TI SLK2511A

SLK2511A
www.ti.com ......................................................................................................................................................... SLLS610C – APRIL 2004 – REVISED MARCH 2009
OC-48/24/12/3 SONET/SDH MULTIRATE TRANSCEIVER
FEATURES
1
• Fully Integrated SONET/SDH Transceiver to
Support Clock/Data Recovery and
Multiplexer/Demultiplexer Functions
• Supports OC-48, OC-24, OC-12, Gigabit
Ethernet, and OC-3 Data Rate With Autorate
Detection
• Supports Transmit Only, Receiver Only,
Transceiver and Repeater Functions in a
Single Chip Through Configuration Pins
• Supports SONET/SDH Frame Detection
• On-Chip PRBS Generation and Verification
• Supports 4-Bit LVDS (OIF99.102) Electrical
Interface
• Parity Checking and Generation for the LVDS
Interface
• Single 2.5-V Power Supply
• Interfaces to Back Plane, Copper Cables, or
2
•
•
•
•
•
•
•
•
•
•
•
Optical Modules
Hot Plug Protection
Low Jitter PECL-Compatible Differential Serial
Interface With Programmable De-Emphasis for
the Serial Output
On-Chip Termination for LVDS and
PECL-Compatible Interface
Receiver Differential Input Thresholds 150 mV
Minimum
Supports SONET Loop Timing
Low Power CMOS
ESD Protection >2 kV
155-MHz or 622-MHz Reference Clock
Maintains Clock Output in Absence of Data
Local and Remote Loopback
100-Pin PZP Package With PowerPAD™
Design With 5×5 mm (Typ) Heatsink
DESCRIPTION
The SLK2511A is a single chip multirate transceiver IC used to derive high-speed timing signals for SONET/SDH
based equipment. The chip performs clock and data recovery, serial-to-parallel/parallel-to-serial conversion and
frame detection function conforming to the SONET/SDH standards.
The device can be configured to operate under OC-48, OC-24, OC-12, or OC-3 data rates through the rate
selection pins or the autorate detection function. An external reference clock operating at 155.52 MHz or 622.08
MHz is required for the recovery loop, and it also provides a stable clock source in the absence of serial data
transitions.
The SLK2511A accepts 4-bit LVDS parallel data/clock and generates a NRZ SONET/SDH-compliant signal at
OC-3, OC-12, OC-24, or OC-48 rates. It also recovers the data and clock from the serial SONET stream and
demultiplexes it into 4-bit LVDS parallel data for full duplex operation. TXDATA0 and RXDATA0 are the first bits
that are transmitted and received in time, respectively. The serial interface is a low jitter, PECL compatible
differential interface.
The SLK2511A provides a comprehensive suite of built-in tests for self-test purposes including local and remote
loopback and PRBS (27-1) generation and verification.
The SLK2511A device provides a comprehensive suite of built-in tests for self-test purposes including local and
remote loopback and pseudorandom bit stream (PRBS) (27-1) generation and verification.
AVAILABLE OPTIONS
TA
–40°C to 85°C
(1)
PACKAGE (1)
PowerPAD QUAD (PZP)
SLK2511APZP
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI website at www.ti.com.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2009, Texas Instruments Incorporated
SLK2511A
SLLS610C – APRIL 2004 – REVISED MARCH 2009 ......................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
The device comes in a 100-pin VQFP package that requires a single 2.5-V supply with 3.3-V tolerant inputs on
the control pins. The SLK2511A device is very power efficient, dissipating less than 900 mW at 2.488 Gbps, the
OC-48 data rate. It is characterised for operation from –40°C to 85°C.
BLOCK DIAGRAM
2
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TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
TYPE
DESCRIPTION
CLOCK PINS
REFCLKP
REFCLKN
94
95
LVDS/PECL
compatible input
Differential reference input clock. There is an on-chip 100-Ω termination resistor
differentially placed between REFCLKP and REFCLKN. The dc bias is also provided
on-chip for the ac-coupled case.
RXCLKP
RXCLKN
67
68
LVDS output
Receive data clock. The data on RXDATA(0:3) is on the falling edges of RXCLKP.
