MOTOROLA MC74HCU04N

SEMICONDUCTOR TECHNICAL DATA
High–Performance Silicon–Gate CMOS
The MC74HCU04 is identical in pinout to the LS04 and the MC14069UB.
The device inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
This device consists of six single–stage inverters. These inverters are well
suited for use as oscillators, pulse shapers, and in many other applications
requiring a high–input impedance amplifier. For digital applications, the
HC04 is recommended.
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
14
1
• Output Drive Capability: 10 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2 to 6 V; 2.5 to 6 V in Oscillator
Configurations
• Low Input Current: 1 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 12 FETs or 3 Equivalent Gates
D SUFFIX
SOIC PACKAGE
CASE 751A–03
14
1
ORDERING INFORMATION
MC74HCUXXN
MC74HCUXXD
Plastic
SOIC
PIN ASSIGNMENT
LOGIC DIAGRAM
A1
A2
A3
1
2
3
4
5
6
9
8
11
10
Y1
Y2
A1
1
14
VCC
Y1
2
13
A6
A2
3
12
Y6
Y2
4
11
A5
A3
5
10
Y5
Y3
6
9
A4
GND
7
8
Y4
Y3
Y=A
A4
A5
A6
13
12
FUNCTION TABLE
Y4
Y5
Y6
PIN 14 = VCC
PIN 7 = GND
10/95
 Motorola, Inc. 1995
1
REV 6
Inputs
A
Outputs
Y
L
H
H
L
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MC74HCU04
MAXIMUM RATINGS*
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to GND)
Value
Unit
– 0.5 to + 7.0
V
V
Vin
DC Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air
750
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
Iin
TL
Plastic DIP†
SOIC Package†
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
_C
Lead Temperature, 1 mm from case for 10 Seconds
(Plastic DIP or SOIC Package)
260
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: –10mW/_C from 65_ to 125_C
SOIC Package: –7mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
DC Supply Voltage (Referenced to GND)
Min
Max
Unit
2.0
6.0
V
0
VCC
V
– 55
+ 125
_C
—
No
Limit
ns
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time (Figure 1)
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
VCC
V
– 55 to
25_C
85_C
125_C
VIH
Minimum High–Level Input
Voltage
Vout = 0.5 V*
|Iout|
20 µA
2.0
4.5
6.0
1.7
3.6
4.8
1.7
3.6
4.8
l.7
3.6
4.8
V
VIL
Maximum Low–Level Input
Voltage
Vout = VCC – 0.5 V*
|Iout|
20 µA
2.0
4.5
6.0
0.3
0.8
1.1
0.3
0.8
1.1
0.3
0.8
1.1
V
Minimum High–Level Output
Voltage
Vin = GND
|Iout|
20 µA
2.0
4.5
6.0
1.8
4.0
5.5
1.8
4.0
5.5
1.8
4.0
5.5
V
4.5
6.0
3.86
5.36
3.76
5.26
3.70
5.20
2.0
4.5
6.0
0.2
0.5
0.5
0.2
0.5
0.5
0.2
0.5
0.5
4.5
6.0
0.32
0.32
0.37
0.37
0.40
0.40
6.0
± 0.1
± 1.0
± 1.0
Symbol
VOH
Parameter
Test Conditions
Vin = GND
VOL
Maximum Low–Level Output
Voltage
Maximum Input Leakage Current
4.0 mA
5.2 mA
Vin = VCC
|Iout|
20 µA
Vin = VCC
Iin
|Iout|
|Iout|
|Iout|
|Iout|
Vin = VCC or GND
4.0 mA
5.2 mA
Unit
V
µA
Vin = VCC or GND
6.0
2
20
40
µA
Iout = 0 µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
* For VCC = 2.0 V, Vout = 0.2 V or VCC – 0.2 V.
ICC
MOTOROLA
Maximum Quiescent Supply
Current (per Package)
2
High–Speed CMOS Logic Data
DL129 — Rev 6
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MC74HCU04
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
VCC
V
– 55 to
25_C
85_C
125_C
tPLH,
tPHL
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 2)
2.0
4.5
6.0
80
16
14
100
20
17
120
24
20
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 2)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
ns
Maximum Input Capacitance
—
10
10
10
pF
Symbol
Cin
Parameter
Unit
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Inverter)*
pF
15
* Used to determine the no–load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
TEST POINT
tr
90%
50%
10%
INPUT A
tPHL
90%
50%
10%
OUTPUT Y
tTHL
tf
OUTPUT
VCC
DEVICE
UNDER
TEST
GND
tPLH
tTLH
CL*
* Includes all probe and jig capacitance
Figure 1. Switching Waveforms
Figure 2. Test Circuit
LOGIC DETAIL
(1/6 of Device Shown)
VCC
A
High–Speed CMOS Logic Data
DL129 — Rev 6
Y
3
MOTOROLA
MC74HCU04
TYPICAL APPLICATIONS
Crystal Oscillator
Stable RC Oscillator
1/6 HCU04 1/6 HCU04
R2
1/6 HCU04
Vout
1/6 HCU04
R2 > > R1
C1 < C2
C
R1
R2
R1
C2
C1
Vout
Schmitt Trigger
High Input Impedance Single–Stage Amplifier
with a 2 to 6 V Supply Range
VCC
R2
1 M 1/6 HCU04
R2 > 6R1
R1
1/6 HCU04
1/6 HCU04
INPUT
Vin
OUTPUT
Vout
1M
Multi–Stage Amplifier
LED Driver
+V
VCC
1/6 HCU04
INPUT
1/6 HCU04
1/6 HCU04 1/6 HCU04
OUTPUT
For reduced power supply current, use high–efficiency
LEDs
such as the Hewlett–Packard HLMP series or equivalent.
MOTOROLA
4
High–Speed CMOS Logic Data
DL129 — Rev 6
MC74HCU04
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
14
8
1
7
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
B
A
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
C
J
N
H
G
D
SEATING
PLANE
K
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
–A–
14
1
P 7 PL
0.25 (0.010)
7
G
D
0.25 (0.010)
M
T
F
J
M
K
14 PL
B
S
M
R X 45°
C
SEATING
PLANE
B
M
A
S
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
8
–B–
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0°
7°
6.20
5.80
0.50
0.25
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7°
0°
0.228 0.244
0.010 0.019
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
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High–Speed CMOS Logic Data
DL129 — Rev 6
◊
CODELINE
5
*MC74HCU04/D*
MC74HCU04/D
MOTOROLA