ONSEMI NCV890130

NCV890130
1.2 A, 2 MHz Automotive
Buck Switching Regulator
The NCV890130 is a fixed−frequency, monolithic, Buck switching
regulator intended for Automotive, battery−connected applications
that must operate with up to a 36 V input supply. The regulator is
suitable for systems with low noise and small form factor
requirements often encountered in automotive driver information
systems. The NCV890130 is capable of converting the typical 4.5 V to
18 V automotive input voltage range to outputs as low as 3.3 V at a
constant switching frequency above the sensitive AM band,
eliminating the need for costly filters and EMI countermeasures. The
NCV890130 also provides several protection features expected in
Automotive power supply systems such as current limit, short circuit
protection, and thermal shutdown. In addition, the high switching
frequency produces low output voltage ripple even when using small
inductor values and an all−ceramic output filter capacitor − forming a
space−efficient switching regulator solution.
http://onsemi.com
MARKING DIAGRAMS
1
DFN8
CASE 506BY
Internal N−Channel Power Switch
Low VIN Operation Down to 4.5 V
High VIN Operation to 36 V
Withstands Load Dump to 45 V
2 MHz Free−running Switching Frequency
Logic level Enable Input Can be Directly Tied to Battery
1.4 A (min) Cycle−by−Cycle Peak Current Limit
Short Circuit Protection enhanced by Frequency Foldback
±1.75% Output Voltage Tolerance
Output Voltage Adjustable Down to 0.8 V
1.4 Millisecond Internal Soft−Start
Thermal Shutdown (TSD)
Low Shutdown Current
Wettable Flanks − DFN
NCV Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change
Requirements; AEC−Q100 Qualified and PPAP
Capable
CDRV
CIN
EN
1 VIN
SW 8
2 DRV
BST 7
3 GND
FB 6
4 EN
V890130
ALYWXG
G
1
SOIC−8 EP
CASE 751AC
A
L
Y
W
G
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Device
(*Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 13 of this data sheet.
• These Devices are Pb−Free and are RoHS Compliant
Applications
•
•
•
•
Audio
Infotainment
Safety − Vision Systems
Instrumentation
DBST
NCV890130
VIN
8
8
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
V8901
30
ALYWG
G
L1
CBST
DFW
VOUT
COUT
RFB1
COMP 5
RFB2
RCOMP
CCOMP
Figure 1. Typical Application
© Semiconductor Components Industries, LLC, 2013
February, 2013 − Rev. 2
1
Publication Order Number:
NCV890130/D
NCV890130
CDRV
VIN
VIN
DBST
L1
SW
VOUT
CIN
3.3 V
Reg
DRV
CBST
BST
Oscillator
PWM
LOGIC
ON
OFF
+
+ S
+
−
FB
1.2 A
TSD
+
−
GND
+
Soft−Start
RESET
COMP
VOLTAGES
MONITORS
RCOMP
Enable
EN
CCOMP
Figure 2. NCV890130 Block Diagram
http://onsemi.com
2
DFW
COUT
NCV890130
MAXIMUM RATINGS
Rating
Symbol
Min/Max Voltage VIN
Max Voltage VIN to SW
Min/Max Voltage SW
Min Voltage SW − 20ns
Value
Unit
−0.3 to 45
V
45
V
−0.7 to 40
V
−3.0
V
Min/Max Voltage BST
−0.3 to 40
Min/Max Voltage BST to SW
−0.3 to 3.6
V
Min/Max Voltage on EN
−0.3 to 40
V
Min/Max Voltage COMP
−0.3 to 2
V
Min/Max Voltage FB
−0.3 to 18
V
Min/Max Voltage DRV
−0.3 to 3.6
V
50
°C/W
−55 to +150
°C
TJ
−40 to +150
°C
VESD
2.0
200
>1.0
kV
V
kV
Moisture Sensitivity, DFN8
MSL
Level 1
Moisture Sensitivity, SOIC−8 EP
MSL
Level 2
Thermal Resistance, 3x3 DFN Junction−to−Ambient*
RqJA
Storage Temperature range
Operating Junction Temperature Range
ESD withstand Voltage
Human Body Model
Machine Model
Charge Device Model
Peak Reflow Soldering Temperature
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*Mounted on 1 sq. in. of a 4−layer PCB with 1 oz. copper thickness.