The interface of RXDATA(0:3) and RXCLKP is source synchronous (refer to
Figure 6).
TXCLKP
TXCLKN
79
80
LVDS input
Transmit data clock. The data on TXDATA(0:3) is latched on the rising edge of
TXCLKP.
TXCLKSRCP
TXCLKSRCN
70
71
LVDS output
Transmit clock source. A clock source generated from the SLK2511A device to the
downstream device (i.e., framer) that could be used by the downstream device to
transmit data back to the SLK2511A device. This clock is frequency-locked to the
local reference clock.
SERIAL SIDE DATA PINS
SRXDIP
SRXDIN
14
15
PECL compatible
input
Receive differential pairs; high-speed serial inputs
STXDOP
STXDON
9
8
PECL compatible
output
Transmit differential pairs; high-speed serial outputs
73
74
LVDS output
Frame sync pulse. This signal indicates the frame boundaries of the incoming data
stream. If the frame-detect circuit is enabled, FSYNC pulses for four RXCLKP and
RXCLKN clock cycles, when it detects the framing patterns.
66-63
60-57
LVDS output
Receive data pins. Parallel data on this bus is valid on the falling edge of RXCLKP
(refer to Figure 6). RXDATA0 is the first bit received in time.
56
55
LVDS output
Receive data parity output
88-81
LVDS input
Transmit data pins. Parallel data on this bus is clocked on the rising edge of TXCLKP.
TXDATA0 is the first bit transmitted in time.
99
98
LVDS input
Transmit data parity input
PARALLEL SIDE DATA PINS
FSYNCP
FSYNCN
RXDATA[0:3]
P/N
RXPARP
RXPARN
TXDATA[0:3]
P/N
TXPARP
TXPARN
CONTROL/STATUS PINS
AUTO_DETECT
34
TTL input
(with pulldown)
Data rate autodetect enable. Enable the autodetection function for different data
rates. When AUTO_DETECT is high, the autodetection circuit generates RATEOUT0
and RATEOUT1 to indicate the data rates for the downstream device.
CONFIG0
CONFIG1
17
18
TTL input
(with pulldown)
Configuration pins. Put the device under one of the four operation modes: TX only,
RX only, transceiver, or repeater mode. (See Table 3)
ENABLE
44
TTL input
(with pullup)
Standby enable. When this pin is held low, the device is disabled for IDDQ testing.
When high, the device operates normally.
FRAME_EN
27
TTL input
(with pullup)
Frame sync enable. When this pin is asserted high, the frame synchronization circuit
for byte alignment is turned on.
LCKREFN
24
TTL input
(with pullup)
Lock to reference. When this pin is low, RXCLKP/N output is forced to lock to
REFCLK. When high, RXCLKP/N is the divided down clock extracted from the receive
serial data.
LLOOP
53
TTL input
(with pulldown)
Local loopback enable. When this pin is high, the serial output is internally looped
back to its serial input.
LOL
45
TTL output
Loss of lock. When the clock recovery loop has locked to the input data stream and
the phase differs by less than 100 ppm from REFCLK, then LOL is high. When the
phase of the input data stream differs by more than 100 ppm from REFCLK, then LOL
is low. If the difference is too large (> 500 ppm), the LOL output is not valid.
LOOPTIME
51
TTL input (with
pulldown)
Loop timing mode. When this pin is high, the PLL for the clock synthesizer is
bypassed. The recovered clock timing is used to send the transmit data.
LOS
46
TTL output
Loss of signal. When no transitions appear on the input data stream for more than 2.3
s, a loss of signal occurs and LOS goes high. The device also transmits all zeroes
downstream using REFCLK as its clock source. When a valid SONET signal is
received, the LOS signal goes low.
4
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TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
NO.
TYPE
DESCRIPTION
PAR_VALID
2
TTL output
Parity checker output. The internal parity checker on the parallel side of the
transmitter checks for even parity. If there is a parity error, the pin is pulsed low for
two clock cycles.
PRBSEN
41
TTL input
(with pulldown)
PRBS testing enable. When this pin is asserted high, the device is put into the PRBS
testing mode.
