EM44CM1688LBC Revision History Revision 0.1 (Jan. 2013) -First release. Dec. 2012 1/29 www.eorex.com EM44CM1688LBC 1Gb (8M×8Bank×16) Double DATA RATE 2 SDRAM Features • JEDEC Standard VDD/VDDQ = 1.8V±0.1V. • All inputs and outputs are compatible with SSTL_18 interface. • Fully differential clock inputs (CK, /CK) operation. • Eight Banks • Posted CAS • Bust length: 4 and 8. • Programmable CAS Latency (CL): 5, 6 • Programmable Additive Latency (AL): 0, 1, 2, 3, 4, 5 • Write Latency (WL) =Read Latency (RL) -1. • Read Latency (RL) = Programmable Additive Latency (AL) + CAS Latency (CL) • Bi-directional Differential Data Strobe (DQS). • Data inputs on DQS centers when write. • Data outputs on DQS, /DQS edges when read. • On chip DLL align DQ, DQS and /DQS transition with CK transition. • DM mask write data-in at the both rising and falling edges of the data strobe. • Sequential & Interleaved Burst type available. • Off-Chip Driver (OCD) Impedance Adjustment • On Die Termination (ODT) • Auto Refresh and Self Refresh • 8,192 Refresh Cycles / 64ms • Average Refresh Period 7.8us at lower than Tcase 85 °C, 3.9us at 85°C < Tcase ≦ 95°C • RoHS Compliance • Partial Array Self-Refresh (PASR) • High Temperature Self-Refresh rate enable Description The EM44CM1688LBC is a high speed Double Date Rate 2 (DDR2) Synchronous DRAM fabricated with ultra high performance CMOS process containing 1,073,741,824 bits which organized as 16Mbits x 8 banks by 16 bits. This synchronous device achieves high speed double-data-rate transfer rates of up to 800 Mb/sec/pin (DDR2-800) for general applications. The chip is designed to comply with the following key DDR2 SDRAM features: (1) posted CAS with additive latency, (2) write latency = read latency -1, (3) Off-Chip Driver (OCD) impedance adjustment and On Die Termination (4) normal and weak strength data output driver. All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and /CK falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and /DQS) in a source synchronous fashion. The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style. The 1Gb DDR2 device operates with a single power supply: 1.8V ± 0.1V VDD and VDDQ. Available package: FBGA-84Ball (with 0.8mm x 0.8mm ball pitch) Dec. 2012 2/29 www.eorex.com EM44CM1688LBC Ordering Information Organization Max. Freq Part No Package Grade Pb EM44CM1688LBC-3 64M X 16 tCK5: DDR2-667MHz 5-5-5 FBGA-84B Commercial Free EM44CM1688LBC-25 64M X 16 tCK6: DDR2-800MHz 6-6-6 FBGA-84B Commercial Free EM44CM1688LBC-3E 64M X 16 tCK5: DDR2-667MHz 5-5-5 FBGA-84B Extended Free EM44CM1688LBC-25E 64M X 16 tCK6: DDR2-800MHz 6-6-6 FBGA-84B Extended Free EM44CM1688LBC-3I 64M X 16 tCK5: DDR2-667MHz 5-5-5 FBGA-84B Industry Free EM44CM1688LBC-25I 64M X 16 tCK6: DDR2-800MHz 6-6-6 FBGA-84B Industry Free Note: Speed ( tCK *) is in order of CL-tRCD-tRP Parts Naming Rule * EOREX reserves the right to change products or specification without notice. Dec. 2012 3/29 www.eorex.com EM44CM1688LBC Pin Assignment: Top View 1 2 3 7 8 9 VDD NC VSS A VSSQ /UDQS VDDQ DQ14 VSSQ UDM B UDQS VSSQ DQ15 VDDQ DQ9 VDDQ C VDDQ DQ8 VDDQ DQ12 VSSQ DQ11 D DQ10 VSSQ DQ13 VDD NC VSS E VSSQ /LDQS VDDQ DQ6 VSSQ LDM F LDQS VSSQ DQ7 VDDQ DQ1 VDDQ G VDDQ DQ0 VDDQ DQ4 VSSQ DQ3 H DQ2 VSSQ DQ5 VDDL VREF VSS J VSSDL CK VDD CKE /WE K /RAS /CK ODT BA0 BA1 L /CAS /CS A10/AP A1 M A2 A0 A3 A5 N A6 A4 A7 A9 P A11 A8 A12 NC R NC NC BA2 VSS VDD VDD VSS 84Ball FBGA Note: VDDL and VSSDL are power and ground for the DLL. Dec. 2012 4/29 www.eorex.com EM44CM1688LBC Pin Description (Simplified) Pin Name Function (System Clock) J8,K8 CK,/CK CK and CK are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of CK and negative edge of CK. Output (read) data is referenced to the crossings of CK and CK (both directions of crossing). (Chip Select) L8 /CS All commands are masked when CS is registered HIGH. CS provides for external Rank selection on systems with multiple Ranks. CS is considered part of the command code. (Clock Enable) K2 CKE CKE high activates and CKE low deactivates internal clock signals and device input buffers and output drivers. Taking CKE low provides Precharge Power-Down and Self- Refresh operation (all banks idle), or Active Power-Down (row Active in any bank). CKE is synchronous for power down entry and exit and for Self-Refresh entry. CKE