RECOMMENDED OPERATING CONDITIONS:
Rating
VIN Range
Ambient Temperature Range
http://onsemi.com
3
Value
Unit
4.5 to 36
V
−40 to 105
°C
NCV890130
VIN
1
8
SW
DRV
2
7
BST
GND
3
6
FB
EN
4
5
COMP
(Top View)
Figure 3. Pin Connections
PIN FUNCTION DESCRIPTIONS
Pin No.
Symbol
Description
1
VIN
Input voltage from battery. Place an input filter capacitor in close proximity to this pin.
2
DRV
Output voltage to provide a regulated voltage to the Power Switch gate driver.
3
GND
Battery return, and output voltage ground reference.
4
EN
5
COMP
6
FB
Feedback input pin to program output voltage, and detect pre−charged or shorted output conditions.
7
BST
Bootstrap input provides drive voltage higher than VIN to the N−channel Power Switch for optimum
switch RDS(on) and highest efficiency.
8
SW
Switching node of the Regulator. Connect the output inductor and cathode of the freewheeling diode to
this pin.
Exposed
Pad
This TTL compatible Enable input allows the direct connection of Battery as the enable signal. Grounding
this input stops switching and reduces quiescent current draw to a minimum.
Error Amplifier output, for tailoring transient response with external compensation components.
Connect to Pin 3 (electrical ground) and to a low thermal resistance path to the ambient temperature
environment.
http://onsemi.com
4
NCV890130
ELECTRICAL CHARACTERISTICS (VIN = 4.5 V to 28 V, VEN = 5 V, VBST = VSW + 3.0 V, CDRV = 0.1 mF, Min/Max values are valid
for the temperature range −40°C ≤ TJ ≤ 150°C unless noted otherwise, and are guaranteed by test, design or statistical correlation.)
Symbol
Conditions
Max
Unit
Quiescent Current, shutdown
IqSD
VIN = 13.2 V, VEN = 0 V, TJ = 25°C
10
mA
Quiescent Current, enabled
IqEN
VIN = 13.2 V
3.0
mA
UVLO Start Threshold
VUVLSTT
VIN rising
4.1
4.5
V
UVLO Stop Threshold
VUVLSTP
VIN falling
3.9
4.4
V
UVLO Hysteresis
VUVLOHY
0.1
0.2
V
Logic Low
VENLO
0.8
Logic High
VENHI
Parameter
Min
Typ
QUIESCENT CURRENT
UNDERVOLTAGE LOCKOUT − VIN (UVLO)
ENABLE (EN)
Input Current
IEN
8.0
tSS
0.8
V
2.0
V
30
mA
1.4
2.0
ms
0.8
0.814
V
1.0
mA
SOFT−START (SS)
Soft−Start Completion Time
VOLTAGE REFERENCE
FB Pin Voltage during regulation
VFBR
COMP shorted to FB
0.786
IFBBIAS
VFB = 0.8 V
0.25
gm
VCOMP = 1.3 V
4.5 V < VIN < 18 V
20 V < VIN < 28 V
0.6
0.3
ERROR AMPLIFIER
FB Bias Current
Transconductance
gm(HV)
Output Resistance
COMP Source Current Limit
ROUT
1.0
0.5
1.5
0.75
1.4
ISOURCE
VFB = 0.63 V, VCOMP = 1.3 V
4.5 V < VIN < 18 V
20 V < VIN < 28 V
75
40
COMP Sink Current Limit
ISINK
VFB = 0.97 V, VCOMP = 1.3 V
4.5 V < VIN < 18 V
20 V < VIN < 28 V
75
40
Minimum COMP voltage
VCMPMIN
VFB = 0.97 V
0.2
FSW
FSW(HV)
4.5 < VIN < 18 V
20 V < VIN < 28 V
1.8
0.9
mmho
MW
mA
mA
0.7
V
2.2
1.1
MHz
OSCILLATOR
Frequency
2.0
1.0
VIN FREQUENCY FOLDBACK MONITOR
VFB = 0.63 V
Frequency Foldback Threshold
VIN rising
VIN falling
VFLDUP
VFLDDN
Frequency Foldback Hysteresis
VFLDHY
0.2
Overvoltage Stop Threshold
VOVSTP
Overvoltage Start Threshold
Overvoltage Hysteresis
18.4
18
20
19.8
0.3
V
0.4
V
32.4
36
V
VOVSTT
30
35.4
V
VOVHY
0.6
2.4
V
1.3
0.6
A/ms
VIN OVERVOLTAGE SHUTDOWN MONITOR
1.5
SLOPE COMPENSATION
Ramp Slope (Note 1)
(With respect to switch current)
Sramp
Sramp(HV)