PRBSPASS
42
TTL output
PRBS test result. This pin reports the status of the PRBS test results (high = pass).
When PRBSEN is disabled, the PRBSPASS pin is set low. When PRBSEN is enabled
and a valid PRBS is received, then the PRBSPASS pin is set high.
PRE1
PRE2
4
5
TTL input
(with pulldown)
Programmable de-emphasis control. Combinations of these two bits can be used to
optimize serial data transmission.
PS
21
TTL input
(with pulldown)
Polarity select. This pin, used with the SIGDET pin, sets the polarity of SIGSET.
When high, SIGDET is an active low signal. When low, SIGDET is an active high
signal.
RATEOUT0
RATEOUT1
37
36
TTL output
Autorate detection outputs. When AUTO_DETECT is high, the autodetection circuit
generates these two bits to indicate the data rates for the downstream device.
RESET
48
TTL input
(with pulldown)
TXFIFO and LOL reset pin. Low is reset and high is normal operation.
RLOOP
54
TTL input
(with pulldown)
Remote loopback enable. When this pin is high, the serial input is internally looped
back to its serial output with the timing extracted from the serial data.
RSEL0
RSE1L
39
38
TTL input
(with pulldown)
Data rate configuration pins. Put the device under one of the four data rate
operations: OC-48, OC-24, OC-12, or OC-3.
RX_MONITOR
47
TTL input
(with pulldown)
RX parallel data monitor in repeater mode. This pin is only used when the device is
put under repeater mode. When high, the RX demultiplexer circuit is enabled and the
parallel data is presented. When low, the demultiplexer is shut down to save power.
SIGDET
20
TTL input
(with pulldown)
Signal detect. This pin is generally connected to the output of an optical receiver. This
signal may be active high or active low depending on the optical receiver. The
SIGDET input is XORed with the PS pin to select the active state. When SIGDET is in
the inactive state, data is processed normally. When activated, indicating a loss of
signal event, the transmitter transmits all zeroes and force the LOS signal to go high.
SPILL
49
TTL output
TX FIFO collision output
TESTEN
43
TTL input
(with pulldown)
Production test mode enable. This pin must be left unconnected or tied low.
REFCLKSEL
40
TTL input
(with pulldown)
Reference clock select. The device can accept a clock frequency of 155.52MHz or
622.08MHz which is selected by this pin (0 = 622.08MHz and 1 = 155.52MHz mode)
VOLTAGE SUPPLY AND RESERVED PINS
GND
GNDA
GNDLVDS
GNDPLL
RSVD
VDD
VDDA
VDDLVDS
VDDPLL
1, 6, 19, 23, Ground
26, 28, 30,
31, 33
Digital logic ground
10, 13
Ground
Analog ground
61, 69, 76,
77, 89, 93,
96, 100
Ground
LVDS ground
12
Supply
PLL ground
52
Reserved
This pin needs to be tied to ground or left floating for normal operation.
3, 22, 25,
29, 32, 35,
50
Supply
Digital logic supply voltage (2.5 V)
7, 16
Supply
Analog voltage supply (2.5 V)
62, 72, 75,
78, 90–92,
97
Supply
LVDS supply voltage (2.5 V)
11
Supply
PLL voltage supply (2.5 V)
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DETAILED DESCRIPTION
The SLK2511A device is designed to support the OC-48/24/12 data rates. The operating data speed can be
configured through the RSEL0 and RSEL1 pins as indicated in Table 1 .
Table 1. Data Rate Select
RSEL0
RSEL1
PARALLEL LVDS DATA RATE
TXCLK/RXCLK
OC-48: 2.488 Gbps
SERIAL DATA RATE
0
0
622.08 Mbps
622.08 MHz
OC-24: 1.244 Gbps
1
0
311.04 Mbps
311.04 MHz
OC-12: 622 Mbps
0
1
155.52 Mbps
155.52 MHz
OC-3: 155.52 Mbps
1
1
38.88 Mbps
38.88 MHz
The user can also enable the autorate detection circuitry through the AUTO_DETECT pin. The device
automatically detects the OC-N of the data line rate and generates two bits of output to indicate the data rate to
other devices in the system. When using AUTO_DETECT, RSEL0 and RSEL1 need to be set to 00 or be
unconnected.
