MC74LCX06 Low-Voltage CMOS Hex Inverter with Open Drain Outputs With 5 V − Tolerant Inputs http://onsemi.com The MC74LCX06 is a high performance hex inverter operating from a 2.3 V to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers. These LCX devices have open drain outputs which provide the ability to set output levels, or do active−HIGH AND or active−LOW OR functions. A VI specification of 5.5 V allows MC74LCX06 inputs to be safely driven from 5.0 V devices. MARKING DIAGRAMS 14 14 1 Features • • • • • • LCX06G AWLYWW 1 Designed for 2.3 V to 3.6 V VCC Operation 5.0 V Tolerant Inputs/Outputs 14 LVTTL Compatible LVCMOS Compatible 24 mA Output Sink Capability 14 Near Zero Static Supply Current (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA • • Wired−OR, Wired−AND • Output Level Can Be Set Externally Without Affecting Speed of Device • Functionally Compatible with LCX05 • ESD Performance: Human Body Model >1500 V; • SOIC−14 D SUFFIX CASE 751A Machine Model >200 V These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant VCC A3 O3 A4 O4 A5 O5 14 13 12 11 10 9 8 1 2 3 4 5 6 7 A0 O0 A1 O1 A2 O2 GND 1 LCX 06 ALYWG G TSSOP−14 DT SUFFIX CASE 948G 1 A = Assembly Location WL, L = Wafer Lot Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Figure 1. Pinout: 14−Lead (Top View) © Semiconductor Components Industries, LLC, 2012 July, 2012 − Rev. 9 1 Publication Order Number: MC74LCX06/D MC74LCX06 A0 A1 A2 A3 A4 A5 1 * 2 3 * 4 5 * 6 13 * 12 * 10 * 8 11 9 Table 1. PIN NAMES O0 O1 Pins Function An On Data Inputs Outputs O2 Table 2. TRUTH TABLE O3 O4 O5 An On L H Z L * OD Figure 2. Logic Diagram MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VI Value Condition Unit −0.5 to +7.0 V DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in HIGH or LOW State (Note 1) V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output/Sink Current +50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C MSL Moisture Sensitivity Level 1 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. ORDERING INFORMATION Package Shipping† MC74LCX06DG SOIC−14 (Pb−Free) 55 Units / Rail MC74LCX06DR2G SOIC−14 (Pb−Free) 2500 / Tape & Reel MC74LCX06DTG TSSOP−14 (Pb−Free) 96 Units / Rail MC74LCX06DTR2G TSSOP−14 (Pb−Free) 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 MC74LCX06 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage Operating Data Retention Only VI Input Voltage VO Output Voltage IOL LOW Level Output Current Sink TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V Min Typ Max Unit 2.0 1.5 2.5, 3.3 2.5, 3.3 3.6 3.6 V 0 5.5 V 0 VCC V +24 +12 +8 mA −40 +85 °C 0 10 ns/V (HIGH or LOW State) VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V DC ELECTRICAL CHARACTERISTICS (TA = −40°C to +85°C) Symbol VIH Characteristic HIGH Level Input Voltage (Note 2) VIL LOW Level Input Voltage (Note 2) VOL LOW Level Output Voltage IOZ 3−State Output Current IOFF Power Off Leakage Current IIN Input Leakage Current ICC Quiescent Supply Current DICC Increase in ICC per Input Condition Min 2.3 V ≤ VCC ≤ 2.7 V 1.7 2.7 V ≤ VCC ≤ 3.6 V 2.0 Max Unit V 2.3 V ≤ VCC ≤ 2.7 V 0.7 2.7 V ≤ VCC ≤ 3.6 V 0.8 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA 0.2 VCC = 2.3 V; IOL= 8 mA 0.3 VCC = 2.7 V; IOL= 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 V V VCC = 3.0 V; IOL = 24 mA 0.55 VCC = 3.6 V, VIN = VIH or VIL, VOUT = 0 to 3.6 V ±5 mA VCC = 0, VIN = 3.6 V or VOUT = 3.6 V 10 mA VCC = 0 to 3.6 V, VIN = 3.6 V or GND ±5 mA VCC = 3.6 V, VIN = 3.6 V or VOUT = 3.6 V 10 mA 2.3 V ≤ VCC ≤ 3.6 V One Input at VIH = VCC − 0.6 V 500 mA 2. These values of VI are used to test DC electrical characteristics only. AC ELECTRICAL CHARACTERISTICS (TA = −40°C to +85°C) VCC = 3.3 V ± 0.3 V CL = 50 pF Symbol tPLZ tPZL Parameter Propagation Delay Input to Output VCC= 2.7 V CL = 50 pF VCC = 2.5 V ± 0.2 V CL = 30 pF Min Max Min Max Min Max Unit 0.8 0.8 3.7 3.7 1.0 1.0 4.1 4.1 0.8 0.8 3.5 3.5 ns ns DYNAMIC SWITCHING CHARACTERISTICS (TA = +25°C) Symbol Characteristic Condition Min Typ Max Unit VOLP Dynamic LOW Peak Voltage (Note 3) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.9 0.7 V VOLV Dynamic LOW Valley Voltage (Note 3) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.8 −0.6 V 3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. http://onsemi.com 3 MC74LCX06 CAPACITIVE CHARACTERISTICS Symbol Parameter CIN Input Capacitance COUT Output Capacitance CPD Power Dissipation Capacitance Condition Typical Unit VCC = 3.3 V, VI = 0 V or VCC 7 pF VCC = 3.3 V, VI = 0 V or VCC 8 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF VCC Vmi An Vmi 0V tPZL On tPLZ Vmo VLZ VOL PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Table 3. AC WAVEFORMS VCC 3.3 V $ 0.3 V 2.7 V 2.5 V $ 0.2 V Vmi 1.5 V 1.5 V VCC / 2 Vmo 1.5 V 1.5 V VCC / 2 VLZ VOL + 0.3 V VOL + 0.3 V VOL + 0.15 V Symbol VCC 6 V or VCC × 2 R1 PULSE GENERATOR DUT RT CL RL Table 4. TEST CIRCUIT TEST SWITCH tPZL, tPLZ 6V Open Collector/Drain tPLH and tPHL 6V tPZH, tPHZ GND CL = 50 pF at VCC = 3.3 $ 0.3 V or equivalent (includes jig and probe capacitance) CL = 30 pF at VCC = 2.5 $ 0.2 V or equivalent (includes jig and probe capacitance) RL = R1 = 500 W or equivalent RT = ZOUT of pulse generator (typically 50 W) http://onsemi.com 4 GND MC74LCX06 PACKAGE DIMENSIONS TSSOP−14 DT SUFFIX CASE 948G−01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. N F 7 1 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S S DETAIL E K A −V− ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 J J1 DIM A B C D F G H J J1 K K1 L M SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ MC74LCX06 PACKAGE DIMENSIONS SOIC−14 D SUFFIX CASE 751A−03 ISSUE J −A− 14 8 −B− P 7 PL 0.25 (0.010) B M M 7 1 G −T− 0.25 (0.010) M T B S A DIM A B C D F G J K M P R J M K D 14 PL F R X 45 _ C SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. S MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 SOLDERING FOOTPRINT* 7X 7.04 14X 1.52 1 14X 0.58 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC74LCX06/D