4.5 < VIN < 18 V
20 V < VIN < 28 V
1. Not tested in production. Limits are guaranteed by design.
http://onsemi.com
5
0.7
0.25
NCV890130
ELECTRICAL CHARACTERISTICS (VIN = 4.5 V to 28 V, VEN = 5 V, VBST = VSW + 3.0 V, CDRV = 0.1 mF, Min/Max values are valid
for the temperature range −40°C ≤ TJ ≤ 150°C unless noted otherwise, and are guaranteed by test, design or statistical correlation.)
Parameter
Symbol
Conditions
ON Resistance
RDSON
Leakage current VIN to SW
Min
Typ
Max
Unit
VBST = VSW + 3.0 V
650
mW
ILKSW
VEN = 0 V, VSW = 0, VIN = 18 V
10
mA
Minimum ON Time
tONMIN
Measured at SW pin
70
ns
Minimum OFF Time
tOFFMIN
Measured at SW pin
At FSW = 2 MHz (normal)
At FSW = 500 kHz (max duty cycle)
POWER SWITCH
45
ns
30
30
50
70
1.4
1.55
1.7
A
400
200
24
500
250
32
600
300
40
kHz
PEAK CURRENT LIMIT
Current Limit Threshold
ILIM
SHORT CIRCUIT FREQUENCY FOLDBACK
Lowest Foldback Frequency
Lowest Foldback Frequency − High Vin
Hiccup Mode
FSWAF
FSWAFHV
FSWHIC
VFB = 0 V, 4.5 V < VIN < 18 V
VFB = 0 V, 20 V < VIN < 28 V
VFB = 0 V
GATE VOLTAGE SUPPLY (DRV pin)
VDRV
3.1
3.3
3.5
V
DRV POR Start Threshold
VDRVSTT
2.7
2.9
3.05
V
DRV POR Stop Threshold
VDRVSTP
2.5
2.8
3.0
V
45
mA
50
mV
Output Voltage
DRV Current Limit
IDRVLIM
VDRV = 0 V
16
OUTPUT PRECHARGE DETECTOR
VSSEN
20
Activation Temperature (Note 1)
TSD
150
190
°C
Hysteresis (Note 1)
THYS
5
20
°C
Threshold Voltage
35
THERMAL SHUTDOWN
1. Not tested in production. Limits are guaranteed by design.
http://onsemi.com
6
NCV890130
VIN = 13.2 V
7
6
5
4
3
2
1
0
−50
−25
0
25
50
75
100
125
IqEN. ENABLED QUIESCENT CURRENT
(mA)
8
150
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
−50
25
50
75
100
125
Figure 5. Enabled Quiescent Current vs.
