TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com Two-Port HDMI Switch Check for Samples: TMDS261B FEATURES 1 • 2 • • • • • • • • 2:1 Sink-side switch Supporting DVI Above 1920 × 1200 and HDMI HDTV Resolutions up to 1080p With 16-Bit Color Depth Designed for Signaling Rates up to 3 Gbps Supports HDMI 1.3a Specification Adaptive Equalization on inputs to support up to 20-m HDMI Cable at 2.25 Gbps for 1080p 12-Bit Color Depth TMDS Input Clock-Detect Circuit DDC Repeater Function <2-mW Low-Power Mode Local I2C or GPIO Configurable Enhanced ESD. HBM: 10 kV on All Input TMDS, DDC I2C, HPD Pins • • • • 3.3-Volt Power Supply Temperature Range: 0°C to 70°C 64-Pin TQFP Package: Pin-Compatible With TMDS251 Robust TMDS Receive Stage That Can Work With Non-Compliant Input Common-Mode HDMI Signal APPLICATIONS • High-Definition Digital TV – LCD – Plasma – DLP® DESCRIPTION The TMDS261B is a two-port digital video interface (DVI) or high-definition multimedia interface (HDMI) switch that allows up to two DVI or HDMI ports to be switched to a single display terminal. Four TMDS channels, one hot-plug detector, and a digital display control (DDC) interface are supported on each port. Each TMDS channel supports signaling rates up to 3 Gbps to allow 1080p resolution in 16-bit color depth. TMDS261B device is not intended for source side applications such as external switch boxes The TMDS261B provides an adaptive equalizer for different ranges of cable lengths. The equalizer automatically compensates for intersymbol interference [ISI] loss of an HDMI/DVI cable for up to 20 dB at 3 Gbps (see Figure 15). TYPICAL APPLICATION Digital TV BRTN TV1 Game Machine TM D S26 1 169 PALplus DVD Player or DVR M0124-02 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DLP is a registered trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION (CONTINUED) When any of the input ports are selected, the integrated terminations (50-Ω termination resistors pulled up to VCC) are switched on for the TMDS clock channel, the TMDS clock-detection circuit is enabled, and the DDC repeater is enabled. After a valid TMDS clock is detected, the integrated termination resistors for the data lines are enabled, and the output TMDS lines are enabled. When an input port is not selected, the integrated terminations are switched off, the TMDS receivers are disabled, and the DDC repeater is disabled. Clock-detection circuitry provides an automatic power-management feature, because if no valid TMDS clock is detected, the terminations on the input TMDS data lines are disconnected and the TMDS outputs are placed in a high-impedance state. The TMDS261B is designed to be controlled via a local I2C interface or GPIO interface, based on the status of the I2C_SEL pin. The local I2C interface in TMDS261B is a slave-only I2C interface. (See the I2C INTERFACE NOTES section.) I2C Mode: When the I2C_SEL pin is set low, the device is in I2C mode. With local I2C, the interface port status can be read, and the advanced configurations of the device such as TMDS output edge rate control, DDC I2C buffer output-voltage-select (OVS) settings (See the DDC I2C Function Description for detailed description on DDC I2C buffer description and OVS description), device power management, TMDS clock-detect feature, and TMDS input-port selection can be set. See Table 8 through Table 11. GPIO mode: When the I2C_SEL pin is set high, the device is in GPIO control mode. The port selection is controlled with source selectors, S1 and S2. The power-saving mode is controlled through the LP pin. In GPIO mode, the default TMDS output edge rate that is the fastest setting of rise and fall time is set, and the default DDC I2C buffer OVS setting (OVS3) is set. See Table 8 and the DDC I2C Function Description for a detailed description of the DDC I2C buffer. Following are some of the key features (advantages) that the TMDS261B provides to the overall sink-side system (HDTV). • • • 2×1 switch that supports TMDS data rates up to 3 Gbps on both input ports. ESD: Built-in support for high ESD protection (up to 10 kV on the HDMI source side). The HDMI source-side pins on the TMDS261B are connected via the HDMI/DVI exterior connectors and cable to the HDMI/DVI sources (e.g., DVD player). In TV applications, it can be expected that the source side may be subjected to higher ESD stresses compared to the sink side that is connected internally to the HDMI receiver. Adaptive equalization: The built-in adaptive equalization support compensates for intersymbol interference [ISI] loss of up to 20 dB, which represents a typical 20-m HDMI/DVI cable at 3 Gbps. Adaptive equalization adjusts the equalization gain automatically, based on the cable length and the incoming TMDS data rate. TMDS clock-detect circuitry: This feature provides an automatic power-management feature and also ensures that the TMDS output port is turned on only if there is a valid TMDS input signal. The TMDS clock-detect feature can be by-passed in I2C mode; see Table 10 and Table 11. It is recommended to enable TMDS clock-detect circuitry during normal operation. However, for HDMI compliance testing (TMDS termination-voltage test), the clock-detect feature should be disabled by using the I2C mode control. If the customer requires passing the TMDS termination-voltage test in the GPIO mode with the default TMDS clock-detect circuitry enabled, then a valid TMDS clock should be provided for this compliance test, so that the terminations on the TMDS data pair can be connected and thus customer can pass the TMDS termination-voltage test. DDC I2C buffer: This feature provides isolation on the source-side and sink-side DDC I2C capacitance, thus helping the sink system to pass system-level compliance. Robust TMDS receive stage: This feature ensures that the TMDS261B can work with TMDS input signals having common-mode voltage levels that can be either compliant or non-compliant with HDMI/DVI specifications. VSadj: This feature adjusts the TMDS output swing and can help the sink system to tune the output TMDS swing of the TMDS261B (if needed) based on the system requirements. GPIO or local I2C interface to control the device features • TMDS output edge-rate control: This feature adjusts the TMDS261B TMDS output rise and fall times. There 2 Copyright © 2009–2011, Texas Instruments Incorporated • • • • • TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com are four settings of the rise and fall times that can be chosen. The default setting is the fastest rise and fall time; the other three settings are slower. Slower edge transitions can potentially help the sink system (HDTV) in passing regulatory EMI compliance. FUNCTIONAL BLOCK DIAGRAM o VCC RINT RINT Dx+_1 TMDS Rx w/ AEQ Dx–_1 VCC RINT RINT CLK+_1 TMDS Rx CLK–_1 Clock Detect VSadj Tx SCL1 Rx Dx+_SINK TMDS Tx Tx Dx–_SINK SDA1 Rx 2:1 MUX VCC CLK+_SINK TMDS Tx CLK–_SINK RINT RINT Dx+_2 Rx TMDS Rx w/ AEQ Dx–_2 SCL_SINK Tx VCC Rx RINT RINT SDA_SINK CLK+_2 Tx TMDS Rx CLK–_2 Clock Detect Clock Detect Tx SCL2 Rx Tx SDA2 Rx HPD_SINK HPD1 HPD2 I2C_SEL 1 kW 2 1 kW Local I C and Control Logic LP S1/SCL S2/SDA B0330-02 Copyright © 2009–2011, Texas Instruments Incorporated 3 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com PAG PACKAGE 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 NC D2+_2 D2–_2 VCC D1+_2 D1–_2 GND D0+_2 D0–_2 VCC CLK+_2 CLK–_2 SCL2 SDA2 HPD2 LP PAG-64 (Top View) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 TMDS261B 64-pin TQFP 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 D2+_1 D2–_1 VCC D1+_1 D1–_1 GND D0+_1 D0–_1 VCC CLK+_1 CLK–_1 SCL1 SDA1 HPD1 I2C_SEL S2/SDA D2+_SINK D2–_SINK VCC D1+_SINK D1–_SINK GND D0+_SINK D0–_SINK VCC CLK+_SINK CLK–_SINK GND SCL_SINK SDA_SINK HPD_SINK S1/SCL 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 NC NC GND NC NC VCC NC NC GND NC NC VCC NC NC GND VSadj P0010-09 4 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com PIN FUNCTIONS PIN SIGNAL NO. I/O DESCRIPTION TMDS INPUT PINS CLK+_1 CLK–_1 39 38 I Port-1 TMDS differential clock 42, 45, 48 41, 44, 47 I Port-1 TMDS differential data inputs 54 53 I Port-2 TMDS differential clock 57, 60, 63 56, 59, 62 I Port-2 TMDS differential data inputs 26 27 O TMDS sink differential clock 23, 20, 17 24, 21, 18 O TMDS sink differential data outputs 35, 50 O Source port hot-plug-detect output 31 I Sink hot-plug-detect input SCL[1:2] 37, 52 I/O TMDS port bidirectional DDC clock SDA[1:2] D[0:2]+_1 D[0:2]–_1 CLK+_2 CLK–_2 D[0:2]+_2 D[0:2]–_2 TMDS OUTPUT PINS CLK+_SINK CLK–_SINK D[0:2]+_SINK D[0:2]–_SINK HOT-PLUG-DETECT STATUS PINS HPD[1:2] HPD_SINK DDC PINS 36, 51 I/O TMDS port bidirectional DDC data SCL_SINK 29 I/O TMDS sink-side bidirectional DDC clock SDA_SINK 30 I/O TMDS sink-side bidirectional DDC data LP 49 I Low-power select bar I2C_SEL 34 I GPIO/local I2C control select S1/SCL 32 I