AME AME8865BCV150

AME
1.5A CMOS LDO
AME8865
n General Description
The AME8865 family of positive, CMOS linear regulators, provide low dropout voltage (400mV @ 1.5A) and
excellent PSRR, thus making them ideal for power-saving systems. These rugged devices have both Thermal
Shutdown, and Current limit to prevent device failure under the "Worst" of operating conditions.
The AME8865 is stable with an output capacitance of
4.7µF or larger.
n Typical Application
IN
400mV Dropout @1.5A
Excellent Line and Load Regulation
Guaranteed 1.5A Output Current
Fixed Output Voltage: 1V to 3.3V
Adjustable Output Voltage from 0.8V to 4.5V
Over Temperature/Over Current Protection
RoHS Compliant and 100%Lead (Pb)-Free
n Applications
AME8865 OUT
GND
C1
4.7µF
n Features
l
l
l
l
l
l
l
OUT
IN
C2
4.7µF
( Fixed Version )
IN
OUT
IN
EN
AME8865
GND
OUT
ADJ
R1
C1
4.7µF
R2
C2
4.7µF
(Adjustable Version )
l Motherboard, Desktop and Computer Peripherals
l LCD Monitor
l Handheld Device
l Data-Communication
Rev. A.04
1
AME
1.5A CMOS LDO
AME8865
n Functional Block Diagram
IN
OUT
4
2
EN 1
EN
REF
R1
AMP
R2
OCP/OTP
GND
3
(Fixed Version )
IN
OUT
4
2
EN 1
EN
REF
R1
AMP
ADJ
5
OCP/OTP
GND
R2
3
(Adjustable Version )
2
Rev. A.04
AME
1.5A CMOS LDO
AME8865
n Pin Configuration
3 Pin
SOT-223
Top View
SOT-223
Top View
AME 8865-AGTxxx
1. IN
2. GND (TAB)
3. OUT
AME8865
1
2
3
* Die Attach:
Conductive Epoxy
TO-252-2
Top View
AME8865
1
2
3
AME8865
1
2
3
AME 8865-ACSxxx
1. IN
2. GND (TAB)
3. OUT
* Die Attach:
Conductive Epoxy
AME8865
1
2
3
Rev. A.04
2
3
AME 8865-BCSxxx
1. GND
2. OUT (TAB)
3. IN
* Die Attach:
Non-Conductive Epoxy
TO-220-3
Top View
AME 8865-ABTxxx
1. IN
2. GND (TAB)
3. OUT
AME8865
AME 8865-BBTxxx
1. GND
2. OUT (TAB)
3. IN
* Die Attach:
Non-Conductive Epoxy
* Die Attach:
Conductive Epoxy
1
* Die Attach:
Non-Conductive Epoxy
TO-252-2
Top View
TO-220-3
Top View
AME8865
AME 8865-BGTxxx
1. GND
2. OUT (TAB)
3. IN
1
2
3
3
AME
1.5A CMOS LDO
AME8865
n Pin Configuration (Contd.)
3 Pin
TO-263-3
Top View
AME8865
1
2
3
TO-263-3
Top View
AME 8865-ADTxxx
1. IN
2. GND (TAB)
3. OUT
* Die Attach:
Conductive Epoxy
TO-263-2
Top View
AME8865
1
2
3
AME8865
1
2
3
AME 8865-BDTxxx
1. GND
2. OUT (TAB)
3. IN
* Die Attach:
Non-Conductive Epoxy
TO-263-2
Top View
AME 8865-ADSxxx
1. IN
2. GND (TAB)
3. OUT
* Die Attach:
Conductive Epoxy
AME8865
1
2
3
AME 8865-BDSxxx
1. GND
2. OUT (TAB)
3. IN
* Die Attach:
Non-Conductive Epoxy
5 Pin
TO-263-5
Top View
TO-263-5
Top View
AME8865
1 2 3 4 5
AME 8865-ADVxxx
1. EN
2. IN
3. GND (TAB)
4. OUT
5. NC
* Die Attach:
Conductive Epoxy
4
AME8865
1 2 3 4 5
AME 8865-BDVADJ
1. EN
2. IN
3. GND (TAB)
4. OUT
5. ADJ
* Die Attach:
Conductive Epoxy
Rev. A.04
AME
1.5A CMOS LDO
AME8865
n Pin Configuration (Contd.)
