TB6588FG TOSHIBA BiCD Integrated Circuit Silicon Monolithic TB6588FG 3-Phase Full-Wave PWM Driver for Sensorless DC Motors The TB6588FG is a three-phase full-wave PWM driver for sensorless brushless DC (BLDC) motors. It controls rotation speed by changing the PWM duty cycle, based on the voltage of an analog control input. Features • Sensorless drive in three-phase full-wave mode • PWM chopper control • Controls the PWM duty cycle, based on an analog input (7-bit ADC) • Output current: IOUT = 1.5 A typ. (2.5 A max) Weight: 0.79 g (typ.) • Power supply: VM = 7 to 42 V (50 V max) • Overcurrent protection • Forward and reverse rotation • Lead angle control (0°, 7.5°, 15°, 30°) • Overlapping commutation • Rotation speed detecting signal • DC excitation mode to improve starting characteristics • Adjustable DC excitation time and forced commutation time for a startup operation • Forced commutation frequency control: fosc/(6 × 216), fosc/(6 × 217), fosc/(6 × 218), fosc/(6 × 219) 1 2008-4-25 TB6588FG Pin Assignment 1 36 VM3 U 2 35 N.C. V 3 34 LA1 CW_CCW 4 33 LA2 EN 5 32 FPWM N.C. 6 31 FST1 FMAX 7 30 FST2 SEL_LAP 8 29 FG_OUT IR1 9 28 IR3 Fin Fin IR2 10 27 OSC_R N.C. 11 26 OSC_C W 12 25 IP PGND 13 24 START OC 14 23 SC WAVEP 15 22 VSP WAVEM 16 21 VREF 17 20 WAVE 18 19 SGND2 VM1 VM2 SGND1 2 2008-4-25 TB6588FG Pin Description Pin No. Symbol I/O Description 1 VM1 ⎯ Motor power supply pin (VM = 7 to 42 V). VM1, VM2 and VM3 are connected together inside the IC. 2 U O U-phase output 3 V O V-phase output 4 CW_CCW I Rotation direction select input (This pin has a pull-up resistor.) H or open: Clockwise (U → V → W) L: Counterclockwise (U → W → V) Protection enable input (This pin has a pull-up resistor.) This input determines whether or not to enable the protection functionality when either of the following conditions is true: a) the maximum commutation frequency is exceeded. b) the rotation speed falls below the forced commutation frequency. H or open: Protection functionality enabled L: Protection functionality disabled 5 EN I 6 N.C. ⎯ No-connect 7 FMAX I Selects the upper limit of the maximum commutation frequency. (This pin has a pull-up resistor.) Maximum commutation frequency (fMAX): cycles per second equivalent to an electrical degree 11 H or open: fMAX ∼ Example: fMAX ∼ − fosc/3 × 212 − 0.8 kHz @ fosc = 5 MHz L: fMAX ∼ Example: fMAX ∼ − fosc/3 × 2 − 0.4 kHz @ fosc = 5 MHz 8 SEL_LAP I Overlapping commutation select pin (This pin has a pull-up resistor.) H or open: 120°commutation L: Overlapping commutation 9 IR1 O Connection pins for an output shunt resistor (IR1 and IR2 are connected together inside the IC. However, IR3 is not connected to IR1 or IR2 inside the IC; these three pins must be connected together externally.) 10 IR2 11 N.C. ⎯ No connect 12 W O W-phase output 13 PGND ⎯ Power ground pin 14 OC I Overcurrent detection input (This pin has a pull-down resistor.) All PWM output signals are stopped when OC ≥ 0.5 V (typ). 15 WAVEP I Positive (+) position signal input 16 WAVEM I Negative (−) position signal input 17 VM2 ⎯ Motor power supply pin (VM = 7 to 42 V). VM1, VM2 and VM3 are connected together inside the IC. 18 SGND1 ⎯ Signal ground pin (SGND1 and SGND2 are connected together inside the IC.) 19 SGND2 20 WAVE O Position signal output Provides a majority of the voltages of the three phase signals. 21 VREF O Reference voltage output; VREF = 5 V (typ.) 22 VSP I Duty cycle/motor speed control input (This pin has a pull-down resistor.) Duty = 0% 0 ≤ VSP < VAD (L): VAD (L) ≤ VSP ≤ VAD (H): Sets the PWM duty cycle, based on the analog input. VAD (H) < VSP ≤ VREF: ≈100% duty cycle (127/128) 23 SC I Connection pin for a capacitor to set the startup commutation time and the ramp-up time for the on state. 