ONSEMI NCV8603

NCV8603
300 mA High Performance
CMOS LDO Regulator with
Enable and Enhanced ESD
Protection
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The NCV8603 provides 300 mA of output current at fixed voltage
options. It is designed for portable battery powered applications and
offers high performance features such as low power operation, fast
enable response time, and low dropout.
The device is designed to be used with low cost ceramic capacitors
and is packaged in the TSOP−5.
Features







Fast Enable Turn−on Time of 15 ms
Wide Supply Voltage Range Operating Range
Excellent Line and Load Regulation
Typical Noise Voltage of 50 mVrms without a Bypass Capacitor
Enhanced ESD Protection (HBM 3.5 kV, MM 200 V)
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
TSOP−5
SN SUFFIX
CASE 483
PIN CONNECTIONS
Vin
1
GND
2
ENABLE
3
Vout
4
NC
(Top View)
MARKING DIAGRAM
Typical Applications





5
5
SMPS Post−Regulation
Hand−held Instrumentation & Audio Players
Noise Sensitive Circuits – VCO, RF Stages, etc.
Camcorders and Cameras
Portable Computing
ADWAYWG
G
1
VOUT
VIN
ADW
A
Y
W
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
Driver w/
Current Limit
GND
+
-
ORDERING INFORMATION
+
1.25 V
−
See detailed ordering and shipping information in the
package dimensions section on page 9 of this data sheet.
Thermal
Shutdown
ENABLE
Figure 1. Simplified Block Diagram
 Semiconductor Components Industries, LLC, 2013
July, 2013 − Rev. 2
1
Publication Order Number:
NCV8603/D
NCV8603
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
1
Vin
2
GND
3
ENABLE
Description
Positive Power Supply Input
Power Supply Ground; Device Substrate
The Enable Input places the device into low−power standby when pulled to logic low (< 0.4 V).
Connect to Vin if the function is not used.
4
NC
No Connection (Note 1)
5
Vout
Regulated Output Voltage
1. True no connect. Printed circuit board traces are allowable.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Input Voltage (Note 2)
Output, Enable
Maximum Junction Temperature
Storage Temperature
Value
Unit
Vin
−0.3 to 6.5
V
Vout, ENABLE
−0.3 to 6.5 (or Vin + 0.3)
Whichever is Lower
V
TJ(max)
150
C
TSTG
−65 to 150
C
ESD Capability, Human Body Model (Note 3)
ESDHBM
3500
V
ESD Capability, Machine Model (Note 3)
ESDMM
200
V
MSL
MSL1/260
−
Moisture Sensitivity Level
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating: v150 mA per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Symbol
Thermal Characteristics, TSOP−5 (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
RqJA
Value
215
Unit
C/W
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
5. Value based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness.
OPERATING RANGES (Note 6)
Rating
Symbol
Min
Input Voltage (Note 7)