Table 2. Data Rate Reporting Under Autorate Detection Mode
RATEOUT0
RATEOUT1
PARALLEL LVDS DATA RATE
TXCLK/RXCLK
OC-48: 2.488 Gbps
SERIAL DATA RATE
0
0
622.08 Mbps
622.08 MHz
OC-24: 1.244 Gbps
1
0
311.04 Mbps
311.04 MHz
OC-12: 622 Mbps
0
1
155.52 Mbps
155.52 MHz
OC-3: 155.52 Mbps
1
1
38.88 Mbps
38.88 MHz
The SLK2511A device has four operational modes controlled by two configuration pins. Table 3 lists these
operational modes. When the device is put in a certain mode, unused circuit blocks are powered down to
conserve system power.
While the transceiver mode, transmit only mode, and receive only mode are straightforward, the repeater mode
of operation is shown in Figure 4. The receive serial data is recovered by the extracted clock, and it is then sent
back out on the transmit serial outputs. The data eye is open both vertically and horizontally in this process. In
the repeater mode, the user can select to turn on the RX demultiplexer function through RX_MONITOR pin and
allow the parallel data to be presented. This feature enables the repeater device not only to repeat but also to
listen in.
Table 3. Operational Modes
6
MODE
CONFIG0
CONFIG1
DESCRIPTION
1
0
0
Full duplex transceiver mode
2
0
1
Transmit only mode
3
1
0
Receive only mode
4
1
1
Repeater mode
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High-Speed Electrical Interface
The high-speed serial I/O uses a PECL-compatible interface. The line could be directly coupled or ac-coupled.
Refer to Figure 9 and Figure 10 for configuration details. As shown in the figures, an on-chip 100-Ω termination
resistor is placed differentially at the receive end.
The PECL output also provides de-emphasis for compensating ac loss when driving a cable or PCB backplane
over long distance. The level of the de-emphasis is programmable via the PRE1 and PRE2 pins. Users can use
software to control the strength of the de-emphasis to optimize the device for a specific system requirement.
Table 4. Programmable De-emphasis
(1)
PRE1
PRE2
DE-EMPHASIS LEVEL
(Vodp/Vodd (1)-1)
0
0
De-emphasis disbled
1
0
10%
0
1
20%
1
1
30%
VODp: Differential voltage swing when there is a transition in the data stream.
VODd: Differential voltage swing when there is no transition in the data stream.
Figure 1. Output Differential Voltage Under De-emphasis
LVDS Parallel Data Interface
The parallel data interface consists of a 4-bit parallel LVDS data and clock. The device conforms to OIF99.102
specification when operating at the OC-48 rate. When operating at lower serial rates the clock and data
frequency are scaled down accordingly, as indicated in Table 1. The parallel data TXDATA[0:3] is latched on the
rising edge of the TXCLK and then is sent to a data FIFO to resolve any phase difference between TXCLK and
REFCLK. If there is a FIFO overflow condition, the SPILL pin is set high. The FIFO resets itself to realign
between two clocks. The internal PLL for the clock synthesizer is locked to the REFCLK and it is used as the
timing to serialize the parallel data (except for the loop timing mode where the recovered clock is used). On the
receive side, RXDATA[0:3] is updated on the rising edge of RXCLK. Figure 6 and Figure 7 show the timing
diagram for the parallel interface.
The SLK2511A also has a built-in parity checker and generator for error detection of the LVDS interface. On the
transmit side, it accepts the parity bit, TXPARP/N, and performs the parity checking function for even parity. If an
error is detected, it pulses the PAR_VALID pin low for two clock cycles. On the receive side, the parity bit
RXPARP/N is generated for the downstream device for parity error checking.
Differential termination 100-W resistors are included on-chip between TXDATAP/N.