Source select 1(GPIO) / local I2C clock (I2C) S2/SDA 33 I/O Source select 2 (GPIO) / local I2C data (I2C) VSadj 16 I VCC 6, 12, 19, 25, 40, 46, 55, 61 GND 3, 9, 15, 22, 28, 43, 58 CONTROL PINS TMDS-compliant voltage swing control SUPPLY AND GROUND PINS NC 1, 2, 4, 5, 7, 8, 10, 11, 13, 14, 64 Copyright © 2009–2011, Texas Instruments Incorporated 3.3-V supply Ground No-connect pins 5 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com Table 1. Source Selection Lookup (1) CONTROL PINS (1) 6 I/O SELECTED HOT-PLUG DETECT STATUS Power Mode S2 S1 Port Selected SCL_SINK SDA_SINK H H Port 1 Terminations of port 2 are disconnected. SCL1 SDA1 HPD_SINK L Normal mode H L Port 2 Terminations of port 1 are disconnected. SCL2 SDA2 L HPD_SINK Normal mode L L Normal Mode HPD_SINK HPD_SINK Standby mode L L L H Disallowed (Indeterminate state, all None (Z) terminations are Are pulled HIGH by disconnected) external pullup None (Z) termination All terminations are disconnected. HPD1 HPD2 H: Logic high; L: Logic low; X: Don't care; Z: High impedance Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS TMDS Input Stage TMDS Output Stage VCC Y Z 50 W 50 W B A 10 mA HPD Output Stage Status and Source Selector VCC VCC HPD_SINK S1 S2 HPD1 HPD2 DDC Buffer VCC Buffer S0386-02 Copyright © 2009–2011, Texas Instruments Incorporated 7 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com Table 2. Control-Pin Lookup Table (1) SIGNAL LEVEL STATE H Normal mode L Low-power mode LP S[2:1] GPIO mode I2C_SEL VSadj (1) DESCRIPTION Normal operational mode for device. If LP is left floating, then a weak internal pullup to VCC pulls it to VCC. Device is forced into a low-power state, causing the inputs and outputs to go to a high-impedance state. All other inputs are ignored. S2 S1 H H Port 1 Port 1 is selected as the active port; all other ports are low. H L Port 2 Port 2 is selected as the active port; all other ports are low. L L Disallowed L H HPD[1:2] follow HPD_SINK 2 Disallowed (Indeterminate state; all terminations are disconnected.) Standby mode: HPD[1:2] follow HPD_sink. Device is configured by I2C logic. L I C H GPIO Device is configured by GPIO. If the I2C_SEL pin is left floating, then a weak internal pullup to VCC pulls the I2C_SEL pin high. 4.02 kΩ Compliant voltage Driver output voltage swing precision control to aid with system compliance. The VSadj resistor value can be selected to be 4.02 kΩ ±10% based on the system requirement to pass HDMI compliance. (H) Logic high; (L) Logic low ORDERING INFORMATION (1) (1) PART NUMBER PART MARKING PACKAGE TMDS261BPAGR TMDS261B 64-pin TQFP reel (large) TMDS261BPAG TMDS261B 64-pin TQFP tray For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) Supply voltage range (2) VCC Electrostatic discharge (2) (3) (4) (5) (6) 8 V HPD and DDC I/O –0.3 to 5.5 Control and status I/O –0.3 to 5.5 Human body model (3) on SCL[1:2], SDA[1:2], HPD[1:2], D[0:2]+_[1:2], D[0:2]–_[1:2], CLK+_[1:2], CLK–_[1:2] pins ±10,000 Human body model (3) on all other pins ±9,000 Charged-device model (4) ±1500 Machine model (5) ±200 IEC 61000-4-2 (6), contact discharge ±8,000 IEC 61000-4-2 (6), air discharge ±15,000 Continuous power dissipation (1) UNIT –0.3 to 4 TMDS I/O Voltage range VALUE –0.3 to 3.6 V V See Dissipation Ratings table Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to network ground terminal. Tested in accordance with JEDEC Standard 22, Test Method A114-B Tested in accordance with JEDEC Standard 22, Test Method C101-A Tested in accordance with JEDEC Standard 22, Test Method A115-A Tested in accordance with IEC EN 61000-4-2 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com DISSIPATION RATINGS PACKAGE PCB JEDEC STANDARD TA ≤ 25°C DERATING FACTOR (1) ABOVE TA = 25°C TA = 70°C POWER RATING Low-K 1066 mW 10.66 mW/°C 586 mW High-K 1481 mW 14.8 mW/°C 814 mW 64-pin TQFP (PAG) (1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. THERMAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX (1) UNIT RθJB Junction-to-board thermal resistance 37.13 °C/W RθJC Junction-to-case thermal resistance 15.3 °C/W PD(1) Device power dissipation in normal mode LP = HIGH, TMDS: VID(pp) = 1200 mV, 3 Gbps TMDS data pattern; HPD_SINK = HIGH, S1/S2 = LOW/HIGH, HIGH/HIGH PD(2) Device power dissipation in standby mode LP = HIGH, TMDS: VID(pp) = 1200 mV, 3 Gbps TMDS data pattern; HPD_SINK = HIGH, S1 = HIGH, S2 = LOW PSD Device power dissipation in low-power mode LP = LOW PNCLK Device power dissipation in normal mode with no active TMDS input clock LP = HIGH, no TMDS input clock, HPD_SINK = HIGH, S1/S2 = LOW/HIGH, HIGH/HIGH TJ Junction Temperature (1) 560 780 mW 10 20 mW 1 2 mW 40 65 mW 125 °C 0 The maximum rating is simulated under 3.6-V VCC across worst-case temperature and process variation. Typical conditions are simulated at 3.3-V VCC, 25°C with nominal process material. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX 3.3 3.6 V 70 °C V VCC Supply voltage 3 TA Operating free-air temperature 0 UNIT TMDS DIFFERENTIAL OUTPUT AND INPUT PINS VID(pp) Peak-to-peak input differential voltage 0.15 1.56 VIC Input common-mode voltage VCC – 0.4 VCC + 0.01 tIN_Rise_Fall TMDS input rise and fall time 75 VIN_PRE Acceptable pre-emphasis on TMDS input signals. Note that an input signal into TMDS261B with longer pre-emphasis duration and/or larger pre-emphasis ampltidue, could result in over-equalization. See (Figure 26) AVCC TMDS output termination voltage 3 3.3 3.6 dR Data rate RVSadj Resistor for TMDS-compliant voltage output swing 3.66 4.02 4.47 kΩ RT Termination resistance 45 50 55 Ω V ps 3 V Gbps DDC PINS VI Input voltage dR(I2C) I2C data rate 0 5.5 V 100 Kbps HPD AND CONTROL PINS VIH High-level input voltage 2 5.5 V VIL Low-level input voltage 0 0.8 V Copyright © 2009–2011, Texas Instruments Incorporated 9 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com DEVICE POWER The TMDS261B is designed to operate from a single 3.3-V supply voltage. The TMDS261B has three power modes of operation. These three modes are referred to as normal mode, standby mode, and low-power mode. Normal mode is designed to be used during typical operating conditions. In normal mode, the device is fully functional and consumes the greatest amount of power. Standby mode is designed to be used when reduced power is desired, but DDC and HPD communication must be maintained. Standby mode can be enabled via the I2C interface (See Table 8 through Table 11) or GPIO interface (See Table 1). In standby mode, the high-speed TMDS data and clock channels are disabled to reduce power consumption. The internal I2C logic and DDC function normally. HPD[1:3] follow HPD_SINK. Low-power mode is designed to consume the least possible amount of power while still applying 3.3 V to the device. Low-power mode can be enabled by either the LP pin or by local I2C (See Table 8 through Table 11). In low-power mode, all of the inputs and outputs are disabled with the exception of the internal I2C logic and LP pin. The clock-detect feature in the TMDS261B provides an automatic power-management feature in normal mode. if no valid TMDS clock is detected, the terminations on the input TMDS data lines are disconnected, and the TMDS outputs are high-Z. As soon as a valid TMDS clock is detected, the terminations on the TMDS data lines are connected, the TMDS outputs come out of high-Z, and the device is fully functional and consumes the greatest amount of power. ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN ICC Normal-mode supply current LP = HIGH, TMDS: VID(pp) = 1200 mV, 3 Gbps TMDS data pattern; HPD_SINK = HIGH, S1/S2 = LOW/HIGH, HIGH/HIGH ISTBY Standby supply current LP = HIGH, TMDS: VID(pp) = 1200 mV, 3 Gbps TMDS data pattern; HPD_SINK = HIGH, S1 = HIGH, S2 = LOW ISD Shutdown current LP = LOW INCLK Normal-mode supply current, with no active TMDS input clock LP = HIGH, No TMDS input clock, HPD_SINK = HIGH, S1/S2 = LOW/HIGH, HIGH/HIGH TYP MAX UNIT 170 216 mA 3 5.5 mA 300 555 μA 12 18 mA HOT-PLUG DETECT The TMDS261B is designed to support the hot-plug indication to the input ports (HDMI/DVI sources connected to TMDS261B) via the HPD[1:2] output pins. The state of the hot-plug output of the selected source follows the state of the hot-plug input (HPD_SINK input pin) from the sink side. The state of the hot-plug output for the non-selected source goes low (See Table 1). The maximum VOH of the HPD depends on VCC. It is recommended that if VOH greater than 3.6 V is needed on HPD, then an external circuit can be used to drive the VOH from the 5 V of the HDMI source (connected as shown in Figure 45). ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) MAX UNIT VOH(HPD) High-level output voltage PARAMETER IOH = 100 μA 2 VCC V VOL(HPD) Low-level output voltage IOL = 100 μA 0 0.4 V IH High-level input current VIH = 2 V, VCC = 3.6 V –10 10 μA IL Low-level input current VIL = 0.8 V, VCC = 3.6 V –10 10 μA RL Output source impedance 1200 Ω 10 TEST CONDITIONS MIN TYP 800 1000 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tPD1(HPD) HPD_SINK propagation delay HPD_SINK to HPD[1:2] 12 20 ns tS1 Selecting port HPD switch time S[1:2] to HPD[1:2] 17 30 ns tS2 Deselecting port HPD switch time S[1:2] to HPD[1:2] 14 22 ns tZ Low-power to high-level propagation delay LP to HPD[1:2] 13 20 ns 5V HPD BUFFER HPD Input HPD_SINK HPD Output 2.5 V 5 pF 5 pF 0V tPD1(HPD) 3.3 V HPD[1:2] S0367-01 1.65 V 0V T0387-02 Figure 1. HPD Test Circuit Figure 2. HPD Timing Diagram #1 5V HPD_SINK 0V 5V 2.5 V 0V S1 5V S2 0V VCC VCC/2 0V HPD2 ts2 VCC VCC/2 0V HPD1 ts1 5V 2.5 V 0V LP tz T0423-01 Figure 3. HPD Timing Diagram #2 Copyright © 2009–2011, Texas Instruments Incorporated 11 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com TMDS DDC and Local I2C Pins DDC I2C Buffer or Repeater: The TMDS261B provides buffering on the DDC I2C interface for each of the input ports connected. This feature isolates the capacitance on the source side from the sink side and thus helps in passing system-level compliance. See the DDC I2C Function Description section for a detailed description on how the DDC I2C buffer operates. Note that a key requirement on the sink side is that the VIL(Sink) (input to TMDS261B) should be less than 0.4 V. This requirement should be met for the DDC I2C buffer to function properly. There are three settings of VIL(Sink) and VOL(Sink) that can be chosen based on OVS settings (See Table 8 through Table 11). Local I2C Interface: The TMDS261B includes a slave I2C interface to control device features like TMDS input port selection, TMDS output edge-rate control, power management, DDC buffer OVS settings, etc. See Table 8 through Table 11. The TMDS261B is designed to be controlled via a local I2C interface or GPIO interface, based on the status of the I2C_SEL pin. The local I2C interface in the TMDS261B is only a slave I2C interface. See the I2C INTERFACE NOTES section for a detailed description of I2C functionality. ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VCC = 3.6 V, VI = 0 V –10 10 μA Sink pins VCC = 3.6 V, VI = 4.95 V –10 10 μA Input/output capacitance Sink pins DC bias = 2.5 V, ac = 3.5 Vp-p, f = 100 kHz 15 pF High-level input voltage Sink pins 2.1 5.5 V VIL1(Sink) Low-level input voltage Sink pins OVS 1 –0.2 0.4 V VOL1(Sink) Low-level output voltage Sink pins IO = 3 mA, OVS = HIGH VIL2(Sink) Low-level input voltage Sink pins OVS 2 VOL2(Sink) Low-level output voltage Sink pins IO = 3 mA, OVS = LOW VIL3(Sink) Low-level input voltage Sink pins OVS 3 VOL3(Sink) Low-level output voltage Sink pins Ilkg(I2C) Input leakage current Port[1:2] pins CIO(I2C) Input/output capacitance Port[1:2] pins DC bias = 2.5 V, ac = 3.5 Vp-p, f = 100 kHz VIH(I2C) High-level input voltage Port[1:2] pins VIL(I2C) Low-level input voltage Port[1:2] pins VOL(I2C) Low-level output voltage Port[1:2] pins IL Low-level input current Ilkg(Sink) Input leakage current CIO(Sink) VIH(Sink) 12 0.6 0.7 V –0.2 0.4 V 0.5 0.6 V –0.2 0.3 V IO = 3 mA, OVS = high-Z 0.4 0.5 V VCC = 3.6 V, VI = 4.95 V –10 10 μA 15 pF 2.1 5.5 V –0.2 1.5 V 0.2 V IO = 3 mA Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tPLH1 Propagation delay time, low to high Source to sink 80 251 ns tPHL1 Propagation delay time, high to low Source to sink 35 200 ns tPLH2 Propagation delay time, low to high Sink to source 204 459 ns tPHL2 Propagation delay time, high to low Sink to source 35 200 ns tf1 Output signal fall time Sink side 20 72 ns tf2 Output-signal fall time Source side 20 72 ns fSCL SCL clock frequency for internal register Local I2C 100 kHz tW(L) Clock LOW period for I2C register Local I2C 4.7 μs tW(H) Clock HIGH period for internal register Local I2C 4 μs tSU1 Internal register setup time, SDA to SCL Local I2C 250 ns 2 th(1) Internal register hold time, SCL to SDA Local I C 0 μs t(buf) Internal register bus free time between STOP and START Local I2C 4.7 μs tsu(2) Internal register setup time, SCL to START Local I2C 4.7 μs th(2) Internal register hold time, START to SCL Local I2C 4 μs 4 μs tsu(3) 2 Internal register hold time, SCL to STOP Local I C 5V VCC RL = 2 kW PULSE GENRATOR D.U.T. RT CL = 100 pF VOUT VIN S0369-02 Figure 4. Sink-Side Test Circuit 5V VCC RL = 2 kW PULSE GENRATOR D.U.T. RT CL = 400 pF VIN VOUT S0370-02 Figure 5. Source-Side Test Circuit Copyright © 2009–2011, Texas Instruments Incorporated 13 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com 5V SCL[x] SDA[x] Input 1.6 V 0.1 V tPHL2 tPLH2 5V 80% SCL_SINK SDA_SINK Output 1.6 V 20% VOL tf2 T0388-01 Figure 6. Source-Side Output AC Measurements 5V SCL_SINK SDA_SINK Input 1.6 V 0.1 V tPHL1 5V 80% SCL[x] SDA[x] Output 1.6 V 20% VOL tf1 T0389-01 Figure 7. Sink-Side Output AC Measurements 5V SCL_SINK SDA_SINK Input VOL tPLH1 5V SCL[x] SDA[x] Output 1.6 V T0390-01 Figure 8. Source-Side Output AC Measurements (Continued) TMDS Main Link Pins The TMDS port of the TMDS261B is designed to support the Digital Video Interface (DVI) 1.0 and High Definition Multimedia Interface (HDMI) 1.3 specifications. The differential output voltage swing can be fine-tuned with the VSadj resistor. 14 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS VOH Single-ended HIGH-level output voltage VOL Single-ended LOW-level output voltage VSWING Single-ended output voltage swing VOC(SS) Change in steady-state common-mode output voltage between logic states VOD(pp) Peak-to-peak output differential voltage V(O)SBY Single-ended standby output voltage I(O)OFF Single-ended power-down output current IOS VCD(pp) MIN AVCC = 3.3 V, RT = 50 Ω TYP MAX UNIT AVCC – 10 AVCC + 10 mV AVCC – 600 AVCC – 400 mV 400 600 mV 5 mV 800 1200 mV AVCC – 10 AVCC + 10 mV 0 V ≤ VCC ≤ 1.5 V, AVCC = 3.3 V, RT = 50 Ω –10 10 μA Short-circuit output current See Figure 16 -15 15 mA Minimum valid clock differential voltage (peak-to-peak) Input TMDS clock frequency = 300 MHz 100 12 mV SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT tPLH Propagation delay time 250 800 ps tPHL Propagation delay time 250 800 ps tR1 Rise time, fastest mode (default setting): fastest setting 84 110 140 ps tF1 Fall time, fastest mode (default setting): fastest setting 84 110 140 ps tR2 Rise time, fastest mode + 50 ps (approximately) 142 160 190 ps tF2 Fall time, fastest mode + 50 ps (approximately) 142 160 190 ps tR3 Rise time, fastest mode + 100 ps (approximately) 187 210 230 ps tF3 Fall time, fastest mode + 100 ps (approximately) 187 210 230 ps tR4 Rise time, fastest mode + 120 ps (approximately): slowest setting 216 230 260 ps tF4 Fall time, fastest mode + 120 ps (approximately): slowest setting 216 230 260 ps tSK(P) Pulse skew (see 8 15 ps tSK(D) Intra-pair skew 10 30 ps tSK(O) Inter-pair skew (see 100 ps 198 ps tJITD(PP) (1) (2) (3) AVCC = 3.3 V, RT = 50 Ω. See Figure 9 and Figure 10. (2) ) AVCC = 3.3 V, RT = 50 Ω. See Figure 11. (3) ) Peak-to-peak output residual data jitter AVCC = 3.3 V, RT = 50 Ω, dR = 2.25 Gbps. See Figure 14 for measurement setup; residual jitter is the total jitter measured at TTP4 minus the jitter measured at TTP1. See Figure 15 for the loss profile of the cable used for tJITD(PP) measurement. Also see Typical Curves for tJITD(PP) across cable length and input TMDS data rate. 125 All typical values are at 25°C and with a 3.3-V supply. tsk(p) is the magnitude of the time difference between tPLH and tPHL of a specified terminal. tsk(o) is the magnitude of the difference in propagation delay times between any specified terminals of a sink-port bank when inputs of the active source port are tied together. Copyright © 2009–2011, Texas Instruments Incorporated 15 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com SWITCHING CHARACTERISTICS (continued) over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX 54 84 ps AVCC = 3.3 V, RT = 50 Ω, input TMDS clock frequency = 225 MHz. See Figure 14for measurement setup; residual jitter is the total jitter measured at TTP4 minus the jitter measured at TTP1. See Figure 15 for the loss profile of the cable used for tJITC(PP) measurement. tJITC(PP) is measured at TMDS differential clock signal crossing. UNIT tJITC(PP) Peak-to-peak output residual clock jitter tCLK1 Valid clock-detect enable time AVCC = 3.3 V, RT = 50 Ω, input TMDS clock frequency = 300 MHz. See Figure 13. 300 500 ns tCLK2 Invalid clock-detect disable time AVCC = 3.3 V, RT = 50 Ω, input TMDS clock frequency = 1 MHz. See Figure 13. 500 800 ns tSEL1 Port selection time (see AVCC = 3.3 V, RT = 50 Ω 300 500 ns tSEL2 Port deselection time (see AVCC = 3.3 V, RT = 50 Ω 40 50 ns fCD Clock-detect frequency 300 MHz (4) (5) (4) (5) ) AVCC = 3.3 V, RT = 50 Ω. See Figure 13. 