IRF IRAMS10UP60B_05

PD-95830 RevH
IRAMS10UP60B
Absolute Maximum Ratings
Parameter
Description
Values
Units
V
IGBT/Diode Blocking Voltage
600
V
IO @ TC=25°C
Positive Bus Input Voltage
450
RMS Phase Current (Note 1)
10
IO @ TC=100°C
VCES / VRRM
+
RMS Phase Current (Note 1)
5
IO
Pulsed RMS Phase Current (Note 2)
15
FPWM
PWM Carrier Frequency
20
kHz
PD
Power dissipation per IGBT @ TC =25°C
27
A
VISO
Isolation Voltage (1min)
2000
W
VRMS
TJ (IGBT & Diodes)
Operating Junction temperature Range
-40 to +150
°C
TJ (Driver IC)
Operating Junction temperature Range
-40 to +150
T
Mounting torque Range (M3 screw)
0.5 to 1.0
Nm
Note 1: Sinusoidal Modulation at V+=400V, TJ=150°C, FPWM=20kHz, Modulation Depth=0.8, PF=0.6, See Figure 3.
Note 2: tP<100ms; TC=25°C; FPWM=20kHz. Limited by IBUS-ITRIP, see Table "Inverter Section Electrical Characteristics"
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Rev.H 011508 1
IRAMS10UP60B
Internal Electrical Schematic - IRAMS10UP60B
V+ (10)
V- (12)
VB1 (7)
U, VS1 (8)
VB2 (4)
V, VS2 (5)
VB3 (1)
W, VS3 (2)
23 VS1
22 21 20 19 18 17
VB2 HO2 VS2 VB3 HO3 VS3
LO1 16
24 HO1
25 VB1
1 VCC
HIN1 (15)
HIN2 (16)
HIN3 (17)
2 HIN1
LIN1 (18)
5 LIN1
3 HIN2
Driver IC
LO2 15
LO3 14
4 HIN3
LIN2 LIN3 F ITRIP EN RCIN VSS COM
6
7 8
9 10 11
12 13
LIN2 (19)
LIN3 (20)
FLT-EN(21)
ITRIP (22)
VTH (13)
THERMISTOR
VCC (14)
VSS (23)
2
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IRAMS10UP60B
Absolute Maximum Ratings (Continued)
Symbol
Parameter
IBDF
Units Conditions
Min
Max
Bootstrap Diode Peak Forward
Current
---
4.5
A
tP= 10ms,
TJ = 150°C, TC=100°C
PBR Peak
Bootstrap Resistor Peak Power
(Single Pulse)
---
80
W
tP=100µs, TC =100°C
ESR / ERJ series
VS1,2,3
High side floating supply offset
voltage
VB1,2,3 - 25
VB1,2,3 +0.3
V
VB1,2,3
High side floating supply voltage
-0.3
600
V
VCC
Low Side and logic fixed supply
voltage
-0.3
20
V
VIN, VEN, VITRIP
Input voltage LIN, HIN, EN, ITrip
-0.3
Lower of
(VSS+15V) or
VCC+0.3V
V
Inverter Section Electrical Characteristics @TJ= 25°C
Units Conditions
Symbol
Parameter
Min
Typ
Max
V(BR)CES
Collector-to-Emitter Breakdown
Voltage
600
---
---
V
VIN=5V, IC=250µA
∆V(BR)CES / ∆T
Temperature Coefficient of
Breakdown Voltage
---
0.57
---
V/°C
VIN=5V, IC=1.0mA
(25°C - 150°C)
VCE(ON)
Collector-to-Emitter Saturation
Voltage
---
1.70
2.00
---
2.00
2.40
ICES
Zero Gate Voltage Collector
Current
---
5
80
---
10
---
VFM
Diode Forward Voltage Drop
---
1.80
2.35
---
1.30
1.70
--
--
1.25
V
µA
V
IC=5A, VCC=15V
IC=5A, VCC=15V, TJ=150°C
VIN=5V, V+=600V
VIN=5V, V+=600V, TJ=150°C
IC=5A
IC=5A, TJ=150°C
IF=1A
VBDFM
Bootstrap Diode Forward Voltage
Drop
---
---
1.10
RBR
Bootstrap Resistor Value
---
2
---
Ω
TJ=25°C
∆RBR/RBR
Bootstrap Resistor Tolerance
---
---
±5
%
TJ=25°C
IBUS_TRIP
Current Protection Threshold
(positive going)
13.1
---
16.4
A
TJ=-40°C to 125°C
See fig. 2
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V
IF=1A, TJ=150°C
3
IRAMS10UP60B
Inverter Section Switching Characteristics @ TJ= 25°C
Symbol
Parameter
Min
Typ
Max
EON
Turn-On Switching Loss
---
200
235
EOFF
Turn-Off Switching Loss
---
75
100