Junction Temperature
4.5
4.4
4.3
4.2
4.1
4.0
−25
0
25
50
75
100
125
TJ. JUNCTION TEMPERATURE (°C)
150
4.5
4.4
4.3
4.2
4.1
4.0
3.9
3.8
3.7
−50
−25
VFBR. FB REGULATION VOLTAGE (V)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0
25
50
75
100
125
0
25
50
75
100
125
TJ. JUNCTION TEMPERATURE (°C)
150
Figure 7. UVLO Stop Threshold vs. Junction
Temperature
2.4
−25
150
4.6
Figure 6. UVLO Start Threshold vs. Junction
Temperature
tSS. SOFT−START DURATION (ms)
0
Figure 4. Shutdown Quiescent Current vs.
Junction Temperature
4.6
0.6
−50
−25
TJ. JUNCTION TEMPERATURE (°C)
4.7
3.9
−50
2.6
TJ. JUNCTION TEMPERATURE (°C)
VUVLSTP. UVLO STOP THRESHOLD (V)
VUVLSTT. UVLO START THRESHOLD (V)
IqSD. SHUTDOWN QUIESCENT CURRENT
(mA)
TYPICAL CHARACTERISTICS CURVES
150
0.85
0.84
0.83
0.82
0.81
0.80
0.79
0.78
0.77
0.76
0.75
−50
−25
0
25
50
75
100
125
TJ. JUNCTION TEMPERATURE (°C)
TJ. JUNCTION TEMPERATURE (°C)
Figure 8. Soft−Start Duration vs. Junction
Temperature
Figure 9. FB Regulation Voltage vs. Junction
Temperature
http://onsemi.com
7
150
NCV890130
TYPICAL CHARACTERISTICS CURVES
100
1.2
1.0
VIN = 4.5 V
0.8
0.6
VIN = 28 V
0.4
0.2
−50
−25
0
25
50
75
90
ISOURCE. ERROR AMPLIFIER
SOURCING CURRENT (mA)
gm. ERROR AMPLIFIER
TRANSCONDUCTANCE (mS)
1.4
100
125
VIN = 4.5 V
80
70
60
50
VIN = 28 V
40
30
20
−50
150
−25
TJ. JUNCTION TEMPERATURE (°C)
Figure 10. Error Amplifier Transconductance
vs. Junction Temperature
FSW. OSCILLATOR FREQENCY (MHz)
ISINK. ERROR AMPLIFIER SINKING
CURRENT (mA)
90
VIN = 4.5 V
70
60
50
VIN = 28 V
40
30
20
−50
−25
0
25
50
75
100
75
100
125
150
125
150
VIN = 13.2 V
2.0
1.8
1.6
1.4
1.2
VIN = 28 V
1.0
0.8
−50
−25
0
25
50
75
100
125
150
TJ. JUNCTION TEMPERATURE (°C)
Figure 12. Error Amplifier Max Sinking Current
vs. Junction Temperature
Figure 13. Oscillator Frequency vs. Junction
Temperature
19.6
900
19.4
19.2
RDS(on). POWER SWITCH ON
RESISTANCE (mW)
VFLDUP. VFLDDN, FREQ. FOLDBACK
THRESHOLD (V)
50
2.2
TJ. JUNCTION TEMPERATURE (°C)
VFLDUP
19.0
VFLDDN
18.8
18.6
18.4
18.2
−50
25
Figure 11. Error Amplifier Max Sourcing
Current vs. Junction Temperature
100
80
0
TJ. JUNCTION TEMPERATURE (°C)
−25
0
25
50
75
100
125
TJ. JUNCTION TEMPERATURE (°C)
150
800
700
600
500
400
300
200
100
0
−50
Figure 14. Rising Frequency Foldback
Threshold vs. Junction Temperature
−25
0
25
50
75
100
125
TJ. JUNCTION TEMPERATURE (°C)
Figure 15. Power Switch RDS(on) vs. Junction
Temperature
http://onsemi.com
8
15 0
NCV890130
80
75
75
70
tOFFMIN. MINIMUM TIME (ns)
tONMIN. MINIMUM TIME (ns)
TYPICAL CHARACTERISTICS CURVES
70
65
60
55
50
45
40
−50
−25
0
25
50
75
100
125
65
60
55
50
45
40
35
−50
150
−25
TJ. JUNCTION TEMPERATURE (°C)
Figure 16. Minimum On Time vs. Junction
Temperature
FSWAF. FOLDBACK MODE
SWITCHING FREQUENCY (kHz)
ILIM. MINIMUM TIME (ns)
1.60
1.55
1.50
1.45
75
100
125
150
−25
0
25
50
75
100
125
VIN = 4.5 V
550
500
450
400
350
300
VIN = 28 V
250
200
−50
150
−25
TJ. JUNCTION TEMPERATURE (°C)
0
25
50
75
100
125
150
TJ. JUNCTION TEMPERATURE (°C)
Figure 18. Current Limit Threshold vs.