is asynchronous for Self-Refresh exit. CKE must be maintained high throughout read and write accesses. Input buffers, excluding CK, /CK, ODT and CKE are disabled during Power Down. Input buffers, excluding CKE are disabled during Self-Refresh. (Address) M8,M3,M7,N2, N8,N3,N7,P2, P8,P3,M2,P7, A0~A12 R2,R8 Provided the row address (RA0 – RA12) for Active commands and the column address (CA0-CA9) and Auto Precharge bit for Read/Write commands to select one location out of the memory array in the respective bank. A10 is sampled during a Precharge command to determine whether the Precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by BA0, BA1 & BA2. The address inputs also provide the op-code during Mode Register Set commands. (Bank Address) L2,L3,L1 BA0, BA1,BA2 BA0 – BA2 define to which bank an Active, Read, Write or Precharge command is being applied. Bank address also determines if the mode register or extended mode register is to be accessed during a MRS or EMRS cycle. (On Die Termination) K9 ODT ODT (registered HIGH) enables termination resistance internal to the DDR2 SDRAM. When enabled, ODT is applied to each DQ, UDQS/UDQS, LDQS/LDQS, UDM, and LDM signal. The ODT pin will be ignored if the Extended Mode Register (EMRS(1)) is programmed to disable ODT. (Command Inputs) K7, L7, K3 Dec. 2012 /RAS,/CAS,/WE /RAS, /CAS and /WE (along with /CS) define the command being entered. 5/29 www.eorex.com EM44CM1688LBC Pin Description (Continued) (Data Strobe) B7,A8,F7,E8 UDQS,/UDQS , LDQS,/LDQS Output with read data, input with write data. Edge-aligned with read data, centered in write data. LDQS corresponds to the data on DQ0-DQ7; UDQS corresponds to the data on DQ8-DQ15. The data strobes LDQS and UDQS may be used in single ended mode or paired with optional complementary signals /LDQS and /UDQS to provide differential pair signaling to the system during both reads and writes. An EMRS(1) control bit enables or disables all complementary data strobe signals. In this data sheet, "differential DQS signals" refers to A10 = 0 of EMRS(1) using LDQS/LDQS and UDQS/UDQS. "single-ended DQS signals" refers to A10 = 1 of EMRS(1) using LDQS and UDQS. (Input Data Mask) B3,F3 G8,G2,H7,H3, H1,H9,F1,F9, C8,C2,D7,D3, D1, D9,B1,B9 A1,E1,J9,M9, R1/ A3,E3,J3, N1,P9 UDM,LDM (Data Input/Output) DQ0~15 VDD/VSS Data inputs and outputs are on the same pin. (Power Supply/Ground) VDD and VSS are power supply for internal circuits. (DQ Power Supply/DQ Ground) A9,C1,C3,C7, C9,E9,G1,G3, G7,G9/A7,B2, B8,D2,D8,E7, F2,F8,H2,H8 VDDQ/VSSQ J1/J7 VDDL/VSSDL J2 VREF A2,E2,R3,R7 NC Dec. 2012 DM is an input mask signal for write data. Input data is masked when DM is sampled HIGH coincident with that input data during a Write access. DM is sampled on both edges of DQS. Although DM pins are input only, the DM loading matches the DQ and DQS loading. VDDQ and VSSQ are power supply for the output buffers. (DLL Power Supply/DLL Ground) VDDL and VSSDL are power supply for DLL circuits (Reference Voltage) SSTL_1.8 reference voltage (No Connection) No internal electrical connection is present. 6/29 www.eorex.com EM44CM1688LBC Absolute Maximum Rating Symbol Item Rating Units VIN, VOUT VDD Input, Output Voltage -0.5 ~ +2.3 V Power Supply Voltage -1.0 ~ +2.3 V VDDQ Power Supply Voltage -0.5 ~ +2.3 V VDDL DLL Power Supply Voltage -0.5 ~ +2.3 V Commercial TOP TSTG PD Operating Temperature Range 0 ~ +70 Extended -25 ~ +85 Industry -40 ~ +85 Storage Temperature Range Power Dissipation °C -55 ~ +100 °C 1 W Note: 1. Caution Exposing the device to stress above those listed in Absolute Maximum Ratings could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. 2. At 85 - 95 °C operation temperature range, doubling refresh commands in frequency to a 32ms period ( tREFI=3.9 us ) is required. Recommended DC Operating Conditions (TA=-0°C ~+70°C) Symbol Parameter Min. Typ. Max. Units VDD Power Supply Voltage 1.7 1.8 1.9 V VDDL Power Supply for DLL Voltage 1.7 1.8 1.9 V VDDQ Power Supply for I/O Voltage 1.7 1.8 1.9 V VREF I/O Reference Voltage 0.49 VDDQ 0.50VDDQ 0.51 VDDQ V VREF-0.04 VREF VREF+0.04 V -0.3 - VREF-0.15 V VTT I/O Termination Voltage VID DC Differential Input Voltage VIH Input Logic High Voltage VREF+0.125 - VDDQ+0.3 V VIL Input Logic Low Voltage -0.3 - VREF-0.125 V Dec. 2012 7/29 www.eorex.com