8 Pin
SOP-8/PP
Top View
8
7
6
5
AME8865
1
2
3
4
SOP-8/PP
Top View
AME 8865-AZAADJ
1. ADJ
2. GND
3. GND
4. EN
5. IN
6. GND
7. GND
8. OUT
8
7
6
5
AME8865
1
2
3
4
* Die Attach:
Conductive Epoxy
SOP-8/PP
Top View
8
7
6
2
3
* Die Attach:
Conductive Epoxy
SOP-8
Top View
5
AME8865
1
AME 8865-BZAADJ
1. EN
2. IN
3. OUT
4. ADJ
5. GND
6. GND
7. GND
8. GND
4
AME 8865-CZAxxx
1. NC
2. GND
3. GND
4. EN
5. IN
6. GND
7. GND
8. OUT
* Die Attach:
Conductive Epoxy
8
7
6
5
AME8865
1
2
3
4
AME 8865-AHAxxx
1. EN
2. IN
3. OUT
4. ADJ
5. GND
6. GND
7. GND
8. GND
* Die Attach:
Conductive Epoxy
Note:
Connect exposed pad (heat sink on the back) to GND.
Rev. A.04
5
AME
1.5A CMOS LDO
AME8865
n Pin Configuration
3 Pin
Pin Number
SOT-223 TO-252-2 TO-220-3
TO-263
Pin Name
Pin Description
Input voltage pin; should be decoupled
with 4.7 F or greater capacitor.
A
B
A
B
A
B
A
B
1
3
1
3
1
3
1
3
IN
2
1
2
1
2
1
2
1
GND
Ground connection pin.
3
2
3
2
3
2
3
2
OUT
LDO voltage regulator output pin; should
be decoupled with a 4.7 F or greater
value low ESR ceramic capacitor.
5 Pin
Pin Number
TO-263-5
6
Pin Name
Pin Description
A
B
2
2
IN
Input voltage pin; should be decoupled with 4.7 F or greater capacitor.
1
1
EN
Enable pin, Active “high". When pulled “low”, the PMOS pass transistor turns
off, current consuming less than 1 A. When EN pin float outside, it’s weakly
pulled high form internal MOS.
3
3
GND
Ground connection pin.
4
4
OUT
LDO voltage regulator output pin; should be decoupled with a 4.7 F or greater
value low ESR ceramic capacitor.
5
N/A
NC
No connection.
N/A
5
ADJ
Feedback output voltage for adjustable device.
Rev. A.04
AME
1.5A CMOS LDO
AME8865
n Pin Configuration (Contd.)
8 Pin
Pin Number
SOP-8/PP
SOP-8
Pin Name
Pin Description
A
B
C
A
5
2
5
2
IN
Input voltage pin; should be decoupled with 4.7 F or greater
capacitor.
4
1
4
1
EN
Enable pin, Active “high". When pulled “low”, the PMOS pass
transistor turns off, current consuming less than 1 A. When EN
pin float outside, it’s weakly pulled high form internal MOS.
2
3
6
7
5
6
7
8
2
3
6
7
5
6
7
8
GND
Ground connection pin.
8
3
8
3
OUT
LDO voltage regulator output pin; should be decoupled with a 4.7
F or greater value low ESR ceramic capacitor.
1
4
1
4
ADJ
Feedback output voltage for adjustable device.
