply Current ●HDMI Stand-by Current Flag Delay Time ■TYPICAL APPLICATION CIRCUIT ■TYPICAL PERFORMANCE CHARACTERISTICS : 0.1μA (MAX.) : 7.5ms (TYP.) * At over-current detection : 4ms(TYP.) * At reverse voltage detection : Reverse Current Prevention Protection Circuit Thermal Shutdown Under Voltage Lockout(UVLO） Soft-start : Flag Output Functions CE Pin Input Logic Selectable : 2μs(TYP.) *Reference value Current Limit Response Time Operating Ambient Temperature : -40℃～+105℃ : USP-6C, SOT-25 Packages Environmentally Friendly : EU RoHS Compliant, Pb Free XC8107xCxxxR CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 6.0 Output Voltage : VOUT [V] 0.5A type 1.0A type 5.0 1.5A type 2.0A type 4.0 3.0 2.0 1.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Output Current : IOUT [A] 1/27 XC8107 Series ■BLOCK DIAGRAM XC8107 Series * Diodes inside the circuit are an ESD protection diode and a parasitic diode. 2/27 XC8107 Series ■PRODUCT CLASSIFICATION ●Ordering Information XC8107①②③④⑤⑥-⑦ DESIGNATOR ITEM ① CE Logic Protection Circuits Type ② Maximum Output Current ③④ ⑤⑥-⑦ (*1) (*1) Packages SYMBOL DESCRIPTION A B C Refer to Selection Guide D 05 0.5A 10 1.0A 15 1.5A 20 2.0A ER-G USP-6C (3,000/Reel) MR-G SOT-25 (3,000/Reel) The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant. ●Selection Guide TYPE CE LOGIC SELECTABLE SOFT-START CURRENT LIMITTER AC Active High Yes Yes AD Active High Yes Yes BC Active Low Yes Yes BD Active Low Yes Yes TYPE UVLO FLG OUTPUT REVERSE CURRENT PREVENTION AC Yes Yes Yes AD Yes Yes Yes BC Yes Yes Yes BD Yes Yes Yes TYPE THERMAL SHUT DOWN LATCH PROTECTION AC Yes No AD Yes Yes BC Yes No BD Yes Yes 3/27 XC8107 Series ■PIN CONFIGURATION * The dissipation pad for the USP-6C packages should be solder-plated for mounting strength and heat dissipation. Please refer to the reference mount pattern and metal masking. The dissipation pad should be connected to the VSS (No. 5) pin. ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTIONS 1 VOUT Output - NC No connection 3 3 FLG Fault Report 4 4 CE ON/OFF Control 5 2 VSS Ground 6 5 VIN Power Input PIN NAME SIGNAL STATUS H Active L Stand-by USP-6C SOT-25 1 2 ■FUNCTION TYPE A CE B OPEN Undefined State H Stand-by L Active OPEN Undefined State (*1) * Avoid leaving the CE pin open; set to any fixed voltage. 4/27 (*1) XC8107 Series ■ABSOLUTE MAXIMUM RATINGS Ta=25℃ PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN -0.3～+6.0 V Output Voltage VOUT -0.3～+6.0 V Output Current IOUT 2.8 A CE Input Voltage VCE -0.3～+6.0 V FLG Pin Voltage VFLG -0.3～+6.0 V FLG Pin Current IFLG 15 mA Pd 120 (*2) 1000 (PCB mounted) 250 600 (PCB mounted) (*2) mW Operating Ambient Temperature Topr -40～+105 ℃ Storage Temperature Tstg -55～+125 ℃ USP-6C Power Dissipation SOT-25 * All voltages are described based on the VSS. (*1) Use with IOUT less than Pd/（VIN-VOUT）. (*2) This is a reference data taken by using the test board. Please refer to page 24 and 25 for details. 5/27 XC8107 Series ■ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL Input Voltage VIN On Resistance Supply Current CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT 2.5 - 100 85 115 100 40 5.5 110 104 135 120 75 V mΩ mΩ mΩ mΩ μA ① ① - 0.01 1.0 μA ② - 0.01 1.0 μA ② VOUT=VIN-0.3V, XC8107xx05 series 0.81 0.90 0.99 A VOUT=VIN-0.3V, XC8107xx10 series 1.26 1.40 1.54 A VOUT=VIN-0.3V, XC8107xx15 series 1.71 1.90 2.09 A VOUT=VIN-0.3V, XC8107xx20 series 2.16 2.40 2.64 A VOUT=0V, XC8107xx05 series - 0.45 - A VOUT=0V, XC8107xx10 series - 0.70 - A VOUT=0V, XC8107xx15 series - 0.95 - A VOUT=0V, XC8107xx20 series - 1.20 - A USP-6C VIN=3.3V (*1) VIN=5.0V (*1) SOT-25 VIN=3.3V (*1) VIN=5.0V (*1) RON ISS VOUT=OPEN Stand-by Current ISTBY VIN=5.5V, VOUT=OPEN VCE=VSS (XC8107A series) VCE=VIN (XC8107B series) Switch