STPS340-Y Automotive power Schottky rectifier Datasheet production data Features ■ Very small conduction losses ■ Negligible switching losses ■ Low forward voltage drop ■ Low thermal resistance ■ Extremely fast switching ■ Surface mounted device ■ Avalanche capability specified ■ AEC-Q101 qualified A A K K SMB STPS340UY Table 1. Description This single chip Schottky rectifier is suited for switch mode power supplies and high frequency DC to DC converters. SMC STPS340SY Device summary IF(AV) 3A VRRM 40 V Tj (max) 150 °C VF (max) 0.57 V Packaged in SMB, and SMC, this device is intended for use in low and medium voltage operation, high frequency inverters, free wheeling and polarity protection applications where low switching losses are required for automotive applications. October 2012 This is information on a product in full production. Doc ID 17390 Rev 1 1/8 www.st.com 8 Characteristics 1 STPS340-Y Characteristics Table 2. Absolute ratings (limiting values) Symbol Unit Repetitive peak reverse voltage 40 V IF(RMS) Forward rms current 6 A SMB TL = 95 °C = 0.5 3 A SMC TL = 105 °C = 0.5 3 A Surge non repetitive forward current tp =10 ms sinusoidal 75 A Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1300 W Storage temperature range -65 to + 150 °C Operating junction temperature (1) range -40 to +150 °C Value Unit IF(AV) Average forward current IFSM PARM Tj 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-l) Table 4. Symbol IR(1) Parameter VF(1) SMB 25 SMC 20 Junction to lead °C/W Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM Typ. 2 Max. Unit 20 µA 10 mA 0.63 IF = 3 A 0.52 0.57 V 0.84 IF = 6 A 1. Pulse test: tp = 380 µs, < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.050 IF2(RMS) 2/8 Value VRRM Tstg 1. Parameter Doc ID 17390 Rev 1 0.63 0.72 STPS340-Y Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current (per diode) Average forward current versus ambient temperature ( = 0.5, per diode) IF(AV)(A) PF(AV)(W) 3.5 2.5 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-l) 3.0 2.0 δ=1 2.5 SMB / SMC 1.5 Rth(j-a)=65°C/W 2.0 1.5 1.0 1.0 T 0.5 T 0.5 IF(AV)(A) δ=tp/T 0.0 0.0 0.5 1.0 Figure 3. 1.5 2.0 2.5 3.0 δ=tp/T tp 0.0 3.5 4.0 Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) 0 25 Figure 4. IM(A) Tamb(°C) tp 50 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) (SMC) IM(A) 10 12 SMB SMC 11 9 10 8 9 7 8 Ta=25°C 6 Ta=25°C 7 5 6 Ta=75°C Ta=75°C 5 4 4 3 3 2 Ta=125°C IM t 1 t(s) δ=0.5 0 Ta=125°C IM 2 t 1 t(s) δ=0.5 0 1.E-03 Figure 5. 1.E-02 1.E-01 1.E+00 Normalized avalanche power derating versus pulse duration 1.E-03 Figure 6. PARM(tp) PARM(1µs) 1.E-02 1.E-01 1.E+00 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25°C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 Tj(°C) tp(µs) 0.1 1 0 10 100 1000 25 Doc ID 17390 Rev 1 50 75 100 125 150 3/8 Characteristics Figure 7. STPS340-Y Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Figure 8. Zth(j-a)/Rth(j-a) Relative variation of thermal impedance junction to ambient versus pulse duration (SMC) Zth(j-a)/Rth(j-a) 1.0 1.0 0.9 0.9 SMB 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 SMC 0.3 T 0.2 T 0.2 Single pulse Single pulse 0.1 0.1 tp(s) δ=tp/T 0.0 1.E-02 1.E-01 Figure 9. 1.E+00 1.E+01 tp 1.E+02 tp(s) δ=tp/T 0.0 1.E+03 Reverse leakage current versus reverse voltage applied (typical values) 1.E-02 1.E-01 1.E+00 1.E+01 tp 1.E+02 1.E+03 Figure 10. Junction capacitance versus reverse voltage applied (typical values) IR(mA) C(pF) 1.E+01 1000 Tj=150°C F=1MHz VOSC=30mVRMS Tj=25°C Tj=125°C 1.E+00 Tj=100°C 1.E-01 Tj=75°C 100 1.E-02 Tj=25°C 1.E-03 VR(V) VR(V) 1.E-04 0 5 10 15 10 20 25 30 35 Figure 11. Forward voltage drop versus forward current 10.00 1 40 10 100 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead IFM(A) Rth(j-a)(°C/W) 110 Printed circuit board FR4 copper thickness = 35 µm 100 90 Tj=125°C (Maximum values) SMB / SMC 80 1.00 70 60 Tj=125°C (Typical values) 50 0.10 40 Tj=25°C (Maximum values) 30 20 10 VFM(V) 0.01 0.0 4/8 SCU(cm²) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 Doc ID 17390 Rev 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 STPS340-Y 2 Package information Package information ● Epoxy meets UL94, V0 ● Band indicates cathode on SMB and SMC In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMB dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 13. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Doc ID 17390 Rev 1 5/8 Package information Table 6. STPS340-Y SMC package dimensions Dimensions Ref Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.40 0.030 0.063 D E A1 C A2 E2 L b Figure 14. Footprint dimensions (in millimeters) 1.54 5.03 1.54 3.15 8.11 6/8 Doc ID 17390 Rev 1 STPS340-Y 3 Ordering information Ordering information Table 7. 4 Ordering information Order code Marking Package Weight STPS340UY U34Y SMB 0.107 g STPS340SY S34Y SMC 0.243 g Base qty Delivery mode 2500 Tape and reel Revision history Table 8. 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