Rev. A.04
7
AME
1.5A CMOS LDO
AME8865
n Ordering Information
AME8865 - x x x xxx
Output Voltage
Number of Pins
Package Type
Pin Configuration
Pin Configuration
A
(SOT-223)
(TO-252-2)
1. IN
2. GND
3. OUT
(TO-220-3)
(TO-263-3)
(TO263-2)
B
(SOT-223)
(TO-252-2)
1. GND
2. OUT
3. IN
Package Type
B: TO-220
C: TO-252
D: TO-263
G: SOT-223
H: SOP-8
Number of Pins
A: 8
S: 2
T: 3
V: 5
Output Voltage
100: 1.0V
120: 1.2V
150: 1.5V
180: 1.8V
250: 2.5V
300: 3.0V
330: 3.3V
ADJ: Adjustable
(TO-220-3)
(TO-263-3)
(TO-263-2)
A
(TO-263-5)
B
(TO-263-5)
A
(SOP-8)
8
1. EN
2. IN
3. GND
4. OUT
5. NC
1. EN
2. IN
3. GND
4. OUT
5. ADJ
1. EN
2. IN
3. OUT
4. ADJ
5. GND
6. GND
7. GND
8. GND
Rev. A.04
AME
1.5A CMOS LDO
AME8865
n Ordering Information (Contd.)
AME8865 - x x x xxx
Output Voltage
Number of Pins
Package Type
Pin Configuration
Pin Configuration
A
(SOP-8/PP)
B
(SOP-8/PP)
C
(SOP-8/PP)
Rev. A.04
1. NC
2. GND
3. GND
4. EN
5. IN
6. GND
7. GND
8. OUT
Package Type
Z: SOP-8/PP
Number of Pins
A: 8
Output Voltage
100: 1.0V
120: 1.2V
150: 1.5V
180: 1.8V
250: 2.5V
300: 3.0V
330: 3.3V
ADJ: Adjustable
1. EN
2. IN
3. OUT
4. ADJ
5. GND
6. GND
7. GND
8. GND
1. NC
2. GND
3. GND
4. EN
5. IN
6. GND
7. GND
8. OUT
9
AME
1.5A CMOS LDO
AME8865
n Absolute Maximum Ratings
Parameter
Maximum
Unit
-0.3 to 6
V
GND - 0.3 to VIN + 0.3
V
Electrostatic Discharge (HBM)
2
kV
Electrostatic Discharge (MM)
200
Electrostatic Discharge (CDM)
1000
Junction Temperature
150
Storage Temperature Range
200
Input Voltage
Output Voltage
V
o
C
n Recommended Operating Conditions
Parameter
10
Symbol
Rating
Unit
Power Input Voltage
VIN
2.5 to 5.5
V
Ambient Temperature Range
TA
- 40 to +85
o
C
Junction Temperaturen Range
TJ
- 40 to +125
o
C
Rev. A.04
AME
1.5A CMOS LDO
AME8865
n Thermal Information
Parameter
Package
SOT-223
TO-252-2
Thermal Resistance*
(Junction to Case)
TO-220-3
Maximum
Conductive Epoxy
25
Non-Conductive Epoxy
31
Conductive Epoxy
5
Non-Conductive Epoxy
30
Conductive Epoxy
6
Non-Conductive Epoxy
θJC
24
Conductive Epoxy
5
TO-263-2
TO-263-3
Non-Conductive Epoxy
27
SOP-8/PP
Conductive Epoxy
19
SOP-8
Conductive Epoxy
60
Conductive Epoxy
120
Non-Conductive Epoxy
135
Conductive Epoxy
90
Non-Conductive Epoxy
140
Conductive Epoxy
55
TO-252-2
Rev. A.04
Symbol
TO-263-2
TO-263-3
TO-263-5
SOT-223
Thermal Resistance
(Junction to Ambient)
Die Attach
TO-220-3
Non-Conductive Epoxy
θJA
80
TO-263-2
TO-263-3
TO-263-5
Conductive Epoxy
80
TO-263-2
TO-263-3
Non-Conductive Epoxy
100
SOP-8/PP
Conductive Epoxy
84
SOP-8
Conductive Epoxy
150
Unit
o
C/W
o
C/W
11
AME
1.5A CMOS LDO
AME8865
n Thermal Information (Contd.)