Leakage Current ILEAK VIN=5.5V, VOUT=0V VCE=VSS (XC8107A series) VCE=VIN (XC8107B series) Current Limit Short-Circuit Current ILIMT ISHORT Ta=25℃ ② ① ① VIN=5.0V, VOUT: OPEN→0V Measure from VOUT=0V to when current falls below a certain ILIM value VIN=5.5V, XC8107A series VIN=5.5V, XC8107B series - 2.0 - μs ① 1.5 - - 5.5 0.8 V ① VIN=5.5V, XC8107A series VIN=5.5V, XC8107B series VIN=5.5V, VCE=5.5V VIN=5.5V, VCE=0V 1.5 -0.1 -0.1 - 0.8 5.5 0.1 0.1 V ① μA μA ① ① VUVLOD VIN: 2.2V→1.7V 1.8 1.9 2.0 V ① UVLO Released Voltage VUVLOR VIN: 1.7V→2.2V 1.9 2.0 2.1 V ① UVLO Hysteresis VUHYS - - 0.1 - V ① Current Limit Circuit (*2) Response Time tCLR CE "H" Level Voltage VCEH CE "L" Level Voltage VCEL CE "H" Level Current CE "L" Level Current ICEH ICEL UVLO Detected Voltage NOTE: Unless otherwise stated, VIN=5.0V, IOUT=1mA, VCE=VIN (XC8107A series) or VCE=VSS (XC8107B series) (*1) IOUT=0.25A (XC8107xx05 series), IOUT=0.5A (XC8107xx10 series), IOUT=0.75A (XC8107xx15series), IOUT=1.0A (XC8107xx20 series) (*2) Design reference value. This parameter is provided only for reference. 6/27 XC8107 Series ■ELECTRICAL CHARACTERISTICS (Continued) Ta=25℃ PARAMETER SYMBOL turn-on time tDLY(ON) turn-off time tDLY(OFF) FLG output FET On-resistance FLG output FET Leakage Current CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT RLOAD=10Ω, VCE=0V→2.2V - 0.60 1.00 ms ① RLOAD=10Ω, VCE=2.2V→0V - 0.08 0.13 ms ① RFLG IFLG=10mA, VOUT=5.5V - 15 20 Ω ③ IFOFF VIN=5.5V, VFLG=5.5V, VOUT=OPEN - 0.01 0.1 μA ③ tFD1 over-current condition 6.5 7.5 8.5 ms ① tFD2 reverse-voltage condition 2.7 4.0 4.7 ms ① IREV VIN=0V, VOUT=5.5V VCE=5.0V (XC8107A series) VCE=VSS (XC8107B series) - 0.1 1.0 μA ① SOT-25 - 170 - - 140 - mV ① USP-6C FLG delay time Reverse Current Reverse Current Prevention Detect Voltage Thermal Shutdown Detect Temperature VREV_D VIN: 5.0V→4.7V VOUT=5.0V TTSD Junction Temperature - 150 - ℃ ① Thermal Shutdown Release Temperature TTSR Junction Temperature - 130 - ℃ ① Thermal Shutdown Hysteresis Width THYS Junction Temperature - 20 - ℃ ① NOTE: Unless otherwise stated, VIN=5.0V, IOUT=1mA, VCE=VIN (XC8107A series) or VCE=VSS (XC8107B series) ■TIMING CHART ●turn-on time, turn-off time XC8107 Series, Type A XC8107 Series, Type B 7/27 XC8107 Series ■TEST CIRCUITS CIN=1.0μF, CL=1.0μF 1) CIRCUIT① 2) CIRCUIT② 3) CIRCUIT③ VOUT VIN FLG A VIN V CIN (ceramic) 8/27 CE VFLG V VCE VOUT VSS V CL (ceramic) V XC8107 Series ■OPERATIONAL EXPLANATION The XC8107 series is a P-channel MOSFET power switch IC. The XC8107 series consists of a CE circuit, UVLO circuit, thermal shutdown circuit, current limiter circuit, reverse current prevention circuit, control block and others. The gate voltage of the power switch transistor is controlled with control block. The current limiter circuit and reverse current prevention circuit will operate based on the output voltage and output current. (See the BLOCK DIAGRAM below) BLOCK DIAGRAM (XC8107 Series) <CE Pin> The voltage level which is fed to CE pin controls the status of this IC. If either “H” level or “L” level which is defined as the electrical specification is fed to CE pin, then XC8107 can operate in standard manner. However, if the middle voltage which is neither “H” level nor “L” level is fed to CE pin, the consumption current will increase due to the shoot-through current at internal circuits. Also if CE pin is open, the status of XC8107 cannot be fixed and the behavior will be unstable. <Thermal Shutdown> For protection against heat damage of the ICs, thermal shutdown function is built in. When the internal junction temperature reaches the temperature limit, the thermal shutdown circuit operates and the power switch transistor will turn OFF. The IC resumes its operation when the thermal shutdown function is released