25 tSEL1 includes the time for the valid clock-detect enable time and tS1(HPD), because the tS1(HPD) event happens in parallel with tSEL1; thus, the tSEL1 time is primarily the tCLK1 time. tSEL2 is primarily the tS2(HPD) time. AVCC VCC 50 W 50 W 50 W D+ VD+ Receiver VID D– VD– 50 W 0.5 pF VID = VD+ – VD– V = (VD+ + VD–) ICM 2 Y Driver VY Z VOD = VY – VZ V = (VY + VZ) VZ OC 2 S0371-02 Figure 9. TMDS Main-Link Test Circuit 16 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com 3.3 V VID 2.8 V VID+ VID(pp) 0V VID– tPLH tPHL 80% 20% tf 80% VOD(pp) VOD 20% tr T0391-01 Figure 10. TMDS Main-Link Timing Measurements VOH VY 50% VZ VOL tsk(D) Figure 11. Definition of Intra-Pair Differential Skew VOC DVOC(SS) T0392-01 Figure 12. TMDS Main-Link Common-Mode Measurements VCD(PP) Valid Input TMDS Clock That Meets the Minimum Frequency Threshold and Amplitude tclk1 tclk2 TMDS Outputs HiZ During This Period VOD(PP) TMDS Outputs HiZ TMDS Output Clock With Peak-to-Peak Swing Supporting the HDMI Spec and With Same Frequency as the Input TMDS Clock Frequency T0424-02 Figure 13. Clock-Detect Timing Diagram Copyright © 2009–2011, Texas Instruments Incorporated 17 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com (4) AVCC RT Data+ Parallel BERT Data– Coax Coax SMA (6) RX +EQ SMA HDMI Cable 1000-mVpp Differential <2-inch 50-W Transmission Line OUT (6) <2-inch 50-W Transmission Line SMA SMA Coax Coax Jitter Testnnn (2, 3) AVCC Instrument (1) TMDS261B RT Clk+ Coax Clk– Coax SMA (6) RX +EQ SMA (5) RT <2-inch 50-W Transmission Line OUT (6) <2-inch 50-W Transmission Line SMA SMA RT Coax Coax Jitter Testnnn (2, 3) Instrument TTP1 TTP2 TTP4 TTP3 B0331-09 (1) The HDMI cable between TTP1 and TTP2 is 0 m (no loss) case and 20 m case. See Figure 15 for the loss profile of the cable. (2) All jitter is measured at a BER of 10–9. (3) Residual jitter reflects the total jitter measured at TTP4 minus the jitter measured at TTP1. (4) AVCC = 3.3 V; VSadj = 4.02 kΩ. (5) RT = 50 Ω. (6) 2 inches = 5,08 cm. NOTES: Output edge rate default (fastest): input edge rate from the parallel BERT greater than 75 ps (20%–80%). The input signal from the parallel BERT has no pre-emphasis. Figure 14. Jitter Measurement Setup 2 HDMI Cable 0 m −3 Amplitude − dB −8 −13 −18 −23 HDMI Cable 20 m −28 −33 0.0 0.5 1.0 1.5 2.0 2.5 3.0 f − Frequency − GHz G001 Figure 15. Loss Profile of 20-m HDMI Cable 18 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com 50 W OS Driver 50 W + – 0 V or 3.6 V S0372-01 Figure 16. TMDS Main Link Short-Circuit Output Circuit TYPICAL CHARACTERISTICS AVCC = 3.3 V, RT = 50 Ω POWER vs AMBIENT TEMPERATURE POWER vs INPUT TMDS DATA RATE 590 590 Fastest (Default) TMDS Output Edge Rate 570 570 550 P − Power − mW P − Power − mW 550 Fastest (Default) TMDS Output Edge Rate 530 510 Slowest TMDS Output Edge Rate 490 530 510 Slowest TMDS Output Edge Rate 490 VCC = 3.3 V VSadj = 4.02 KΩ Input TMDS Data Rate = 2.25 Gbps 470 470 450 0 10 20 30 40 50 TA − Ambient Temperature − °C Figure 17. Copyright © 2009–2011, Texas Instruments Incorporated 60 70 450 0.0 TA = 25°C VCC = 3.3 V VSadj = 4.02 KΩ 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Input TMDS Data Rate − Gbps G002 G003 Figure 18. 19 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) AVCC = 3.3 V, RT = 50 Ω PEAK-to-PEAK RESIDUAL CLOCK JITTER vs INPUT TMDS CLOCK FREQUENCY PEAK-to-PEAK RESIDUAL DATA JITTER vs INPUT TMDS DATA RATE 160 TA =25°C VCC = 3.3 V VSadj = 4.02 kΩ 50 20 m, 22 AWG HDMI Cable Peak-to-Peak Residual Data Jitter − ps Peak-to-Peak Residual Clock Jitter − ps 60 20 m, 24 AWG HDMI Cable 40 30 15 m, 26 AWG HDMI Cable 20 10 3 m, 28 AWG HDMI Cable 50 100 150 200 140 20 m, 24 AWG HDMI Cable 120 100 80 20 m, 22 AWG HDMI Cable 60 3 m, 28 AWG HDMI Cable 40 TA =25°C VCC = 3.3 V VSadj = 4.02 kΩ 20 10 m, 28 AWG HDMI Cable 0 0 15 m, 26 AWG HDMI Cable 250 300 0 0.0 350 0.5 Input TMDS Clock Frequency − MHz 1.0 1.5 10 m, 28 AWG HDMI Cable 2.0 2.5 3.0 G009 G005 Figure 19. Figure 20. PEAK-to-PEAK RESIDUAL CLOCK JITTER vs HDMI CABLE LENGTH PEAK-to-PEAK RESIDUAL DATA JITTER vs HDMI CABLE LENGTH 250 TA = 25°C VCC = 3.3 V VSadj = 4.02 kΩ 70 Peak-to-Peak Residual Data Jitter − ps Peak-to-Peak Residual Clock Jitter − ps 80 60 50 40 30 20 10 0 20 m 28 AWG TA = 25°C VCC = 3.3 V VSadj = 4.02 kΩ 200 150 100 50 0 20 m 24 AWG 20 m 22 AWG 15 m 26 AWG 10 m 28 AWG 5m 28 AWG 3m 28 AWG HDMI Cable Length Figure 21. 20 3.5 Input TMDS Data Rate − Gbps 3m 30 AWG 1m 28 AWG 1m 30 AWG G010 20 m 28 AWG 20 m 24 AWG 20 m 22 AWG 15 m 26 AWG 10 m 28 AWG 5m 28 AWG 3m 28 AWG HDMI Cable Length 3m 30 AWG 1m 28 AWG 1m 30 AWG G007 Figure 22. Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) AVCC = 3.3 V, RT = 50 Ω DIFFERENTIAL OUTPUT VOLTAGE vs RESISTANCE VOD(pp) − Differential Output Voltage − mV 1600 TA = 25°C 1400 VCC = 3.6 V 1200 1000 VCC = 3.3 V 800 VCC = 3 V 600 400 200 0 3 4 5 6 7 VSadj Resistance − kΩ G008 Figure 23. (1) The HDMI cable between TTP1 and TTP2 is 0 m (no loss) case. See Figure 15 for the loss profile of the cable. (2) Eye data is measured using an 8-GHz bandwith oscilloscope (Agilent). (3) Eye data is taken at TTP4. (4) AVCC = 3.3 V; VSadj = 4.02 kΩ. (5) RT = 50 Ω. (6) 2 inches = 5,08 cm. NOTES: Output edge rate default (fastest): input edge rate from the video pattern generator greater than 75 ps (20%–80%). The input signal from the parallel BERT has pre-emphasis. See Figure 26 for acceptable input pre-emphasis duration and amplitude. Pass/fail criterion: output eye at TTP4 should comply with output eye mask (See Figure 25). The input TMDS clock frequencies tested: 25 MHz, 30.24 MHz, 36 MHz, 54 MHz, 65 MHz, 74.25 MHz, 84.75 MHz, 108 MHz, 135 MHz, 148.5 MHz, 185.625 MHz, 222.75 MHz, 297 MHz. (4) AVCC Parallel BERT RT Data+ 800-mVpp, Data– 1000-mVpp, 1200-mVpp Differential Signal Coax Coax SMA (6) RX +EQ SMA HDMI Cable <2-inch 50-W Transmission Line OUT (6) <2-inch 50-W Transmission Line SMA SMA Coax Coax Eye Testnnn (2, 3) AVCC Instrument (1) TMDS261B RT With Clk+ Preemphasis Coax Clk– Coax SMA (6) RX +EQ SMA (5) RT <2-inch 50-W Transmission Line OUT (6) <2-inch 50-W Transmission Line (3-dB, 120-ps Duration SMA SMA RT Coax Coax Eye Testnnn (2, 3) Instrument TTP1 TTP2 TTP3 TTP4 B0331-10 Figure 24. Input Pre-Emphasis Tolerance-Measurement Setup Copyright © 2009–2011, Texas Instruments Incorporated 21 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) AVCC = 3.3 V, RT = 50 Ω 780 mV 200 mV 0 –200 mV –780 mV 0 0.25 UI 0.75 UI 1.0 UI M0146-01 Figure 25. Output-Eye Mask at TTP4 Pre-emphasis Duration 120 ps 3-dB Pre-emphasis Level 80% 20% VOD p-p = 800 mV–1200 mV 20% 80% Input Signal Rise Time (20–80%) Input Signal Fall Time (20–80%) T0235-02 Figure 26. Acceptable Pre-Emphasis Into TMDS261B Any input pre-emphasis higher than the input condition shown in Figure 26 can result in over-equalization and potential system failure. During over-equalization, the TMDS261B in the setup of Figure 24 fails the output eye mask as shown in Figure 25. 22 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) AVCC = 3.3 V, RT = 50 Ω Figure 27. TMDS Data Rate of 250 Mbps Figure 28. TMDS Data Rate of 302.4 Mbps Figure 29. TMDS Data Rate of 360 Mbps Figure 30. TMDS Data Rate of 540 Mbps Copyright © 2009–2011, Texas Instruments Incorporated 23 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) AVCC = 3.3 V, RT = 50 Ω 24 Figure 31. TMDS Data Rate of 650 Mbps Figure 32. TMDS Data Rate of 742.5 Mbps Figure 33. TMDS Data Rate of 847.5 Mbps Figure 34. TMDS Data Rate of 1080 Mbps Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) AVCC = 3.3 V, RT = 50 Ω Figure 35. TMDS Data Rate of 1350 Mbps Figure 36. TMDS Data Rate of 1485 Mbps Figure 37. TMDS Data Rate of 1856.25 Mbps Figure 38. TMDS Data Rate of 2227.5 Mbps Copyright © 2009–2011, Texas Instruments Incorporated 25 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) AVCC = 3.3 V, RT = 50 Ω Figure 39. TMDS Data Rate of 2970 Mbps 26 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com APPLICATION INFORMATION Table 3. TMDS261B vs TMDS251 Pinout PIN NUMBER I/O Pins 32 and 33 I TMDS251 GPIO mode: S1 and S2 configured as source selector pins TMDS261B GPIO mode: S1 and S2 configured as source selector pins (same as TMDS251) I2C mode: S1 and S2 configured as SCL and SDA for local slave I2C communication Pin 34 Pin 49 I — EQ: TMDS input equalization control select I2C_SEL: GPIO / local I2C control select EQ = High – 10-m 28 AWG HDMI cable I2C_SEL = High – Device is configured by GPIO logic. EQ = Low – HDMI 1.3 compliant cable I2C_SEL= Low – Device is configured by I2C logic. VDD: HPD/DDC power supply LP: Low-power mode-select bar LP = High – Normal operational mode LP = Low – Device goes into low-power state. Based on the differences listed in Table 3, attention must be given to pin 34, which determines whether the device uses I2C or GPIO control. Supply Voltage The TMDS261B is powered up with a single power source that is 3.3-V VCC for the TMDS circuitry for HPD, DDC, and most of the control logic. TMDS