ONSEMI MC14094BDTR2G

MC14094B
8-Stage Shift/Store Register
with Three-State Outputs
The MC14094B combines an 8−stage shift register with a data latch
for each stage and a 3−state output from each latch.
Data is shifted on the positive clock transition and is shifted from the
seventh stage to two serial outputs. The QS output data is for use in
high−speed cascaded systems. The QS output data is shifted on the
following negative clock transition for use in low−speed cascaded systems.
Data from each stage of the shift register is latched on the negative
transition of the strobe input. Data propagates through the latch while
strobe is high.
Outputs of the eight data latches are controlled by 3−state buffers which
are placed in the high−impedance state by a logic Low on Output Enable.
Features
• 3−State Outputs
• Capable of Driving Two Low−Power TTL Loads or One Low−Power
Schottky TTL Load Over the Rated Temperature Range
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MARKING DIAGRAMS
PDIP−16
P SUFFIX
CASE 648
SOEIAJ−16
F SUFFIX
CASE 966
Parameter
VDD
Vin, Vout
Iin, Iout
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
Input or Output Current
(DC or Transient) per Pin
14094BG
AWLYWW
1
16
•
•
•
•
Symbol
1
16
TSSOP−16
DT SUFFIX
CASE 948F
MAXIMUM RATINGS (Voltages Referenced to VSS)
MC14094BCP
AWLYYWWG
SOIC−16
D SUFFIX
CASE 751B
• Input Diode Protection
• Data Latch
• Dual Outputs for Data Out on Both Positive and
Negative Clock Transitions
Useful for Serial−to−Parallel Data Conversion
Pin−for−Pin Compatible with CD4094B
These Devices are Pb−Free and are RoHS Compliant
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
16
14
094B
ALYWG
G
1
16
A
WL, L
YY, Y
WW, W
G or G
MC14094B
ALYWG
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Indicator
Value
Unit
−0.5 to +18.0
V
−0.5 to VDD + 0.5
V
±10
mA
PD
Power Dissipation, per Package (Note 1)
500
mW
TA
Ambient Temperature Range
−55 to +125
°C
Tstg
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature
(8−Second Soldering)
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be
taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout
should be constrained to the range VSS v (Vin or Vout) v VDD.
ORDERING INFORMATION
Unused inputs must always be tied to an appropriate logic voltage level
See detailed ordering and shipping information in the package
(e.g., either VSS or VDD). Unused outputs must be left open.
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 9
1
Publication Order Number:
MC14094B/D
MC14094B
PIN ASSIGNMENT
STROBE
1
16
DATA
2
15
CLOCK
3
14
VDD
OUTPUT
ENABLE
Q5
Q1
4
13
Q6
Q2
5
12
Q7
Q3
6
11
Q8
Q4
7
10
Q′S
VSS
8
9
QS
TRUTH TABLE
Clock
Parallel Outputs
Serial Outputs
Output
Enable
Strobe
Data
Q1
QN
QS *
Q′S
0
X
X
Z
Z
Q7
No Chg.
0
X
X
Z
Z
No Chg.
Q7
1
0
X
No Chg.
No Chg.
Q7
No Chg.
1
1
0
0
QN−1
Q7
No Chg.
1
1
1
1
QN−1
Q7
No Chg.
1
1
1
No Chg.
No Chg.
No Chg.
Q7
Z = High Impedance
X = Don’t Care
* At the positive clock edge, information in the 7th shift register stage is transferred to Q8 and QS.
ORDERING INFORMATION
Package
Shipping†
MC14094BCPG
PDIP−16
(Pb−Free)
500 Units / Rail
MC14094BDG
SOIC−16
(Pb−Free)
48 Units / Rail
MC14094BDR2G
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
TSSOP−16
(Pb−Free)
2500 Units / Tape & Reel
SOEIAJ−16
(Pb−Free)
2000 Units / Tape & Reel
Device
NLV14094BDR2G*
MC14094BDTR2G
NLV14094BDTR2G*
MC14094BFELG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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2
MC14094B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
− 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ (2)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
−
−
−
−
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
−
−
−
−
– 1.7
– 0.36
– 0.9
– 2.4
−
−
−
−
IOL
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current
Iin
15
−
±0.1
−
±0.00001
±0.1
−
±1.0
mAdc
Input Capacitance
(Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
−
−
−
5.0
10
20
−
−
−
0.005
0.010
0.015
5.0
10
20
−
−
−
150
300
600
mAdc
Total Supply Current (3) (4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT
5.0
10
15
3−State Output Leakage Current
ITL
15
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Source
Sink
IOH
Vdc
Vdc
mAdc
IT = (4.1 mA/kHz) f + IDD
IT = (14 mA/kHz) f + IDD
