DOCUMENT : SRFD0000NH REVISION : A2 PAGE : 1 OF 7 SPECIFICATION FOR APPROVAL 1/20W, 0201 Low Resistance Chip Resistor (Lead / Halogen free) 1. Scope This specification applies to 0.3mm x 0.6mm size 1/20W, fixed metal film chip resistors rectangular type for use in electronic equipment. 2. Type Designation RL 0603 (1) Where 3. — D — □□□□ □ (2) (3) (4) (1) Series No. (2) Power rating D = 1/20W (3) Resistance value: For example— R070 = 0.070 Ω R100 = 0.1 Ω (4) Resistance tolerance: F = ± 1% G = ± 2% J = ± 5% Construction and Physical Dimensions L a a W b t b Figure 1. Construction and Dimensions Code Letter Dimensions (mm) L 0.6 ± 0.03 W 0.31 ± 0.04 t 0.27 ± 0.04 a 0.14 ± 0.06 b 0.14 ± 0.06 ① Resistive element : Metal film (Under protection film) ② Electrode : Solder Sn (on Cu) Sn 100% ( Lead free) ③ Protection film : Epoxy resin ④ Substrate : Alumina DOCUMENT : SRFD0000NH REVISION : A2 PAGE : 2 OF 7 SPECIFICATION FOR APPROVAL 4. Electrical Specifications 4-1 Specification Power Rating* 1/20 W Resistance Range 0.020Ω~＜0.070Ω 0.070Ω ~ 1.0Ω ±1% , ±2% , ±5% Resistance Tolerance T.C.R. (Temperature Coefficient of Resistance) ± 200ppm/℃ 0~500 ppm/℃ Note*: Power Rating is based on continuous full load operation at rated ambient temperature of 70℃. For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be derated in accordance with the following curve. % 100 Percentage of the rated dissipation 50 0 -55 70 125 Ambient temperature Figure 2 Derating Curve 4-2 Rated Voltage The rated voltage shall be determined by the following expression. V = P× R Where V：Rated voltage (V) R：Nominal resistance value (Ω) P：Rated dissipation (W) 4-3 Operating and Storage Temperature Range -55 to +125℃ ℃ DOCUMENT : SRFD0000NH REVISION : A2 PAGE : 3 OF 7 SPECIFICATION FOR APPROVAL 5. Characteristics Test Item Condition of Test Requirements Short Time Overload 2.5 * Rated power for 5 seconds Refer to JIS C 5201-1 4.13 ∆R : ± (0.5%+0.0005Ω) Without significant damage by flashover ( spark, arching ), burning or breakdown etc. Insulation Resistance The resistor shall be cramped in the metal block and tested , as shown below. Test voltage : 100 ± 15VDC for 1 minute Refer to JIS C 5201-1 4.6 Mounting condition G. Between Electrode and Protection Film 100MΩ or over Between Electrode and Substrate 1,000MΩ or over Voltage Proof The voltage : 100VAC (rms.) for 1 minute ∆R : ± (0.5%+0.0005Ω) Refer to JIS C 5201-1 4.7 Without damage by flashover, fire or breakdown, as shown below. Thermal Shock -55 ~125℃ 5 cycles, 15 min at each extreme condition Refer to JIS C 5201-1 4.19 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance Low Temperature Storage Kept at -55℃, 1,000 hours Refer to JIS C 5201-1 4.23.4 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance High Temperature Exposure Kept at 125℃ for 1,000 hours Refer to JIS C 5201-1 4.23.2 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance Solderability Temperature of Solder : 245 ± 5℃ Immersion Duration : 2 ± 0.5 second Refer to JIS C 5201-1 4.17 Uniform coating of solder cover minimum of 95% surface being immersed Resistance to Soldering Heat Dipped into solder at 270 ± 5℃ for 10 ± 1 seconds Refer to JIS C 5201-1 4.18 ∆R : ± (0.5%+0.0005Ω) Without distinct deformation in appearance DOCUMENT : SRFD0000NH REVISION : A2 PAGE : 4 OF 7 SPECIFICATION FOR APPROVAL Test Item Condition of Test Requirements Load Life Rated voltage for 1.5 hours followed by a pause 0.5 hour at 70 ± 2℃. Cycle repeated 1000 hours Refer to JIS C 5201-1 4.25 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance Damp Heat with Load 40 ± 2℃ with relative humidity 90% to 95%. D.C. rated voltage for 1.5 hours ON and 30 minutes OFF. Cycle repeated 1,000 hours Refer to JIS C 5201-1 4.24 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance Mechanical Shock 100 G’s for 6milliseconds. 5 pulses Refer to JIS C 5201-1 4.21 ∆R : ± (0.5%+0.0005Ω) Without mechanical damage such as break Bending Test Glass-Epoxy board thickness : 1.6mm Bending width : 2mm Between the fulcrums : 90mm Refer to JIS C 5201-1 4.33 ∆R : ±(0.5%+0.0005Ω) Without mechanical damage such as break DOCUMENT : SRFD0000NH REVISION : A2 PAGE : 5 OF 7 SPECIFICATION FOR APPROVAL 6. Recommend Land Pattern Dimensions A B C A 0.3 B 1.0 C 0.3 ~ 0.7 Unit : mm DOCUMENT : SRFD0000NH REVISION : A2 PAGE : 6 OF 7 SPECIFICATION FOR APPROVAL 7. Packaging 7-1 Dimensions 7-1-1 Tape packaging dimensions 0.38 ± 0.05 +0.1 1.5-0.0 Sprocket hole 4.0 ± 0.1 1.75 ±0.1 a CHIP 3.5 ± 0.05 8.0 ± 0.3 b 0.49 max. 4.0 ± 0.1 Carrier cavity 2.0 ± 0.05 Pull Direction ※Pre-emptied holes : 150 holes (or 30cm) or more. Code letter a b Dimension 0.40 ± 0.05 0.7 ± 0.05 Unit : mm 7-1-2 Reel dimensions 2.0±0.5 60 ± 2.0 178 ± 2.0 13 ± 0.2 21 ± 0.8 9.0 ± 0.3 Unit : mm 11.4 ± 1.0 SPECIFICATION FOR APPROVAL 7-2 Peel force of top cover tape The peel speed shall be about 300 mm/min. The peel force of top cover tape shall be between 0.1 to 0.5 N. Top Cover Tape 165 ~ 180° 0.1~0.7 N 7-3 Numbers of taping 10,000 pieces/reel 7-4 Making The following items shall be marked on the reel. (1) Type designation (2) Quantity (3) Manufacturing date code (4) Manufacturer’s name (5) The country of origin DOCUMENT : SRFD0000NH REVISION : A2 PAGE : 7 OF 7