Vin
1.75
6
V
Output Current
Iout
0
300
mA
Ambient Temperature
TA
−40
125
C
6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
7. Minimum Vin = 1.75 V or (Vout + VDO), whichever is higher.
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2
Max
Unit
NCV8603
ELECTRICAL CHARACTERISTICS
(Vin = Vout + 0.5 V (fixed version), Cin = Cout =1.0 mF, for typical values TA = 25C, for min/max values TA = −40C to 125C, unless
otherwise specified.) (Note 8)
Characteristic
Symbol
Test Conditions
Min
Typ
Max
Unit
(−3%)
3.201
3.3
(+3%)
3.399
V
Regulator Output
Output Voltage
Power Supply Ripple Rejection (Note 9)
Vout
Iout = 1.0 mA to 300 mA
Vin = (Vout + 0.5 V) to 6.0 V
PSRR
Iout = 1.0 mA to 150 mA
Vin = Vout + 1 V + 0.5 Vp−p
f = 120 Hz
f = 1.0 kHz
f = 10 kHz
dB
−
−
−
62
55
38
−
−
−
Line Regulation
Regline
Vin = 1.750 V to 6.0 V,
Iout = 1.0 mA
−
1.0
10
mV
Load Regulation
Regload
Iout = 1.0 mA to 300 mA
−
2.0
45
mV
f = 10 Hz to 100 kHz
−
50
−
mVrms
350
650
900
mA
−
157
230
300
650
−
mA
Output Noise Voltage (Note 9)
Vn
Output Short Circuit Current
Isc
Dropout Voltage
VDO
Output Current Limit (Note 9)
Measured at: Vout – 2.0%
Iout = 300 mA
Iout(max)
mV
General
Disable Current
IDIS
ENABLE = 0 V, Vin = 6 V
−40C  TA  85C
−
0.01
1.0
mA
Ground Current
IGND
ENABLE = 0.9 V,
Iout = 1.0 mA to 300 mA
−
145
180
mA
Thermal Shutdown Temperature (Note 9)
TSD
−
175
−
C
Thermal Shutdown Hysteresis (Note 9)
TSH
−
10
−
C
0.9
−
−
−
−
0.4
−
3.0
100
nA
−
15
25
ms
Chip Enable
ENABLE Input Threshold Voltage
Voltage Increasing, Logic High
Voltage Decreasing, Logic Low
Vth(EN)
Enable Input Bias Current (Note 9)
IEN
V
Timing
Output Turn On Time (Note 9)
tEN
ENABLE = 0 V to Vin
8. Performance guaranteed over the indicated operating temperature range by design and/or characterization, production tested at TJ = TA
= 25C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
9. Values based on design and/or characterization.
VIN
5
1
CIN
2
VOUT
COUT
4
3
Figure 2. Typical Application Circuit
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NCV8603
TYPICAL CHARACTERISTICS
0.25
3.30
VDO, DROPOUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
3.31
3.29
3.28
Vout = 3.3 V
Vin = 4.3 V
Cin = 1.0 mF
Cout = 1.0 mF
Iout = 1 mA
3.27
3.26
3.25
−40
−20
0
20
40
60
80
100
150 mA
0.10
0.05
0
−40
1 mA
−20
0
20
40
60
80
120
100
TA, TEMPERATURE (C)
TA, TEMPERATURE (C)
Figure 3. Vout vs. Temperature
Figure 4. Dropout Voltage vs. Temperature
(Over Current Range)
800
3.0
ENABLE THRESHOLD (mV)
Vout, OUTPUT VOLTAGE (V)
300 mA
0.15
120
3.5
2.5
2.0
1.5
Iout = 0 mA
Cout = 1.0 mF
TA = 25C
ENABLE = Vin
1.0
0.5
0
0
0.20
1
2
3
4
5
750
Enable Increasing
700
Enable Decreasing
650
Vin = 5.5 V
600
−40
6
−15
10
35
60
85
110 125
Vin, INPUT VOLTAGE (V)
TA, TEMPERATURE (C)
Figure 5. Output Voltage vs. Input Voltage
Figure 6. Enable Threshold vs. Temperature
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NCV8603
TYPICAL CHARACTERISTICS
IDIS, DISABLE CURRENT (mA)
6.0
5.0
4.0
3.0
2.0
ENABLE = 0 V
1.0
0
−40
−15
10
35
60
85
110
125
TA, TEMPERATURE (C)
Figure 7. Ground Current (Sleep Mode) vs.