Parameter
Package
SOT-223
TO-252-2
TO-220-3
Internal Power Dissipation
Die Attach
Symbol
Maximum
Conductive Epoxy
900
Non-Conductive Epoxy
800
Conductive Epoxy
1200
Non-Conductive Epoxy
1000
Conductive Epoxy
2200
Non-Conductive Epoxy
PD
1600
TO-263-2
TO-263-3
TO-263-5
Conductive Epoxy
1700
TO-263-2
TO-263-3
Non-Conductive Epoxy
1400
SOP-8/PP
Conductive Epoxy
1450
SOP-8
Conductive Epoxy
810
Lead Temperature (soldering 10 sec)**
260
Unit
mW
o
C
* Measure θJC on backside center of tab
** MIL-STD-202G 210F
12
Rev. A.04
AME
1.5A CMOS LDO
AME8865
n Electrical Specifications
Typical values VIN=VOUT+1V( for VOUT< 2V VIN=2.5V) with typical TA=25oC, unless otherwise specified.
Parameter
Input Voltage
Output Accuracy
(For Fixed Version)
Symbol
Max
Units
5.5
V
VOUT,ACC
-2
2
%
0.816
V
1
µA
4.5
V
ADJ Input Bias Current
IADJ
Output Voltage Range
(For ADJ Version)
VOUT
Quiescent Current
(For Fixed Version)
Typ
2.5
VADJ
Output Current
Min
VIN
ADJ Reference Voltage
Dropout Voltage
(Note1)
Test Condition
VDROP
0.784 0.8
VIN=5V, VADJ=1.0V
0.8
IOUT=1.5A, 1.2VVOUT(NOM) 1.8V
600
IOUT=1.5A, 1.8V< VOUT(NOM) 2.5V
500
IOUT=1.5A, 2.5V<VOUT(NOM)
400
IOUT
Note2
mV
1.5
A
IQ
IOUT=0mA
500
µA
Line Regulation
REGLINE
VIN,MINVINVIN,MIN+0.7V 10mA
0.25
%/V
Load Regulation
REGLOAD
VIN=VOUT+1V
10mA IOUT 1.5A
0.8
PSRR
F=120Hz, IOUT=100mA, COUT=4.7uF
60
Output Current Limit
ILIM
VOUT = 0.9 x VOUT(NOM)
Short Circuit Current
ISC
VIN= VOUT(NOM)+1V, VOUT < 0.4V
900
Shutdown, temperature increasing
150
Restore, temperature decreasing
130
Power Supply Rejection Ratio
Thermal Shutdown Temperature
TSHDN
EN Pin Voltage High
VEH,HI
VIN(MIN) VIN 5.5V
EN Pin Voltage Low
VEN,LO
VIN(MIN) VIN 5.5V
Enable Input Bias Current
Shutdown Current
IEN
ISHDN
2
dB
1.6
A
1.4
mA
o
C
VIN
V
0.4
V
VEN = VIN
0.1
1.0
VEN = 0V
0.1
1.0
VEN=0V
%/A
1.5
µA
µA
Note 1. Dropout Voltage is measured at VOUT = VOUT(NOM) x 98%
Note 2. VIN(MIN) = VDROP + VOUT(NOM) or VIN(MIN) = 2.5V whichever is greater
Rev. A.04
13
AME
1.5A CMOS LDO
AME8865
n Detailed Description
The AME8865 is low-dropout; low quiescent current
linear regulator designed for motherboard, notebook and
LCD monitor applications. The output voltage range from
0.8V to 4.5V, and can drive 1.5A loading current.
Capacitor Selection and Regulator Stability
Use 4.7µF for input capacitor and 4.7µF or greater for
output capacitor on the AME8865. Larger input capacitor
value and low ESR provide better supply noise rejection
and improve line transient response. To reduce output
noise and load transient response, use output capacitor
greater than 4.7uF. In addition, AME8865 can prevent
output voltage overshoot at power-on or enabled through
the EN/ENB pin.
Calculating the Maximum Output Power
The maximum output power of the AME8865 is limited
by the maximum power dissipation of the package. By
calculation the power dissipation of the package as a
function of the input voltage, output voltage and output
current, the maximum input voltage can be obtained. The
maximum power dissipation should not exceed the
package's maximum power rating.
