AOSMD AO4420

AO4420
30V N-Channel MOSFET
General Description
Product Summary
The AO4420 uses advanced trench technology to
provide excellent RDS(ON), shoot-through immunity
and body diode characteristics. This device is
suitable for use as a synchronous switch in PWM
applications.
VDS (V) = 30V
ID = 13.7A (VGS = 10V)
RDS(ON) < 10.5mΩ (VGS = 10V)
RDS(ON) < 12mΩ (VGS = 4.5V)
100% UIS Tested
100% Rg Tested
SOIC-8
Top View
D
D
D
Bottom View
D
D
G
G
S
S
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain
Current A
VGS
TA=25°C
TA=70°C
TA=25°C
Junction and Storage Temperature Range
Maximum Junction-to-Lead C
±12
V
ID
9.7
IDM
60
-55 to 150
Symbol
Alpha & Omega Semiconductor, Ltd.
W
2
TJ, TSTG
t ≤ 10s
Steady-State
Steady-State
A
3.1
PD
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Units
V
13.7
Pulsed Drain Current B
Power Dissipation
Maximum
30
RθJA
RθJL
Typ
28
54
21
°C
Max
40
75
30
Units
°C/W
°C/W
°C/W
AO4420
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Min
ID=250µA, VGS=0V
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±12V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=250µA
0.6
ID(ON)
On state drain current
VGS=4.5V, VDS=5V
40
Static Drain-Source On-Resistance
TJ=125°C
gFS
Forward Transconductance
VDS=5V, ID=13.7A
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
1
Units
V
5
VGS=4.5V, ID=12.7A
Output Capacitance
0.004
TJ=55°C
VGS=10V, ID=13.7A
Coss
Max
30
VDS=24V, VGS=0V
IDSS
RDS(ON)
Typ
30
100
nA
1.1
2
V
8.3
10.5
12.5
15
9.7
12
mΩ
1
V
5
A
A
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg(4.5V) Total Gate Charge
VGS=4.5V, VDS=15V, ID=13.7A
S
4050
pF
256
pF
168
pF
0.86
1.1
Ω
30.5
36
nC
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
8.6
tD(on)
Turn-On DelayTime
5.5
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
VGS=10V, VDS=15V, RL=1.1Ω,
RGEN=3Ω
mΩ
37
0.76
3656
VGS=0V, VDS=15V, f=1MHz
µA
4.6
nC
nC
9
ns
ns
3.4
7
49.8
75
ns
5.9
11
ns
IF=13.7A, dI/dt=100A/µs
22.5
28
Body Diode Reverse Recovery Charge IF=13.7A, dI/dt=100A/µs
12.5
16
ns
nC
Body Diode Reverse Recovery Time
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
value in any a given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in
curve provides a single pulse rating.
Rev 8 : Nov 2010
2
FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
AO4420
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
60
30
10V
VGS=5V
4.5V
50
25
VGS =2.5V
20
ID(A)
ID(A)
40
30
125°C
15
10
20
25°C
VGS =2.0V
5
10
0
0
0.0
0
1
2
3
4
0.5
5
1.0
1.5
2.0
2.5
3.0
VGS(Volts)
Figure 2: Transfer Characteristics
VDS(Volts)
Figure 1: On-Regions Characteristics
1.8
Normalize ON-Resistance
12
11
RDS(ON)(mΩ )
VGS =4.5V
10
9
8
VGS =10V
7
ID=13.7A
1.6
VGS=4.5V
1.4
VGS=10V
1.2
1.0
0.8
0
6
0
5
10
15
20
25
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
30
ID(A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
1E+01
30
1E+00
ID=13.7A
25
125°C
IS(A)
RDS(ON)(mΩ )
1E-01
125°C
20
15
1E-02
1E-03
10
25°C
25°C
1E-04
5
1E-05
0
0
2
4
6
8
VGS(Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
10
0.0
0.2
0.4
0.6
0.8
VSD(Volts)
Figure 6: Body-Diode Characteristics
1.0
AO4420
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
5
10000
VDS=15V
ID=13.7A
Ciss
Capacitance (pF)
VGS(Volts)
4
3
2
1000
Coss
1
Crss
100
0
0
10
20
30
0
40
10
15
20
25
30
VDS(Volts)
Figure 8: Capacitance Characteristics
Qg (nC)
Figure 7: Gate-Charge Characteristics
50
100
10µs
RDS(ON)
limited
40
100µs
ID(A)
0.1s
1s
1
1ms
Power (W)
10ms
10
10s
20
DC
0.1
0.1
30
10
TJ(Max) =150°C
TA =25°C
1
10
100
0
0.01
VDS(Volts)
Figure 9: Maximum Forward Biased Safe Operating
Area (Note E)
10
Zθ JA Normalized Transient
Thermal Resistance
5
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=40°C/W
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
T
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width (S)
Figure 11: Normalized Maximum Transient Thermal Impedence
Alpha & Omega Semiconductor, Ltd.
100
1000