Temperature
IGND, GROUND CURRENT (mA)
154
146
1.0 mA
138
300 mA
130
122
114
−40
−20
0
20
40
60
80
100
120
TA, TEMPERATURE (C)
Figure 8. Ground Current vs. Temperature
IGND, GROUND CURRENT (mA)
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
Vin, INPUT VOLTAGE (V)
Figure 9. Ground Current vs. Input Voltage
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5
6
NCV8603
700
650
Iout(max), CURRENT LIMIT (mA)
ISC, OUTPUT SHORT CIRCUIT CURRENT (mA)
TYPICAL CHARACTERISTICS
600
550
500
450
−40 −20
0
20
40
60
80
100
400
300
200
100
0
1.0
2.0
3.0
5.0
4.0
TA, TEMPERATURE (C)
Vin, INPUT VOLTAGE (V)
Figure 10. Output Short Circuit Current vs.
Temperature
Figure 11. Current Limit vs. Input Voltage
6.0
5.0
Regload, LOAD REGULATION (mV)
Regline, LINE REGULATION (mV)
500
0
120
4.0
3.0
2.0
1.0
0
−40 −20
Vin = (Vout + 0.5 V) to 6.0 V
Iout = 1.0 mA
0
20
40
60
80
100
4.0
3.0
2.0
1.0
Iout = 1.0 mA to 150 mA
0
−40
120
−15
10
35
60
85
110 125
TA, TEMPERATURE (C)
TA, TEMPERATURE (C)
Figure 12. Line Regulation vs. Temperature
Figure 13. Load Regulation vs. Temperature
25
70
60
POWER SUPPLY RIPPLE
REJECTION (dB)
tEN, OUTPUT TURN ON TIME (ms)
600
20
15
10
5
0
−40 −20
0
20
40
60
80
100
1.0 mA
50
300 mA
40
30
20
10
0
0.1
120
Vout = 3.3 V
Vin = Vout + 1.0 V
Vripple = 0.5 Vp−p
Cout = 1.0 mF
1
10
100
TA, TEMPERATURE (C)
f, FREQUENCY (kHz)
Figure 14. Output Turn On Time vs.
Temperature
Figure 15. Power Supply Ripple Rejection vs.
Frequency
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NCV8603
TYPICAL CHARACTERISTICS
OUTPUT CAPACITOR ESR (W)
10
Unstable Region
Vout = 3.3 V
Stable Region
1
0.1
0.01
Cout = 1.0 mF to 10 mF
TA = −40C to 125C
Vin = up to 6.0 V
0
25 50 75 100 125 150 175 200 225 250 275 300
Iout, OUTPUT CURRENT (mA)
Figure 16. Output Stability with Output
Capacitor ESR over Output Current
Figure 17. Load Transient Response (1.0 mF)
Figure 18. Load Transient Response (10 mF)
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NCV8603
DEFINITIONS
Load Regulation
Line Regulation
The change in output voltage for a change in output load
current at a constant temperature.
The change in output voltage for a change in input voltage.
The measurement is made under conditions of low
dissipation or by using pulse techniques such that the
average junction temperature is not significantly affected.
Dropout Voltage
The input/output differential at which the regulator output
no longer maintains regulation against further reductions in
input voltage. Measured when the output drops 2% below its
nominal. The junction temperature, load current, and
minimum input supply requirements affect the dropout level.
Line Transient Response
Typical output voltage overshoot and undershoot
response when the input voltage is excited with a given
slope.
Output Noise Voltage
Load Transient Response
This is the integrated value of the output noise over a
specified frequency range. Input voltage and output load
current are kept constant during the measurement. Results
are expressed in mVrms or nV  Hz.
Typical output voltage overshoot and undershoot
response when the output current is excited with a given
slope between no−load and full−load conditions.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 175C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Ground Current
Ground Current is the current that flows through the
ground pin when the regulator operates without a load on its
output (IGND). This consists of internal IC operation, bias,
etc. It is actually the difference between the input current
(measured through the LDO input pin) and the output load
current. If the regulator has an input pin that reduces its
internal bias and shuts off the output (enable/disable
function), this term is called the standby current (ISTBY.)
Maximum Package Power Dissipation
The power dissipation level at which the junction
temperature reaches its maximum operating value.