PMAX = (VIN(MAX)-VOUT) x IOUT
Where: VIN(MAX) = maximum input voltage
PMAX = maximum power dissipation of the package
Adjustable Version
The adjustable version uses external feedback resistors to generate an output voltage anywhere from 1.0V to
5.0V. By the equation:
VOUT = V ADJ (1 +
R1
)
R2
Feedback resistors R1 and R2 should be high enough
to keep quiescent current low, but increasing R1 + R2
will reduce stability. In general, R1 and R2 in the 10’ s of
KΩ will produce adequate stability, given reasonable layout precautions. To improve stability characteristics, keep
parasites on the ADJ pin to a minimum, and lower R1 and
R2 values.
14
Rev. A.04
AME
1.5A CMOS LDO
AME8865
n Characterization Curve
Load Transient Response
Load Transient Response
VIN=5V, IOUT=10mA~1A, VOUT=2.5V
VIN=5V, IOUT=10mA~1.5A, VOUT=2.5V
VOUT
C2
(200mV/div)
IOUT
(1A/div)
VOUTC2
(200mV/div)
IOUT
(1A/div)
C4
C4
Time(50µs/div)
Time(50µs/div)
Power On from VIN
Power Off from VIN
VIN=5V, IOUT=1.5A,
VOUT=2.5V
VIN
(2V/div)
V OUT
(2V/div)
IIN
(1A/div)
VIN=5V, IOUT=1.5A, VOUT=2.5V
V IN
(2V/div) C1
VOUT C2
(2V/div)
C1
C2
IIN C4
(1A/div)
C4
Time(5ms/div)
Time(5ms/div)
Line Transient Response
VIN=3.5~4.5V, IOUT=10mA, VOUT=2.5V
V IN
(1V/div)
V OUT
(20mV/div)
C1
C2
Time(500µs/div)
Rev. A.04
15
AME
1.5A CMOS LDO
AME8865
n Characterization Curve
Output Voltage vs. Temperature
Quiescent Current vs. Temperature
0.7
Quiescent Current (mA)
Output Voltage (V)
3.43
3.39
3.35
3.31
3.27
0.65
0.6
0.55
0.5
0.45
0.4
0.35
0.3
3.23
-40
-25
-10
5
20
35
50
65
80
95
110
-40
125
-25
-10
Temperature ( C)
20
35
50
65
80
95
110
125
o
Dropout Voltage vs. Temperature
Line Regulation vs. Temperature
0.6
1.4
0.55
Line Regulation (%/V)
Dropout Voltage (V)
5
Temperature ( C)
o
0.5
0.45
0.4
0.35
0.3
0.25
0.2
1.2
1
0.8
0.6
0.4
0.2
0
-40
-25
-10
5
20
35
50
65
80
95
110
125
Temperature ( C)
-40
-25
-10
5
20
35
50
65
80
95
110
125
Temperature ( C)
o
o
Short Circuit Current vs. Input Voltage
Short Circuit Current (A)
1.8
1.7
1.6
1.5
1.4
1.3
2.5
3
3. 5
4
4.5
5
5.5
Input Voltage (V)
16
Rev. A.04
AME
1.5A CMOS LDO
AME8865
n Date Code Rule
Month Code
1: January 7: July
2: February 8: August
3: March
9: September
4: April
A: October
5: May
B: November
6: June
C: December
n Tape and Reel Dimension
SOT-223
P
W
AME
AME
PIN 1
Carrier Tape, Number of Components Per Reel and Reel Size
Rev. A.04
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
SOT-223
12.0±0.1 mm
4.0±0.1 mm
2500pcs
330±1 mm
17
AME
1.5A CMOS LDO
AME8865
n Tape and Reel Dimension (Contd.)
TO-252-2
P
PIN 1
W
AME
AME
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
TO-252-2
16.0±0.1 mm
4.0±0.1 mm
2500pcs
330±1 mm
TO-263-3
P
PIN 1
W
AME
AME
Carrier Tape, Number of Components Per Reel and Reel Size
18
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
TO-263-3
24.0±0.1 mm
4.0±0.1 mm
800pcs
330±1 mm
Rev. A.04
AME
1.5A CMOS LDO
AME8865
n Tape and Reel Dimension (Contd.)