Reference Clock
The device accepts either a 155.52-MHz or a 622.08-MHz clock. A clock select pin (REFCLKSEL) allows the
selection of the external reference clock frequency. The REFCLK input is compatible with the LVDS level and
also the 3.3-V LVPECL level using ac-coupling. A 100-Ω differential termination resistor is included on-chip, as
well as a dc biasing circuit (3 kΩ to VDD and 4.5 kΩ to GND) for the ac-coupled case. A high quality REFCLK
must be used on systems required to meet SONET/SDH standards. For non-SONET/SDH compliant systems,
loose tolerances may be used.
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Clock and Data Recovery
The CDR unit of SLK2511A recovers the clock and data from the incoming data streams.
In the event of receive data loss, the PLL automatically locks to the local REFCLK to maintain frequency stability.
If the frequency of the data differs by more that 100 ppm with respect to the REFCLK frequency, the LOL pin is
asserted as a warning. Actual loss of lock occurs if the data frequency differs by more than 170 ppm.
Minimum Transition Density
The loop filter transfer function is optimized to enable the CDR to track ppm difference in the clocking and
tolerate the minimum transition density that can be received in a SONET data signal (±20 ppm). The transfer
function yields a typical capture time of 3500 bit times for random incoming NRZ data after the device is powered
up and achieves frequency locking.
The device tolerates up to 72 consecutive digits (CID) without sustaining an error.
Jitter Transfer
The jitter transfer is less than the mask shown in Figure 5 (GR-253 Figure 5-27). Jitter transfer function is defined
as the ratio of jitter on the output signal to the jitter applied on the input signal versus frequency. The input
sinusoidal jitter amplitude is applied up to the mask level in the jitter tolerance requirement (see Figure 2).
Jitter Tolerance
Input jitter tolerance is defined as the peak-to-peak amplitude of sinusoidal jitter applied on the input signal that
causes the equivalent 1-dB optical/electrical power penalty. This refers to the ability of the device to withstand
input jitter without causing a recovered data error. The device has a jitter tolerance that exceeds the mask shown
in Figure 2 (GR-253 Figure 5-28) (2). This jitter tolerance is measured using a pseudorandom data pattern of 231
-1.
(2)
The tolerance margin is 10% or more at all modulating frequencies when measured using the HP7150A jitter analysis system on the
Texas Instruments provided EVM.
OC-N/STS-N LEVEL
F0
F1
F2
F3
F4
A1
A2
A3
(Hz)
(Hz)
(Hz)
(kHz)
(kHz)
(Ulpp)
(Ulpp)
(Ulpp)
3
10
30
300
6.5
65
0.15
1.5
15
12
10
30
300
25
250
0.15
1.5
15
24
Not specified
48
10
600
6000
100
1000
0.15
1.5
15
Figure 2. Input Jitter Tolerance
Jitter Generation
The jitter of a serial clock and serial data outputs must not exceed 0.01 UI rms/0.1 UIp-p when a serial data with
no jitter is presented to the inputs. The measurement bandwidth for intrinsic jitter is 12 kHz to 20 MHz.
8
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Loop Timing Mode
When LOOPTIME is high, the clock synthesizer used to serialize the transmit data is bypassed and the timing is
provided by the recovered clock. However, REFCLK is still needed for the recovery loop operation.
Loss-of-Lock Indicator
The SLK2511A has a lock detection circuit to monitor the integrity of the data input. When the clock recovery
loop is locked to the input serial data stream, the LOL signal goes high. If the recovered clock frequency deviates
from the reference clock frequency by more than 100 ppm, LOL goes low. If the data stream clock rate deviates
by more than 170 ppm, loss of lock occurs. If the data streams clock rate deviates more than 500 ppm from the
local reference clock, the LOL output status might be unstable. Upon power up, the LOL goes low until the PLL is
close to phase lock with the local reference clock.
Loss of Signal
The loss of signal (LOS) alarm is set high when no transitions appear in the input data path for more than 2.3 µs.
The LOS signal becomes active when the above condition occurs. If the serial inputs of the device are
ac-coupled to its source, the ac-couple capcitor needs to be big enough to maintain a signal level above the
threshold of the receiver for the 2.3 µs no transition period. Once activated, the LOS alarm pin is latched high
until the receiver detects an A1A2 pattern. The recovered clock (RXCLK) is automatically locked to the local
reference when LOS occurs. The parallel data (RXDATAx) may still be processed even when LOS is activated.