24 START O 25 IP I 26 OSC_C 27 OSC_R 28 IR3 DC excitation time setting pins When VSP ≥ 1 V (typ.), START is driven low, starting DC excitation. When the IP voltage has reached VREF/2, the TB6588FG switches to forced commutation mode. ⎯ OSC_C: Connection pins for the oscillator capacitor OSC_R: Connection pins for the oscillator resistor Example: Internal oscillating frequency (fosc) ∼ − 5.25 MHz (typ.) when OSC_C = 100 pF and OSC_R = 20 kΩ O Connection pin for an output shunt resistor (IR1 and IR2 are connected together inside the IC. However, IR3 is not connected to IR1 or IR2 inside the IC; these three pins must be connected together externally.) 3 2008-4-25 TB6588FG Pin No. Symbol I/O Description O Rotation speed output pin (open-drain) This output is held low at startup and when an abnormality is detected. In sensorless mode, pulses are generated at 3 ppr according to the back-EMF. Note: 3 ppr = 3 pulses per electrical degree (With a four-pole motor, six pulses are generated per revolution.) I Forced commutation frequency select inputs (These pins have a pull-down resistor.) Forced commutation frequency: cycles per second equivalent to an electrical degree 16 FST2: FST1 = H: H: fST ∼ − fosc/(6 × 217) → 12.7 Hz @ fosc = 5 MHz FST2: FST1 = H: L or Open: fST ∼ − fosc/(6 × 218) → 6.4 Hz @ fosc = 5 MHz FST2: FST1 = L or Open: H: fST ∼ − fosc/(6 × 219) → 3.2 Hz @ fosc = 5 MHz FST2: FST1 = L or Open: L or Open: fST ∼ − fosc/(6 × 2 ) → 1.6 Hz @ fosc = 5 MHz I PWM frequency (fPWM) select input (This pin has a pull-down resistor.) H: fPWM ∼ − fosc/128) → fPWM ∼ − 39 kHz @ fosc = 5 MHz L or Open: fPWM ∼ − fosc/256) → fPWM ∼ − 19.5 kHz @ fosc = 5 MHz I Lead angle select input (These pins have a pull-up resistor.) LA2: LA1 ∼ − H or Open : H or Open : 30° lead angleI LA2: LA1 ∼ : 15° lead angle − H or Open : L LA2: LA1 ∼ : H or Open : 7.5° lead angle −L LA2: LA1 ∼ :L : 0° lead angle −L 29 FG_OUT 30 FST2 31 FST1 32 FPWM 33 LA2 34 LA1 35 N.C. ⎯ No connect 36 VM3 ⎯ Motor power supply pin (VM = 7 to 42 V). VM1, VM2 and VM3 are connected together inside the IC. Fin Fin ⎯ Fin This pin provides for thermal dissipation. Board traces should be designed, considering thermal dissipation from the IC. (Since the fin and the package bottom are electrically connected, the Fin pin should be connected to insulation or ground.) 4 2008-4-25 TB6588FG Functional Description 1. Sensorless Drive Mode Based on the analog voltage input for a startup operation, the rotor is aligned to a known position in DC excitation mode. Then the forced commutation signal is generated to start the motor rotation. As the motor rotates, the back-EMF occurs in each phase of the coil. When a signal indicating the polarity of three phase voltage of the motor, including the back-EMF, is detected at the position signal inputs (WAVEP, WAVEM), the motor driving signal is automatically switched from the forced commutation PWM signal to the normal commutation PWM signal that is based on the position signal input (back-EMF). Then, a BLDC motor starts running in sensorless commutation mode. 2. Startup Operation At startup, no induced voltage is generated due to the stationary motor, and the rotor position cannot be detected in sensorless mode. Therefore, the TB6588FG rotor is first aligned to a known position in DC excitation mode for an appropriate period of time, and then the motor is started in forced commutation mode. The DC excitation and forced commutation times are determined by external capacitors. These time settings vary depending on the motor type and load, so that they should be adjusted experimentally. VSP ≥ 1.0 (V) VSP VSP VAD (L) TUP SC START TUP (typ.) = C1 × VSP/4.5 µA (s) VREF IP VREF/2 VSP (a) (b) VSP GND TFIX (a): DC excitation time: TFIX (typ.) = 0.69 × C2 × R1 (s) (b): Forced commutation time C1 TB6588FG SC START IP R1 C2 The rotor is aligned to a known position specified in DC excitation mode