TOSHIBA TLP118

TLP118
TOSHIBA PHOTOCOUPLER
GaAℓAs Ired & PHOTO-IC
TLP118
PDP (Plasma Display Panel)
Unit: mm
FA (Factory Automation)
Interfaces of measuring and control instruments
Operate at high ambient temperatures up to 125°C
5
4
4.55
+0.25
-0.15
6
The Toshiba TLP118 consists of GaAℓAs infrared light emitting diodes
and integrated high-gain, high-speed photodetectors.
The TLP118 is housed in the SO6 package. The output stage is an open
collector type.
The photodetector has an internal Faraday shield that provides a
guaranteed common-mode transient immunity of ±15 kV/μs.
3
1
+0.25
3.7 -0.15
0.4
z
Inverter logic type (Open collector output)
z
Package: SO6 pin
z
Guaranteed performance over: -40 to 125°C
z
Power supply voltage: 4.5 to 5.5 V
z
Input threshold current: IFH = 5.0 mA (max)
z
Propagation delay time tpHL/tpLH: 60 ns (max)
z
Common-mode transient immunity: ±15 kV/μs (min)
z
Isolation voltage: 3750 Vrms (min)
z
UL approved : UL1577, File No.E67349
z
cUL approved: CSA Component Acceptance Service No. 5A, File No.E67349
0.15
0.5 min
1.27
2.54
Truth Table
Input
H
L
0.1 2.1 ± 0.1
7.0 ± 0.4
JEDEC
―
JEITA
―
TOSHIBA
11−4L1
Weight: 0.08 g (typ.)
Pin Configuration (Top View)
LED
ON
OFF
Output
L
1
VCC
H
6
5
GND
3
SHIELD
4
1:ANODE
3:CATHODE
4:GND
5:VO (Output)
6:VCC
Construction Mechanical Ratings
Creepage distance
5.0 mm (min)
Clearance distance
5.0 mm (min)
Insulation thickness
0.4 mm (min)
Schematic
ICC
IF
IO 6
1＋
VCC
VO
5
3－
SHIELD
1
GND
4
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TLP118
Absolute Maximum Ratings (Ta=25°C)
CHARACTERISTIC
SYMBOL
Forward Current
LED
UNIT
IF
25
mA
ΔIF /°C
-0.67
mA/°C
IFP
50
mA
ΔIFP /°C
-1.34
mA/°C
VR
5
V
IO
25
mA
Output Voltage
VO
6
V
Supply Voltage
VCC
6
V
PO
80
mW
ΔPO /°C
-2.0
mW/°C
Forward Current Derating
(Ta ≥ 110°C)
Pulse Forward Current
(Note 1)
Pulse Forward Current Derating (Ta ≥ 110°C)
Reverse Voltage
Output Current 1
DETECTOR
RATING
(Ta ≤ 125℃)
Output Power Dissipation
Output Power Dissipation Derating (Ta ≥ 110°C)
Operating Temperature Range
Topr
-40 to 125
°C
Storage Temperature Range
Tstg
-55 to 125
°C
Tsol
260
°C
BVs
3750
Vrms
Lead Soldering Temperature
(10 s)
Isolation Voltage (AC,1 min.,R.H.≤ 60%,Ta=25°C)
(Note 2)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width ≤ 1ms, duty = 50%.
Note 2: This device is regarded as a two terminal device: pins 1 and 3 are shorted together,
as are pins 4, 5 and 6.
Recommended Operating Conditions
CHARACTERISTIC
SYMBOL
MIN
TYP.
MAX
UNIT
Input Current , High Level
IFH
7.5
-
15
mA
Input Voltage , Low Level
VFL
0
-
0.8
V
Supply Voltage*
VCC
4.5
-
5.5
V
Operating Temperature
Topr
-40
-
125
°C
* This item denotes operating range, not meaning of recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
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TLP118
Electrical Characteristics
(Unless otherwise specified, Ta=-40 to 125°C, VCC=4.5 to 5.5 V)
CHARACTERISTIC
Input Forward Voltage
Temperature Coefficient
of Forward Voltage
SYMBOL
TEST
CIRCUIT
CONDITION
MIN
TYP.
MAX
UNIT
1.45
1.61
1.85
V
-
-1.6
-
mV/°C
VF
-
IF = 10 mA , Ta = 25°C
ΔVF/ΔTa
-
IF = 10 mA
Input Reverse Current
IR
-
VR = 5 V , Ta = 25°C
-
-
10
μA
Input Capacitance
CT
-
V = 0 , f = 1 MHz, Ta = 25°C
-
60
-
pF
Logic High Output Current
IOH
1
VF=0.8 V ,VO=5.5 V
-
-
250
Ta = 25℃
-
0.5
10
Logic Low Output Voltage
VOL
2
IF = 10 mA, IO = 13 mA (Sinking)
-
0.2
0.6
V
Logic Low Supply Current
ICCL
3
IF = 10 mA
-
1.5
5
mA
Logic High Supply Current
ICCH
4
IF = 0 mA
-
1.5
5
mA
IFH
-
IO = 13 mA (Sinking), VO < 0.6 V
-
1.0
5.0
mA
“H Level Output to L Level
Output” Input Current
μA
*All typical values are at Ta=25°C, VCC=5 V unless otherwise specified
Isolation Characteristics (Ta = 25°C)
Characteristic
Capacitance input to output
Isolation resistance
Symbol
CS
RS
Test Condition
VS = 0,f = 1 MHz
R.H. ≤ 60%,VS = 500 V
AC,1 minute
Isolation voltage
BVS
(Note 2)
MIN
TYP.