EM44CM1688LBC Recommended DC Operating Conditions (VDD=1.8V±0.2V, TA=0°C ~ 70°C) Symbol Parameter Test Conditions (Note 1) IDD1 Operating Current IDD2P Precharge Standby Current in Power Down Mode IDD2N Precharge Standby Current in NON-power down mode All banks idle IDD3P IDD3P IDD3N IDD4W Active Standby Current in Power Down Mode (A12=0) Active Standby Current in Power Down Mode (A12=1) Active Standby Current in Non-power Down Mode Operating Current Mode) (Note 2) IDD4R (Note 3) IDD5 Refresh Current IDD6 Self Refresh Current IDD7 Operating Current (Burst IOUT = 0mA BL = 4, CL = CL(IDD), AL = 0 tCK = tCK(IDD), tRC = tRC (IDD) tRAS = tRASmin(IDD), tRCD = tRCD(IDD) CKE=HIGH CS=HIGH between valid commands Address bus inputs are SWITCHING Data pattern is same as IDD4W All banks idle tCK = tCK(IDD), CKE is LOW Other control and address bus inputs are STABLE Data bus inputs are FLOATING All banks idle tCK = tCK(IDD), CKE is HIGH, CS is HIGH Other control and address bus inputs are SWITCHING Data bus inputs are SWITCHING All banks open tCK = tCK(IDD), CKE is LOW Other control and address bus inputs are STABLE Data bus inputs are FLOATING All banks open tCK = tCK(IDD), tRAS = tRASmax(IDD) tRP = tRP(IDD), CKE is HIGH CS is HIGH between valid commands Other control and address bus inputs are SWITCHING Data bus inputs are SWITCHING All banks open, Continuous burst writes BL = 4, CL = CL(IDD), AL = 0 tCK = tCK(IDD), tRAS = tRASmax(IDD) tRP = tRP(IDD), CKE is HIGH CS is HIGH between valid commands Address bus inputs are SWITCHING Data bus inputs are SWITCHING tCK = tCK(IDD) Refresh command at every tRFC(IDD) interval CKE is HIGH, CS is HIGH between valid commands Other control and address bus inputs are SWITCHING Data bus inputs are SWITCHING CK and CK at 0 V, CKE 0.2 V Other control and address bus inputs are FLOATING, Data bus inputs are FLOATING All bank interleaving reads IOUT = 0mA, BL = 4, CL = CL(IDD) AL = tRCD(IDD) - 1 x tCK(IDD) tCK = tCK(IDD), tRC = tRC(IDD) tRRD = tRRD(IDD), tFAW = tFAW(IDD) tRCD = 1 x tCK(IDD), CKE is HIGH CS is HIGH between valid commands Address bus inputs are STABLE during DESELECTs Data pattern is same as IDD4R -25(800) -3(667) Max Units 130 120 mA 10 10 mA 40 35 mA 35 35 mA 20 20 mA 90 80 mA 200 175 mA 200 175 290 280 mA 10 10 mA 350 310 mA *All voltages referenced to VSS. Note 1: IDD1 depends on output loading and cycle rates. (CL=CLmin, AL=0) Note 2: IDD4 depends on output loading and cycle rates. Input signals SWITCHING Note 3: Min. of tRFC (Auto refresh Row Cycle Times) is shown at AC Characteristics. Dec. 2012 8/29 www.eorex.com EM44CM1688LBC Recommended DC Operating Conditions (Continued) Symbol Parameter Test Conditions VOH High Level Output Voltage *Note5 VOL Low Level Output Voltage *Note5 ILI Input Leakage Current - ILO Output Leakage Current - IOH Output Minimum Source Current *Note2, 4, 5 IOL Output Minimum Sink Current *Note3, 4, 5 Min. Max. VTT+0.603 Units V VTT-0.603 V - 2 µA - 5 µA -13.4 mA +13.4 mA Note1: The VDDQ of the device under test is referenced Note2: VDDQ=1.7V, VOUT=1.42V Note3: VDDQ=1.7V, VOUT=0.28V Note4: The DC value of VREF applied to the receiving device is expected to be set to VTT Note5: After OCD calibration to 18Ω at TC=25℃, VDD=VDDQ=1.8V Dec. 2012 9/29 www.eorex.com EM44CM1688LBC Block Diagram DM Auto/ Self Refresh Counter DQM Control A0 CLK, /CLK A1 A2 A5 A6 A7 A8 A9 Row Decoder Address Register A4 DQS Generator Row Add. Buffer A3 DLL Memory Array Driver S/ A & I/ O Gating A10 Write FIFO CLK, /CLK A11 Col. Decoder A12 BA0 BA1 Receiver Col. Add. Buffer Data In Mode Register Set Data Out Col Add. Counter Burst Counter DIO Timing Register DQS /CLK Dec. 2012 CLK CKE /CS / RAS / CAS 10/29 / WE DM DQS www.eorex.com EM44CM1688LBC OCD Default Setting Table Parameter Min. Typ. Max. Units Output Impedance - - - Ω Pull-up / Pull-down mismatch 0 - 4 Ω 1.5 - 5.0 V/ns Output Slew Rate Notes: Absolute Specifications (0°C ≤ TCASE ≤ +95°C; VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V) AC Operating Test Conditions (VDD=1.8V±0.1V, TA=0°C ~70°C) Symbol Parameter Value Units VSWING (max.) Input Signal Maximum Peak to Peak Swing 1.0 V SLEW Input Signal Minimum Slew Rate 1.0 V/ns VREF Input Reference Level 0.5*VDDQ V AC Operating Test Conditions Symbol Parameter Min. Max. Units 0.5 VDDQ V VID AC