CHENDA BZT52C27S

BZT52C2V4S-BZT52C39S
ZENER DIODE
SOD-323
FEATURES
1.35(0.053)
1.26(.050)
1.15(0.045)
1.24(.048)
Planar die construction
Ultra-Small surface mount package
Ideally suited for automated assembly processes
2.75(0.108)
1.80(0.071)
2.75(0.108)
1.80(0.071)
2.30(0.091)
1.60(0.063)
2.30(0.091)
1.60(0.063)
MECHANICAL DATA
0.4(0.016)
.305(0.012)
.25(0.010)
.295(0.010)
.177(.007)
.089(.003)
1.00(.040)
0.1(0.004)
0.80(.031)
MIN
.72(0.028)
.69(0.027)
Case: Molded plastic body
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Polarity: Polarity symbols marked on case
.08(.003)
MIN
Dimensions in millimeters and (inches)
Maximum ratings (Tamb=25C unless otherwise specified)
PARAMETER
Forward voltage (Note 2)
@IF=10mA
Power dissipation (Note1)
Thermal resistance, Junction to ambient air (Note1)
Operating and storage temperature range
UNITS
SYMBOLS
Limits
VF
0.9
V
Pd
200
mW
RΘJA
625
C/W
TJ,TSTG
-65 to +150
C
NOTES: 1.Valid provided that device terminals are kept at ambient temperature.
2.Short duration test pulse used in minimize self-heating effect.
3.f=1KHz.
MDD ELECTRONIC
ELECTRICAL CHARACTERISTICS (@ TA=25C unless otherwise specified)
Type Number
Type
Code
Zener Voltage Range (Note 2)
[email protected]
Izr
Nom(V) Min(V) Max(V) mA
2.2
5
2.4
2.6
2.5
5
2.7
2.9
2.8
5
3.0
3.2
3.1
5
3.3
3.5
3.4
5
3.6
3.8
3.7
5
3.9
4.1
4.0
5
4.3
4.6
4.4
5
4.7
5.0
4.8
5
5.1
5.4
5.2
5
5.6
6.0
5.8
5
6.2
6.6
6.4
5
6.8
7.2
7.0
5
7.5
7.9
7.7
5
8.2
8.7
8.5
5
9.1
9.6
9.4
10
10.6 5
10.4 11.6
5
11
11.4 12.7 5
12
12.4 14.1 5
13
13.8 15.6 5
15
15.3 17.1 5
16
16.8 19.1 5
18
18.8 21.2 5
20
20.8 23.3 5
22
22.8 25.6 5
24
25.1 28.9 2
27
28.0 32.0 2
30
31.0 35.0 2
33
34.0 38.0 2
36
37.0 41.0 2
39
Maximum Zener
Impedance (Note 3)
[email protected]
[email protected]
BZT52C2V4S WX
100
W1
BZT52C2V7S
100
W2
BZT52C3V0S
95
W3
BZT52C3V3S
95
W4
BZT52C3V6S
90
W5
BZT52C3V9S
90
W6
BZT52C4V3S
90
W7
BZT52C4V7S
80
W8
BZT52C5V1S
60
W9
BZT52C5V6S
40
BZT52C6V2S WA
10
BZT52C6V8S WB
15
BZT52C7V5S WC
15
BZT52C8V2S WD
15
BZT52C9V1S WE
15
WF
BZT52C10S
20
WG
BZT52C11S
20
WH
BZT52C12S
25
WI
BZT52C13S
30
WJ
BZT52C15S
30
WK
BZT52C16S
40
WL
BZT52C18S
45
WM
BZT52C20S
55
WN
BZT52C22S
55
WO
BZT52C24S
70
WP
BZT52C27S
80
WQ
BZT52C30S
80
WR
BZT52C33S
80
WS
BZT52C36S
90
WT
BZT52C39S
130
Note:
1.Valid prvided device terminals are kept at ambient temperatrue
600
600
600
600
600
600
600
500
480
400
150
80
80
80
100
150
150
150
170
200
200
225
225
250
250
300
300
325
350
350
Izk
mA
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.5
0.5
0.5
0.5
0.5
Maximum Reverse
Current (Note 2)
IR
uA
50
20
10
5
5
3
3
3
2
1
3
2
1
0.7
0.5
0.2
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
2.Test with pluses, period=5ms,pluse width=300us.
3.f=1KHz
MDD ELECTRONIC
VR
V
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
2.0
4.0
4.0
5.0
5.0
6.0
7.0
8.0
8.0
8.0
10.5
11.2
12.6
14.0
15.4
16.8
18.9
21.0
23.1
25.2
27.3
Temperature Coefficent
of zener voltage @IZT=5mA
mV / C
Min
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-2.7
-2.0
0.4
1.2
2.5
3.2
3.8
4.5
5.4
6.0
7.0
9.2
10.4
12.4
14.4
16.4
18.4
21.4
24.4
27.4
30.4
33.4
Max
0
0
0
0
0
0
0
0.2
1.2
2.5
3.7
4.5
5.3
6.2
7.0
8.0
9.0
10.0
11.0
13.0
14.0
16.0
18.0
20.0
22.0
25.3
29.4
33.4
37.4
41.2
RATINGS AND CHARACTERISTIC CURVES BZT52C2V4S-BZT52C39S
FIG. 1- POWER DERATING CURVE
FIG. 2-ZENER BREAKDOWN CHARACTERISTICS
500
400
300
200
C3V3
40
Tj=25
C5V6
C6V6
C4V7
C8V2
30
20
Test current Iz
5mA
10
100
0
0
100
0
0
200
1
FIG. 3-ZENER BREAKDOWN CHARACTERISTICS
4
5
6
7
8
9
10
1000
C10
Tj=25
C12
C15
20
C18
C22
Test current Iz
2mA
C27
10 Test current Iz
5mA
C33
C36
0
0
3
FIG. 4-JUNCTION CAPACITANCE VS NOMINAL
ZENER VOLTAGE
CJ, JUNCTION CAPACITANCE (pF)
30
2
VZ,ZENER VOLTAGE (V)
TA, AMBIENT TEMPERATURE( C)
Vz, ZENER CURRENT (mA)
C3V9
C2V7
See Note1
Iz, ZENER CURRENT (mA)
Pd, POWER DISSPATION (mW)
50
Tj=25
Va=1V
Va=2V
100
Va=1V
Va=2V
10
10
20
30
40
0
VZ,ZENER VOLTAGE (V)
MDD ELECTRONIC
10
Vz, NOMINAL ZENER VOLTAGE(V)
100
RATINGS AND CHARACTERISTIC CURVES BZT52C2V4S-BZT52C39S
PACKAGE OUTLINE
Plastic surface mounted package
SOD-323
SOD-323
K
B
C
A
D
J
E
Dim
Min
Max
A
1.275
1.325
B
1.675
1.725
C
D
0.25
0.35
E
0.27
0.37
H
0.02
0.1
J
H
0.9 Typical
K
0.1 Typical
2.6
2.7
All Dimensions in mm
SOLDERING FOOTPRINT
Unit : mm
PACKAGE
INFORMATION
Device
Package
Shipping
BZT52C2V0S-BZT52C39S
SOD-323
3000/Tape&Reel
MDD ELECTRONIC