Signal Detect
The SLK2511A has an input SIGDET pin to force the device into the loss of signal state. This pin is generally
connected to the signal detect output of the optical receiver. Depending on the optics manufacturer, this signal
can be either active high or active low. To accommodate the differences, a polarity select (PS) pin is used. For
an active low, SIGDET input sets the PS pin high. For an active high, SIGDET input sets the PS pin low. When
the PS signal pin and SIGDET are of opposite polarities, the loss of signal state is generated and the device
transmits all zeroes downstream.
Multiplexer Operation
The 4-bit parallel LVDS data is clocked into an input buffer by a clock derived from the synthesized clock. The
data is then clocked into a 4:1 multiplexer. The D0 bit is the most significant bit and is shifted out first in the serial
output stream.
Demultiplexer Operation
The serial 2.5 Gbps data is clocked into a 1:4 demultiplexer by the recovered clock. The D0 bit is the first bit that
is received in time from the input serial stream. The 4-bit parallel data is then sent to the LVDS driver along with
the divided down recovered clock.
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Frame Synchronization
The SLK2511A has a SONET/SDH-compatible frame detection circuit that can be enabled or disabled by the
user. Frame detection is enabled when the FRAMEN pin is high. When enabled it detects the A1, A2 framing
pattern, which is used to locate and align the byte and frame boundaries of the incoming data stream. When
FRAMEN is low the frame detection circuitry is disabled and the byte boundary is frozen to the location found
when detection was previously enabled.
The frame detect circuit searches the incoming data for three consecutive A1 bytes followed immediately by one
A2 byte. The data alignment circuit then aligns the parallel output data to the byte and frame boundaries of the
incoming data stream. During the framing process the parallel data bus does not contain valid and aligned data.
Upon detecting the third A1, A2 framing patterns that are separated by 125 µs from each other, the FSYNC
signal goes high for 4 RXCLK cycles, indicating frame synchronization has been achieved.
The probability that random data in a SONET/SDH data stream mimics the framing pattern in the data payload is
extremely low. However, there is a state machine built in to prevent false reframing if a framing pattern does
show up in the data payload.
Testability
The SLK2511A has a comprehensive suite of built-in self-tests. The loopback function provides for at-speed
testing of the transmit/receive portions of the circuitry. The enable pin allows for all circuitry to be disabled so that
an Iddq test can be performed. The PRBS function allows for a BIST (built-in self-test).
IDDQ Function
When held low, the ENABLE pin disables all quiescent power in both the analog and digital circuitry. This allows
for Iddq testing on all power supplies and can also be used to conserve power when the link is inactive.
Local Loopback
l loopback The LLOOP signal pin controls the local loopback. When LLOOP is high, the loopback mode is
activated and the parallel transmit data is selected and presented on the parallel receive data output pins. The
parallel transmit data is also multiplexed and presented on the high-speed serial transmit pins. Local loopback
can only be enabled when the device is under the transceiver mode.
Figure 3. Local Loopback Data Path
10
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Remote Loopback
The RLOOP signal pin controls the remote loopback. When RLOOP is high, the serial receive data is selected
and presented on the serial transmit data output pins. The serial received data is also demultiplexed and
presented on the parallel receive data pins. The remote loop can be enabled only when the device is under
transceiver mode. When the device is put under the repeater mode with RX_MONITOR high, it performs the
same function as the remote loopback.
Figure 4. Remote Loopback Data Path/Repeater Mode Operation
PRBS
The SLK2511A has two built-in pseudorandom bit stream (PRBS) functions. The PRBS generator is used to
transmit a PRBS signal. The PRBS verifier is used to check and verify a received PRBS signal.
When the PRBSEN pin is high, the PRBS generator and verifier are both enabled. A PRBS is generated and fed
into the parallel transmitter input bus. Data from the normal input source is ignored in PRBS mode. The PBRS
pattern is then fed through the transmitter circuitry as if it was normal data and sent out by the transmitter. The
output can be sent to a bit error rate tester (BERT) or to the receiver of another SLK2511A. If an error occurs in
the PRBS pattern, the PRBSPASS pin is set low for 2 RXCLKP/N cycles.