Differential Input Voltage VIX AC Differential Cross Point Input Voltage 0.5*VDDQ-0.175 0.5*VDDQ+0.175 V VOX AC Differential Cross Point Output Voltage 0.5*VDDQ-0.125 0.5*VDDQ+0.125 V VIH Input Logic High Voltage VREF+0.2 VDDQ+Vpeak V VIL Input Logic High Voltage VSSQ-Vpeak VREF-0.2 V Dec. 2012 11/29 www.eorex.com EM44CM1688LBC AC Operating Test Characteristics (VDD=1.8V±0.1V, TA=0°C ~70°C) -25 (DDR2-800) -3 (DDR2-667) Min. Max. Min. Max. DQ output access from CLK,/CLK -0.40 0.40 -0.45 0.45 ns tDQSCK DQS output access from CLK,/CLK -0.35 0.35 -0.40 0.40 ns tCL,tCH CL low/high level width 0.48 0.52 0.48 0.52 tCK tCK Clock Cycle Time 2.5 8 3 8 ns tDS DQ and DM setup time 0.05 - 0.10 - ns tDH DQ and DM hold time 0.125 - 0.175 - ns DQ and DM input pulse width for each input 0.35 - 0.35 - tCK Symbol tAC tDIPW tHZ tLZ (DQ) tLZ (DQS) Parameter Data out high impedance time from CLK,/CLK DQ low impedance time from CLK,/CLK DQS,/DQS low impedance time from CLK,/CLK - tAC - (max) tAC Units ns (max) 2*tAC tAC 2*tAC tAC (min) (max) (min) (max) tAC tAC tAC tAC (min) (max) (min) (max) ns ns tDQSQ DQS-DQ skew for associated DQ signal - 0.20 - 0.24 ns tQHS Data hold skew factor - 0.30 - 0.34 ns tDQSS Write command to first latching DQS transition -0.25 0.25 -0.25 0.25 tCK DQS Low/High input pulse width 0.35 - 0.35 - tCK DQS input valid window 0.20 - 0.20 - tCK tDQSL,tDQSH tDSL,tDSH Mode Register Set command cycle time 2 - 2 - tCK tWPRES tMRD Write Preamble setup time 0 - 0 - ns tWPRE Write Preamble 0.35 - 0.35 - tCK tWPST Write Postamble 0.4 0.6 0.4 0.6 tCK 0.175 - 0.20 - ns 0.25 - 0.275 - ns 0.9 1.1 0.9 1.1 tCK tIS tIH tRPRE Dec. 2012 Address/control input setup time (fast slew rate) Address/control input hold time (fast slew rate) Read Preamble 12/29 www.eorex.com EM44CM1688LBC AC Operating Test Characteristics (Continued) (VDD=1.8V±0.1V, TA=0°C ~70°C) Symbol Parameter -25 (DDR2-800) -3 (DDR2-667) Min. Max. Min. Max. Units tRPST Read Postamble 0.4 0.6 0.4 0.6 tCK tRAS Active to Precharge command period 45 70k 45 70k ns tRC Active to Active command period 57.5 - 60 - ns tRFC Auto Refresh Row Cycle Time 127.5 - 127.5 - ns tRCD Active to Read or Write delay 12.5 - 15 - ns tRP Precharge command period 12.5 - 15 - ns tRRD Active bank A to B command period 10 - 10 - ns tCCD Column address to column address delay 2 - 2 - tCK tWR Write recover time 15 - 15 - ns tDAL Auto precharge write recovery + precharge time tRP + tWR - tRP + tWR - ns tXARD Exit active power-down mode to read command (fast exit) 2 - 2 - tCK tXARDS Exit active power-down mode to read command (slow exit) 8-AL - 7-AL - tCK 2 - 2 - tCK tXP Exit precharge power-down to any non-read command tWTR Internal write to read command delay 7.5 - 7.5 - ns tRTP Internal read to precharge delay 7.5 - 7.5 - ns tXSNR Exit self Refresh to non-read command tRFC +10 - tRFC +10 - ns tXSRD Exit self Refresh to read command 200 - 200 - tCK tREFI Average periodic refresh interval - 7.8 - 7.8 us 3 - 3 - tCK tCKE CKE minimum pulse width tFAW Four active to Row active delay (same bank) tOIT OCD drive mode output delay Dec. 2012 45 0 13/29 50 12 0 ns 12 ns www.eorex.com EM44CM1688LBC AC Operating Test Characteristics (Continued) (VDD=1.8V±0.1V, TA=0°C ~70°C) Symbol Speed 667/800 Parameter Min. Max. Units tAOND ODT turn-on delay 2 2 tCK tAOFD ODT turn-off delay tAON ODT turn-on tAOF ODT turn-off 2.5 2.5 tCK (Note1) tAC(min.) tAC(max) +0.7 ns (Note2) tAC(min.) tAC(max) +0.6 ns tAONPD ODT turn-on in power-down mode tAC(min.) +2 2*tCK + tAC(max) +1 ns tAOFPD ODT turn-off in power-down mode tAC(min.) +2 2.5*tCK + tAC(max) +1 ns tANPD ODT to power-down mode entry latency 3 - tCK tAXPD ODT power-down exit latency 8 - tCK Note 1: ODT turn on time min is when the device leaves high impedance and ODT resistance begins to turn on. ODT turn on time max is when the ODT resistance is fully on. Both are measure from tAOND. Note 2: ODT turn off time min is when the device starts to turn off ODT resistance ODT turn off time max is when the bus is in high impedance. Both are measured from tAOFD. Dec. 2012 14/29 www.eorex.com EM44CM1688LBC Simplified State Diagram Dec. 2012 15/29 www.eorex.com EM44CM1688LBC 1. Command Truth Table Device Deselect DESL H X H X X X BA0 ~ BA2 X No Operation NOP H X L H H H X X X READ H H L H L H V L V READA H H