and the IC’s operation is automatically restored because the junction temperature drops to the level of the thermal shutdown release temperature. When the thermal shutdown circuit detects higher junction temperature than the detect temperature, the voltage level of FLG pin is low level. When the thermal shutdown circuit detects lower junction temperature than the release temperature, the thermal shutdown function is released and the voltage level of FLG pin is high level. <Under Voltage Lockout (UVLO) > When the VIN pin voltage goes down to lower voltage than UVLO detected voltage, the power switch transistor turns OFF by UVLO function in order to prevent false output caused by unstable operation of the internal circuitry. When the VIN pin voltage goes up to higher voltage than UVLO released voltage, the UVLO function is released and the power switch transistor can turn ON. <Soft-start Function> The soft-start circuit can reduce the in-rush current charged on the output capacitor when IC starts up. Additionally, due to the reduction of the in-rush current, the circuit can reduce the fluctuation of the input voltage as well. The soft-start time is optimized internally and defined as turn-on time. (TYP: 0.6ms) 9/27 XC8107 Series ■OPERATIONAL EXPLANATION (Continued) <Current limiter, short-circuit protection> When the output current reaches the current limit value, the constant current limiter circuit activates and as a result, the output voltage goes down. If the short circuit comes at the VOUT pin, the output current is limited to the current which is specified as the short-circuit current value. If the over-current state lasts for 7.5ms (TYP.), the FLG pin changes to Low level output. Two types are available for the current limiter circuit: an auto recovery type (product type C) and a latch off type (product type D). After the current limiter circuit activates and the FLG pin outputs low level, the operation is different between these two types. The auto recovery type continuously limits the output current by the current limit value. When the over-current status finishes and the status of that the output current is less than the current limit value continues for 7.5ms (TYP.) or more, the voltage of FLG pin goes up “H” level again. The latch off type turns off the power switch transistor after the FLG pin outputs Low level. The off state is maintained regardless of whether the over-current state is released. Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below the UVLO detected voltage once and after that raising it higher than UVLO released voltage. <Reverse current prevention> An internal circuit is built in that prevents reverse current from the VOUT pin to the VIN pin. When the difference between input voltage and VOUT pin voltage is higher than the detect voltage set internally, the reverse current prevention circuit activates, and the power switch transistor turns off, then the reverse current from the VOUT pin to the VIN pin is reduced to 0.1μA (TYP.). If the reverse-voltage state lasts for 4ms (TYP.), the FLG pin changes to Low level output. Two types are available for the reverse current prevention circuit: the auto recovery type (product type C) and the latch off type (product type D). After the reverse current prevention circuit activates and the FLG pin outputs low level, the operation is different between these two types. On the auto recovery type, when the output voltage drops below the input voltage, the reverse current prevention circuit stops immediately, and the power switch transistor turns on again. If the output voltage remains lower than the input voltage for 4ms (TYP.), the FLG pin returns to High level output. On the latch off type, the power switch transistor remains in the off state even if the reverse voltage state is released. Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below the UVLO detected voltage once and after that raising it higher than UVLO released voltage. 10/27 XC8107 Series ■OPERATIONAL EXPLANATION (Continued) <Flag function> The flag circuit is built in which monitors the state of the power switch. The FLG pin outputs Low level when the reverse current prevention function is operating. recommended for the FLG pin pull-up resistance. A resistance of 10kΩ to 100kΩ is Auto recovery type (product type C) Protective function FLG pin Low level output Return to FLG pin High level output Current limiter 7.5ms after over-current detection 7.5ms after over-current release Reverse current prevention 4.0ms after reverse voltage detection 4.0ms after reverse voltage release Thermal shutdown Same time as overheat state is detected Same time as overheat state is released Protective function FLG pin Low level output Return to FLG pin High level output Current limiter 7.5ms after over-current detection When latch operation is released Reverse current prevention 4.0ms after reverse voltage detection When latch operation is released Thermal shutdown Same time as overheat state is detected Same time as overheat state is released Latch off type (product type D) 11/27 XC8107 Series ■NOTES ON USE 1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated if IC is used beyond the absolute MAX. specifications. 2. Where wiring impedance is high, operations may become unstable due to noise depending on output current. Please keep the resistance low between VIN and VSS wiring in particular. 3. Please place the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible. For the input or output capacitor, a capacitance of 1.0μF or higher is recommended. 4. When the voltage which is higher than the maximum input voltage is fed to the VIN pin, and VOUT is shorted to the VSS level, in this case the short circuit may cause a fatal impact to operation for the IC. Please use within the operational voltage range. 5. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. 12/27 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) UVLO detect Voltage vs. Input Voltage (2) UVLO release Voltage vs. Input Voltage XC8107xxxxxR XC8107xxxxxR CIN=1.0μF(ceramic), CL=1.0μF(ceramic) UVLO release Voltage : UVLO [V] UVLO detect Voltage : UVLO [V] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 Ta=105℃ Ta=25℃ Ta=-40℃ 2.5 2.0 1.5 1.0 0.5 0.0 3.0 Ta=105℃ Ta=25℃ Ta=-40℃ 2.5 2.0 1.5 1.0 0.5 0.0 1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 Input Voltage : VIN [V] 1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 Input Voltage : VIN [V] (3) UVLO threshold Voltage vs. Ambient Temperature XC8107xxxxxR UVLO threshold Voltage : UVLO [V] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 2.5 2.0 1.5 1.0 UVLO detect UVLO release 0.5 0.0 -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 (4) Stand-by Current vs. Input Voltage (5) Stand-by Current vs. Ambient Temperature XC8107xxxxxR XC8107xxxxxR CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 Ta=105℃ 2.5 Ta=25℃ Ta=-40℃ 2.0 1.5 1.0 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Stand-by Current : Istby [μA] Stand-by Current : Istby [μA] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 Istby 2.5 2.0 1.5 1.0 0.5 0.0 -50 Input Voltage : VIN [V] -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 13/27 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6) Supply Current vs. Input Voltage（sweep up） (7) Supply Current vs. Ambient Temperature XC8107xxxxxR XC8107xxxxxR CIN=1.0μF(ceramic), CL=1.0μF(ceramic) Supply Current : ISS [μA] Supply Current : ISS [μA] VIN=5.0V, CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 50 