for the period of (a), during which the IP pin voltage decreases from VREF to VREF/2. The time constant for the period is determined by C2 and R1. Then, operation mode is switched to forced commutation mode for the period of (b) as shown above. The duty cycles for DC excitation and forced commutation modes are determined according to the SC pin voltage. When the motor rotation frequency exceeds the forced commutation frequency specified by FST1 and FST2, the operation mode is switched to the sensorless mode. The duty cycle for sensorless mode is determined by VSP. 5 2008-4-25 TB6588FG 3. SC Signal Delay in Rotational Speed Control (VSP follow-up property of SC) The rotational speed and the starting and stopping of the motor are controlled based on an analog voltage at the VSP input. However, the actual operation of the IC is determined by the voltage applied to the SC pin. The voltage at the SC pin equals the charging voltage of the capacitor C1, which is determined by the charging/discharging time of C1. This causes a delay in the SC voltage level relative to the VSP input. When the voltage at the VSP pin rises from 1 to 4 V, the SC signal delay occurs as shown below. VSPU VSPL VSP VSPU VSPL SC TUP TDOWN • Charging time of C1 (when accelerating): TUP (typ.) = C1 × (VSPU − VSPL)/4.5 µA (s) • Discharging time of C1 (when decelerating): TDOWN (typ.) = C1 × (VSPU − VSPL)/37 µA (s) Note: When the motor is stopped (VSP < 1 V), the capacitor C1 at the SC pin is instantly discharged. (The C1 is discharged through 2 kΩ (typ.) to GND.) 4. Forced Commutation Frequency The forced commutation frequency at startup is determined as follows. Since the optimal frequency varies depending on the motor type and load, it must be adjusted experimentally. The forced commutation frequency is determined by the value of external capacitor and resistor, and the logic level of the FST1 and FST2 pins (These pins have a pull-down resistor). FST2: FST1 = H :H : Forced commutation frequency fST ∼ − fosc/(6 × 216) FST2: FST1 = H : L or Open : Forced commutation frequency fST ∼ − fosc/(6 × 217) FST2: FST1 = L or Open : H : Forced commutation frequency fST ∼ − fosc/(6 × 218) FST2: FST1 = L or Open : L or Open : Forced commutation frequency fST ∼ − fosc/(6 × 219) 5. PWM Frequency The PWM frequency is determined by the value of the external capacitor and resistor, and the logic level of the FPWM pin (which has a pull-down resistor). FPWM: H or Open: fPWM = fosc/128 FPWM: L or Open: fPWM = fosc/256 The PWM frequency must be sufficiently high relative to the electrical frequency of the motor and within the range permitted by the driver circuit. The PWM turn the high-side output transistors off. PWM signal driving high-side transistors PWM signal driving low-side transistors Motor terminal voltage 6 2008-4-25 TB6588FG 6. Motor Speed Control Pin (VSP) An analog voltage applied to the VSP pin is converted by a 7-bit AD converter and used to control the duty cycle of the PWM. 0 ≤ VSP < VAD (L) → Duty cycle = 0% VAD (L) ≤ VSP ≤ VAD (H) → Figure on the right (1/128 to 127/128) VAD (H) < VSP ≤ VREF → Duty cycle ≈ 100% (127/128) Duty Cycle 100% 0% VAD (L) VSP VAD (H) 7. Fault Protection Operation The logic level of the EN pin determines whether to enable the protection functionality. (The EN pin has a pull-up resistor.) H or Open : Protection functionality enabled L : Protection functionality disabled When a behavior as shown below is detected via the WAVEP and WAVEM pins, as the motor is deemed to be in an abnormal state and the output transistors are turned off. About one second later, the motor is restarted. The device begins cycling into and out of the protection mode if the abnormality persists. • The maximum commutation frequency is exceeded. • The rotation speed falls below the forced commutation frequency. VSP = 