VISHAY VEMD2023SLX01

VEMD2023SLX01
www.vishay.com
Vishay Semiconductors
Silicon PIN Photodiode
FEATURES
• Package type: surface mount
• Package form: side view
• Dimensions (L x W x H in mm): 2.3 x 2.55 x 2.3
• AEC-Q101 qualified
• High radiant sensitivity
• Daylight blocking filter matched with 830 nm
to 950 nm IR emitters
• Fast response times
• Angle of half sensitivity:  = ± 35°
DESCRIPTION
• Package matched with IR emitter series
VSMB2943SLX01
VEMD2023SLX01 is a high speed and high sensitive PIN
photodiode in a miniature side looking, surface mount
package (SMD) with dome lens and daylight blocking filter.
Filter is matched with IR emitters operating at wavelength of
830 nm to 950 nm. The photo sensitive area of the chip is
0.23 mm2.
• Floor life: 4 weeks, MSL 2a, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• High speed photo detector
• Infrared remote control
• Infrared data transmission
• Photo interrupters
• IR touch panels
PRODUCT SUMMARY
COMPONENT
VEMD2023SLX01
Ira (μA)
 (deg)
0.5 (nm)
10
± 35
750 to 1050
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VEMD2023SLX01
Tape and reel
MOQ: 3000 pcs, 3000 pcs/reel
Side view
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Reverse voltage
Power dissipation
Tamb 25 °C
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Thermal resistance junction/ambient
Rev. 1.0, 04-Apr-13
SYMBOL
VALUE
VR
60
UNIT
V
PV
215
mW
Tj
100
°C
Tamb
- 40 to + 100
°C
°C
Tstg
- 40 to + 100
Acc. reflow solder profile fig. 7
Tsd
260
°C
Acc. J-STD-051
RthJA
250
K/W
Document Number: 83493
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VEMD2023SLX01
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
IF = 50 mA
VF
IR = 100 μA, E = 0
V(BR)
VR = 10 V, E = 0
Iro
Forward voltage
Breakdown voltage
Reverse dark current
Diode capacitance
Open circuit voltage
MIN.
TYP.
MAX.
UNIT
1
V
32
V
1
10
nA
VR = 0 V, f = 1 MHz, E = 0
CD
4
VR = 5 V, f = 1 MHz, E = 0
CD
1.3
pF
Ee = 1 mW/cm2,  = 950 nm
Vo
350
mV
mV/K
pF
Temperature coefficient of Vo
Ee = 1 mW/cm2,  = 950 nm
TKVo
- 2.6
Short circuit current
Ee = 1 mW/cm2,  = 950 nm
Ik
10
μA
Temperature coefficient of Ik
Ee = 1 mW/cm2,  = 950 nm
TKIk
0.1
%/K
Ee = 1 mW/cm2,  = 950 nm, VR = 5 V
Ira
Reverse light current
7

Angle of half sensitivity
10
14
μA
± 35
deg
Wavelength of peak sensitivity
p
940
nm
Range of spectral bandwidth
0.5
750 to 1050
nm
Rise time
VR = 10 V, RL = 1 k,  = 820 nm
tr
100
ns
Fall time
VR = 10 V, RL = 1 k,  = 820 nm
tf
100
ns
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
100
Ira - Reverse Light Current (µA)
Iro - Reverse Dark Current (nA)
1000
100
10
VR = 10 V
1
20
94 8427
40
60
1
0.1
1
10
Ee - Irradiance (mW/cm2)
Tamb - Ambient Temperature (°C)
Fig. 1 - Reverse Dark Current vs. Ambient Temperature
Fig. 3 - Reverse Light Current vs. Irradiance
8
1.4
CD - Diode Capacitance (pF)
Ira, rel - Relative Reverse Light Current
10
0.1
0.01
100
80
VR = 5 V
VR = 5 V
λ = 950 nm
1.2
1.0
0.8
6
E=0
f = 1 MHz
4
2
0
0.6
0
94 8416
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 2 - Relative Reverse Light Current vs. Ambient Temperature
Rev. 1.0, 04-Apr-13
0.1
94 8430
1
10
100
VR- Reverse Voltage (V)
Fig. 4 - Diode Capacitance vs. Reverse Voltage
Document Number: 83493
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VEMD2023SLX01
www.vishay.com
Vishay Semiconductors
0°
10°
20°
30°
1.0
0.8
0.6
0.4
0.2
0
600
700
800
900
1000
1.0
0.9
50°
0.8
60°
1100
70°
80°
0.7 0.6
0.4
0.2
0
λ - Wavelength (nm)
21554
Fig. 5 - Relative Spectral Sensitivity vs. Wavelength
REFLOW SOLDER PROFILE
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
max. 30 s
150
max. 100 s
100
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
0
0
19841
50
100
150
200
250
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label: 
Floor life: 4 weeks 
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
200
max. 120 s
Fig. 6 - Relative Radiant Intensity vs. Angular Displacement
DRYPACK
300
Temperature (°C)
40°
ϕ - Angular Displacement
Srel - Relative Radiant Sensitivity
S (λ)rel - Relative Spectral Sensitivity
1.2
300
Time (s)
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
Rev. 1.0, 04-Apr-13
Document Number: 83493
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VEMD2023SLX01
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters: VEMD2023SL
Rev. 1.0, 04-Apr-13
Document Number: 83493
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VEMD2023SLX01
www.vishay.com
Vishay Semiconductors
TAPING AND REEL DIMENSIONS in millimeters: VEMD2023SL
Reel
Unreel direction
Ø
13
±0
.5
Ø 330 ± 1
0.5
5±
Ø 62 ± 0.5
2.
Tape position
coming out from reel
3000 pcs / reel
technical drawings
according to DIN
specifications
Label posted here
12.4 ± 1.5
Leader and tailer tape:
Empty (160 mm min.)
Parts mounted
Direction of pulling out
1.75 ± 0.1
Empty (400 mm min.)
Terminal position in tape
Lead II
Cathode
Rev. 1.0, 04-Apr-13
5.5 ± 0.05
Emitter
Drawing refers to following types:
Reel dimensions and tape
X 2:1
Ø1.55 ± 0.05
I
Anode
+0.3
12 -0.1
Lead I
Device
VSMB2943SLX01
VSMF2893SLX01
Cathode
VSMB2948SL
VEMD2023SLX01
VEMD2523SLX01
VEMT2023SLX01
Collector
VEMT2523SLX01
Anode
VSMY2853SL
4 ±0.1
2 ± 0.05
8 ± 0.1
II
2.85± 0.1
see table
Drawing-No.: 9.800-5123.01-4
Issue: 2; 19.02.13
Document Number: 83493
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000