IT = (140 mA/kHz) f + IDD
−
±0.1
−
±0.0001
±0.1
mAdc
−
±3.0
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
http://onsemi.com
3
mA
MC14094B
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SWITCHING CHARACTERISTICS (5) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.35 ns/pF) CL + 33 ns
tTLH, tTHL = (0.6 ns/pF) CL + 20 ns
tTLH, tTHL = (0.4 ns/pF) CL + 20 ns
tTLH,
tTHL
Propagation Delay Time (Figure 1)
Clock to Serial out QS
tPLH, tPHL = (0.90 ns/pF) CL + 305 ns
tPLH, tPHL = (0.36 ns/pF) CL + 107 ns
tPLH, tPHL = (0.26 ns/pF) C L + 82 ns
tPLH,
tPHL
VDD
Vdc
Min
Typ (6)
Max
5.0
10
15
−
−
−
100
50
40
200
100
80
Unit
ns
ns
5.0
10
15
−
−
−
350
125
95
600
250
190
Clock to Serial out Q’S
tPLH, tPHL = (0.90 ns/pF) CL + 350 ns
tPLH, tPHL = (0.36 ns/pF) CL + 149 ns
tPLH, tPHL = (0.26 ns/pF) CL + 62 ns
5.0
10
15
−
−
−
230
110
75
460
220
150
Clock to Parallel out
tPLH, tPHL = (0.90 ns/pF) CL + 375 ns
tPLH, tPHL = (0.35 ns/pF) CL + 177 ns
tPLH, tPHL = (0.26 ns/pF) CL + 122 ns
5.0
10
15
−
−
−
420
195
135
840
390
270
Strobe to Parallel out
tPLH, tPHL = (0.90 ns/pF) CL + 245 ns
tPLH, tPHL = (0.36 ns/pF) C L + 127 ns
tPLH, tPHL = (0.26 ns/pF) CL + 87 ns
5.0
10
15
−
−
−
290
145
100
580
290
200
tPHZ,
tPZL
5.0
10
15
−
−
−
140
75
55
280
150
110
tPLZ,
tPZH
5.0
10
15
−
−
−
225
95
70
450
190
140
Setup Time
Data in to Clock
tsu
5.0
10
15
125
55
35
60
30
20
−
−
−
ns
Hold Time
Clock to Data
th
5.0
10
15
0
20
20
– 40
– 10
0
−
−
−
ns
Clock Pulse Width, High
tWH
5.0
10
15
200
100
83
100
50
40
−
−
−
ns
Clock Rise and Fall Time
tr(cl)
tf(cl)
5
10
15
−
−
−
−
−
−
15
5.0
4.0
ms
fcl
5.0
10
15
−
−
−
2.5
5.0
6.0
1.25
2.5
3.0
MHz
tWL
5.0
10
15
200
80
70
100
40
35
−
−
−
ns
Output Enable to Output
tPHZ, tPZL = (0.90 ns/pF) CL + 95 ns
tPHZ, tPZL = (0.36 ns/PF) CL + 57 ns
tPHZ, tPZL = (0.26 ns/pF) CL + 42 ns
tPLZ, tPZH = (0.90 ns/pF) CL + 180 ns
tPLZ, tPZH = (0.36 ns/pF) CL + 77 ns
tPLZ, tPZH = (0.26 ns/pF) CL + 57 ns
Clock Pulse Frequency
Strobe Pulse Width
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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4
MC14094B
3−STATE TEST CIRCUIT
FOR tPHZ AND tPZH
VSS
FOR tPLZ AND tPZL
VDD
O.E.
R1 = 1 k = tPHL, tPLH
R1 = 10 k = tPHZ, tPZH, tPLZ, tPZL
R1
DATA
OUTPUT
ST
50 pF
CLOCK
Figure 1.
BLOCK DIAGRAM
REGISTER STAGE 1
CLOCK
2
CLOCK
STROBE
VDD
CLOCK
CLOCK
STROBE STROBE
CLOCK
CLOCK
STROBE
4
Q1
*
2
OUTPUT
ENABLE
3
4
5
6
7
8
REGISTER STAGE 2
LATCH 2
3-STATE BUFFER2
5
Q2
REGISTER STAGE 3
LATCH 3
3-STATE BUFFER3
6
Q3
REGISTER STAGE 4
LATCH 4
3-STATE BUFFER4
7
Q4
REGISTER STAGE 5
LATCH 5
3-STATE BUFFER5
14
Q5
REGISTER STAGE 6
LATCH 6
3-STATE BUFFER6
13
Q6
REGISTER STAGE 7
LATCH 7
3-STATE BUFFER7
12
Q7
LATCH 8
3-STATE BUFFER8
11
Q8
10
Q′S
9
QS
REGISTER STAGE 8
CLOCK
3
3-STATE BUFFER 1
*
SERIAL
DATA IN
15
LATCH 1
*
STROBE STROBE
CLOCK
CLOCK
CLOCK
CLOCK
CLOCK
CLOCK
CLOCK
1
*
STROBE
STROBE
*Input Protection Diodes
CLOCK
STROBE
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5
MC14094B
DYNAMIC TIMING DIAGRAM
tWH
3
tf
tr
CLOCK
50%
90%
50%
10%
tsu
2
th
DATA IN
tWL
1
STROBE
15
OUTPUT
ENABLE
50%
tPLH
N
Q1 ³ Q7
tPHL
9
QS
tPHZ
90%
90%
tTHL
tPLZ
tPZL
90%
10%
10%
tPHL
tPLH
50%
50%
tPLH
10 Q′S
tPZH
90%
10%
10%
tTLH
tPLH
50%
50%
tPHL
50%
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6
MC14094B
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
S
−T−
H
SEATING
PLANE
K
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
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7
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MC14094B
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
B
M
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT*
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14094B
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
T U
M
S
V
S
K
S
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
8
1
0.25 (0.010)
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
9
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC14094B
PACKAGE DIMENSIONS
SOEIAJ−16
F SUFFIX
CASE 966−01
ISSUE A
16
LE
9
Q1
E HE
1
M_
L
8
Z
DETAIL P
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
0.10 (0.004)
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--0.78
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.031
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MC14094B/D