Input Fail-Safe The TMDS261B incorporates clock-detect circuitry. If there is no valid TMDS clock from the connected HDMI/DVI source, the TMDS261B does not switch on the terminations on the source-side data channels. Additionally, the TMDS outputs are placed in the high-impedance state. This prevents the TMDS261B from turning on its outputs if there is no valid incoming HDMI/DVI data. TMDS Outputs A 10% precision resistor, 4.02-kΩ, is recommended to control the output swing to the HDMI-supporting 800-mV to 1200-mV range VOD(pp) (1000 mV typical). The TMDS outputs are high-impedance under standby-mode operation, S1 = H and S2 = L. DDC I2C Function Description The TMDS261B provides buffers on the DDC I2C lines on both input ports. This section explains the operation of the buffer. For representation, the source side of the TMDS261B is represented by RSCL/RSDA, and the sink side is represented by TSCL/TSDA. The buffers on the RSCL/RSDA and TSCL/TSDA pins are 5-V tolerant when the device is powered off and high-impedance under low supply voltage, 1.5 V or below. If the device is powered up, the driver T (see Figure 40) is turned on or off depending on the corresponding R-side voltage level. When the R side is driven low below 1.5 V, the corresponding T-side driver turns on and drives the T side down to a low level output voltage, VOL. The value of VOL and VIL on the T side or the sink side of the TMDS261B switch depends on the output-voltage select (OVS) control settings. OVS control can be changed by the slave I2C, see Table 8. When the OVS1 setting is selected, VOL is typically 0.7 V and VIL is typically 0.4 V. When the OVS2 setting is selected, VOL is typically 0.6 V and VIL is typically 0.4 V. When the OVS3 setting (default) is selected, VOL is typically 0.5 V and VIL is typically 0.3 V. VOL is always higher than the driver-R input threshold, VIL on the T side or the sink side, preventing lockup of the repeater loop. The TMDS261B is targeted primarily as a switch in the HDTV market and is expected to be a companion chip to an HDMI receiver; thus, the OVS control has been provided on the sink side, so that the requirement of VIL to be less than 0.4 V can be met. The VOL value can be selected to improve or optimize noise margins between VOL and VIL of the repeater itself or VIL of some external device connected on the T side. When the R side is pulled up, above 1.5 V, the T-side driver turns off and the T-side pin is high-impedance. Copyright © 2009–2011, Texas Instruments Incorporated 27 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com OVS T RSCL RSDA TSCL TSDA R B0344-01 2 Figure 40. I C Drivers in the TMDS261B (R Side Is the HDMI Source Side, T Side Is the HDMI Sink Side) When the T side is driven below 0.4 V by an external I2C driver, both drivers R and T are turned on. Driver R drives the R side to near 0 V, and driver T is on, but is overridden by the external I2C driver. If driver T is already on, due to a low on the R side, driver R just turns on. When the T side is released by the external I2C driver, driver T is still on, so the T side is only able to rise to the VOL of driver T. Driver R turns off, because VOL is above its 0.4-V VIL threshold, releasing the R side. If no external I2C driver is keeping the R side low, the R side rises, and driver T turns off once the R side rises above 1.5 V, see Figure 41. VCC TSCL/TSDA 0.5 V tPLH 5 V ±10% RSCL/RSDA VCC/2 Figure 41. Waveform of Driver T Turning Off It is important that any external I2C driver on the T side is able to drive the bus below 0.4 V to achieve full operation. If the T side cannot be driven below 0.4 V, driver R may not recognize and transmit the low value to the R side. DDC I2C Behavior The typical application of the TMDS261B is as a 2×1 switch in a TV, connecting up to two HDMI input sources to an HDMI receiver. The I2C repeater is 5-V tolerant, and no additional circuitry is required to translate between 3.3-V and 5-V bus voltages. In the following example, the system master is running on an R-side I2C-bus, whereas the slave is connected to a T-side bus. Both buses run at 100 kHz, supporting standard-mode I2C operation. Master devices can be placed on either bus. VRdd V Tdd Driver T RRup RTup Master Slave CSOURCE CI CO Cslave Driver R Cmedium CCABLE Figure 42. Typical Application 28 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com Figure 43 illustrates the waveforms seen on the R-side I2C-bus when the master writes to the slave through the I2C repeater circuit of the TMDS261B. This looks like a normal I2C transmission, and the turnon and turnoff of the acknowledge signals are slightly delayed. 9th Clock Pulse - Acknowledge From Slave RSCL RSDA Figure 43. Bus-R Waveform Figure 44 illustrates the waveforms seen on the T-side I2C-bus under the same operation as in Figure 43. On the T-side of the I2C repeater, the clock and data lines would have a positive offset from ground equal to the VOL of the driver T. After the eighth clock pulse, the data line is pulled to the VOL of the slave device, which is very close to ground in this example. At the end of the acknowledge, the slave device releases and the bus level rises back to the VOL set by the driver until the R-side rises above VCC/2, after which it continues to be high. It is important to note that any arbitration or clock-stretching events require that the low level on the T-side bus at the input of the TMDS261B I2C repeater is below 0.4 V to be recognized by the device and then transmitted to the R-side I2C bus. 9th Clock Pulse - Acknowledge From Slave TSCL TSDA VOL Of Driver T V OL Of Slave Figure 44. Bus-T Waveform I2C Pullup Resistors The pullup resistor value is determined by two requirements: 1. The maximum sink current of the I2C buffer: The maximum sink current is 3 mA or slightly higher for an I2C driver supporting standard-mode I2C operation. Rup(min) = VDD / Isink (1) 2. The maximum transition time on the bus: The maximum transition time, T, of an I2C bus is set by an RC time constant, where R is the pullup resistor value and C is the total load capacitance. The parameter, k, can be calculated from Equation 3 by solving for t, the times at which certain voltage thresholds are reached. Different input threshold combinations introduce different values of t. Table 4 summarizes the possible values of k under different threshold combinations. t = k ´ RC (2) ( V(t) = VDD 1 - e - t/RC ) (3) Table 4. Value of k for Different Input Threshold Voltages Vth–\Vth+ 0.7 VDD 0.65 VDD 0.6 VDD 0.55 VDD 0.5 VDD 0.45 VDD 0.4 VDD 0.35 VDD 0.3 VDD 0.1 VDD 1.0986 0.9445 0.8109 0.6931 0.5878 0.4925 0.4055 0.3254 0.2513 0.15 VDD 1.0415 0.8873 0.7538 0.6360 0.5306 0.4353 0.3483 0.2683 0.1942 0.2 VDD 0.9808 0.8267 0.6931 0.5754 0.4700 0.3747 0.2877 0.2076 0.1335 Copyright © 2009–2011, Texas Instruments Incorporated 29 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com Table 4. Value of k for Different Input Threshold Voltages (continued) 0.25 VDD 0.9163 0.7621 0.6286 0.5108 0.4055 0.3102 0.2231 0.1431 0.0690 0.3 VDD 0.8473 0.6931 0.5596 0.4418 0.3365 0.2412 0.1542 0.0741 — From Equation 1, Rup(min) = 5.5 V/3 mA = 1.83 kΩ to operate the bus under a 5-V pullup voltage and provide less than 3 mA when the I2C device is driving the bus to a low state. If a higher sink current, for example 4 mA, is allowed, Rup(min) can be as low as 1.375 kΩ. Given a 5-V I2C device with input low and high threshold voltages at 0.3 VDD and 0.7 Vdd, respectively, the value of k is 0.8473 from Table 4. Taking into account the 1.83-kΩ pullup resistor, the maximum total load capacitance is C(total-5V) = 645 pF. Ccable(max) should be restricted to be less than 545 pF if Csource and Ci can be as high as 50 pF. Here the Ci is treated as Csink, the load capacitance of a sink device. Fixing the maximum transition time from Table 4, T = 1 μs, and using the k values from Table 4, the recommended maximum total resistance of the pullup resistors on an I2C bus can be calculated for different system setups. To support the maximum load capacitance specified in the HDMI specification, Ccable(max) = 700 pF/Csource = 50 pF/Ci = 50 pF, R(max) can be calculated as shown in Table 5. Table 5. Pullup Resistors for Different Threshold Voltages and 800-pF Load Vth–\Vth+ 0.7 VDD 0.65 VDD 0.6 VDD 0.55 VDD 0.5 VDD 0.45 VDD 0.4 VDD 0.35 VDD 0.3 VDD UNIT 0.1 VDD 1.14 1.32 1.54 1.80 2.13 2.54 3.08 3.84 4.97 kΩ 0.15 VDD 1.20 1.41 1.66 1.97 2.36 2.87 3.59 4.66 6.44 kΩ 0.2 VDD 1.27 1.51 1.80 2.17 2.66 3.34 4.35 6.02 9.36 kΩ 0.25 VDD 1.36 1.64 1.99 2.45 3.08 4.03 5.60 8.74 18.12 kΩ 0.3 VDD 1.48 1.80 2.23 2.83 3.72 5.18 8.11 16.87 — kΩ Or, limiting the maximum load capacitance of each cable to 400 pF to accommodate with I2C specification version 2.1, Ccable(max) = 400 pF/Csource = 50 pF/Ci = 50 pF; the maximum values of R(max) are