Junction Temperature
Figure 19. Short−Circuit Foldback Frequency
vs. Junction Temperature
40
3.50
38
3.45
VDRV. DRV VOLTAGE (V)
FSWHC. HICCUP MODE FREUQNCY
(kHz)
50
600
1.65
36
34
32
30
28
3.40
3.35
IDRV = 0 mA
3.30
IDRV = 16 mA
3.25
3.20
3.15
26
24
−50
25
Figure 17. Minimum Off Time vs. Junction
Temperature
1.70
1.40
−50
0
TJ. JUNCTION TEMPERATURE (°C)
−25
0
25
50
75
100
125
3.10
−50
150
TJ. JUNCTION TEMPERATURE (°C)
−25
0
25
50
75
100
125
TJ. JUNCTION TEMPERATURE (°C)
Figure 20. Hiccup Mode Switching Frequency
vs. Junction Temperature
Figure 21. DRV Voltage vs. Junction
Temperature
http://onsemi.com
9
150
NCV890130
TYPICAL CHARACTERISTICS CURVES
IDRVLIM. DRV CURRENT LIMIT (mA)
30
3.0
2.9
VDRVSTT
2.8
VDRVSTP
2.7
2.6
2.5
−50
−25
0
25
50
75
100
125
TJ. JUNCTION TEMPERATURE (°C)
150
29
28
27
26
25
24
23
22
21
−50
Figure 22. DRV Reset Threshold vs. Junction
Temperature
−25
0
25
50
75
100
125
TJ. JUNCTION TEMPERATURE (°C)
Figure 23. DRV Current Limit vs. Junction
Temperature
55
VSSEN. OUTPUT PRECHARGE
DETECTOR THRESHOLD (V)
VDRVSTT. VDRVSTP, DRV RESET
THRESHOLDS (V)
3.1
50
45
40
35
30
25
20
−50
−25
0
25
50
75
100
125
TJ. JUNCTION TEMPERATURE (°C)
Figure 24. Output Precharge Detector
Threshold vs. Junction Temperature
http://onsemi.com
10
150
150
NCV890130
GENERAL INFORMATION
INPUT VOLTAGE
ERROR AMPLIFIER
An Undervoltage Lockout (UVLO) circuit monitors the
input, and inhibits switching and resets the Soft−start circuit
if there is insufficient voltage for proper regulation. The
NCV890130 can regulate a 3.3 V output with input voltages
above 4.5 V and a 5.0 V output with an input above 6.5 V.
The NCV890130 automatically terminates switching if
input voltage exceeds VOVSTP (see Figure 25), and
withstands input voltages up to 45 V.
To limit the power lost in generating the drive voltage for
the Power Switch, the switching frequency is reduced by a
factor of 2 when the input voltage exceeds the VIN
Frequency Foldback threshold VFLDUP (see Figure 25).
Frequency reduction is automatically terminated when the
input voltage drops back below the VIN Frequency Foldback
threshold VFLDDN.
The error amplifier is a transconductance type amplifier.
The output voltage of the error amplifier controls the peak
inductor current at which the power switch shuts off. The
Current Mode control method employed by the NCV890130
allows the use of a simple, Type II compensation to optimize
the dynamic response according to system requirements.