MAX
UNIT
―
0.8
―
pF
―
Ω
12
(Note 2) 1×10
10
14
3750
―
―
AC,1 second,in oil
―
10000
―
DC,1 minute,in oil
―
10000
―
3
Vrms
Vdc
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TLP118
Switching Characteristics
(Unless otherwise specified, Ta=-40 to 125 °C､VCC=4.5 to 5.5V)
CHARACTERISTIC
SYMBOL
Propagation delay time
(H→L)
tpHL
Propagation delay time
(L→H)
tpLH
TEST
CIRCUIT
CONDITION
IF=0→7.5 mA RL=350Ω
CL=15pF
IF=7.5→0 mA (Note 4)
Switching Time Dispersion
|tpHL-
between ON and OFF
tpLH|
Propagation Delay Skew (Note 5)
tpsk
RL=350Ω,
IF=0↔7.5 mA CL=15pF
5
(Note 4)
MIN
TYP.
MAX
UNIT
-
30
60
ns
-
30
60
ns
-
-
30
ns
-40
-
40
ns
Fall Time (90 – 10 %)
tf
IF=0→7.5 mA RL=350Ω
CL=15pF
-
30
-
ns
Rise Time (10 – 90 %)
tr
IF=7.5→0 mA (Note 4)
-
30
-
ns
VCM=1000 Vp-p , IF=0 mA,
VCC=5 V , Ta=25°C
15
-
-
kV/μs
VCM=1000 Vp-p , IF=10 mA,
VCC=5 V , Ta=25°C
-15
-
-
kV/μs
Common Mode transient
Immunity at High Level Output
Common Mode transient
Immunity at Low Level Output
CMH
6
CML
*All typical values are at Ta=25°C
Note 3: A ceramic capacitor (0.1 μF) should be connected from pin 6 (VCC) to pin 4 (GND) to stabilize the operation
of the high gain linear amplifier. Failure to provide the bypass may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
Note 4: f=5MHz, duty=50%, input current tr=tf=5ns,
CL is approximately 15pF which includes probe and Jig/stray wiring capacitance.
Note 5: Propagation delay skew is defined as the difference between the largest and smallest propagation delay
times (i.e. tpHL or tpLH) of multiple samples. Evaluations of these samples are conducted under identical
test conditions (supply voltage, input current, temperature, etc).
TEST CIRCUIT 1: IOH Test Circuit
TEST CIRCUIT 2: VOL Test Circuit
0.1μF
0.1μF
IOH
VF
A
IF
VCC
VO
SHIELD
VCC
SHIELD
TEST CIRCUIT 3: ICCL Test Circuit
IF
VOL IO
↑
V
TEST CIRCUIT 4: ICCH Test Circuit
ICCL
ICCH
A
A
0.1 μF
0.1 μF
VCC
SHIELD
VCC
SHIELD
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TLP118
TEST CIRCUIT 5: Switching Time Test Circuit
IF=7.5mA(P.G)
(f=5MHz , duty=50%, tr=tf=5ns)
IF
50%
P.G.
tpHL
RL=350Ω
0.1μF
IF monitor
VO
*CL=15pF
90%
VCC
*CL=15pF
SHIELD
tpLH
VO
VOL
RIN=100Ω
1.5 V
10%
tf
tr
CL includes probe and stray capacitance.
P.G.: Pulse generator
TEST CIRCUIT 6: Common-Mode Transient Immunity Test Circuit
90%
IF
SW
VCM
RL=350Ω
→
10%
0.1 μF
A
B
tf
tr
VO
・SW B : IF=0 mA
VCC
CMH
2V
VO
0.8 V
CML
・SW A : IF=10 mA
＋
VCM
1000 V
－
CM
5
H
=
800(V )
t r (μs)
CM
L
=
800(V )
t f (μs)
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TLP118
IF- VF
∆ V F / ∆ Ta - I F
-3
10
Coefficient ∆VF/ ∆Ta (mV/˚C)
Forward Current IF (mA)
100
125˚C
25˚C
-40˚C
1
1
1.2
1.4
1.6
1.8
2
-2.5
-2
-1.5
-1
2.2
0.1
Forward Voltage VF (V)
1
Forward Current
VO-IF
IF (mA)
5.0
I FH (mA)
5
4
Threshold Input Current
Output Voltage VO (V)
100
I F H - Ta
6
3
2
RL=350Ω
4kΩ
1
0
0
1
2
3
4.0
VCC=5V
IO=13mA
3.0
2.0
1.0
0.0
-40 -20
Forward Current IF (mA)
0
20 40
60 80 100 120 140
Ambient Temperature
I C C L - Ta
Ta (℃)
I C C H - Ta
2.0
2.0
High Level Output Current ICCH (mA)
Low Level Output Current ICCL (mA)
10
1.8
1.5
1.3
1.0
0.8
0.5
VCC=5V
IF=10mA
0.3
0.0
-40 -20
0
20 40
60 80 100 120 140
Ambient Temperature
Ta (℃)
1.8
1.5
1.3
1.0
0.8
0.5
VCC=5V
IF=0mA
0.3
0.0
-40 -20
0
20 40
60 80 100 120 140
Ambient Temperature
Ta (℃)
*The above graphs show typical characteristics.