calculated as shown in Table 6. Table 6. Pullup Resistor Upon Different Threshold Voltages and 500-pF Loads Vth–\Vth+ 0.7 VDD 0.65 VDD 0.6 VDD 0.55 VDD 0.5 VDD 0.45 VDD 0.4 VDD 0.35 VDD 0.3 VDD UNIT 0.1 VDD 1.82 2.12 2.47 2.89 3.40 4.06 4.93 6.15 7.96 kΩ 0.15 VDD 1.92 2.25 2.65 3.14 3.77 4.59 5.74 7.46 10.30 kΩ 0.2 VDD 2.04 2.42 2.89 3.48 4.26 5.34 6.95 9.63 14.98 kΩ 0.25 VDD 2.18 2.62 3.18 3.92 4.93 6.45 8.96 13.98 28.99 kΩ 0.3 VDD 2.36 2.89 3.57 4.53 5.94 8.29 12.97 26.99 — kΩ Obviously, to accommodate the 3-mA drive current specification, a narrower threshold voltage range is required to support a maximum 800-pF load capacitance for a standard-mode I2C bus. When the input low- and high-level threshold voltages, Vth– and Vth+, are 0.7 V and 1.9 V, respectively, which is 0.15 VDD and 0.4 VDD, approximately, then with VDD = 5 V from Table 5, the maximum pullup resistor is 3.59 kΩ. The allowable pullup resistor is in the range of 1.83 kΩ and 3.59 kΩ. HPD Pins The HPD circuits are powered by the 3.3-V VCC supply. This provides maximum VOH = VCC and maximum VOL= 0.4-V output signals to the SOURCE with a typical 1-kΩ output resistance. An external 1-kΩ resistor is not needed here. The HPD output of the selected source port follows the logic level of the HPD_SINK input. Unselected HPD outputs are kept low. When the device is in standby mode, all HPD outputs follow HPD_SINK. If VOH greater than VCC is desired, then an external circuit as shown in Figure 45 can be used. In this case, the maximum VOH can be equal to the 5 V coming from the HDMI source. 30 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com 5V_Source (5V coming from HDMI source) VCC/5V_source VCC 1 kW 1 kW HPD_SOURCE 1 kW (internal series resistor) 10 kW HPD[1:2] HPD_SINK TMDS261B VCC HPD_SINK HPD[1:2] ON L H HPD_SOURCE L ON H L H OFF X Z H S0387-07 Figure 45. External Circuit to Drive 5-V VOH on HPD[1:2] Layout Considerations The high-speed differential TMDS inputs are the most critical paths for the TMDS261B. There are several considerations to minimize discontinuities on these transmission lines between the connectors and the device: • Maintain 100-Ω differential transmission-line impedance into and out of the TMDS261B. • Keep an uninterrupted ground plane beneath the high-speed I/Os. • Keep the ground-path vias to the device as close as possible to allow the shortest return current path. • Keep the trace lengths of the TMDS signals between connector and device as short as possible. • Keep intra-pair skew (trace length) between the positive and negative TMDS inputs matched to within 5 mils (0.005 inches or 0.127 mm). Using the TMDS261B in Systems with Different CEC Link Requirements The TMDS261B supports a DTV with up to two HDMI inputs when used in conjunction with a signal-port HDMI receiver. Figure 46 and Figure 47 through Figure 49 show simplified application block diagrams for the TMDS261B in different DTVs with different consumer electronic control (CEC) requirements. The CEC is an optional feature of the HDMI interface for centralizing and simplifying user control instructions from multiple audio/video products in an interconnected system, even when all the audio/video products are from different manufacturers. This feature minimizes the number of remote controls in a system, as well as reducing the number of times buttons must be pressed. A DTV Supporting a Passive CEC Link In Figure 46, the DTV does not have the capability of handling CEC signals, but allows CEC signals to pass over the CEC bus. The source selection is done by the control command of the DTV. The user cannot force the command from any audio/video product on the CEC bus. The selected source reads the E-EDID data after receiving an asserted HPD signal. The microcontroller loads different CEC physical addresses while changing the source by means of the S1 and S2 pins. Copyright © 2009–2011, Texas Instruments Incorporated 31 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com E-EDID Reading Configurations in Standby Mode When the DTV system is in standby mode, the sources do not read the E-EDID memory because the 1-kΩ pulldown resistor keeping the HPD_SINK input at logic low forces all HPD pins to output logic-low to all sources. The source does not read the E-EDID data with a low on HPD signal. However, if reading the E-EDID data in the system standby mode is preferred, then TMDS261B can still support this need. The recommended configuration sequences are: 1. Apply the same 3.3-V power to the VCC of TMDS261B and the TMDS line termination at the HDMI receiver. 2. Because the TMDS261B has clock-detect circuitry and there is no valid input TMDS clock in the standby mode, TMDS261B draws significanty less current. 3. Set S1 and S2 to select the source port which is allowed to read the E-EDID memory. Note that if the source has a time-out limitation between the 5-V and the HPD signals, the foregoing configuration is not applicable. Uses individual EEPROMs assigned for each input port, see Figure 47 through Figure 49. The solution uses E-EDID data to be readable during system power-off or standby-mode operations. SINK HPD 5V HPD 5V 5V 47kW SOURCE 1 SDA SCL CEC SDA SCL CEC CLK D0 D1 D2 CLK D0 D1 D2 HPD 5V HPD 5V SDA SCL CEC SDA SCL CEC CLK D0 D1 D2 CLK D0 D1 D2 HPD1 VDD (5V) VCC (3.3V) EQ mController S1 S2 SDA1 SCL1 CEC A21/B11 A22/B12 A23/B13 A24/B14 HPD_SINK 1kW 3.3V 4.7kW 5V 47kW SOURCE 2 HPD2 4.7kW DDC_SDA DDC_SCL SDA_SINK SCL_SINK E-EDID SDA2 SCL2 HDMI RX CEC Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 A21/B21 A22/B22 A23/B23 A24/B24 GND VSadj 4.02kW 10% Figure 46. Two-Port HDMI-Enabled DTV With TMDS261B – CEC Commands Passing Through 32 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B www.ti.com SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 A DTV Supporting an Active CEC Link In Figure 47, the CEC PHY and CEC LOGIC functions are added. The DTV can initiate and/or react to CEC signals from its remote control or other audio/video products on the same CEC bus. All sources must have their own CEC physical address to support the full functionality of the CEC link. A source reads its CEC physical address stored in its E-EDID memory after receiving a logic-high from the HPD feedback. When HPD is high, the sink-assigned CEC physical address should be maintained. Otherwise, when HPD is low, the source sets the CEC physical address value to (F.F.F.F). Case 1 – AC-Coupled Source (See Figure 47, Port 1) When the source TMDS lines are ac-coupled or when the source cannot detect the TMDS termination provided in the connected sink, the indication of the source selection can only come from the HPD signal. The TMDS261B HPD1 pin should be applied directly as the HPD signal back to the source. Case 2 – DC-Coupled Source (See Figure 48, Port 2) When the source TMDS lines are dc-coupled, there are two methods to inform the source that it is the active source to the sink. One is checking the HPD signal from the sink, and the other is checking the termination condition in the sink. In full-CEC operation mode, the HPD signal is set high whether the port is selected or not. The source loads and maintains the CEC physical address when HPD is high. As soon as HPD goes low, the source loses the CEC physical address. To keep the CEC physical address to the source, the HPD signal loops back from the source-provided 5-V signal through a 1-kΩ pullup resistor in the sink. This method is acceptable in applications where the HDMI transmitter can detect the receiver termination by current sensing and the receiver has a switchable termination on the TMDS inputs. The internal termination resistors are connected to the termination voltage when the port is selected, or they are disconnected when the port is not selected. The TMDS261B features switchable termination on the TMDS inputs. Case 3 – External Logic Control for HPD (See Figure 49, Port 3) When the HDMI transmitter does not have the capability of detecting the receiver termination, using the HPD signal as a reference for sensing port selections is the only possible method. External control logic for switching the connections of the HPD signals between the HPD pins of the TMDS261B and the 5-V signal from the source provides a good solution. E-EDID Reading Configurations in Standby Mode When the TMDS261B is in standby-mode operation, S1 = H and S2 = L, all sources can read their E-EDID memories simultaneously with all HPD pins following HPD_SINK in logic-high. HPD_SINK input low prevents E-EDID reading in standby-mode operation. (See Figure 47 through Figure 49) Copyright © 2009–2011, Texas Instruments Incorporated 33 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com SINK HPD 5V SOURCE with AC coupled HDMI output HPD 5V SDA SCL CEC SDA SCL CEC CLK D0 D1 D2 CLK D0 D1 D2 HPDx VDD (5V) VCC (3.3V) SDA SCL EQ 5V 47kW SDAx