45 40 35 30 25 20 15 10 5 0 Ta=105℃ Ta=25℃ Ta=-40℃ 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 50 45 40 35 30 25 20 15 10 5 0 -50 Input Voltage : VIN [V] (8) CE "H" Level Voltage vs. Input Voltage VIN=5.0V -25 0 25 50 75 100 Ambient Temperature : Ta [℃] (9) CE "L" Level Voltage vs. Input Voltage XC8107xxxxxR XC8107xxxxxR 2.5 2.0 1.5 Ta=105℃ Ta=25℃ 0.5 Ta=-40℃ 0.0 0.0 0.5 1.0 1.5 2.0 Input Voltage : VIN [V] 2.5 (10) CE threshold Voltage vs. Ambient Temperature XC8107xxxxxR CIN=1.0μF(ceramic), CL=1.0μF(ceramic) CE threshold Voltage : VCE [V] 3.0 CE"H"Level 2.5 CE"L"Level 2.0 1.5 1.0 0.5 0.0 -50 14/27 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) CE "L" Level Voltage : VCEL [V] CE "H" Level Voltage : VCEH [V] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 1.0 125 125 3.0 2.5 2.0 1.5 1.0 Ta=105℃ Ta=25℃ 0.5 Ta=-40℃ 0.0 0.0 0.5 1.0 1.5 2.0 Input Voltage : VIN [V] 2.5 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (11) On Resistance vs. Input Voltage (SOT-25) (12) On Resistance vs. Ambient Temperature (SOT-25) XC8107xxxxMR XC8107xxxxMR CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 180 160 160 On Resistance : Ron [mΩ] On Resistance : Ron [mΩ] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 180 140 120 100 80 Ta=105℃ 60 Ta=25℃ 40 Ta=-40℃ 20 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : VIN [V] 5.5 120 100 80 VIN=2.5V 60 VIN=3.5V VIN=4.5V 40 VIN=5.0V 20 VIN=5.5V 0 -50 6.0 (13) On Resistance vs. Input Voltage (USP-6C) 140 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 (14) On Resistance vs. Ambient Temperature (USP-6C) XC8107xxxxER XC8107xxxxER CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 180 160 160 On Resistance : Ron [mΩ] On Resistance : Ron [mΩ] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 180 140 120 100 80 60 Ta=105℃ Ta=25℃ 40 Ta=-40℃ 20 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : VIN [V] 5.5 120 100 80 VIN=2.5V 60 VIN=3.5V 40 VIN=4.5V VIN=5.0V 20 VIN=5.5V 0 -50 6.0 (15) turn-on time vs. Input Voltage 140 XC8107xxxxxR 0.7 0.6 0.6 turn-on time : tDLY(ON) [ms] turn-on time : tDLY(ON) [ms] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 0.7 0.5 0.4 Ta=105℃ Ta=25℃ 0.2 Ta=-40℃ 0.1 CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 0.5 0.4 0.3 VIN=2.5V 0.2 VIN=3.5V VIN=4.5V 0.1 VIN=5.0V VIN=5.5V 0.0 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : VIN [V] 125 (16) turn-on time vs. Ambient Temperature XC8107xxxxxR 0.3 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 5.5 6.0 -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 15/27 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (17) turn-off time vs. Input Voltage (18) turn-off time vs. Ambient Temperature XC8107xxxxxR XC8107xxxxxR CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 0.09 0.08 0.08 turn-off time : tDLY(OFF) [ms] turn-off time : tDLY(OFF) [ms] VIN=4.3V, CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 0.09 0.07 0.06 0.05 0.04 Ta=105℃ 0.03 Ta=25℃ 0.02 Ta=-40℃ 0.01 0.00 0.07 0.06 0.05 VIN=2.5V VIN=3.5V 0.04 0.03 VIN=4.5V VIN=5.0V 0.02 VIN=5.5V 0.01 0.00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : VIN [V] 5.5 6.0 (19) FLG delay time over-current vs. Ambient Temperature -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] (20) FLG delay time reverse-voltage vs. Ambient Temperature XC8107xxxxxR XC8107xxxxxR CIN=1.0μF(ceramic), CL=1.0μF(ceramic) FLG reverse-voltage : tFD [ms] FLG over-current : tFD [ms] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 9.0 8.5 8.0 7.5 7.0 6.5 6.0 5.5 5.0 4.5 4.0 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V -50 125 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 125 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 (21) Output Voltage vs. Output Current XC8107xCxxxR XC8107xDxxxR CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 1.0A type 1.5A type 2.0A type 4.0 3.0 2.0 1.0 0.5A type Output Voltage : VOUT [V] Output Voltage : VOUT [V] 0.5A type 5.0 0.0 1.0A type 5.0 1.5A type 2.0A type 4.0 3.0 2.0 1.0 If the over-current state lasts for 7.5ms, the latch off type turns off the power switch transistor. 