SLOPE COMPENSATION
A fixed slope compensation signal is generated internally
and added to the sensed current to avoid increased output
voltage ripple due to bifurcation of inductor ripple current
at duty cycles above 50%. The fixed amplitude of the slope
compensation signal requires the inductor to be greater than
a minimum value, depending on output voltage, in order to
avoid sub−harmonic oscillations. For 3.3 V and 5 V output
voltages, the recommended inductor value is 4.7 mH.
Fsw
(MHz)
SHORT CIRCUIT FREQUENCY FOLDBACK
During severe output overloads or short circuits, the
NCV890130 automatically reduces its switching frequency.
This creates duty cycles small enough to limit the peak
current in the power components, while maintaining the
ability to automatically reestablish the output voltage if the
overload is removed. If the current is still too high after the
switching frequency folds back to 500 kHz, the regulator
enters an auto−recovery burst mode that further reduces the
dissipated power.
2
1
CURRENT LIMITING
4
18 20
30
36
45
Due to the ripple on the inductor current, the average
output current of a buck converter is lower than the peak
current setpoint of the regulator. Figure 26 shows − for a
4.7 mH inductor − how the variation of inductor peak current
with input voltage affects the maximum DC current the
NCV890130 can deliver to a load.
VIN (V)
Figure 25. NCV890130 Switching Frequency
Reduction at High Input Voltage
ENABLE
1.4
MINIMUM CURRENT LIMIT (A)
The NCV890130 is designed to accept either a logic level
signal or battery voltage as an Enable signal. EN low induces
a ’sleep mode’ which shuts off the regulator and minimizes
its supply current to a couple of mA typically (IqSD) by
disabling all functions. Upon enabling, voltage is
established at the DRV pin, followed by a soft−start of the
switching regulator output.
SOFT−START
Upon being enabled or released from a fault condition,
and after the DRV voltage is established, a soft−start circuit
ramps the switching regulator error amplifier reference
voltage to the final value. During soft−start, the average
switching frequency is lower than its normal mode value
(typically 2 MHz) until the output voltage approaches
regulation.
1.3
(3.3 VOUT)
1.2
1.1
(5 VOUT)
1.0
0.9
0.8
0.7
0.6
0
5
10
15
20
25
30
35
40
INPUT VOLTAGE (V)
Figure 26. NCV890130 Load Current Capability
with 4.7 mH Inductor
http://onsemi.com
11
NCV890130
7
BOOTSTRAP
At the DRV pin an internal regulator provides a
ground−referenced voltage to an external capacitor (CDRV),
to allow fast recharge of the external bootstrap capacitor
(CBST) used to supply power to the power switch gate driver.
If the voltage at the DRV pin goes below the DRV UVLO
Threshold VDRVSTP, switching is inhibited and the
Soft−start circuit is reset, until the DRV pin voltage goes
back up above VDRVSTT.
In order for the bootstrap capacitor to stay charged, the
Switch node needs to be pulled down to ground regularly. In
very light load condition, the NCV890130 skips switching
cycles to ensure the output voltage stays regulated. When the
skip cycle repetition frequency gets too low, the bootstrap
voltage collapses and the regulator stops switching.
Practically, this means that the NCV890130 needs a
minimum load to operate correctly: to cover all conditions
of input voltage and temperature, this minimum load is 8
mA.
VOUT = 5 V
6
VIN (V)
5
4
3
2
1
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
IOUT (A)
Figure 27. Minimum Input Voltage vs. Output Current
EXPOSED PAD
The exposed pad (EPAD) on the back of the package must
be electrically connected to the electrical ground (GND pin)
for proper, noise−free operation.
OUTPUT PRECHARGE DETECTION
Prior to Soft−start, the FB pin is monitored to ensure the
SW voltage is low enough to have charged the external
bootstrap capacitor (CBST). If the FB pin is higher than
VSSEN, restart is delayed until the output has discharged.