ETOT
Total Switching Loss
---
275
335
EREC
Diode Reverse Recovery energy
---
15
25
tRR
Diode Reverse Recovery time
---
70
100
EON
Turn-On Switching Loss
---
300
360
EOFF
Turn-off Switching Loss
---
135
165
ETOT
Total Switching Loss
---
435
525
EREC
Diode Reverse Recovery energy
---
30
40
tRR
Diode Reverse Recovery time
---
100
145
QG
Turn-On IGBT Gate Charge
RBSOA
Reverse Bias Safe Operating Area
---
29
44
Units Conditions
µJ
IC=5A, V+=400V
VCC=15V, L=2mH
Energy losses include "tail" and
diode reverse recovery
See CT1
ns
µJ
IC=5A, V+=400V
VCC=15V, L=2mH, TJ=150°C
Energy losses include "tail" and
diode reverse recovery
See CT1
ns
nC
+
IC=15A, V =400V, VGE=15V
TJ=150°C, IC=5A, VP=600V
V+= 450V
VCC=+15V to 0V
FULL SQUARE
See CT3
TJ=150°C, VP=600V,
SCSOA
Short Circuit Safe Operating Area
10
---
---
µs
V+= 360V,
VCC=+15V to 0V
See CT2
TJ=150°C, VP=600V, tSC<10µs
ICSC
Short Circuit Collector Current
---
47
---
A
V+= 360V, VGE=15V
VCC=+15V to 0V
See CT2
Recommended Operating Conditions Driver Function
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the
recommende conditions. All voltages are absolute referenced to COM/ITRIP. The VS offset is tested with all supplies biased
at 15V differential (Note 3)
Symbol
Definition
Min
Max
VB1,2,3
High side floating supply voltage
VS+12
VS+20
VS1,2,3
High side floating supply offset voltage
Note 4
450
Units
V
VCC
Low side and logic fixed supply voltage
12
20
VITRIP
ITRIP input voltage
VSS
VSS+5
VIN
Logic input voltage LIN, HIN
VSS
VSS+5
V
VEN
Logic input voltage EN
VSS
VSS+5
V
V
Note 3: For more details, see IR21363 data sheet
Note 4: Logic operational for Vs from COM-5V to COM+600V. Logic state held for Vs from COM-5V to COM-VBS.
(please refer to DT97-3 for more details)
4
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IRAMS10UP60B
Static Electrical Characteristics Driver Function
VBIAS (VCC, VBS1,2,3)=15V, unless otherwise specified. The VIN and IIN parameters are referenced to COM/ITRIP and are
applicable to all six channels. (Note 3)
Symbol
Definition
Min
Typ
Max
Units
3.0
---
---
V
VINH , VENH
Logic "0" input voltage
VINL , VENL
Logic "1" input voltage
---
---
0.8
V
VCCUV+, VBSUV+
VCC and VBS supply undervoltage Positive going threshold
10.6
11.1
11.6
V
VCCUV-, VBSUV-
VCC and VBS supply undervoltage Negative going threshold
10.4
10.9
11.4
V
VCCUVH, VBSUVH
VCC and VBS supply undervoltage lock-out hysteresis
---
0.2
---
V
VIN,Clamp
Input Clamp Voltage (HIN, LIN, ITRIP) IIN=10µA
4.9
5.2
5.5
V
IQBS
Quiescent VBS supply current VIN=0V
---
---
165
µA
IQCC
Quiescent VCC supply current VIN=0V
---
---
3.35
mA
ILK
Offset Supply Leakage Current
---
---
60
µA
IIN+, IEN+
Input bias current VIN=5V
---
200
300
µA
IIN-, IEN-
Input bias current VIN=0V
---
100
220
µA
ITRIP+
ITRIP bias current VITRIP=5V
---
30
100
µA
ITRIP-
ITRIP bias current VITRIP=0V
---
0
1
µA
V(ITRIP)
ITRIP threshold Voltage
440
490
540
mV
V(ITRIP, HYS)
ITRIP Input Hysteresis
---
70
---
mV
RON,FLT
Fault Output ON Resistance
---
50
100
ohm
Dynamic Electrical Characteristics
Driver only timing unless otherwise specified.)
