AOSMD AO3414

AO3414
20V N-Channel MOSFET
General Description
Features
The AO3414 uses advanced trench technology to
provide excellent RDS(ON), low gate charge and
operation with gate voltages as low as 1.8V. This
device is suitable for use as a load switch or in PWM
applications.
VDS = 20V
ID = 3A
RDS(ON) < 62mΩ
RDS(ON) < 70mΩ
RDS(ON) < 85mΩ
SOT23
Top View
(VGS = 4.5V)
(VGS = 4.5V)
(VGS = 2.5V)
(VGS = 1.8V)
D
Bottom View
D
D
G
S
G
S
S
G
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TA=25°C
Continuous Drain
Current A
Pulsed Drain Current B
TA=25°C
Power Dissipation
Junction and Storage Temperature Range
Maximum Junction-to-Lead C
Rev 7: July 2010
±8
V
ID
2.5
IDM
16
W
0.9
TJ, TSTG
-55 to 150
Symbol
t ≤ 10s
Steady-State
Steady-State
A
1.4
PD
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Units
V
3
TA=70°C
A
Maximum
20
RθJA
RθJL
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Typ
70
100
63
°C
Max
90
125
80
Units
°C/W
°C/W
°C/W
Page 1 of 5
AO3414
Electrical Characteristics (TJ=25°C unless otherwise noted)
Parameter
Symbol
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=250µA, VGS=0V
Typ
V
1
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS=±8V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=250µA
0.4
ID(ON)
On state drain current
VGS=4.5V, VDS=5V
16
TJ=55°C
0.7
62
85
VGS=2.5V, ID=2.8A
58
70
mΩ
85
mΩ
VGS=1.8V, ID=2.5A
68
Forward Transconductance
VDS=5V, ID=3A
11
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.7
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Gate resistance
260
VGS=0V, VDS=10V, f=1MHz
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
mΩ
S
1
V
2
A
320
pF
48
pF
27
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Total Gate Charge
Qg
Qgs
V
51
gFS
Rg
1
68
TJ=125°C
Static Drain-Source On-Resistance
Output Capacitance
nA
A
RDS(ON)
Reverse Transfer Capacitance
µA
5
100
VGS=4.5V, ID=3A
Coss
Units
20
VDS=20V, VGS=0V
IDSS
Crss
Max
VGS=4.5V, VDS=10V, ID=3A
VGS=5V, VDS=10V, RL=3.3Ω,
RGEN=6Ω
pF
3
4.5
Ω
2.9
3.8
nC
0.4
nC
0.6
nC
2.5
ns
3.2
ns
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
21
ns
3
ns
Body Diode Reverse Recovery Time
IF=3A, dI/dt=100A/µs
14
Qrr
Body Diode Reverse Recovery Charge IF=3A, dI/dt=100A/µs
3.8
19
ns
nC
A: The value of R θJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. copper, in a still air environment with TA=25°C. The
value in any given application depends on the user's specific board design. The current rating is based on the t ≤10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA
12
curve provides a single pulse rating.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev 7: July 2010
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Page 2 of 5
AO3414
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
16
16
VDS=5V
4.5V
12
ID(A)
ID (A)
2V
2.5V
12
8
8
VGS=1.5V
4
4
125°C
25°C
0
0
0
1
2
3
4
5
0
VDS (Volts)
Figure 1: On-Region Characteristics
100
RDS(ON) (mΩ
Ω)
1
1.5
2
VGS(Volts)
Figure 2: Transfer Characteristics
2.5
1.6
Normalized On-Resistance
120
0.5
VGS=1.8V
80
VGS=2.5V
60
VGS=1.8V
ID=2.5A
1.4
VGS=2.5V
ID=2.8A
VGS=4.5V
ID=3A
1.2
1
VGS=4.5V
40
0.8
0
3
6
9
12
-50
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
-25
0
25
50
75
100 125 150 175
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
120
1E+01
ID=3A
1E+00
12
125°C
1E-01
IS (A)
RDS(ON) (mΩ
Ω)
100
80
125°C
1E-02
25°
1E-03
60
1E-04
25°
40
0
2
4
6
8
1E-05
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Rev 7: July 2010
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0.0
0.2
0.4
0.6
0.8
1.0
1.2
VSD (Volts)
Figure 6: Body-Diode Characteristics
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AO3414
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
5
400
VDS=10V
ID=3A
Capacitance (pF)
VGS (Volts)
4
3
2
1
Ciss
300
200
Coss
100
Crss
0
0
0
0.5
1
1.5
2
2.5
3
0
3.5
5
10
Qg (nC)
Figure 7: Gate-Charge Characteristics
20
1000
100.00
TJ(Max)=150°C
TA=25°C
TJ(Max)=150°C
TA=25°C
10µs
10.00
Power (W)
100µs
ID (Amps)
15
VDS (Volts)
Figure 8: Capacitance Characteristics
1ms
1.00
RDS(ON)
limited
10ms
0.1s
0.10
DC
100
10
1s
0.01
0.1
1
10
1
100
0.00001
0.1
10
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junctionto-Ambient (Note E)
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
0.001
Zθ JA Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=125°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
12
0.1
PD
0.01
Ton
Single Pulse
T
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note E)
Rev 7: July 2010
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Page 4 of 5
AO3414
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+
VDC
-
VDC
Qgs
Vds
Qgd
-
DUT
Vgs
Ig
Charge
Res istive Switching Test Circuit & Waveforms
RL
Vds
Vds
DUT
Vgs
+
VDC
90%
Vdd
-
Rg
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
t off
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LI
Vds
2
AR
BVDSS
Vds
Id
+
Vgs
Vgs
VDC
-
Rg
Vdd
I AR
Id
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Qrr = - Idt
Vds +
DUT
Vgs
Vds -
Isd
Vgs
Ig
Rev 7: July 2010
L
Isd
+
VDC
-
IF
trr
dI/dt
IRM
Vdd
Vdd
Vds
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Page 5 of 5