TO-263-2
P
W
PIN 1
AME
AME
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
TO-263-2
24.0±0.1 mm
4.0±0.1 mm
800pcs
330±1 mm
TO-263-5
P
W
PIN 1
AME
AME
Carrier Tape, Number of Components Per Reel and Reel Size
Rev. A.04
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
TO-263-5
24.0±0.1 mm
4.0±0.1 mm
800pcs
330±1 mm
19
AME
1.5A CMOS LDO
AME8865
n Tape and Reel Dimension (Contd.)
SOP-8/PP
P
PIN 1
W
AME
AME
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
SOP-8/PP
12.0±0.1 mm
4.0±0.1 mm
2500pcs
330±1 mm
SOP-8
P
PIN 1
W
AME
AME
Carrier Tape, Number of Components Per Reel and Reel Size
20
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
SOP-8
12.0±0.1 mm
4.0±0.1 mm
2500pcs
330±1 mm
Rev. A.04
AME
1.5A CMOS LDO
AME8865
n Package Dimension
SOT-223
Top View
Side View
D
B1
C
o
H
13 (4X)
E
MILLIMETERS
SYMBOLS
PIN 1
MIN
MAX
MIN
MAX
A1
0.01
0.10
0.0004
0.0039
B
0.60
0.84
0.0236
0.0330
B1
2.90
3.15
0.1140
0.1240
C
0.24
0.38
0.0094
0.0150
D
6.20
6.71
0.2441
0.2640
E
3.30
3.71
0.1299
0.1460
2.30 BSC
e
e
Front View
13 o (4X)
1.40
1.80
0.0551
0.0709
H
6.70
7.30
0.2638
0.2874
o
o
0
o
10
10o
0
B
TO-252-2
SYMBOLS
Top View
Side View
E
K
B
A
D1
L
F
E1
G
PIN 1
J
0.0906 BSC
F
F
A1
INCHES
H
C
D
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
0.43
0.89
0.0169
0.0350
B
1.60
1.95
0.0630
0.0768
C
0.51
1.78
0.0200
0.0701
D
0.43
0.60
0.0169
0.0236
E
6.35
6.80
0.2500
0.2677
F
5.36
6.22
0.2110
0.2450
G
2.20
3.00
0.0866
0.1181
H
-
* 2.30
-
*0.0906
J
0.50
0.97
0.0197
0.0380
K
4.95
5.50
0.1950
0.2165
L
0.90
1.65
0.0354
0.0650
D1
E1
3.80 REF
3.81
5.10
0.1496 REF
0.1500
0.2008
*: Typical Value
Notes:
1. Controlling dimension: Millimeters.
2. Maximum lead thickness includes lead finish thickness Minimum lead thickness is the minimum thickness of base material.
Rev. A.04
21
AME
1.5A CMOS LDO
AME8865
n Package Dimension (Contd.)
TO-220-3
Top View
G
Side View
C
D
Bottom View
A
A
I
P
P1
G1
PIN 1
M
O
N
E
K
TO-263-3
Side View
Bottom View
A
K
E
B1
B
H
A2
D
P
G
R
Front View
C
N
INCHES
MIN
MAX
MIN
MAX
5.58
7.49
0.2197
0.2949
C
2.03
4.83
0.0799
0.1902
D
0.50
1.45
0.0197
0.0571
E
0.30
1.15
0.0118
0.0453
G
9.65
10.67
0.3799
0.4201
I
3.53
4.09
0.1390
0.1610
K
0.50
1.15
0.0197
0.0453
M
1.14
1.78
0.0449
0.0701
N
2.28
2.80
0.0898
0.1102
O
12.70
14.74
0.5000
0.5803
P
14.22
16.51
0.5598
0.6500
P1
5.00
5.70
0.1969
0.2244
G1
7.30
8.05
0.2874
0.3169
SYMBOLS
Top View
PIN 1
MILLIMETERS
SYMBOLS
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
9.65
10.67
0.380
0.420
B
8.28
9.66
0.326
0.380
C
4.06
4.83
0.160
0.190
D
0.50
1.36
0.020
0.054
E
1.14
1.45
0.045
0.057
*
G
*
2.54
0.100
H
14.60
15.875
K
0.99
2.93
2.28
0.625
0.03898 0.11535
0.31
N
P
0.5748
0.012
2.80
0.08976 0.11024
R
0
B1
A2
5.00
5.70
0.197
0.224
7.30
8.05
0.287
0.317
o
8
o
0o
8o
*: Typical Value
Notes:
1. Controlling dimension: Millimeters.
2. Maximum lead thickness includes lead finish thickness Minimum lead thickness is the minimum thickness of base material.