0.0 0.0 16/27 CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 6.0 6.0 0.5 1.0 1.5 2.0 2.5 3.0 Output Current : IOUT [A] 3.5 4.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Output Current : IOUT [A] 3.5 4.0 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (22) turn-on Delay vs. Rise Time (CL=1.0μF) (23) turn-oｆｆ Delay vs. Fall Time (CL=1.0μF) 8.0 3.0 6.0 2.5 2.0 Output Voltage 2.0 1.5 0.0 -2.0 1.0 -4.0 0.5 -6.0 Supply Current 0.0 (25) turn-oｆｆ Delay vs. Fall Time (CL=120μF) 3.5 8.0 3.0 6.0 2.5 2.0 0.0 1.5 1.0 0.5 -4.0 -6.0 Supply Current 0.0 VCE=5.0V→0V, tf=5μs, RL=10Ω, Ta=25℃ VIN=5.0V, CIN=1.0μF, CL=120μF(ceramic) 2.0 3.5 3.0 2.5 4.0 Output Voltage 2.0 1.5 0.0 CE Input Voltage -2.0 1.0 -4.0 0.5 -6.0 0.0 Supply Current -0.5 -8.0 -0.5 -8.0 -0.5 XC8107xx10xR 2.0 -2.0 0.0 Time [100μs/div] Voltage : [V] Output Voltage 0.5 -8.0 Supply Current : Isupply [A] Voltage : [V] 4.0 CE Input Voltage 1.0 -6.0 XC8107xx10xR 6.0 CE Input Voltage Supply Current (24) turn-on Delay vs. Rise Time (CL=120μF) 8.0 1.5 0.0 Time [100μs/div] VCE=0V→5.0V, tr=5μs, RL=10Ω, Ta=25℃ VIN=5.0V, CIN=1.0μF, CL=120μF(ceramic) 2.5 2.0 2.0 -4.0 -0.5 -8.0 3.0 Output Voltage 4.0 -2.0 3.5 Supply Current : Isupply [A] 4.0 Voltage : [V] 3.5 Voltage : [V] 6.0 CE Input Voltage Supply Current : Isupply [A] 8.0 XC8107xx10xR VCE=5.0V→0V, tf=5μs, RL=10Ω, Ta=25℃ VIN=5.0V, CIN=CL=1.0μF(ceramic) Supply Current : Isupply [A] XC8107xx10xR VCE=0V→5.0V, tr=5μs, RL=10Ω, Ta=25℃ VIN=5.0V, CIN=CL=1.0μF(ceramic) Time [500μs/div] Time [500μs/div] (26) Short Circuit Current, Device Enabled Into Short XC8107xx10xR XC8107xx10xR VCE=0V→5.0V, tr=5μs, Ta=25℃ VIN=5.0V, CIN=CL=1.0μF(ceramic) 4.0 2.5 2.0 2.0 1.5 0.0 Output Voltage 1.0 -2.0 0.5 -4.0 -6.0 Supply Current 0.0 -0.5 -8.0 Time [40μs/div] 6.0 3.0 4.0 2.5 2.0 2.0 1.5 0.0 Output Voltage 1.0 -2.0 0.5 -4.0 Supply Current Supply Current : Isupply [A] 3.0 Voltage : [V] CE Input Voltage 3.5 CE Input Voltage Supply Current : Isupply [A] Voltage : [V] 6.0 8.0 3.5 8.0 VCE=5.0V→0V, tf=5μs, Ta=25℃ VIN=5.0V, CIN=1.0μF, CL=120μF(ceramic) 0.0 -6.0 -0.5 -8.0 Time [40μs/div] 17/27 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （27） Short-Curcuit Transient Response (VOUT=5.0Ω→short, CL=1.0μF) （28） Short-Curcuit Transient Response (VOUT=short→5.0Ω, CL=1.0μF) XC8107xC10xR VIN=5.0V, tf=100μs, Ta=25℃ FLG=100kΩ, CIN=CL=1.0μF(ceramic) VOUT = Short circuit to Vss 6.0 FLG Voltage 2.0 2.5 2.0 0.0 1.5 Output Voltage 1.0 -4.0 0.5 Supply Current -6.0 -8.0 4.0 Voltage : [V] -4.0 -6.0 -0.5 -8.0 8.0 6.0 3.0 2.5 2.0 2.0 0.0 1.5 Output Voltage -2.0 1.0 -4.0 0.5 Supply Current 4.0 Voltage : [V] FLG Voltage Supply Current : Isupply [A] Voltage : [V] 0.0 -0.5 VIN=5.0V, tr=100μs, Ta=25℃ FLG=100kΩ, CIN=CL=1.0μF(ceramic) VOUT = Removed Short circuit 3.5 3.0 2.5 Output Voltage 2.0 2.0 FLG Voltage 0.0 1.5 -2.0 1.0 -4.0 0.5 0.0 -6.0 -0.5 -8.0 Supply Current : Isupply [A] VOUT = Short circuit to Vss -8.0 0.0 Supply Current -0.5 Time [2ms/div] Time [2ms/div] （31） Short-Curcuit Transient Response (VOUT=5.0Ω→short, CL=120μF) （32） Short-Curcuit Transient Response (VOUT=short→5.0Ω, CL=120μF) XC8107xC10xR XC8107xC10xR VIN=5.0V, tf=100μs, Ta=25℃ FLG=100kΩ, CIN=1.0μF, CL=120μF(ceramic) VOUT = Short circuit to Vss 8.0 3.5 6.0 3.0 2.5 2.0 2.0 1.5 0.0 Output Voltage 1.0 -2.0 0.5 -4.0 Supply Current -6.0 -8.0 Time [2ms/div] 4.0 Voltage : [V] FLG Voltage Supply Current : Isupply [A] Voltage : [V] 0.5 Supply