SCLx mController S1 S2 CEC LOGIC CEC E-EDID Ax1/Bx1 Ax2/Bx2 Ax3/Bx3 Ax4/Bx4 HPD_SINK 1kW CEC PHY 3.3V 4.7kW 4.7kW DDC_SDA DDC_SCL SDA_SINK SCL_SINK HDMI RX Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 VSadj GND 4.02kW 10% Figure 47. Two-Port HDMI-Enabled DTV With TMDS261B – AC-Coupled Source – CEC Commands Active SINK HPD 5V HPD 5V 1kW 5V 47kW SOURCE with DC coupled HDMI output SDA SCL CEC SDA SCL CEC CLK D0 D1 D2 CLK D0 D1 D2 HPDx VDD (5V) VCC (3.3V) SDA SCL EQ SDAx SCLx mController S1 S2 CEC LOGIC CEC E-EDID Ax1/Bx1 Ax2/Bx2 Ax3/Bx3 Ax4/Bx4 HPD_SINK 1kW CEC PHY 3.3V 4.7kW SDA_SINK SCL_SINK 4.7kW DDC_SDA DDC_SCL HDMI RX Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 GND Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 VSadj 4.02kW 10% Figure 48. Two-Port HDMI-Enabled DTV With TMDS261B – DC-Coupled Source – CEC Commands Active 34 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com SINK SOURCE in general HDMI output HPD 5V HPD 5V SDA SCL CEC SDA SCL CEC CLK D0 D1 D2 CLK D0 D1 D2 1kW 5V 47kW HPDx VDD (5V) VCC (3.3V) SDA SCL EQ SDAx SCLx mController S1 S2 CEC LOGIC CEC E-EDID Ax1/Bx1 Ax2/Bx2 Ax3/Bx3 Ax4/Bx4 HPD_SINK 1kW CEC PHY 3.3V 4.7kW 4.7kW DDC_SDA DDC_SCL SDA_SINK SCL_SINK HDMI RX Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 Y1/Z1 Y2/Z2 Y3/Z3 Y4/Z4 VSadj GND 4.02kW 10% Figure 49. Two-Port HDMI-Enabled DTV With TMDS261B – External Logic – CEC Commands Active I2C INTERFACE NOTES The I2C interface is used to access the internal registers of the TMDS261B. I2C is a two-wire serial interface developed by Philips Semiconductor (see I2C-Bus Specification, Version 2.1, January 2000). The bus consists of a data line (SDA) and a clock line (SCL) with pullup structures. When the bus is idle, both SDA and SCL lines are pulled high. All the I2C-compatible devices connect to the I2C bus through open-drain I/O pins, SDA and SCL. A master device, usually a microcontroller or a digital signal processor, controls the bus. The master is responsible for generating the SCL signal and device addresses. The master also generates specific conditions that indicate the START and STOP of data transfer. A slave device receives and/or transmits data on the bus under control of the master device. The TMDS261B works as a slave and supports standard-mode transfer (100 kbps). The basic I2C start and stop access cycles are shown in Figure 50. The basic access cycle consists of the following: • A start condition • A slave address cycle • Any number of data cycles • A stop condition SDA SDA SCL SCL S P Start Condition Stop Condition T0393-01 2 Figure 50. I C Start and Stop Conditions Copyright © 2009–2011, Texas Instruments Incorporated 35 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com GENERAL I2C PROTOCOL • • • • The master initiates data transfer by generating a start condition. The start condition is when a high-to-low transition occurs on the SDA line while SCL is high, as shown in Figure 50. All I2C-compatible devices should recognize a start condition. The master then generates the SCL pulses and transmits the 7-bit address and the read/write direction bit R/W on the SDA line. During all transmissions, the master ensures that data is valid. A valid data condition requires the SDA line to be stable during the entire high period of the clock pulse (see Figure 51). All devices recognize the address sent by the master and compare it to their internal fixed addresses. Only the slave device with a matching address generates an acknowledge (see Figure 52) by driving the SDA line low during the entire high period of the ninth SCL cycle. On detecting this acknowledge, the master knows that a communication link with a slave has been established. The master generates further SCL cycles to either transmit data to the slave (R/W bit 0) or receive data from the slave (R/W bit 1). In either case, the receiver must acknowledge the data sent by the transmitter. So an acknowledge signal can be generated either by the master or by the slave, depending on which one is the receiver. The 9-bit valid data sequences consisting of 8-bit data and 1-bit acknowledge can continue as long as necessary (See Figure 54 through Figure 57). To signal the end of the data transfer, the master generates a stop condition by pulling the SDA line from low to high while the SCL line is high (see Figure 50). This releases the bus and stops the communication link with the addressed slave. All I2C compatible devices must recognize the stop condition. Upon the receipt of a stop condition, all devices know that the bus is released, and they wait for a start condition followed by a matching address. SDA SCL Data Line Stable; Data Valid Change of Data Allowed T0394-01 2 Figure 51. I C Bit Transfer Data Output by Transmitter Not Acknowledge Data Output by Receiver Acknowledge SCL From Master 1 2 8 9 S Clock Pulse for Acknowledgement START Condition T0395-01 2 Figure 52. I C Acknowledge 36 Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 SCL SDA MSB Stop Acknowledge Acknowledge Slave Address Data T0396-01 2 Figure 53. I C Address, Data Cycle(s), and Stop During a write cycle, the transmitting device must not drive the SDA signal line during the acknowledge cycle so that the receiving device may drive the SDA signal low. After each byte transfer following the address byte, the receiving device pulls the SDA line low for one SCL clock cycle. A stop condition is initiated by the transmitting device after the last byte is transferred. An example of a write cycle can be found in Figure 54 and Figure 55. Note that the TMDS261B allows multiple write transfers to occur. See the Example – Writing to the TMDS261 section for more information. During a read cycle, the slave receiver acknowledges the initial address byte if it decodes the address as its address. Following this initial acknowledge by the slave, the master device becomes a receiver and acknowledges data bytes sent by the slave. When the master has received all of the requested data bytes from the slave, the not-acknowledge (A) condition is initiated by the master by keeping the SDA signal high just before it asserts the stop (P) condition. This sequence terminates a read cycle as shown in Figure 56 and Figure 57. See the Example – Reading from the TMDS261 section for more information. From Receiver S Slave Address W Data A Data A A A = No Acknowledge (SDA High) A = Acknowledge S = Start Condition P = Stop Condition W = Write P From Transmitter R0007-01 2 Figure 54. I C Write Cycle Acknowledge (From Receiver) Start Condition A6 SDA A5 A1 A0 R/W ACK D7 2 I C Device Address and Read/Write Bit Acknowledge (Receiver) D6 D1 D0 ACK First Data Byte Acknowledge (Receiver) D7 D6 D1 D0 ACK Other Last Data Byte Data Bytes Stop Condition T0397-01 Figure 55. Multiple-Byte Write Transfer S Slave Address R A Data A Data A Transmitter Receiver P A = No Acknowledge (SDA High) A = Acknowledge S = Start Condition P = Stop Condition W = Write R = Read R0008-01 2 Figure 56. I C Read Cycle Copyright © 2009–2011, Texas Instruments Incorporated 37 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com A0 R/W ACK A6 SDA Not Acknowledge (Transmitter) Acknowledge Acknowledge (From Receiver) (From Transmitter) Start Condition 2 I C Device Address and Read/Write Bit D7 D0 ACK D7 D6 D1 D0 ACK Stop Condition First Data Other Last Data Byte Byte Data Bytes T0398-01 Figure 57. Multiple-Byte Read Transfer Slave Address Both SDA and SCL must be connected to a positive supply voltage via a pullup resistor. These resistors should comply with the I2C specification that ranges from 2 kΩ to 19 kΩ. When the bus is free, both lines are high. The address byte is the first byte received following the START condition from the master device. The 7-bit address is factory preset to 0101 100. Table 7 lists the calls that the TMDS261B responds to. Table 7. TMDS261B Slave Address FIXED ADDRESS READ/WRITE BIT Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (R/W) 0 1 0 1 1 0 0 1/0 EXAMPLE – WRITING TO THE TMDS261B The proper way to write to the TMDS261B is illustrated as follows: An I2C master initiates a write operation to the TMDS261B by generating a start condition (S) followed by the TMDS261B I2C address (as shown following, in MSB-first bit order, followed by a 0 to indicate a write cycle. After receiving an acknowledge from the TMDS261B, the master presents the subaddress (sink port) to be written, consisting of one byte of data, MSB-first. The TMDS261B acknowledges the byte after completion of the transfer. Finally, the master presents the data to be written to the register (sink port), and the TMDS261B acknowledges the byte. The master can continue presenting data to be written after TMDS261B acknowledges the previous byte (steps 6, 7). After the last byte to be written has been acknowledged by TMDS261B, the I2C master then