Symbol
Parameter
Min
Typ
Max
TON
Input to Output propagation turnon delay time (see fig.11)
---
590
---
TOFF
Input to Output propagation turnoff delay time (see fig. 11)
---
700
---
ns
TFLIN
Input Filter time (HIN, LIN)
100
200
---
ns
VIN=0 & VIN=5V
TBLT-Trip
ITRIP Blancking Time
100
150
ns
VIN=0 & VIN=5V
DT
Dead Time (VBS=VDD=15V)
220
290
360
ns
VBS=VCC=15V
MT
Matching Propagation Delay Time
(On & Off)
---
40
75
ns
VCC= VBS= 15V, external dead
time> 400ns
TITrip
ITrip to six switch to turn-off
propagation delay (see fig. 2)
---
---
1.75
µs
VCC=VBS= 15V, IC=10A, V+=400V
TFLT-CLR
Post ITrip to six switch to turn-off
clear time (see fig. 2)
---
7.7
---
---
6.7
---
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Units Conditions
ns
VCC=VBS= 15V, IC=10A, V+=400V
ms
TC = 25°C
TC = 100°C
5
IRAMS10UP60B
Thermal and Mechanical Characteristics
Symbol
Parameter
Min
Typ
Max
Rth(J-C)
Thermal resistance, per IGBT
---
4.2
4.7
Rth(J-C)
Thermal resistance, per Diode
---
5.5
6.5
Rth(C-S)
Thermal resistance, C-S
---
0.1
---
CD
Creepage Distance
3.2
---
---
Units Conditions
Flat, greased surface. Heatsink
°C/W compound thermal conductivity
1W/mK
See outline Drawings
mm
Internal Current Sensing Resistor - Shunt Characteristics
Symbol
Parameter
Min
Typ
Max
RShunt
Resistance
33.0
33.3
33.7
Units Conditions
mΩ
TCoeff
Temperature Coefficient
0
---
200
ppm/°C
PShunt
Power Dissipation
---
---
2.2
W
TRange
Temperature Range
-40
---
125
°C
TC = 25°C
-40°C< TC <100°C
Internal NTC - Thermistor Characteristics
Parameter
Definition
Min
Typ
Max
R25
Resistance
97
100
103
kΩ
TC = 25°C
R125
Resistance
2.25
2.52
2.80
kΩ
TC = 125°C
B
B-constant (25-50°C)
4165
4250
4335
k
125
°C
Temperature Range
-40
Typ. Dissipation constant
Units Conditions
R2 = R1e [B(1/T2 - 1/T1)]
mW/°C TC = 25°C
1
Input-Output Logic Level Table
V+
Ho
Hin1,2,3
(15,16,17)
U,V,W
IC
Driver
(8,5,2)
Lin1,2,3
(18,19,20)
6
Lo
FLT- EN
ITRIP
1
1
1
1
0
0
0
0
1
X
HIN1,2,3 LIN1,2,3
0
1
1
X
X
1
0
1
X
X
U,V,W
V+
0
Off
Off
Off
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IRAMS10UP60B
HIN1,2,3
LIN1,2,3
1
IBUS
2
3
4
5
6
IBUS_trip
6µs
1µs
50%
U,V,W
tfltclr
Sequence of events:
1-2) Current begins to rise
2) Current reaches IBUS_Trip level
2-3) Current is higher than IBUS_Trip for at least 6µs. This value is the worst-case condition with very low
over-current. In case of high current (short circuit), the actual delay will be smaller.
3-4) Delay between driver identification of over-current condition and disabling of all outputs
4) Current starts decreasing, eventually reaching 0
5) Current goes below IBUS_trip, the driver starts its auto-reset sequence
6) Driver is automatically reset and normal operation can resume (over-current condition must be removed
by the time the drivers automatically resets itself)
Figure 2. ITrip Timing Waveform
Note 5: The shaded area indicates that both high-side and low-side switches are off and therefore the half-bridge output
voltage would be determined by the direction of current flow in the load.