APPLICATIONS INFORMATION
V output, there is no resistor divider. If the part is enabled
under no−load conditions, leakage current through the pass
transistor at junction temperatures above 85C can approach
several microamperes, especially as junction temperature
approaches 150C. If this leakage current is not directed into
a load, the output voltage will rise up to a level
approximately 20 mV above nominal.
The NCV8603 contains an overshoot clamp circuit to
improve transient response during a load current step
release. When output voltage exceeds the nominal by
approximately 20 mV, this circuit becomes active and
clamps the output from further voltage increase. Tying the
ENABLE pin to Vin will ensure that the part is active
whenever the supply voltage is present, thus guaranteeing
that the clamp circuit is active whenever leakage current is
present.
When the NCV8603 adjustable regulator is disabled, the
overshoot clamp circuit becomes inactive and the pass
transistor leakage will charge any capacitance on Vout. If no
load is present, the output can charge up to within a few
millivolts of Vin. In most applications, the load will present
some impedance to Vout such that the output voltage will be
inherently clamped at a safe level. A minimum load of
10 mA is recommended.
The NCV8603 series regulator is self−protected with
internal thermal shutdown and internal current limit. Typical
application circuit is shown in Figure 2.
Input Decoupling (Cin)
A ceramic or tantalum 1.0 mF capacitor is recommended
and should be connected close to the NCV8603 package.
Higher capacitance and lower ESR will improve the overall
line transient response.
Output Decoupling (Cout)
The NCV8603 is a stable component and does not require
a minimum Equivalent Series Resistance (ESR) for the
output capacitor. The minimum output decoupling value is
1.0 mF and can be augmented to fulfill stringent load
transient requirements. The regulator works with ceramic
chip capacitors as well as tantalum devices. Larger values
improve noise rejection and load regulation transient
response. Figure 16 shows the stability region for a range of
operating conditions and ESR values.
No−Load Regulation Considerations
The NCV8603 adjustable regulator will operate properly
under conditions where the only load current is through the
resistor divider that sets the output voltage. However, in the
case where the NCV8603 is configured to provide a 1.250
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NCV8603
Noise Decoupling
PCB, the junction temperature will be relatively low with
high power applications. The maximum dissipation the
NCV8603 can handle is given by:
The NCV8603 is a low noise regulator and needs no
external noise reduction capacitor. Unlike other low noise
regulators which require an external capacitor and have slow
startup times, the NCV8603 operates without a noise
reduction capacitor, has a typical 15 ms start up delay and
achieves a 50 mVrms overall noise level between 10 Hz and
100 kHz.
PD(MAX) +
TJ(MAX) * TA
RqJA
(eq. 1)
Since TJ is not recommended to exceed 125_C (TJ(MAX)),
then the NCV8603 can dissipate up to 465 mW when the
ambient temperature (TA) is 25_C and the device is
assembled on 1 oz PCB with 645 mm2 area.
The power dissipated by the NCV8603 can be calculated
from the following equations:
Enable Operation
The enable pin will turn the regulator on or off. The
threshold limits are covered in the electrical characteristics
table in this data sheet. The turn−on/turn−off transient
voltage being supplied to the enable pin should exceed a
slew rate of 10 mV/ms to ensure correct operation. If the
enable function is not to be used then the pin should be
connected to Vin.
PD [ VIN([email protected]) ) IOUT(VIN * VOUT)
(eq. 2)
or
VIN(MAX) [
PD(MAX) ) (VOUT
IOUT)
IOUT ) IGND
Thermal
As power in the NCV8603 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the NCV8603 has good thermal conductivity through the
(eq. 3)
Hints
Vin and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCV8603, and
make traces as short as possible.
DEVICE ORDERING INFORMATION
Device
NCV8603SN33T1G*
Marking Code
Version
Package
Shipping†
ADW
3.3 V
TSOP−5
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
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NCV8603
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE K
D 5X
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative
NCV8603/D