1 V or higher VSP Output pin ON OFF When the SC pin capacitor = 0.47 µF and VSP = 4 V ON (a): TOFF = CSC × (VSP − 1) i = 0.47μF × (4 − 1) 1.6μA START = 880 ms (typ.) IP (a) SC VSP 1V Fault detected 7 2008-4-25 TB6588FG 8. Motor Position Detection Error The position detection is performed synchronizing with the PWM signal generated in the IC. Thus, a position detection error related to the PWM signal frequency is induced. Care should be taken when the TB6588FG is used in high-speed motor applications. The detection is performed on the falling edge of the PWM signal. An error is recognized when the terminal voltage exceeds the reference voltage. Detection lag < 1/fp fp: PWM frequency = fosc/256, fosc/128 fosc: Internal oscillating frequency Output: ON Internal PWM signal Terminal voltage Terminal voltage Reference voltage Position detection Ideal detection timing 8 Actual detection timing 2008-4-25 TB6588FG 9. Lead Angle Control The TB6588FG runs in forced commutation mode with a lead angle of 0° at startup. After switching to normal commutation mode, the lead angle is automatically changed to the value set by the LA1 and LA2 pins. U Induced voltage PWM signal (1) Lead angle of 0° V W 30° U V W (2) Lead angle of 7.5° 22.5° U V W (3) Lead angle of 15° 15° U V W (4) Lead angle of 30° 0° U V W 10. Overlapping Commutation Control When SEL_LAP = High, the TB6588FG runs in 120° commutation mode; When SEL_LAP = Low, it runs in overlapping commutation mode. In overlapping commutation mode, there occurs an overlapping period due to the lengthened commutation time between the zero cross point and the 120° commutation timing upon PWM signal switching as shown in the shaded areas. These periods vary depending on the lead angle setting. U Induced voltage PWM signal (1) Lead angle of 0° V W 30° U V W (2) Lead angle of 7.5° 22.5° U V W (3) Lead angle of 15° 15° U V W (4) Lead angle of 30° 0° U V W 9 2008-4-25 TB6588FG 11. Thermal Shutdown (TSD) Circuit (Note) When the die temperature exceeds the rated TSD temperature, the TSD circuit detects it as the abnormal state of the motor and the output transistors are turned off. At the same time, START and SC are set High and Low respectively. After the TSD circuit is disabled, the TB6588FG restarts its operation following the startup sequence. VSP = 1 V or higher VSP Output pin ON OFF ON START IP SC VSP 1V GND TSD TSD Return 165°C 150°C (Reference value) (Reference value) Note: The TSD circuit is not intended to provide protection against all abnormal conditions. Therefore, the TB6588FG should exit the abnormal state immediately after the TSD circuit is enabled. If the device is used beyond the maximum ratings, the TSD circuit may not operate properly, or the device may break down before the protection circuit is activated. Also, if the motor keeps running due to inertia after the TSD circuit is activated, the startup sequence may lose synchronization with the motor rotation, which may prevent the motor from restarting after the TSD circuit is disabled. Thus, for a restart operation after the TSD circuit operation, it should be ensured that the motor be stopped once before being restarted. 10 2008-4-25 TB6588FG 12. Overcurrent Protection Circuit (Note) The overcurrent protection circuit limits the current by turning the high-side output transistors off. The output current is monitored as a voltage across R1. If it exceeds the rated VOC voltage (0.5 V (typ.)), the protection functionality is enabled. The current value that trips the overcurrent protection circuit is calculated as: IOUT = Overcurrent detection voltage VOC/Resistor value R1 R2 and C2 used as an RC filter should be adjusted properly to prevent the malfunction of the overcurrent protection circuit due to the PWM switching noise. Example: When R1 = 0.33 [Ω], IOUT (typ.) = 0.5 [V] (typ.)