22
Rev. A.04
AME
1.5A CMOS LDO
AME8865
n Package Dimension (Contd.)
TO-263-2
MILLIMETERS
SYMBOLS
TOPVIEW
SIDEVIEW
BOTTOMVIEW
A
K
E
B2
B
H
G
MAX
MIN
MAX
A
9.65
10.42
0.380
0.410
B
8.28
9.66
0.326
0.380
C
4.06
4.83
0.160
0.190
D
0.50
1.36
0.020
0.054
E
1.14
1.45
0.045
*
FRONTVIEW
14.60
15.80
0.575
0.622
K
0.99
2.93
0.039
0.115
0.38 REF
2.28
0.015 REF
2.80
0.090
0.110
R
0
B2
6.30
8.20
0.248
0.323
A2
7.30
8.95
0.287
0.352
o
8
o
0
o
8o
*: Typical Value
Notes:
1. Controlling dimension: Millimeters
2. Maximum lead thickness includes lead finish thickness Minimum lead
thickness is the minimum thickness of base material.
TO-263-5
TOP VIEW
SIDE VIEW
A
BOTTOM VIEW
A1
E
B1
B
H
SYMBOLS
MILLIMETERS
PIN 1
P
D
N
G
C
FRONT VIEW
R
INCHES
MIN
MAX
MIN
MAX
A
9.800
10.668
0.386
0.420
B
8.200
9.169
0.323
0.361
C
4.310
4.800
0.170
0.189
D
0.660
0.910
0.026
0.036
E
1.140
1.450
0.045
0.057
1.70 REF
G
Rev. A.04
0.100
H
P
C
0.057
*
2.54
N
N
R
K
MIN
G
P
PIN1
D
A2
INCHES
0.067 REF
H
14.600
15.875
0.575
0.625
K
1.143
1.760
0.045
0.069
N
0.310
0.580
0.012
0.023
P
2.280
2.800
0.090
0.110
R
0o
8o
0o
8o
A1
7.500
7.700
0.295
0.303
B1
5.800
6.450
0.228
0.254
23
AME
1.5A CMOS LDO
AME8865
n Package Dimension (Contd.)
SOP-8/PP
TOP VIEW
SIDE VIEW
D1
θ
E1
E2
E
L1
C
PIN 1
D
e
A1
FRONT VIEW
A
A2
b
SYMBOLS
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
1.350
1.750
0.053
0.069
A1
0.000
0.250
0.000
0.010
A2
1.250
1.650
0.049
0.065
C
0.100
0.250
0.004
0.010
E
3.750
4.150
0.148
0.163
E1
5.700
6.300
0.224
0.248
L1
0.300
1.270
0.012
0.050
b
0.310
0.510
0.012
0.020
D
4.720
5.120
0.186
0.202
1.270 BSC
e
0.050 BSC
θ
0
E2
2.050
2.600
0.081
0.102
D1
2.090
3.500
0.082
0.138
o
8
o
0
o
8o
SOP-8
24
Rev. A.04
www.ame.com.tw
E-Mail: sales@ame.com.tw
Life Support Policy:
These products of AME, Inc. are not authorized for use as critical components in life-support
devices or systems, without the express written approval of the president
of AME, Inc.
AME, Inc. reserves the right to make changes in the circuitry and specifications of its devices and
advises its customers to obtain the latest version of relevant information.
 AME, Inc. , September 2013
Document: A003B-DS8865-A.04
Corporate Headquarter
AME, Inc.
8F, 12 WenHu St., Nei-Hu
Taipei 114, Taiwan .
Tel: 886 2 2627-8687
Fax: 886 2 2659-2989