FAIRCHILD FDD8445_10

FDD8445_F085
N-Channel PowerTrench® MOSFET
40V, 50A, 8.7mΩ
Features
Applications
„ RDS(ON) = 6.7 mΩ (Typ), VGS = 10V, ID=50A
„ Automotive Engine Control
„ Qg(10) = 45nC (Typ), VGS=10V
„ Powertrain Management
„ Low Miller Charge
„ Solenoid and Motor Drivers
„ Low Qrr Body Diode
„ Electronic Transmission
„ UIS Capability (Single Pulse/ Repetitive Pulse)
„ Distributed Power Architecture and VRMs
„ Qualified to AEC Q101
„ Primary Switch for 12V Systems
A
REE I
DF
M ENTATIO
LE
N
MP
LE
„ RoHS Compliant
D
G
S
©2010 Fairchild Semiconductor Corporation
FDD8445_F085 Rev A (W)
1
www.fairchildsemi.com
FDD8445_F085 N-Channel PowerTrench® MOSFET
January 2010
Symbol
VDSS
Drain to Source Voltage
Parameter
Ratings
40
Units
V
VGS
Gate to Source Voltage
±20
V
70
A
15.2
A
Drain Current Continuous (VGS=10v) (Note 1)
Continuous (VGS=10v,with RθJA = 52oC/W)
ID
Pulsed
EAS
PD
TJ, TSTG
Figure 4
Single Pulse Avalanche Energy (Note 2)
144
Power Dissipation
79
W
Derate above 25oC
0.53
W/oC
Operating and Storage Temperature
mJ
o
-55 to +175
C
Thermal Characteristics
RθJC
RθJA
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient TO-252,
lin2
copper pad area
1.9
oC/W
52
oC/W
Package Marking and Ordering Information
Device Marking
FDD8445
Device
FDD8445_F085
Package
TO-252AA
Reel Size
13”
Tape Width
12mm
Quantity
2500 units
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
40
-
-
V
-
-
1
μA
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = 250μA, VGS = 0V
IDSS
Zero Gate Voltage Drain Current
VDS = 32V
VGS = 0V
-
-
250
IGSS
Gate to Source Leakage Current
VGS = ±20V
-
-
±100
nA
VDS = VGS, ID = 250μA
2
2.8
4
V
ID = 50A, VGS = 10V
-
6.7
8.7
ID = 50A, VGS = 10V,
TJ = 175°C
-
12.5
16.3
-
3040
4050
pF
-
295
390
pF
-
178
270
pF
TJ=150°C
On Characteristics
VGS(th)
RDS(ON)
Gate to Source Threshold Voltage
Drain to Source On Resistance
mΩ
Dynamic Characteristics
CISS
Input Capacitance
COSS
Output Capacitance
CRSS
Reverse Transfer Capacitance
RG
Gate Resistance
f = 1MHz
-
1.7
-
Ω
Qg(TOT)
Total Gate Charge at 10V
VGS = 0 to 10V
-
45
59
nC
Qg(5)
Total Gate Charge at 5V
VGS = 0 to 5V
-
17
22
nC
Qg(TH)
Threshold Gate Charge
VGS = 0 to 2V
-
5.8
7.6
nC
Qgs
Gate to Source Gate Charge
-
12.5
-
nC
Qgs2
Gate Charge Threshold to Plateau
-
9.5
-
nC
Qgd
Gate to Drain “Miller” Charge
-
10.5
-
nC
FDD8445_F085 Rev A (W)
VDS = 25V, VGS = 0V,
f = 1MHz
2
VDD = 20V,
ID = 50A
www.fairchildsemi.com
FDD8445_F085 N-Channel PowerTrench® MOSFET
Absolute Maximum Ratings Tc = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Switching Characteristics
t(on)
Turn-On Time
-
-
138
ns
td(on)
Turn-On Delay Time
-
10
-
ns
tr
Turn-On Rise Time
-
82
-
ns
td(off)
Turn-Off Delay Time
-
26
-
ns
tf
Turn-Off Fall Time
-
9.6
-
ns
toff
Turn-Off Time
-
-
53
ns
V
VDD = 20V, ID = 50A
VGS = 10V, RGS = 2Ω
Drain-Source Diode Characteristics
ISD=50A
-
-
1.25
ISD=25A
-
-
1.0
V
Reverse Recovery Time
IF= 50A, dIF/dt=100A/μs
-
-
39
ns
Reverse Recovery Charge
IF= 50A, dIF/dt=100A/μs
-
-
38
nC
VSD
Source to Drain Diode Voltage
trr
Qrr
Notes:
1: Maximum package current capability is 50A.
2: Starting TJ = 25oC, L=0.18mH, IAS=40A.
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For
a copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems
certification.