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7
IRAMS10UP60B
Module Pin-Out Description
Pin
Name
1
VB3
2
W,VS3
Description
High Side Floating Supply Voltage 3
Output 3 - High Side Floating Supply Offset Voltage
3
NA
none
4
VB2
High Side Floating Supply voltage 2
5
V,VS2
6
NA
none
7
VB1
High Side Floating Supply voltage 1
8
U, VS1
9
NA
Output 2 - High Side Floating Supply Offset Voltage
Output 1 - High Side Floating Supply Offset Voltage
none
+
10
V
11
NA
Positive Bus Input Voltage
none
-
Negative Bus Input Voltage
12
V
13
VTH
Temperature Feedback
14
VCC
+15V Main Supply
15
HIN1
Logic Input High Side Gate Driver - Phase 1
16
HIN2
Logic Input High Side Gate Driver - Phase 2
17
HIN3
Logic Input High Side Gate Driver - Phase 3
18
LIN1
Logic Input Low Side Gate Driver - Phase 1
19
LIN2
Logic Input Low Side Gate Driver - Phase 2
20
LIN3
Logic Input Low Side Gate Driver - Phase 3
21
FLT/Enable
Fault Output and Enable Pin
22
ITRIP
Current Sense and Itrip Pin
23
VSS
Negative Main Supply
1
23
8
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IRAMS10UP60B
Typical Application Connection IRAMS10UP60B
1
BOOT-STRAP
CAPACITORS
V B3
2.2µF
V S3
W
VS2
V
VB1
VS1
U
V+
DC BUS
CAPACITORS
VV TH
+5V
PGND
V cc (15 V)
+15V
+5V
10mF
0.1mF
HIN1
HIN2
47kohm
HIN3
DGND
LIN1
Temp
Monitor
LIN2
Date Code Lot #
IRAMS10UP60B
3-Phase AC
MOTOR
VB2
LIN3
CONTROLLER
Fault/Enable
ITRIP
V SS
23
+5V
Fault
1K
DGND
1. Electrolytic bus capacitors should be mounted as close to the module bus terminals as possible to reduce ringing and
EMI problems. Additional high frequency ceramic capacitor mounted close to the module pins will further improve performance.
2. In order to provide good decoupling between VCC-VSS and VB1,2,3-VS1,2,3 terminals, the capacitors shown connected between these terminals should be located very close to the module pins. Additional high frequency capacitors, typically
0.1µF, are strongly recommended.
3. Value of the boot-strap capacitors depends upon the switching frequency. Their selection should be made based on
IR design tip DN 98-2a, application note AN-1044 or Figure 9. Bootstrap capacitor value must be selected to limit the
power dissipation of the internal resistor in series with the VCC. (see maximum ratings Table on page 3).
4. Current sense signal can be obtained from pin 22 and pin 23. Care should be taken to avoid having inverter current
flowing through pin 22 to mantain required current measurement accuracy.
5. After approx. 8ms the FAULT is reset. (see Dynamic Characteristics Table on page 5).
6. PWM generator must be disabled within Fault duration to garantee shutdown of the system, overcurrent condition
must be cleared before resuming operation.
7. Fault/Enable pin must be pulled-up to +5V.
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9
Maximum Output Phase RMS Current - A
IRAMS10UP60B
8.0
7.0
6.0
5.0
4.0
3.0
TC = 100°C
2.0
TC = 110°C
TC = 120°C
1.0
0.0
TJ = 150°C
Sinusoidal Modulation
0
2
4
6
8
10
12
14
16
18
20
PWM Frequency - kHz
Figure 3. Maximum Sinusoidal Phase Current vs. PWM Switching Frequency
Maximum Output Phase RMS Current - A
V+=400V , TJ=150°C, Modulation Depth=0.8, PF=0.6
7.0
TJ = 150°C
6.0
Sinusoidal Modulation
5.0
4.0
FPWM = 20kHz
3.0
FPWM = 16kHz
2.0
FPWM = 12kHz
1.0
0.0
1
10
100
Modulation Frequency - Hz
Figure 4. Maximum Sinusoidal Phase Current vs. Modulation Frequency
V+=400V, TJ=150°C, TC=100°C, Modulation Depth=0.8, PF=0.6
10
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IRAMS10UP60B
70
Total Power Losses - W
60
IOUT = 6 ARMS
IOUT = 5 ARMS
50
IOUT = 4 ARMS
40
30
20
10
0
TJ = 150°C
Sinusoidal Modulation
0
2
4
6
8
10
12
14
16
18
20
PWM Switching Frequency - kHz
Figure 5. Total Power Losses vs. PWM Switching Frequency, Sinusoidal modulation
V+=400V , TJ=150°C, Modulation Depth=0.8, PF=0.6