Power-On Reset
Upon application of minimum valid power, the SLK2511A generates a power-on reset. During the power-on reset
the PRXDATA[0:3] signal pins goes to 3-state. RXCLKP and RXCLKN are held low. The length of the power-on
reset cycle is dependent upon the REFCLKP and REFCLKN frequency but is less than 1 ms in duration.
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SLK2511A
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VDD
Supply voltage
TTL input terminals
Voltage range
LVDS terminals
Any other terminal except above
PD
Package power dissipation
Tstg
Storage temperature
Electrostatic discharge
TA
VALUE
UNIT
–0.3 to 3
V
–0.3 to 4
V
–0.3 to 3
V
–0.3 to VDD + 0.3
V
See Dissipation Rating Table
–65 to 150
°C
2
kV
–40 to 85
°C
260
°C
HBM
Characterized free-air operating temperature range
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR (1)
ABOVE TA = 25°C
TA = 85°C
POWER RATING
PZP (2)
3.4 W
33.78 mW/C
1.3 W
2.27 W
22.78 mW/°C
0.911 W
PZP
(1)
(2)
(3)
(3)
This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA).
2 oz trace and copper pad with solder.
2 oz trace and copper pad without solder.
RECOMMENDED OPERATING CONDITIONS
VDD
Supply voltage
PD
Power dissipation
Shutdown current
TA
MIN
NOM
MAX
UNIT
2.375
2.5
2.625
V
Frequency = 2.488 Gb/sec, PRBS pattern
900
1100
mW
Enable = 0, VDDA, VDD pins, VDD = max
20
Operating free-air temperature
–40
µA
85
°C
START UP SEQUENCE
To ensure proper start up, follow one of the following steps when powering up the SLK2511A device.
1. Keep ENABLE (pin 44) low until power supplies and reference clock have become stable.
2. Drive ENABLE (pin 44) low for at least 30 ns after power supplies and reference clock have become stable.
The following step is recommended with either of the above two sequences.
3. Drive RESET low for at least 10 ns after link has become stable to center the TXFIFO.
12
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ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TTL
VIH
High-level input voltage
2
VIL
Low-level input voltage
IIH
Input high current
VDD = MAX, VIN = 2 V
IIL
Input low currentl
VDD = MAX, VIN = 0.4 V
–40
VOH
High-level output voltage
IOH = –1 mA
2.10
VOL
Low-level output voltage
IOH = 1 mA
CI
Input capacitance
3.6
V
0.80
V
40
µA
µA
2.3
0.25
V
0.5
V
4
pF
1575
mV
LVDS INPUT SIGNALS
VI
Input voltage
825
VID(th)
Input differential threshold voltage
100
CI
Input capacitance
RI
Input differential impedance
On-chip termination
tsu
Input setup time requirement
See Figure 7
300
ps
th
Input hold time requirement
See Figure 7
300
ps
T(duty)
Input clock duty cycle
mV
3
80
100
pF
Ω
120
40%
60%
300
800
1070
1375
LVDS OUTPUT SIGNALS
VOD
Output differential voltagee
VOS
Output common mode voltage
ΔVOD
Change VOD between 1 and 0
ΔVOS
Change VOS between 1 and 0
RL = 100 ±1%
25
I(SP), I(SN),
I(SPN)
Output short circuit current
Outputs shorted to ground or shorted
together
Ioff
Power-off current
VDD = 0 V
t(cq_min)
t(cq_max)
tr/tf
mV
25
Clock-output time
See Figure 6
Output transition time
20% to 80%
Output clock duty cycle
Data output to FRAME_SYNC delay
24
mA
10
µA
100
ps
100
100
300
45%
55%
4
7
ps
Bit times
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SLK2511A
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TIMING REQUIREMENTS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
20
ppm
REFERENCE CLOCK (REFCLK)
Frequency tolerance (1)
–20
Duty cycle
40%
Jitter
(1)
50%
60%
12 kHz to 20 MHz
3
ps rms
The ±20-ppm tolerance is required to meet SONET/SDH requirements. For non-SONET/SDH-compliant systems, looser tolerances may
apply.