Current （30） Short-Curcuit Transient Response (VOUT=short→open, CL=1.0μF) 3.5 4.0 18/27 1.0 XC8107xC10xR 8.0 4.0 1.5 Time [2ms/div] VIN=5.0V, tf=100μs, Ta=25℃ FLG=100kΩ, CIN=CL=1.0μF(ceramic) 6.0 2.0 FLG Voltage -2.0 XC8107xC10xR 8.0 2.5 Output Voltage 0.0 0.0 （29） Short-Curcuit Transient Response (VOUT=open→short, CL=1.0μF) -6.0 3.0 2.0 Time [2ms/div] 6.0 3.5 VIN=5.0V, tr=100μs, Ta=25℃ FLG=100kΩ, CIN=1.0μF, CL=120μF(ceramic) VOUT = Removed Short circuit 3.0 2.5 Output Voltage 2.0 3.5 FLG Voltage 2.0 0.0 1.5 -2.0 1.0 0.5 -4.0 Supply Current 0.0 -6.0 -0.5 -8.0 0.0 -0.5 Time [2ms/div] Supply Current : Isupply [A] Voltage : [V] 6.0 VOUT = Removed Short circuit 3.0 4.0 -2.0 8.0 3.5 Supply Current : Isupply [A] 8.0 VIN=5.0V, tr=100μs, Ta=25℃ FLG=100kΩ, CIN=CL=1.0μF(ceramic) Supply Current : Isupply [A] XC8107xC10xR XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （33） Short-Curcuit Transient Response (VOUT=open→short, CL=120μF) （34） Short-Curcuit Transient Response (VOUT=short→open, CL=120μF) VOUT = Short circuit to Vss Voltage : [V] 4.0 FLG Voltage 3.5 8.0 3.0 6.0 2.5 2.0 2.0 Output Voltage 0.0 1.5 -2.0 1.0 -4.0 0.5 -6.0 4.0 Voltage : [V] 6.0 XC8107xC10xR Supply Current : Isupply [A] 8.0 VIN=5.0V, tf=100μs, Ta=25℃ FLG=100kΩ, CIN=1.0μF, CL=120μF(ceramic) 3.5 3.0 2.5 Output Voltage 2.0 2.0 FLG Voltage 0.0 1.5 -2.0 1.0 -4.0 0.5 0.0 Supply Current -0.5 -8.0 -0.5 -8.0 VOUT = Removed Short circuit -6.0 0.0 Supply Current VIN=5.0V, tr=100μs, Ta=25℃ FLG=100kΩ, CIN=1.0μF, CL=120μF(ceramic) Supply Current : Isupply [A] XC8107xC10xR Time [2ms/div] Time [2ms/div] (35) UVLO Transient Response (CL=1.0μF) Voltage : [V] 4.0 Input Voltage 3.5 8.0 3.0 6.0 2.5 2.0 Output Voltage 2.0 1.5 0.0 -2.0 1.0 -4.0 0.5 -6.0 Supply Current -8.0 Voltage : [V] 6.0 XC8107xxxxxR Supply Current : Isupply [A] 8.0 VIN=0V→5.0V, tr=3ms, Ta=25℃ RL=5Ω, CIN=CL=1.0μF(ceramic) VIN=5.0V→0V, tf=3ms, Ta=25℃ RL=5Ω, CIN=CL=1.0μF(ceramic) 3.5 3.0 Input Voltage 4.0 2.5 2.0 2.0 1.5 0.0 Output Voltage -2.0 0.5 -4.0 0.0 -6.0 -0.5 -8.0 1.0 0.0 Supply Current : Isupply [A] XC8107xxxxxR Supply Current -0.5 Time [500μs/div] Time [500μs/div] (36) UVLO Transient Response (CL=120μF) Input Voltage Voltage : [V] 8.0 3.0 6.0 2.5 4.0 2.0 3.5 Output Voltage 2.0 1.5 0.0 -2.0 1.0 -4.0 0.5 -6.0 Supply Current -8.0 Time [500μs/div] Voltage : [V] 6.0 XC8107xxxxxR Supply Current : Isupply [A] 8.0 VIN=0V→5.0V, tr=3ms, Ta=25℃ RL=5Ω, CIN=1.0μF, CL=120μF(ceramic) VIN=5.0V→0V, tf=3ms, Ta=25℃ RL=5Ω, CIN=1.0μF, CL=120μF(ceramic) 3.5 3.0 Output Voltage 4.0 2.5 2.0 2.0 1.5 0.0 Input Voltage -2.0 1.0 -4.0 0.5 0.0 -6.0 -0.5 -8.0 Supply Current Supply Current : Isupply [A] XC8107xxxxxR 0.0 -0.5 Time [500μs/div] 19/27 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (37) Reverse Voltage Detected Voltage (CL=1.0μF) (38) Reverse Voltage Released Voltage (CL=1.0μF) Output Voltage 3.0 2.0 1.0 -2.0 0.0 -4.0 Supply Current -8.0 6.0 4.0 2.0 1.0 -4.0 -2.0 -8.0 0.0 Supply Current -1.0 -2.0 Time [500μs/div] (40) Reverse Voltage Released Voltage (CL=120μF) 6.0 8.0 5.0 6.0 4.0 Input Voltage 3.0 FLG Voltage 2.0 1.0 0.0 -4.0 Supply Current -1.0 4.0 Voltage : [V] Output Voltage -2.0 -6.0 3.0 XC8107xxxxxR VIN=5.0V, Ta=25℃ CIN=1.0μF, CL=120μF(ceramic) 2.0 0.0 4.0 Output Voltage 0.0 -6.0 Supply Current : Isupply [A] Voltage : [V] 4.0 5.0 -2.0 XC8107xxxxxR 6.0 Input Voltage 6.0 FLG Voltage -1.0 (39) Reverse Voltage Detected Voltage (CL=120μF) VOUT=5.5V forced VOUT = 5.5V Removed 2.0 Time [500μs/div] 8.0 VIN=5.0V, RL=5Ω, Ta=25℃ CIN=CL=1.0μF(ceramic) VOUT = 5.5V Removed Input Voltage 6.0 5.0 4.0 Output Voltage 3.0 FLG Voltage 0.0 2.0 -2.0 1.0 0.0 -4.0 Supply Current -1.0 -6.0 -2.0 -8.0 -2.0 -8.0 2.0 VIN=5.0V, Ta=25℃ CIN=1.0μF, CL=120μF(ceramic) Supply Current : Isupply [A] 0.0 FLG Voltage 8.0 5.0 4.0 