L H L H V H V WRIT H H L H L L V L V WRITA H H L H L L V H V ACT H H L L H H V V V PRE H H L L H L V L X PALL H H L L H L X H X EMRS H H L L L L V* V V REF H H L L L H X X X SELF H L L L L H X X X H L H X X X X X X H L L H H H X X X L H H X X X X X X L H L H H H X X X Command Symbol Read Read with Auto Pre-charge Write Write with Auto Pre-charge Bank Activate Pre-charge Select Bank Pre-charge All Banks (Ext.) Mode Register Set Auto Refresh Self refresh entry Power Down Entry PDEN Power Down Exit PDEX CKE n-1 N /CS /RAS /CAS /WE A10 A12~A0 X X H = High level, L = Low level, X = High or Low level (Don't care), V = Valid data input * Please refers to the MRS, EMRS(1) & EMRS(2) setting 2. CKE Truth Table Item Command Any state *Note1 All Bank Idle Self Refresh Entry Self Refresh Self Refresh Exit All Bank Idle Active or Precharge Power Down Entry Power Down Power Down Exit Power Down Maintain power down Self Refresh Maintain self refresh Symbol CKE /CS /RAS /CAS /WE Addr. H V V V V V H L L L L H X NOP L H L H H H X DESL L H H X X X X DESL H L H X X X X NOP H L L H H H X DESL L H H X X X X NOP L H L H H H X - L L X X X X X - L L X X X X X n-1 n - H SELF H = High level, L = Low level, X = High or Low level (Don't care) Note1: Must be legal commands as defined in the command truth table. And any state other than list above. Dec. 2012 16/29 www.eorex.com EM44CM1688LBC 3. Operative Command Table Current State Idle Bank Active Read Write Dec. 2012 /CS /R /C /W Addr. Command H X X X X DESL NOP L H H H X NOP NOP L H L H BA/CA/A10 READ/READA ILLEGAL (Note 1) L H L L BA/CA/A10 WRIT/WRITA ILLEGAL (Note 1) L L H H BA/RA ACT L L H L BA, A10 PRE/PREA L L L H REF/SELF L L L L H L X H X H X H X Op-Code, Mode-Add X X L H L H BA/CA/A10 READ/READA L H L L BA/CA/A10 WRIT/WRITA L L H H BA/RA ACT L L H L BA/A10 PRE/PREA Precharge/Precharge all L L L H X REF/SELF ILLEGAL (Note 1) L L L L MRS/EMRS(1)(2) ILLEGAL (Note 1) H L L L X H H H X H L L X H H L Op-Code, Mode-Add X X BA/CA/A10 BA/CA/A10 L L H H BA/RA ACT ILLEGAL (Note 1) L L H L BA, A10 PRE/PREA ILLEGAL (Note 1) L L L H REF/SELF ILLEGAL (Note 1) L L L L MRS/EMRS(1)(2) ILLEGAL (Note 1) H L L X H H X H L X H H X Op-Code, Mode-Add X X BA/CA/A10 L H L L BA/CA/A10 L L H H BA/RA ACT ILLEGAL (Note 1) L L L L L L H L L L H L BA, A10 X Op-Code, PRE/PREA REF/SELF MRS/EMRS(1)(2) ILLEGAL (Note 1) ILLEGAL (Note 1) ILLEGAL (Note 1) MRS/EMRS(1)(2) DESL NOP DESL NOP READ/READA WRIT/WRITA Action Bank active,Latch RA NOP(Note 3) Auto/Self refresh(Note 4) Mode register NOP NOP Begin read,Latch CA, Determine auto-precharge Begin write,Latch CA, Determine auto-precharge ILLEGAL (Note 1) Row Active(Continue burst to end) Row Active(Continue burst to end) Burst Interrupt ILLEGAL(Note 1) DESL NOP READ/READA Write recovering (Continue burst to end) Write recovering (Continue burst to end) ILLEGAL(Note 1) WRIT/WRITA Burst Interrupt 17/29 www.eorex.com EM44CM1688LBC 3. Operative Command Table (Continued) Current State Read with AP Write with AP Pre-charging Row Activating /CS /R /C /W Addr. Command H X X X X DESL L H H H X NOP L H L H BA/CA/A10 READ/READA L H L L BA/CA/A10 WRIT/WRITA L L H H BA/A10 ACT ILLEGAL (Note 1) L L H L BA/A10 PRE/PREA ILLEGAL (Note 1) L L L H REF/SELF ILLEGAL (Note 1) L L L L X Op-Code, Mode-Add MRS/EMRS(1)(2) ILLEGAL (Note 1) H X X X X DESL L H H H X NOP L H L H BA/CA/A10 READ/READA L H L L BA/CA/A10 WRIT/WRITA ILLEGAL (Note 1) Action Precharging (Continue burst to end) Precharging (Continue burst to end) ILLEGAL (Note 1) ILLEGAL (Note 1) Write recover with auto precharge (Continue burst to end) Write recover with auto precharge (Continue burst to end) ILLEGAL (Note 1) L L H H BA/RA ACT ILLEGAL (Note 1) L L L L H L L H PRE/PREA ILLEGAL (Note 1) REF/SELF ILLEGAL (Note 1) L L L L MRS/EMRS(1)(2) ILLEGAL (Note 1) H L L X H H X H L X H H BA/A10 X Op-Code, Mode-Add X X BA/CA/A10 DESL NOP READ/READA NOP(idle after tRP) NOP(idle after tRP) ILLEGAL (Note 1) L H L L BA/CA/A10 WRIT/WRITA ILLEGAL (Note 1) L L H H BA/RA ACT ILLEGAL (Note 1) L L L L H L L H PRE/PREA NOP(idle after tRP) (Note 3) REF/SELF ILLEGAL (Note 1) L L L L MRS/EMRS(1)(2) ILLEGAL (Note 1) H L L X H H X H L X H H BA/A10 X Op-Code, Mode-Add X X BA/CA/A10 L H L L BA/CA/A10 WRIT/WRITA L L H H BA/RA ACT ILLEGAL (Note 1) L L H L BA/A10 PRE/PREA ILLEGAL (Note 1) L