DESIGN METHODOLOGY
The NCV890130 being a fixed−frequency regulator with
the switching element integrated, is optimized for one value
of inductor. This value is set to 4.7 mH, and the slope
compensation is adjusted for this inductor. The only
components left to be designed are the input and output
capacitor and the freewheeling diode.
Output capacitor:
The minimum output capacitor value can be calculated
based on the specification for output voltage ripple:
THERMAL SHUTDOWN
A thermal shutdown circuit inhibits switching, resets the
Soft−start circuit, and removes DRV voltage if internal
temperature exceeds a safe level. Switching is automatically
restored when temperature returns to a safe level.
MINIMUM DROPOUT VOLTAGE
When operating at low input voltages, two parameters
play a major role in imposing a minimum voltage drop
across the regulator: the minimum off time (that sets the
maximum duty cycle), and the on state resistance.
When operating in continuous conduction mode (CCM),
the output voltage is equal to the input voltage multiplied by
the duty ratio. Because the NCV890130 needs a sufficient
bootstrap voltage to operate, its duty cycle cannot be 100%:
it needs a minimum off time (tOFFmin) to periodically re−fuel
the bootstrap capacitor CBST. This imposes a maximum duty
ratio DMAX = 1 − tOFFmin.FSW(min), with the switching
frequency being folded back down to FSW(min) = 500 kHz to
keep regulating at the lowest input voltage possible.
The drop due to the on−state resistance is simply the
voltage drop across the Switch resistance RDSON at the
given output current: VSWdrop = IOUT.RDSon.
Which leads to the maximum output voltage in low Vin
condition: VOUT = DMAX.VIN(min) − VSWdrop
C OUT min +
DI L
8 @ DV OUT @ F SW
(eq. 1)
With
− DIL the inductor ripple current:
ǒ
V OUT @ 1 *
DI L +
V
Ǔ
OUT
V
IN
(eq. 2)
L @ F SW
− DVOUT the desired voltage ripple.
However, the ESR of the output capacitor also contributes
to the output voltage ripple, so to comply with the
requirement, the ESR cannot exceed RESRmax:
R ESR max +
DV OUT @ L @ F SW
ǒ
V OUT 1 *
http://onsemi.com
12
V
Ǔ
OUT
V
IN
(eq. 3)
NCV890130
Finally, the output capacitor must be able to sustain the ac
current (or RMS ripple current):
I OUTac +
DI L
Then, knowing the thermal resistance of the package and
the amount of heatsinking on the PCB, the temperature rise
corresponding to this power dissipation can be estimated.
(eq. 4)
2 Ǹ3
Input capacitor:
The input capacitor must sustain the RMS input ripple
current IINac:
Typically, with the recommended 4.7 mH inductor, two
ceramic capacitors of 10 mF each in parallel give very good
results.
I INac +
Freewheeling diode:
The diode must be chosen according to its maximum
current and voltage ratings, and to thermal considerations.
As far as max ratings are concerned, the maximum reverse
voltage the diode sees is the maximum input voltage (with
some margin in case of ringing on the Switch node), and the
maximum forward current the peak current limit of the
NCV890130, ILIM.
The power dissipated in the diode is PDloss:
ǒ
P Dloss + I OUT @ 1 *
Ǔ
V OUT
V IN
Ǹ
PCB LAYOUT RECOMMENDATION
As with any switching power supplies, there are some
guidelines to follow to optimize the layout of the printed
circuit board for the NCV890130. However, because of the
high switching frequency extra care has to be taken.
− Minimize the area of the power current loops:
♦ Input capacitor ³ NCV890130 switch ³ Inductor
³ output capacitor ³ return through Ground
♦ Freewheeling diode ³ inductor ³ Output capacitor
³ return through ground
− Minimize the length of high impedance signals, and
route them far away from the power loops:
♦ Feedback trace
♦ Comp trace
@ V F ) I DRMS @ R D (eq. 5)
ǒ
(1 * D) I OUT 2 )
DI L
12
Ǔ
(eq. 7)
It can be designed in combination with an inductor to build
an input filter to filter out the ripple current in the source, in
order to reduce EMI conducted emissions.