80
Total Power Losses - W
70
TJ = 150°C
60
Sinusoidal Modulation
50
40
30
FPWM = 12 kHz
20
FPWM = 16 kHz
FPWM = 20 kHz
10
0
0
1
2
3
4
5
6
7
8
Output Phase Current - ARMS
Figure 6. Total Power Losses vs. Output Phase Current, Sinusoidal modulation
VBUS=400V , TJ=150°C,
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Modulation Depth=0.8, PF=0.6
11
Maximum Allowable Case Temperature -°C
IRAMS10UP60B
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
FPWM = 12 kHz
FPWM = 16 kHz
FPWM = 20 kHz
TJ = 150°C
Sinusoidal Modulation
0
1
2
3
4
5
6
7
8
Output Phase Current - ARMS
Figure 7. Maximum Allowable Case temperature vs. Output RMS Current per Phase
IGBT Junction Temperature - °C
160
TJ avg. = 1.2363 x TTherm+ 26.2775
150
140
130
120
110
100
65
70
75
80
85
90
95
100
105
110
115
Internal Thermistor Temperature Equivalent Read Out - °C
Figure 8. Estimated Maximum IGBT Junction Temperature vs. Thermistor Temperature
12
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IRAMS10UP60B
Thermistor Pin Read-Out Voltage - V
5.0
4.5
TTHERM
°C
RTHERM
Ω
TTHERM
°C
RTHERM
Ω
TTHERM
°C
RTHERM
Ω
-40
4397119
25
100000
90
7481
-35
3088599
30
79222
95
6337
-30
2197225
35
63167
100
5384
-25
1581881
40
50677
105
4594
-20
1151037
45
40904
110
3934
-15
846579
50
33195
115
3380
-10
628988
55
27091
120
2916
-5
471632
60
22224
125
2522
0
357012
65
18322
130
2190
5
272500
70
15184
135
1907
10
209710
75
12635
140
1665
15
162651
80
10566
145
1459
20
127080
85
8873
150
1282
80
90
4.0
+5V
3.5
3.0
REXT
VTherm
2.5
RTherm
2.0
1.5
Min
Avg.
Max
1.0
0.5
0.0
-40
-30
-20
-10
0
10
20
30
40
50
60
70
100 110 120 130
Thermistor Temperature - °C
Recommended Bootstrap Capacitor - µF
Figure 9. Thermistor Readout vs. Temperature (47kohm pull-up resistor, 5V) and
Nominal Thermistor Resistance values vs. Temperature Table.
16.0
15.0
14.0
13.0
12.0
11.0
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
15µF
V+
RBS
DBS
CBS
vB
+15V
VCC
HIN
HIN
LIN
LIN
VSS COM
RG1
HO
U,V,W
VS
RG2
LO
VSS
6.8µF
GND
4.7µF
3.3µF
2.2µF
0
5
10
15
20
PWM Frequency - kHz
Figure 10. Recommended Bootstrap Capacitor Value vs. Switching Frequency
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13
IRAMS10UP60B
Figure 11. Switching Parameter Definitions
VCE
IC
IC
VCE
90% IC
50%
HIN /LIN
90% IC
50%
VCE
HIN /LIN
50%
HIN /LIN
HIN /LIN
50%
VCE
10% IC
10% IC
tr
tf
TON
TOFF
Figure 11a. Input to Output Propagation
turn-on Delay Time
Figure 11b. Input to Output Propagation
turn-off Delay Time
IF
VCE
HIN/LIN
Irr
trr
Figure 11c. Diode Reverse Recovery
14
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IRAMS10UP60B
V+
5V
Ho
IN
Hin1,2,3
IC
Driver
U,V,W
IO
Lo
Lin1,2,3
Figure CT1. Switching Loss Circuit
V+
Ho
Hin1,2,3
1k
VCC
IN
10k
Lin1,2,3
IC
Driver
5VZD
U,V,W
IO
Lo
IN
Io
Figure CT2. S.C.SOA Circuit
V+
Ho
Hin1,2,3
1k
IN
10k
VCC
IC
Driver
5VZD
Lin1,2,3
IN
U,V,W
IO
Lo
Io
Figure CT3. R.B.SOA Circuit
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15
IRAMS10UP60B
Package Outline
note 3
note 2
027-E2D24
IRAMS10UP60B
note 1
Standard pin leadforming option
Notes:
Dimensions in mm
1- Marking for pin 1 identification
2- Product Part Number
3- Lot and Date code marking
4- Tollerances ±0.5mm, unless otherwise stated
For mounting instruction, see AN1049
16
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IRAMS10UP60B
Package Outline
note 2
note 3
027-E2D24
IRAMS10UP60B-2
note 1
Pin leadforming option -2
Notes:
Dimensions in mm
1- Marking for pin 1 identification
2- Product Part Number
For mounting instruction see AN-1049
3- Lot and Date code marking
4- Tollerances ±0.5mm, unless otherwise stated
Data and Specifications are subject to change without notice
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01/08
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17