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TLP118
V O L - Ta
t p H L / t p L H - Ta
Propagation Delay Time tpHL / tpLH (ns)
Low Level Output Voltage VOL (V)
0.6
0.5
0.4
0.3
0.2
VCC=5V
IF=10mA
IO=13mA(Sinking)
0.1
0.0
-40 -20
0
20 40
60 80 100 120 140
Ambient Temperature Ta (˚C)
60
50
40
30
tpHL
tpLH
20
10
VCC=5V
RL=350Ω
IF=7.5mA
0
-40 -20
0
20
40 60
80 100 120 140
Ambient Temperature Ta (˚C)
*The above graphs show typical characteristics.
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TLP118
PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &
GENERAL STORAGE
(1) Precautions for Soldering
1) When Using Soldering Reflow
z
An example of a temperature profile when Sn-Pb eutectic solder is used:
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type
used by the customer within the
described profile.
z
An example of a temperature profile when lead(Pb)-free solder is used:
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type
used by the customer within the
described profile.
z Reflow soldering must be performed once or twice.
z The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z Apply preheating of 150 deg.C for 60 to 120 seconds.
z Mounting condition of 260 deg.C or less within 10 seconds is recommended.
z Flow soldering must be performed once
3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds
not exceeding 350 deg.C.
z Heating by soldering iron must be only once per 1 lead
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TLP118
(2) Precautions for General Storage
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.
2) When transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5 degree C
to 35 degree C, and relative humidity should be maintained at between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive)gases, or in dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature
changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,
as a result, the solderability of the leads will be degraded.
6) When repacking devices, use anti-static containers.
7) Do not apply any external force or load directly to devices while they are in storage.
8) If devices have been stored for more than two years, even though the above conditions have been
followed, it is recommended that solderability of them should be tested before they are used.
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TLP118
Specification for Embossed–Tape Packing (TPL)(TPR) for SO6 Coupler
1. Applicable Package
Package
Product Type
SO6
Mini-flat coupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example)
TLP118 (TPL)
Tape type
Device name
3. Tape Dimensions
3.1 Specification Classification Are as Shown in Table 1
Table 1 Tape Type Classification
Tape type
Classification
Quantity
(pcs / reel)
TPL
L direction
3000
TPR
R direction
3000
3.2 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Direction of Tape
L direction
R direction
Figure 1 Device Orientation
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TLP118
3.3 Empty Device Recesses Are as Shown in Table 2.
Table 2 Empty Device Recesses
Standard
Occurrences of 2 or more
successive empty device
recesses
Remarks
Within any given 40-mm section of
tape, not including leader and trailer
0
Single empty device
recesses
6 devices (max) per reel
Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty
turns only for a cover tape.
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3.
+0.1
φ1.5 −0
A
G
K0
12.0 ± 0.3
B
D
E
0.3 ± 0.05
F
φ1.6 ± 0.1
2.95 ± 0.2
Figure 2 Tape Forms
Table 3 Tape Dimensions
Unit: mm
Unless otherwise specified: ±0.1
Symbol
Dimension
Remark
A
4.0
―
B
7.6
―
D
5.5
Center line of indented square hole and sprocket hole
E
1.75
F
8.0
G
4.0
K0
2.6
Distance between tape edge and hole center
+0.1
Cumulative error -0.3 (max) per 10 feed holes
Cumulative error +0.1 (max) per 10 feed holes
-0.3
Internal space
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TLP118
3.6 Reel
A
C
U
B
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4.
E
W1
W2
Figure 3 Reel Form
Table 4 Reel Dimensions
Unit: mm
Symbol
Dimension
A
Φ380 ±2
B
Φ80 ±1
C
Φ13 ±0.5
E
2.0 ±0.5
U
4.0 ±0.5
W1
13.5 ±0.5
W2
17.5 ±1.0
4. Packing
Either one reel or five reels of photocoupler are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of
standard, the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the
following example.
(Example)
TLP118 (TPL) 3000 pcs
Quantity (must be a multiple of 3000)
Tape type
Device name
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TLP118
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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