/0.33 [Ω] ∼ − 1.5 [A] VM3 VM1 VM2 TB6588FG U V VOC = 0.5 V W 100 kΩ 5 pF 200 kΩ OC IR3 IR1 IR2 R2 R1 C2 IOUT Note: The overcurrent protection circuit (normally a current limiter) is not intended to provide protection against all abnormal conditions. Therefore, the TB6588FG should exit the abnormal state immediately after the overcurrent protection circuit is enabled. If the device is used beyond the maximum ratings, the overcurrent protection circuit may not operate properly, or the device may break down before the protection circuit is activated. Also, if the overcurrent still persists after the protection circuit is activated, the device may be destroyed due to overheating. If the overcurrent protection circuit remains active, the timing of the position detection that is performed synchronously with the PWM signal changes. Thus, the motor may lose synchronization. Therefore, the overcurrent protection circuit must be configured not to operate under normal operation. 11 2008-4-25 TB6588FG Input Equivalent Circuits Some parts are omitted from the equivalent circuit diagrams or simplified for the sake of simplicity. 1. VSP 2. SC VREF 3. 100 kΩ VSP VREF VREF SC 4. FPWM, FST1, FST2 CW_CCW, LA1, LA2, FMAX, SEL_LAP, EN VREF VREF 100 kΩ VREF Input 100 kΩ Input WAVE, WAVEM, WAVEP 6. OC VREF 100 kΩ OC WAVE FG_OUT 8. 0.5 V 200 kΩ WAVEM WAVEP 7. VREF 5 pF 5. U, V, W VM1,VM2,VM3 VREF 100 Ω U W V FG_OUT IR3 IR2 IR1 9. IP 10. START VREF VREF 100 Ω IP START 12 2008-4-25 TB6588FG 11. OSC_R,OSC_C VREF VREF 12. VREF VREF VREF VREF VM VM VREF OSC_R OSC_C 13 2008-4-25 TB6588FG Absolute Maximum Ratings (Ta = 25°C) Characteristics Power supply voltage Symbol Rating Unit VM 50 V VIN1 (Note 1) −0.3 to VREF + 0.3 Input voltage PWM signal output current IOUT Power dissipation V −0.3 to 30 VIN2 (Note 2) 2.5 (Note 3) V 1.3 (Note 4) PD W 3.2 (Note 5) Operating temperature Topr −30 to 105 °C Storage temperature Tstg −55 to 150 °C Note 1: VIN1 is applicable to the voltage at the following pins: FPWN, FMAX, VSP, CW_CCW, LA1, LA2, OC, SEL_LAP, FST1, FST2 and EN Note 2: VIN2 is applicable to the voltage at the following pins: WAVEP, WAVEM Note 3: Output current may be limited by the ambient temperature or a heatsink. The maximum junction temperature should not exceed Tjmax = 150°C. Note 4: Measured for the IC only. (Ta = 25°C) Note 5: Measured when mounted on the board. (140 mm × 70 mm × 1.6 mm, Cu 50%, Rth (j-a): 39°C/W) Operating Ranges (Ta = −30 to 105°C) Characteristics Symbol Min Typ. Max Unit VM 7 24 42 V VIN1 (Note 1) GND ⎯ VREF V Power supply voltage Input voltage Package Power Dissipation PD – Ta 3.5 (3) (W) 3 Power Dissipation PD 2.5 2 (2) 1.5 1 (1) 0.5 0 0 25 50 75 Ambient Temperature (1) 100 Ta 125 150 (°C) Rth (j-a) only (96°C/W) (2) When mounted on the board (114 mm × 75 mm × 1.6 mm, Cu 20% , Rth (j-a): 65°C/W) (3) When mounted on the board (140 mm × 70 mm × 1.6 mm, Cu 50% , Rth (j-a): 39°C/W) 14 2008-4-25 TB6588FG Electrical Characteristics (Ta = 25 °C, VM = 24 V, unless otherwise specified) Characteristics Symbol Static power supply current at VM IM Dynamic power supply current at VM Input current Input offset voltage Test Conditions Min Typ. Max Unit VSP = 0 V, OSC_C = 0 V ⎯ 3.5 6 mA IM (opr) VSP = 2.5 V, Output: Open (OSC_C = 100 pF,OSC_R = 20 kΩ) ⎯ 4.5 8 mA IIN-1 (H) VIN = VREF, SEL_LAP,FMAX CW_CCW, LA1, LA2, EN ⎯ 0 1 IIN-1 (L) VIN = 0 V, SEL_LAP,FMAX CW_CCW, LA1, LA2, EN −75 −50 ⎯ IIN-2 (H) VIN = VREF, OC,FST1, FST2, FPWM ⎯ 50 75 IIN-2 (L) VIN = 0 V, OC, FST1, FST2, FPWM −1 0 ⎯ IIN-3 (H) VIN = VREF, VSP ⎯ 90 150 IIN-3 (L) VIN = 0 V, VSP −1 0 ⎯ IIN-4 (H) WAVEM; WAVEM = VM/2,WAVEP= 0V WAVEP; WAVEM = VM/2,WAVEP = VM ⎯ 0 0.25 IIN-4 (L) WAVEM; WAVEM= VM/2,WAVEP = VM WAVEP; WAVEM = VM/2,WAVEP = 0V -0.25 -0.1 ⎯ WAVE; WAVEP-WAVEM −6 4 14 VIN-1 (H) SEL_LAP, CW_CCW, LA1, LA2, FMAX, FST1, FST2, EN, FPWM 