terminates the write operation by generating a stop condition (P). Step 1 0 I2C start (master) S Step 2 7 6 5 4 3 2 1 0 I2C general address (master) 0 1 0 1 1 0 0 0 Step 3 8 I2C acknowledge (slave) A Step 4 7 6 5 4 3 2 1 0 I2C write sink logic address (master) 0 0 0 0 Addr Addr Addr Addr Step 5 8 2 I C acknowledge (slave) Step 6 I2C write data (master) 38 A 7 6 5 4 3 2 1 0 Data Data Data Data Data Data Data Data Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com Data is the register address or register data to be written Step 7 8 I2C acknowledge (slave) A Step 8 0 2 I C stop (master) P An example of the proper bit control for selecting port 2 is: Step 4: 0000 0001 Step 6: 1001 0000 EXAMPLE – READING FROM THE TMDS261B The read operation consists of two phases. The first phase is the address phase. In this phase, an I2C master initiates a write operation to the TMDS261B by generating a start condition (S) followed by the TMDS261B I2C address, in MSB-first bit order, followed by a 0 to indicate a write cycle. After receiving acknowledges from the TMDS261B, the master presents the subaddress of the register to be read. After the cycle is acknowledged (A), the master may optionally terminate the cycle by generating a stop condition (P). The second phase is the data phase. In this phase, an I2C master initiates a read operation to the TMDS261B by generating a start condition followed by the TMDS261B I2C address (as shown following for a read operation), in MSB first bit order, followed by a 1 to indicate a read cycle. After an acknowledge from the TMDS261B, the I2C master receives one byte of data from the TMDS261B. The master can continue receiving data byes by issuing an acknowledge after each byte read (steps 10, 11). After the last data byte has been transferred from the TMDS261B to the master, the master generates a not-acknowledge followed by a stop. TMDS261B Read Phase 1 Step 1 0 2 I C start (master) S Step 2 7 6 5 4 3 2 1 0 I2C general address (master) 0 1 0 1 1 0 0 0 Step 3 8 I2C acknowledge (slave) A Step 4 7 6 5 4 3 2 1 0 I2C write sink logic address (master) 0 0 0 0 Addr Addr Addr Addr Where Addr is determined by the values shown in Table 7. Step 5 2 I C acknowledge (slave) 8 A Step 6 0 I2C stop (master) P Step 6 is optional. TMDS261B Read Phase 2 Step 7 2 I C start (master) 0 S Copyright © 2009–2011, Texas Instruments Incorporated 39 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com Step 8 7 6 5 4 3 2 1 0 I2C general address (master) 0 1 0 1 1 0 0 1 Step 9 8 I2C acknowledge (slave) A Step 10 I2C read data (slave) 7 6 5 4 3 2 1 0 Data Data Data Data Data Data Data Data Where Data is determined by the logic values contained in the internal registers. Step 11A 8 2 I C acknowledge (master) A If Step 11A is executed, go to step 10. If Step 11B is executed, go to Step 12. Step 11B 8 2 I C not acknowledge (master) A Step 12 0 I2C stop (master) P Table 8. I2C Register 0x01 Lookup Table BIT VALUE STATE 7:6 Bit 7 Bit 6 1 1 1 0 Port 2 is selected as the active port; HPD on non-selected ports is low. HPD2 can go low, high or high-Z. 0 0 Disallowed (indeterminate state, all terminations are disconnected) Standby mode: HPD[1:2] follows HPD_SINK. 5:4 3:2 1:0 40 0 1 Bit 4 Bit 3 0 0 0 1 DEFAULT DESCRIPTION Port Select I2C Mode X Port 1 is selected as the active port; HPD on non-selected ports is low. HPD1 can go low, high or high-Z. OVS Control OVS2: DDC sink-side VOL and VIL offset range 2: VIL2 (max): 0.4 V, VOL2 (max): 0.6 V X OVS3: DDC sink-side VOL and VIL offset range 3: VIL3 (max): 0.3 V, VOL3 (max): 0.5 V 1 1 Bit 3 Bit 2 OVS1: DDC sink-side VOL and VIL offset range 1: VIL1 (max): 0.4 V, VOL1 (max): 0.7 V 1 1 Fastest TMDS output rise and fall time setting + 120 ps approximately (slowest rise and fall time setting) 1 0 Fastest TMDS output rise and fall time setting + 100 ps approximately 0 1 0 0 Bit 1 Bit 0 1 0 Device enters low-power mode. 1 1 Device enters low-power mode. 0 1 0 0 Output Edge Rate Control Fastest TMDS output rise and fall time setting + 50 ps approximately X Fastest TMDS output rise and fall time setting Power Mode Reserved X Device is in normal-power mode. Copyright © 2009–2011, Texas Instruments Incorporated TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com Register 0x01 is read/write. Table 9. I2C Register 0x02 Lookup Table BIT VALUE STATE 7:6 Bit 7 Bit 6 1 1 1 0 Indicates port 2 is selected as the active port, all other ports are low. 0 0 Disallowed (indeterminate state, all terminations are disconnected) 0 1 Indicates standby mode: HPD[1:2] follows HPD_SINK. Bit 4 Bit 3 0 0 0 1 1 1 Bit 3 Bit 2 1 1 Indicates fastest TMDS output rise and fall time setting + 120 ps approximately (slowest rise and fall time setting) 1 0 Indicates fastest TMDS output rise and fall time setting + 100 ps approximately 0 1 0 0 Bit 1 Bit 0 1 0 Indicates device enters low-power mode 1 1 Indicates device enters low-power mode 0 1 Reserved 0 0 5:4 3:2 1:0 DEFAULT DESCRIPTION Port Select Status Indicator X Indicates port 1 is selected as the active port, all other ports are low. OVS Control Status Indicator Indicates DDC sink side VOL and VIL offset range 2: VIL2 (max): 0.4 V, VOL2 (max): 0.6 V X Indicates DDC sink side VOL and VIL offset range 3: VIL3 (max): 0.3 V, VOL3 (max): 0.5 V Indicates DDC sink side VOL and VIL offset range 1: VIL1 (max): 0.4 V, VOL1 (max): 0.7 V Output Edge Rate Status Control Indicates fastest TMDS output rise and fall time setting + 50 ps approximately X Indicates fastest TMDS output rise and fall time setting Power-Mode Status Indicator X Indicates device is in normal-power mode Register 0x02 is read-only. Table 10. I2C Register 0x03 Lookup Table BIT VALUE STATE 7 1 Clock detect disabled DEFAULT DESCRIPTION 0 Clock detect enabled 6:5 X RSVD 4 0 RSVD X Note: Do not write a 1 to this bit. 3:0 0 RSVD X Reserved Clock-detect circuit disabled. For HDMI compliance testing (TMDS termination-voltage test), clock-detect feature should be disabled. In this mode, the terminations on the TMDS input data lines are always connected when the port is selected. X Clock-detect circuit enabled. It is recommended that the TMDS261B is used in this default mode during normal operation where clock detect circuit is enabled. The terminations on the TMDS input data lines are connected only when a valid TMDS clock is detected on the selected port. Reserved Register 0x03 is read/write. For disabling clock detect, the value of 80h or 1000 0000b can be written to register 0x03. Table 11. I2C Register 0x04 Lookup Table BIT VALUE STATE 7 1 Clock detected DEFAULT DESCRIPTION 0 No clock detect 6:5 X RSVD 4 0 RSVD X This bit should always read 0 3:0 0 RSVD X Reserved A valid clock signal is detected on the selected port. If clock detect is disabled in register 0x03, then bit 7 of register 0x04 is always 1. X The selected port does not have a valid clock signal. Reserved Copyright © 2009–2011, Texas Instruments Incorporated 41 TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com Register 0x04 is read-only. Table 12. I2C Register 0x05 Lookup Table BIT VALUE STATE DEFAULT 7:0 — RSVD X DESCRIPTION Reserved. Read-only, value is indeterministic. Register 0x05 is TI internal use only. Table 13. I2C Register 0x06 Lookup Table BIT VALUE STATE DEFAULT 7:0 — RSVD X DESCRIPTION Reserved. Read-only, value is indeterministic. Register 0x06 is TI internal use only. Table 14. I2C Register 0x07 Lookup Table BIT VALUE STATE DEFAULT 7:0 — RSVD X DESCRIPTION Reserved. Read-only, value is indeterministic. Register 0x07 is TI internal use only. SPACER REVISION HISTORY Changes from Original (September 2009) to Revision A • 42 Page Added Junction Temperature to the THERMAL CHARACTERISTICS table ....................................................................... 9 Copyright © 2009–2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 8-Jul-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) TMDS261BPAG ACTIVE TQFP PAG 64 160 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR TMDS261BPAGR ACTIVE TQFP PAG 64 1500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TMDS261BPAGR Package Package Pins Type Drawing TQFP PAG 64 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1500 330.0 24.4 Pack Materials-Page 1 13.0 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 13.0 1.5 16.0 24.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMDS261BPAGR TQFP PAG 64 1500 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MTQF006A – JANUARY 1995 – REVISED DECEMBER 1996 PAG (S-PQFP-G64) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 48 0,08 M 33 49 32 64 17 0,13 NOM 1 16 7,50 TYP Gage Plane 10,20 SQ 9,80 12,20 SQ 11,80 0,25 0,05 MIN 1,05 0,95 0°– 7° 0,75 0,45 Seating Plane 0,08 1,20 MAX 4040282 / C 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. 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