FDD8445_F085 Rev A (W)
3
www.fairchildsemi.com
FDD8445_F085 N-Channel PowerTrench® MOSFET
Electrical Characteristics TJ = 25°C unless otherwise noted
80
VGS=10V
CURRENT LIMITED
BY PACKAGE
1.0
ID, DRAIN CURRENT (A)
POWER DISSIPATION MULTIPLIER
1.2
0.8
0.6
0.4
60
40
20
0.2
0.0
0
25
50
75
100
125
150
0
25
175
o
TC , CASE TEMPERATURE( C)
Figure 1. Normalized Power Dissipation vs Case
Temperature
50
75
100
125
o
TC, CASE TEMPERATURE( C)
150
175
Figure 2. Maximum Continuous Drain Current vs
Case Temperature
2
DUTY CYCLE - DESCENDING ORDER
NORMALIZED THERMAL
IMPEDANCE, ZθJC
1
D = 0.50
0.20
0.10
0.05
0.02
0.01
0.1
PDM
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC x RθJC + TC
0.01
-5
10
SINGLE PULSE
-4
-3
10
-2
-1
0
10
10
10
t, RECTANGULAR PULSE DURATION(s)
1
10
10
Figure 3. Normalized Maximum Transient Thermal Impedance
2000
VGS = 10V
IDM, PEAK CURRENT (A)
1000
TC = 25oC
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
175 - TC
I = I25
150
100
SINGLE PULSE
10
-5
10
-4
10
-3
-2
-1
10
10
10
t, RECTANGULAR PULSE DURATION(s)
0
10
1
10
Figure 4. Peak Current Capability
FDD8445_F085 Rev A (W)
4
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FDD8445_F085 N-Channel PowerTrench® MOSFET
Typical Characteristics
200
1000
IAS, AVALANCHE CURRENT (A)
ID, DRAIN CURRENT (A)
100
100us
10
CURRENT LIMITED
BY PACKAGE
1
0.1
1
1ms
OPERATION IN THIS SINGLE PULSE
AREA MAY BE
TJ = MAX RATED
LIMITED BY rDS(ON)
TC = 25oC
10ms
DC
10
If R = 0
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
If R ≠ 0
tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
100
10us
O
STARTING TJ = 25 C
10
O
STARTING TJ = 150 C
1
0.01
100
VDS, DRAIN-SOURCE VOLTAGE (V)
0.1
1
10
100
tAV, TIME IN AVALANCHE (ms)
1000
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Indutive Switching
Capability
Figure 5. Forward Bias Safe Operating Area
120
100
VDD = 6V
ID, DRAIN CURRENT (A)
120
PULSE DURATION=80μs
DUTY CYCLE=0.5% MAX
80
ID, DRAIN CURRENT (A)
140
O
TJ = 175 C
60
O
TJ = 25 C
40
O
TJ = - 55 C
20
0
2.0
4.5V
60
40
4.0V
20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VGS, GATE TO SOURCE VOLTAGE (V)
0
0.0
6.0
0.5
1.0
1.5
2.0
2.5
VDS, DRAIN TO SOURCE VOLTAGE (V)
3.0
Figure 8. Saturation Characteristics
20
2.0
PULSE DURATION=80μS
DUTY CYCLE=0.5%MAX
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
RDS(ON), DRAIN TO SOURCE
ON-RESISTANCE (mΩ )
PULSE DURATION =80μS
DUTY CYCLE =0.5% MAX
80
Figure 7. Transfer Characteristics
ID=12A
16
TJ
= 175oC
12
8
4
5.0V
VGS=10V
100
TJ = 25oC
3.5
4.5
6.0
7.5
9.0
VGS, GATE TO SOURCE VOLTAGE (V)
10
PULSE DURATION =80μS
DUTY CYCLE =0.5% MAX
1.6
1.4
1.2
1.0
ID = 50A
VGS = 10V
0.8
0.6
-80
-40
0
40
80
120
160
200
o
TJ, JUNCTION TEMPERATURE( C)
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
Figure 9. Drain to Source On-Resistance
Variation vs Gate to Source Voltage
FDD8445_F085 Rev A (W)
1.8
5
www.fairchildsemi.com
FDD8445_F085 N-Channel PowerTrench® MOSFET
Typical Characteristics
1.10
1.2
1.1
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
VGS=VDS
NORMALIZED GATE
THRESHOLD VOLTAGE
ID =250μA
1.0
0.9
0.8
0.7
0.6
0.5
-80
-40
0
40
80
120
160
o
TJ, JUNCTION TEMPERATURE ( C)
200
Figure 11. Normalized Gate Threshold Voltage vs
Junction Temperature
1.00
0.95
0.90
-80
-40
0
40
80
120
160
o
TJ, JUNCTION TEMPERATURE ( C)
200
10
1000
VGS, GATE TO SOURCE VOLTAGE(V)
f = 1MHz
VGS = 0V
CISS
CAPACITANCE (pF)
1.05
Figure 12. Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
10000
COSS
CRSS
100
0.1
ID =250μA
8
40
Figure 13. Capacitance vs Drain to Source
Voltage
FDD8445_F085 Rev A (W)
VDD=20V
VDD=25V
6
4
2
0
1
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
VDD=15V
ID=50A
0
20
40
Qg , GATE CHARGE (nC)
60
Figure 14. Gate Charge vs Gate to Source
Voltage
6
www.fairchildsemi.com
FDD8445_F085 N-Channel PowerTrench® MOSFET
Typical Characteristics
tm
tm
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
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PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
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Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I47
FDD8445_F085 Rev A (W)
7
www.fairchildsemi.com
FDD8445_F085 N-Channel PowerTrench® MOSFET
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
PowerTrench®
AccuPower™
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Saving our world, 1mW/W/kW at a time™
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Motion-SPM™
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