For example, using a 4.7 mH input capacitor, it is easy to
calculate that an inductor of 200 nH will ensure that the
input filter has a cut−off frequency below 200 kHz (low
enough to attenuate the 2 MHz ripple).
with:
− IOUT the average (dc) output current
− VF the forward voltage of the diode
− IDRMS the RMS current in the diode:
I DRMS +
D
Ǹ
3
2
DI L
2
(eq. 6)
− RD the dynamic resistance of the diode (extracted from
the V/I curve of the diode in its datasheet).
ORDERING INFORMATION
Package
Shipping†
NCV890130MWTXG
DFN8 with wettable flanks
(Pb−Free)
3000 / Tape & Reel
NCV890130PDR2G
SOIC−8 EP
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
13
NCV890130
PACKAGE DIMENSIONS
SOIC−8 EP
CASE 751AC
ISSUE B
2X
D
E1
2X
0.10 C D
PIN ONE
LOCATION
DETAIL A
D
A
8
EXPOSED
PAD
5
ÉÉ
ÉÉ
1
5
F
8
G
E
h
2X
4
4
0.20 C
e
1
BOTTOM VIEW
8X b
0.25 C A-B D
B
A
0.10 C
A2
8X
b1
GAUGE
PLANE
0.10 C
SEATING
PLANE
SIDE VIEW
A1
L
0.25
ÇÇ
ÉÉ
ÉÉ
ÇÇ
ÉÉ
ÇÇ
c
H
A
A
END VIEW
TOP VIEW
C
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS (ANGLES
IN DEGREES).
3. DIMENSION b DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE
0.08 MM TOTAL IN EXCESS OF THE “b”
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
4. DATUMS A AND B TO BE DETERMINED
AT DATUM PLANE H.
0.10 C A-B
(L1)
DETAIL A
q
c1
(b)
SECTION A−A
SOLDERING FOOTPRINT*
2.72
0.107
1.52
0.060
7.0
0.275
Exposed
Pad
4.0
0.155
2.03
0.08
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
14
DIM
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
L1
F
G
h
q
MILLIMETERS
MIN
MAX
1.35
1.75
0.00
0.10
1.35
1.65
0.31
0.51
0.28
0.48
0.17
0.25
0.17
0.23
4.90 BSC
6.00 BSC
3.90 BSC
1.27 BSC
0.40
1.27
1.04 REF
2.24
3.20
1.55
2.51
0.25
0.50
0_
8_
NCV890130
PACKAGE DIMENSIONS
DFN8, 3x3, 0.5P
CASE 506BY
ISSUE A
A
B
D
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. FOR DEVICE OPN CONTAINING W OPTION,
DETAIL B ALTERNATE CONSTRUCTION IS
NOT APPLICABLE.
L
L1
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
DETAIL A
ALTERNATE
CONSTRUCTIONS
E
ÉÉ
ÇÇ
EXPOSED Cu
TOP VIEW
(A3)
DETAIL B
0.05 C
A
A3
MOLD CMPD
A1
DETAIL B
ÉÉ
ÇÇ
ÇÇ
ALTERNATE
CONSTRUCTIONS
0.05 C
NOTE 4
SIDE VIEW
C
SEATING
PLANE
1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.25
0.35
3.00 BSC
2.20
2.40
3.00 BSC
1.40
1.60
0.65 BSC
0.20
−−−
0.20
0.40
0.00
0.15
RECOMMENDED
SOLDERING FOOTPRINT*
D2
DETAIL A
8X
A1
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
ÇÇÇÇÇÇ
ÇÇÇÇÇÇ
4
2.46
L
E2
8X
0.53
3.30
1.66
8X
K
e/2
8
5
e
BOTTOM VIEW
8X
ÇÇÇÇÇÇ
ÇÇÇÇÇÇ
b
0.10 C A B
0.05 C
1
NOTE 3
0.65
PITCH
8X
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
15
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCV890130/D