MC74LCXU04 Low-Voltage CMOS Unbuffered Hex Inverter With 5 V−Tolerant Inputs The MC74LCXU04 is a high performance unbuffered hex inverter operating from a 2.3 to 3.6 V supply. (High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance.) A VI specification of 5.5 V allows MC74LCXU04 inputs to be safely driven from 5 V devices. http://onsemi.com MARKING DIAGRAMS 14 Features • • • • • SOIC−14 D SUFFIX CASE 751A 14 Designed for 2.3 to 3.6 V VCC Operation 5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic 1 1 LVTTL Compatible LVCMOS Compatible Near Zero Static Supply Current (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA • • ESD Performance: Human Body Model >2000 V Machine Model >200 V These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 14 14 1 ♦ LCX U04 ALYWG G TSSOP−14 DT SUFFIX CASE 948G 1 ♦ • LCXU04G AWLYWW A L, WL Y, YY W, WW G or G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2012 October, 2012 − Rev. 9 1 Publication Order Number: MC74LCXU04/D MC74LCXU04 VCC A3 O3 A4 O4 A5 O5 14 13 12 11 10 9 8 PIN NAMES Pins Function An Data Inputs On Outputs TRUTH TABLE An On 1 2 3 4 5 6 7 L H A0 O0 A1 O1 A2 O2 GND H L Figure 1. Pinout: 14−Lead (Top View) A0 A1 A2 A3 A4 A5 1 2 3 4 5 6 13 12 11 10 9 8 O0 O1 O2 O3 O4 O5 Figure 2. Logic Diagram MAXIMUM RATINGS Symbol VCC Parameter DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK Value Condition Units −0.5 to +7.0 V −0.5 ≤ VI ≤ +7.0 V −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State. (Note 1) V DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C MSL Moisture Sensitivity Level 1 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. http://onsemi.com 2 MC74LCXU04 RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Min Typ Max 2.0 1.5 2.5, 3.3 2.5, 3.3 3.6 3.6 Supply Voltage Operating Data Retention Only VI Input Voltage 0 5.5 0 VCC VO Output Voltage (HIGH or LOW State) IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V −18 −12 −8 IOL LOW Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V +16 +12 +8 TA Operating Free−Air Temperature Dt/DV Units V V V mA mA −40 +85 °C 0 10 ns/V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V DC ELECTRICAL CHARACTERISTICS TA = −40°C to +85°C Symbol VIH VIL VOH VOL IOFF Characteristic HIGH Level Input Voltage (Note 2) LOW Level Input Voltage (Note 2) HIGH Level Output Voltage LOW Level Output Voltage Power Off Leakage Current IIN Input Leakage Current ICC Quiescent Supply Current DICC Increase in ICC per Input Condition Min VCC = 2.3 V 1.7 VCC = 2.7 V 2.1 VCC = 3.0 V 2.2 VCC = 3.6 V 2.7 Max V VCC = 2.3 V 0.55 VCC = 2.7 V 0.55 VCC = 3.0 V 0.55 VCC = 3.6 V 0.55 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA VCC − 0.2 VCC = 2.3 V; IOH = −8 mA 1.8 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 Units V V 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA 0.2 V VCC = 2.3 V; IOL = 8 mA 0.6 VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.5 VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 mA VCC = 3.6 V, VIN = 5.5 V or GND ±5 mA VCC = 3.6 V, VIN = 5.5 V or GND 10 mA 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 mA 2. These values of VI are used to test DC electrical characteristics only. http://onsemi.com 3 MC74LCXU04 AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 W) (Note 3) Limits TA = −40°C to +85°C Parameter Symbol tPLH tPHL tOSHL tOSLH Propagation Delay Input to Output VCC = 3.3 V ± 0.3 V VCC = 2.7 V VCC = 2.5 V ± 0.2 V CL = 50 pF CL = 50 pF CL = 30 pF Waveform Min Max Min Max Min Max Units 1 1.0 1.0 3.6 3.6 1.0 1.0 4.5 4.5 1.0 1.0 4.3 4.3 ns Output−to−Output Skew (Note 4) 1.0 1.0 ns 3. These AC parameters are preliminary and may be modified. 4. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol Characteristic Condition Min Typ Max Units VOLP Dynamic LOW Peak Voltage (Note 5) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.8 0.6 V VOLV Dynamic LOW Valley Voltage (Note 5) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.8 −0.6 V 5. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Condition Typical Units Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF CIN Parameter ORDERING INFORMATION Package Shipping† MC74LCXU04DG SOIC−14 (Pb−Free) 55 Units / Rail MC74LCXU04DR2G SOIC−14 (Pb−Free) 2500 Tape & Reel MC74LCXU04DTG TSSOP−14 (Pb−Free) 96 Units / Rail MC74LCXU04DTR2G TSSOP−14 (Pb−Free) 2500 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MC74LCXU04 VCC An Vmi Vmi 0V tPHL tPLH Vmo On VOH Vmo VOL PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VCC Symbol 3.3 V ± 0.3 V 2.7 V 2.5 V ± 0.2 V Vmi 1.5 V 1.5 V VCC/2 Vmo 1.5 V 1.5 V VCC/2 Figure 3. AC Waveforms VCC PULSE GENERATOR DUT RT CL = CL = RL = RT = CL RL 50 pF at VCC = 3.3 ± 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 ± 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 W or equivalent ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit http://onsemi.com 5 MC74LCXU04 PACKAGE DIMENSIONS SOIC−14 NB CASE 751A−03 ISSUE K D A B 14 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. A3 E H L 1 0.25 M DETAIL A 7 B 13X M b 0.25 M C A S B S e DETAIL A h A X 45 _ M A1 C SEATING PLANE DIM A A1 A3 b D E e H h L M MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.19 0.25 0.35 0.49 8.55 8.75 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ SOLDERING FOOTPRINT* 6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 INCHES MIN MAX 0.054 0.068 0.004 0.010 0.008 0.010 0.014 0.019 0.337 0.344 0.150 0.157 0.050 BSC 0.228 0.244 0.010 0.019 0.016 0.049 0_ 7_ MC74LCXU04 PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. N F 7 1 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S S DETAIL E K A −V− ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 J J1 SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E DIM A B C D F G H J J1 K K1 L M SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS http://onsemi.com 7 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74LCXU04 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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