L L H REF/SELF ILLEGAL (Note 1) L L L L X Op-Code, Mode-Add MRS/EMRS(1)(2) ILLEGAL (Note 1) DESL NOP READ/READA NOP(Row active after tRCD) NOP(Row active after tRCD) ILLEGAL (Note 1) ILLEGAL (Note 1) H = High level, L = Low level, X = High or Low level (Don't care), AP = Auto Pre-charge Dec. 2012 18/29 www.eorex.com EM44CM1688LBC 3. Operative Command Table (Continued) Current State /CS /R /C /W Addr. Command H X X X X DESL NOP (enter bank active after tWR) L H H H X NOP NOP (enter bank active after tWR) L H L H BA/CA/A10 READ ILLEGAL (Note 1) Write L H L L BA/CA/A10 WRIT/WRITA Recovering L L H H BA/RA ACT ILLEGAL (Note 1) L L H L BA/A10 PRE/PREA ILLEGAL (Note 1) L L L H X REF/SELF ILLEGAL (Note 1) L L L L Op-Code, Mode-Add MRS/EMRS(1)(2) ILLEGAL (Note 1) H X X X X DESL NOP(idle after tRFC) L H H H X NOP NOP(idle after tRFC) L H L H BA/CA/A10 READ/READA ILLEGAL (Note 1) L H L L BA/CA/A10 WRIT/WRITA ILLEGAL (Note 1) L L H H BA/RA ACT ILLEGAL (Note 1) L L H L BA/A10 PRE/PREA ILLEGAL (Note 1) L L L H X REF/SELF ILLEGAL (Note 1) L L L L Op-Code, Mode-Add MRS/EMRS(1)(2) ILLEGAL (Note 1) Refreshing Action New write, Determine AP H = High level, L = Low level, X = High or Low level (Don't care), AP = Auto Pre-charge Note 1: ILLEGAL to bank in specified states; Function may be legal in the bank indicated by Bank Address (BA), depending on the state of that bank. Note 2: Must satisfy bus contention, bus turn around, and/or write recovery requirements. Note 3: NOP to bank precharging or in idle state.May precharge bank indicated by BA. Note 4: ILLEGAL of any bank is not idle. Dec. 2012 19/29 www.eorex.com EM44CM1688LBC 4. Command Truth Table for CKE Current State Self Refresh Both bank precharge power down All Banks Idle Any state other than listed above C H KE X /CS X X /R /C X /W X Addr. X Action INVALID L H H X X X X Exist Self-Refresh L H L H H H X L H L H H L X L H L H L X X Exist Self-Refresh ILLEGAL ILLEGAL L H L L X X X ILLEGAL L L X X X X X NOP(Maintain self refresh) H X X X X X X INVALID L H H X X X X L L L H H H L L L H H H H H L H L X X X X L H L L X X X Exist Power down Exist Power down ILLEGAL ILLEGAL ILLEGAL L L X X X X X NOP(Maintain Power down) H H X X X X X Refer to function true table H L H X X X X Enter power down mode(Note 3) H L L H H H X Enter power down mode(Note 3) H L L H H L X H H L L L L H L L H X H X RA H L L L L H X ILLEGAL ILLEGAL Row active/Bank active Enter self-refresh(Note 3) H L L L L L Op-Code Mode register access H L L L L L Op-Code Special mode register access L X X X X X X Refer to current state H H X X X X X Refer to command truth table H = High level, L = Low level, X = High or Low level (Don't care) Notes 1: After CKE’s low to high transition to exist self refresh mode.And a time of tRC(min) has to be Elapse after CKE’s low to high transition to issue a new command. Notes 2: CKE low to high transition is asynchronous as if restarts internal clock. Notes 3: Power down and self refresh can be entered only from the idle state of all banks. 5. Bank Selection Signal Table Bank\Signal Bank0 Bank1 Bank2 Bank3 Bank4 Bank5 Bank6 Bank7 Note: H:VIH, L:VIL Dec. 2012 BA0 L H L H L H L H BA1 L L H H L L H H BA2 L L L L H H H H 20/29 www.eorex.com EM44CM1688LBC Initialization The following sequence is required for power-up and initialization and is shown in below Figure: 1. Apply power and attempt to maintain CKE below 0.2 * VDDQ and ODT at a low state (all other inputs may be undefined). To guarantee ODT off, VREF must be valid and a low level must be applied to the ODT pin. - VDD, VDDL and VDDQ are driven from a single power converter output, and VTT is limited to 0.95 V max, and VREF tracks VDDQ/2 or - Apply VDD before or at the same time as VDDL; Apply VDDL before or at the same time as VDDQ; - Apply VDDQ before or at the same time as VTT & VREF. at least one of these two sets of conditions must be met. 2. Start clock (CK, /CK) and maintain stable power and clock condition for a minimum of 200 µs. 3. Apply NOP or Deselect commands & take CKE high. 4. Wait minimum of 400ns, then issue a Precharge-all command. 5. Issue Reserved command EMRS(2) or EMRS(3). 6. Issue EMRS(1) command to enable DLL. (A0=0 and BA0=1 and BA1=0) 7. Issue MRS Command (Mode Register Set) for "DLL reset". (A8=1 and BA0=BA1=0) 8. Issue Precharge-All command. 