PLL PERFORMANCE SPECIFICATIONS
PARAMETER
TEST CONDITIONS
PLL startup lock time
VDD, VDDC = 2.3 V, after REFCLK is stable
Acquisition lock time
Valid SONET signal or PRBS OC-48
MIN
TYP
MAX
1
2031
UNIT
ms
Bit Times
SERIAL TRANSMITTER/RECEIVER CHARACTERISTICS
PARAMETER
TEST CONDITIONS
Vodd = |STXDOP-STXDON|, transmit
differential output voltage under
de-emphasis
MIN
TYP
MAX
PRE1 = 0, PRE2 = 0, Rt = 50,
See Table 4 and Figure 1
650
850
1000
PRE1 = 1, PRE2 = 0
550
750
900
PRE1 = 0, PRE2 = 1
540
700
860
PRE1 = 1, PRE2 = 1
V(CMT)
Transmit common mode voltage range
Rt = 50 Ω
Receiver Input voltage requirement,
VID = |SRXDIP-SRXDIN|
500
650
800
1100
1250
1400
150
V(CMR)
Receiver common mode voltage range
1100
Il
Receiver input leakage
–550
Rl
Receiver differential impedance
CI
Receiver input capacitance
80
UNIT
mV
mV
mV
1250
100
2250
mV
550
µA
120
Ω
1
pF
td(TX_Latency)
50
td(RX_Latency)
50
Bit Times
SERIAL DIFFERENTIAL SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
tt
Differential signal rise time (20% to 80%)
RL = 50 Ω
tj
Output jitter
Jitter-free data,
12 kHz to 20 MHz, RLOOP =
1
Jitter tolerance
RLOOP = 1,
See Figure 2
Jitter transfer
RLOOP = 1,
See
14
80
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TYP
MAX
UNIT
100
140
ps
0.05
0.1
UI(pp)
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SLK2511A
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TYPICAL CHARACTERISTICS
Figure 5. Test Load and Voltage Definitions for LVDS Outputs
Figure 6. LVDS Output Waveform
Figure 7. LVDS Input Waveform
Figure 8. Transmitter Test Setup
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TYPICAL CHARACTERISTICS (continued)
Figure 9. High-Speed I/O Directly-Coupled Mode
Figure 10. High-Speed I/O AC-Coupled Mode
16
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SLK2511A
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APPLICATION INFORMATION
DESIGNING WITH THE PowerPAD PACKAGE
The SLK2511A device is housed in high-performance, thermally enhanced, 100-pin PZP PowerPAD packages.
Use of a PowerPAD package does not require any special considerations except to note that the PowerPAD,
which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. Correct
device operation requires that the PowerPAD be soldered to the thermal land. Do not run any etches or signal
vias under the device, but have only a grounded thermal land, as explained below. Although the actual size of
the exposed die pad may vary, the minimum size required for the keepout area for the 100-pin PZP PowerPAD
package is 12 mm × 12 mm.
A thermal land, which is an area of solder-tinned-copper, is required underneath the PowerPAD package. The
thermal land varies in size depending on the PowerPAD package being used, the PCB construction, and the
amount of heat that needs to be removed. In addition, the thermal land may or may not contain numerous
thermal vias, depending on PCB construction.
Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD.
Thermally Enhanced Package Application Report, TI literature number SLMA002, available via the TI Web pages
beginning at URL http://www.ti.com.
Figure 11. Example of a Thermal Land
For the SLK2511A device, this thermal land must be grounded to the low-impedance ground plane of the device.
This improves not only thermal performance but also the electrical grounding of the device. It is also
recommended that the device ground terminal landing pads be connected directly to the grounded thermal land.
The land size must be as large as possible without shorting device signal terminals. The thermal land may be
soldered to the exposed PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low-impedance ground plane of the device. More
information may be obtained from the TI application note PHY Layout, TI literature number SLLA020.
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PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SLK2511AIPZP
ACTIVE
HTQFP
PZP
100
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
SLK2511AIPZPG4
ACTIVE
HTQFP
PZP
100
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
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Addendum-Page 1
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