3.5 ⎯ VREF VIN-1 (L) SEL_LAP, CW_CCW, LA1, LA2, FMAX, FST1, FST2, EN, FPWM GND ⎯ 1.5 ⎯ 0.45 ⎯ GND ⎯ 0.5 V ⎯ 0 10 µA VINO Input voltage Input voltage hysteresis VH IP VFG_OUT IFG_OUT =1 mA FG_OUT leakage current ILFG_OUT VFG_OUT = 5.5 V Output leakage current PWM input voltage RON (H) IOUT = 1.5 A U, V, W ⎯ 0.3 0.35 RON(L) IOUT = −1.5 A U, V, W ⎯ 0.3 0.35 V Ω IL (H) VOUT = 0 V U, V, W ⎯ 0 1 IL (L) VOUT = 50 V U, V, W ⎯ 0 1 1.0 1.2 1.4 3.9 4.1 4.3 SC VSP = 2.5 V 3.0 4.5 6.5 µA ⎯ 880 ⎯ ms 0.46 0.5 0.54 V VAD (L) VSP FPWM = L (OSC_C = 100 pF, OSC_R = 20 kΩ) VAD (H) ISC Fault recovery time TOFF VSP = 4 V, SC pin = 0.47 µF Overcurrent detection voltage VOC OC FC H FPWM = H (OSC_C = 100 pF, OSC_R = 20 kΩ) 36 40 44 FC L FPWM = L (OSC_C = 100 pF, OSC_R = 20 kΩ) 18 20 22 TSD Thermal shutdown temperature (Design target only.) 150 165 180 Thermal shutdown hysteresis (Design target only.) ⎯ 15 ⎯ IVREF = −1 mA 4.5 5 5.5 PWM frequency Thermal shutdown TSDhys VREF 15 µA V CSC charge current VREF output voltage mV V Low-level FG_OUT output voltage Output ON-resistance µA kHz °C V 2008-4-25 TB6588FG Application Circuit Example VM = 10~42V VREF FG_OUT VM1 VM2 VM3 0.1µF 10 kΩ 22 µF FPWM 0.1µF 0.47µF MCU Reference voltage circuit VSP Speed control input (analog voltage) Startup time setting 7-bit AD converter PWM control 220 kΩ IP FST1 FST2 FMAX LA1 PWM signal generator 1-phase excitation control circuit V W Startup commutation frequency setting Timing setting SBD IR3 IR2 Maximum commutation frequency setting IR1 TSD LA2 U Lead angle setting Overcurrent protection circuit OC 100 kΩ × 3 VREF START 1µF 0.47 µF SC CW_CCW OSC_R SGND2 SGND1 PGND Fin WAVEM WAVE R1 C1 20 kΩ 100pF OSC_C Position detection circuit C2 WAVEP Clock generation 10 kΩ EN 10 kΩ SEL_LAP Note 1: Utmost care is necessary in the design of the output, VM, and GND lines since the IC may be destroyed in case of a short-circuit across outputs, a short-circuit to power supply, or a short-circuit to ground. Note 2: The above application circuit including constant values is provided only as a guide. Since each value may vary depending on the motor type, the optimal values must be determined experimentally. Note 3: C1, C2 and R1 should be connected, if necessary, to prevent malfunction due to noise. Note 4: A Schottky barrier diode (SBD; Toshiba CMS15) must be connected externally between W and GND to ensure smooth current recovery upon output switching. 16 2008-4-25 TB6588FG Package Dimensions Weight: 0.79 g (typ.) 17 2008-4-25 TB6588FG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 18 2008-4-25 TB6588FG Points to Remember on Handling of ICs (1) Over current protection circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal shutdown circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat radiation design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. (5) Damage due to Short-Circuits Between Neighboring Pin Short-circuits between pins 1 and 2, pins 3 and 4 and pins 12 and 13 cause permanent damage to the TB6588FG. As a result, a large current continuously flow into the device, leading to smoke and possibly fire. To avoid this, the device application should be designed and adjusted properly, including the external fail-safe mechanism, such as power supply fuses and overcurrent protection circuitry for power supply. To minimize the effect of such a current flow in case of damage, ensure that the fuse capacity, fusing time and overcurrent protection circuitry are properly adjusted. 19 2008-4-25 TB6588FG RESTRICTIONS ON PRODUCT USE 070122EBA_R6 • The information contained herein is subject to change without notice. 021023_D • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. 070122_C • Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_AF • The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E 20 2008-4-25