9. Issue 2 or more Auto-Refresh commands. 10. Issue a MRS command with low on A8 to initialize device operation. (Without resetting the DLL) 11. At least 200 clocks after step 8, execute OCD Calibration (Off Chip Driver impedance adjustment). If OCD calibration is not used, EMRS OCD Default command (A9=A8=A7=1) followed by EMRS(1) OCD Calibration Mode Exit command (A9=A8=A7=0) must be issued with other parameters of EMRS(1). 12. The DDR2 SDRAM is now initialized and ready for normal operation. Dec. 2012 21/29 www.eorex.com EM44CM1688LBC Mode Register Definition Mode Register Set The mode register stores the data for controlling the various operating modes of DDR2 SDRAM which contains addressing mode, burst length, /CAS latency, WR (write recovery), test mode, DLL reset and various vendor’s specific opinions. The defaults value of the register is not defined, so the mode register must be written after power up for proper DDR2 SDRAM operation. The mode register is written by asserting low on /CS, /RAS, /CAS, /WE and BA0/1. The state of the address pins A0-A12 in the same cycle as /CS, /RAS, /CAS, /WE and BA0/1 going low is written in the mode register. Two clock cycles are requested to complete the write operation in the mode register. The mode register contents can be changed using the same command and clock cycle requirements during operating as long as all banks are in the idle state. The mode register is divided into various fields depending on functionality. The burst length uses A0-A2, addressing mode uses A3, /CAS latency (read latency from column address) uses A4-A6. A7 is used for test mode. A8 is used for DDR reset. A9 ~ A11 are used for write recovery time (WR), A7 must be set to low for normal MRS operation. With address bit A12 two Power-Down modes can be selected, a “standard mode” and a “low-power” Power-Down mode. Dec. 2012 22/29 www.eorex.com EM44CM1688LBC Address input for Mode Register Set BA2 BA1 BA0 A15 A14 A13 A12 A11 0 0 0 0 0 0 PD Write Recovery MRS Mode BA1 BA0 MRS 0 0 EMRS(1) EMRS(2) EMRS(3) Reserved 0 1 1 0 1 1 A9 DLL Rest No Yes Active power down exit time A12 Fast exit Slow exit 0 1 Write recovery Reserved 2 3 4 5 6 7 8 A10 A11 0 0 0 0 1 1 1 1 A8 A7 A6 DLL TM CAS Latency A4 A8 0 1 Mode Normal Test A10 0 0 1 1 0 0 1 1 A5 A9 0 1 0 1 0 1 0 1 A3 A2 BT Burst Latency Burst 4 8 A7 0 1 CAS Latency Reserved Reserved Reserved Reserved Reserved 5 6 Reserved A1 A2 0 0 Burst Type Sequential Interleave A6 0 0 0 0 1 1 1 1 A5 0 0 1 1 0 0 1 1 A0 A1 1 1 A0 0 1 A3 0 1 A4 0 1 0 1 0 1 0 1 * A13,A14,A15 is reserved for future use. Dec. 2012 23/29 www.eorex.com EM44CM1688LBC Burst Type (A3) Burst Length 4 8 A2 A1 A0 Sequential Addressing Interleave Addressing X 0 0 0123 0123 X 0 1 1230 1032 X 1 0 2301 2301 X 1 1 3012 3210 0 0 0 01234567 01234567 0 0 1 12345670 10325476 0 1 0 23456701 23016745 0 1 1 34567012 32107654 1 0 0 45670123 45670123 1 0 1 56701234 54761032 1 1 0 67012345 67452301 1 1 1 70123456 76543210 *Page length is a function of I/O organization and column addressing Write Recovery WR (Write Recovery) is for Writes with Auto-Precharge only and defines the time when the device starts pre-charge internally. WR must be programmed to match the minimum requirement for the analogue tWR timing. Power-Down Mode Active power-down (PD) mode is defined by bit A12. PD mode allows the user to determine the active power-down mode, which determines performance vs. power savings. PD mode bit A12 does not apply to precharge power-down mode. When bit A12 = 0, standard Active Power-down mode or ‘fast-exit’ active power-down mode is enabled. The tXARD parameter is used for ‘fast-exit’ active power-down exit timing. The DLL is expected to be enabled and running during this mode. When bit M12 = 1, a lower power active power-down mode or ‘slow-exit’ active power-down mode is enabled. The tXARDS parameter is used for ‘slow-exit’ active power-down exit timing. The DLL can be enabled, but ‘frozen’ during active power-down mode since the exit-to-READ command timing is relaxed. The power difference expected between PD ‘normal’ and PD ‘low-power’ mode is defined in the IDD table. Dec. 2012 24/29 www.eorex.com EM44CM1688LBC Extended Mode Register Set EMRS(1 ) The EMRS (1) is written by asserting low on /CS, /RAS, /CAS, /WE,BA1 and high on BA0 ( The