Input Voltage 2.0 -6.0 6.0 Voltage : [V] Voltage : [V] 4.0 VOUT=5.5V forced Supply Current : Isupply [A] 8.0 6.0 XC8107xxxxxR VIN=5.0V, RL=5Ω, Ta=25℃ CIN=CL=1.0μF(ceramic) Supply Current : Isupply [A] XC8107xxxxxR Time [500μs/div] Time [500μs/div] （41） CE Transient Response XC8107xxxxxR XC8107xxxxxR VCE=0→5.0V, tr=5μs, Ta=25℃ VIN=5.0V, CIN=1.0μF, CL=120μF(ceramic) 0.035 0.030 0.025 Voltage : [V] 4.0 0.020 2.0 0.0 0.5A type 1.0A type -2.0 1.5A type -4.0 2.0A type 0.015 0.010 0.005 0.000 -6.0 In Rush Current -0.005 -8.0 Time [500μs/div] 20/27 3.5 8.0 6.0 Voltage : [V] 6.0 CE Voltage In Rush Current : IRUSH [A] 8.0 CE Voltage 3.0 4.0 2.5 2.0 2.0 0.0 0.5A type 1.5 -2.0 1.0A type 1.0 1.5A type -4.0 2.0A type 0.0 -6.0 -8.0 0.5 In Rush Current Time [500μs/div] -0.5 In Rush Current : IRUSH [A] VCE=0→5.0V, tr=5μs, Ta=25℃ VIN=5.0V, CIN=CL=1.0μF(ceramic) XC8107 Series ■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (43) Current Limit adapted time (42) Short Applied XC8107xx10xR 12.0 10.0 4.0 Voltage : [V] 14.0 8.0 2.0 Output Voltage 0.0 6.0 -2.0 4.0 2.0 -4.0 In Rush Current 0.0 -6.0 -2.0 -8.0 Time [2μs/div] Current Limit Response : [μs] 6.0 VOUT = Short circuit to Vss XC8107xx10xR In Rush Current : [A] 8.0 VIN=5.0V, Ta=25℃ CL=open VIN=5.0V, Ta=25℃ CL=open 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0.0 1.0 2.0 3.0 4.0 5.0 Peak Limit Current [A] 6.0 21/27 XC8107 Series ■PACKAGING INFORMATION ●USP-6C (unit:mm) 1.8±0.05 1pin INDENT 0.05 0.30±0.05 (0.1) (0.50) 0.10±0.05 1.4±0.05 ●SOT-25 (unit:mm) 22/27 0.20±0.05 XC8107 Series ■PACKAGING INFORMATION (Continued) ●USP-6C Reference Pattern Layout (unit: mm) ●USP-6C Reference Metal Mask Design (unit: mm) 23/27 XC8107 Series ■PACKAGING INFORMATION (Continued) ● SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition: Ambient: Soldering: Board: 40.0 Mount on a board Natural convection 28.9 Lead (Pb) free 2 Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used) Material: Thickness: Through-hole Glass Epoxy (FR-4) 1.6mm 4 x 0.8 Diameter 2.54 1.4 Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature (105℃) Board Mount (Tjmax=125℃) Ambient Temperature (℃) Power Dissipation Pd (mW) 25 600 105 120 Thermal Resistance (℃/W) 166.67 Power Dissipation: Pd (mW) 許容損失Pd（mW） Pd vs. Ta Pd-Ta特性グラフ 700 600 500 400 300 200 100 0 25 24/27 45 65 85 周囲温度Ta（℃） Ambient Temperature: Ta (℃) 105 125 XC8107 Series ■PACKAGING INFORMATION (Continued) ● USP-6C Power Dissipation Power dissipation data for the USP-6C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition: Ambient: Soldering: Board: Mount on a board Natural convection Lead (Pb) free 2 Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Thickness: Through-hole Glass Epoxy (FR-4) 1.6mm 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature (105℃) Board Mount (Tjmax=125℃) Ambient Temperature (℃) Power Dissipation Pd (mW) 25 1000 105 200 Thermal Resistance (℃/W) 100.00 Power Dissipation: Pd (mW) 許容損失Pd（mW） Pd vs. Ta Pd-Ta特性グラフ 1200 1000 800 600 400 200 0 25 45 65 85 周囲温度Ta（℃） Ambient Temperature: Ta (℃) 105 125 25/27 XC8107 Series ■MARKING RULE ① represents products series SOT-25 5 ① ② ③ 1 ④ 2 MARK PRODUCT SERIES 4 Z XC8107******-G ⑤ ② represents product type 3 USP-6C ② ⑤ ③ 3 ④ 2 ① 1 6 5 4 MARK CE LOGIC PROTECTION CIRCUIT TYPE PRODUCT SERIES 1 Active High Auto-recovery XC8107AC****-G 2 Active High Latch-off XC8107AD****-G 3 Active Low Auto-recovery XC8107BC****-G 4 Active Low Latch-off XC8107BD****-G ③ represents maximum output current MARK CURRENT (A) PRODUCT SERIES 1 2 0.5 1.0 XC8107**05**-G XC8107**10**-G 3 1.5 XC8107**15**-G 4 2.0 XC8107**20**-G ④⑤ represents production lot number 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. 26/27 XC8107 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 27/27