DDR2 should be in all bank pre-charge with CKE already prior to writing into the extended mode register. ) The extended mode register EMRS(1) stores the data for enabling or disabling the DLL, output driver strength, additive latency, OCD program, ODT, DQS and output buffers disable, RQDS and RDQS enable. The default value of the extended mode register EMRS(1) is not defined, therefore the extended mode register must be written after power-up for proper operation. The mode register set command cycle time (tMRD) must be satisfied to complete the write operation to the EMRS(1). Mode register contents can be changed using the same command and clock cycle requirements during normal operation when all banks are in pre-charge state. BA2 BA1 BA0 A15 A14 A13 A12 A11 A10 0 0 1 0 0 0 Qoff RDQS /DQS Qoff (Output Buffer) A12 Enabled 0 Disabled 1 RDQS enable A11 Disable 0 Enable 1 OCD Calibration Program A9 A9 A8 A7 OCD program /DQS A10 Enable 0 Disable 1 A8 A5 A4 A3 Additive latency A2 A1 A0 Rtt DIC DLL DLL A0 Enable 0 Disable 1 Output Driver Impedance Control A1 A7 Normal (100%) 0 Weak (60%) 1 OCD Calibration mode exit 0 0 0 Drive (1) 0 0 1 Drive (0) 0 1 0 Adjust mode (*1) 1 0 0 OCD Calibration default (*2) 1 1 1 *1: When adjust mode is issued, AL from previously set value must b e applied. *2: After setting to default, OCD mode needs to be exited by settin g A9-A7 to 000. Refer to the section Off -Chip Driver (OCD) impedance adjustment for detail information Rtt A6 A2 ODT Disable 0 0 75 ohm 0 1 150 ohm 1 0 50 ohm 1 1 Additive Latency A5 A4 A3 0 0 0 0 MRS Mode BA1 BA0 1 0 0 1 MRS 0 0 2 0 1 0 EMRS(1) 0 1 3 0 1 1 EMRS(2) 1 0 4 1 0 0 EMRS(3) Reserved 1 1 5 1 0 1 Reserved 1 1 0 Reserved 1 1 1 *A13,A14,A15 is reserved for future use. Dec. 2012 A6 Rtt 25/29 www.eorex.com EM44CM1688LBC Output Drive Strength The output drive strength is defined by bit A1. Normal drive strength outputs are specified to be SSTL_18. Programming bit A1 = 0 selects normal (100 %) drive strength for all outputs. Programming bit A1 = 1 will reduce all outputs to approximately 60 % of the SSTL_18 drive strength. This option is intended for the support of the lighter load and/or point-to-point environments. Single-ended and Differential Data Strobe Signals EMRS Strobe Function Matrix Signals A11 (/RDQS Enable) A10 (/DQS Enable) RDQS DM /RDQS DQS /DQS 0 (Disable) 0 (Enable) DM Hi-Z DQS /DQS Differential DQS signal 0 (Disable) 1 (Disable) DM Hi-Z DQS Hi-Z Single-ended DQS signal 1 (Enable) 0 (Enable) RDQS /RDQS DQS /DQS Differential DQS signal 1 (Enable) 1 (Disable) RDQS Hi-Z DQS Hi-Z Single-ended DQS signal Output Disable (Qoff) Under normal operation, the DRAM outputs are enabled during Read operation for driving data Qoff bit in the EMRS(1) is set to (0). When the Qoff bit is set to 1, the DRAM outputs will be disabled. Disabling the DRAM outputs allows users to measure IDD currents during Read operations, without including the output buffer current. Dec. 2012 26/29 www.eorex.com EM44CM1688LBC Address input for Extended Mode Register Set EMRS(2) Dec. 2012 27/29 www.eorex.com EM44CM1688LBC On-Die Termination (ODT) ODT (On-Die Termination) is a new feature on DDR2 components that allows a DRAM to turn on/off termination resistance for each UDQ, LDQ, UDQS, UDQS, LDQS, LDQS, UDM and LDM signal via the ODT control pin for x16 configuration, where UDQS and LDQS are terminated only when enabled in the EMRS(1) by address bit A10 = 0. The ODT feature is designed to improve signal integrity of the memory channel by allowing the DRAM controller to independently turn on/off termination resistance for any or all DRAM devices. The ODT function can be used for all active and standby modes. ODT is turned off and not supported in Self- Refresh mode. ODT Function Switch sw1 or sw2 is enabled by the ODT pin. Selection between sw1 or sw2 is determined by “Rtt (nominal)” in EMRS(1) address bits A6 & A2. Target Rtt = 0.5 * Rval1 or 0.5 * Rval2. The ODT pin will be ignored if the EMRS(1) is programmed to disable ODT. Dec. 2012 28/29 www.eorex.com EM44CM1688LBC Package Description: 84Ball-FBGA Solder ball: Lead free (Sn-Ag-Cu) Unit: mm 6.4 A1 9 8 7 6 5 4 3 2 1 A 0 .80 B C D E F G 11.2 12 .5 ± 0.1 H J K L 5. 6 ± 0.05 M N P R 0.80 1.6 8±0.1 1.2 MAX 0.35 ± 0.05 0.45 ± 0.05 Dec. 2012 29/29 0.12 MAX www.eorex.com