ETC 74F133

INTEGRATED CIRCUITS
74F133
13-input NAND gate
Product specification
Supersedes data of 1989 Oct 16
IC15 Data Handbook
1993 Jul 02
Philips Semiconductors
Product specification
13-input NAND gate
74F133
FEATURE
PIN CONFIGURATION
• Industrial temperature range available (–40°C to +85°C)
TYPE
D0
1
16
VCC
D1
2
15
D12
TYPICAL
PROPAGATION
DELAY
TYPICAL
SUPPLY CURRENT
(TOTAL)
D2
3
14
D11
D3
4
13
D10
4.0ns
2.0mA
D4
5
12
D9
D5
6
11
D8
D6
7
10
D7
GND
8
9
Q
74F133
SF00099
ORDERING INFORMATION
DESCRIPTION
COMMERCIAL RANGE
VCC = 5V ±10%, Tamb = 0°C to +70°C
INDUSTRIAL RANGE
VCC = 5V ±10%, Tamb = –40°C to +85°C
PKG DWG #
16-pin plastic DIP
N74F133N
I74F133N
SOT38-4
16-pin plastic SO
N74F133D
I74F133D
SOT109-1
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
74F (U.L.) HIGH/LOW
LOAD VALUE HIGH/LOW
D0–D12
PINS
Data inputs
DESCRIPTION
1.0/1.0
20µA/0.6mA
Q
Data output
50/33
1.0mA/20mA
NOTE: One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state.
LOGIC SYMBOL
IEC/IEEE SYMBOL
1
2
3
4
5
6
7
10
11
12
13
14
15
VCC = Pin 16
GND = Pin 8
D0
1
D1
2
D2
3
D3
4
D4
5
6
D5
D6
Q
7
9
10
D7
D8
11
D9
12
D10
13
D11
14
D12
15
SF00100
July 2, 1993
&
9
SF00101
2
853–1154 10219
Philips Semiconductors
Product specification
13-input NAND gate
74F133
LOGIC DIAGRAM
D0
D1
D2
D3
D4
D5
D6
1
2
3
4
5
6
7
D7
D8
10
D9 D10
11
12
D11
13
D12
14
15
9
VCC = Pin 16
GND = Pin 8
Q
SF00102
FUNCTION TABLE
INPUTS
OUTPUT
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
Q
H
H
H
H
H
H
H
H
H
H
H
H
H
L
Any one input = L
H
NOTES:
H = High voltage level
L = Low voltage level
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
VCC
Supply voltage
–0.5 to +7.0
V
VIN
Input voltage
–0.5 to +7.0
V
IIN
Input current
VOUT
Voltage applied to output in High output state
IOUT
Current applied to output in Low output state
Tamb
free air temperature range
Operating free-air
Tstg
Storage temperature range
–30 to +5
mA
–0.5 to VCC
V
40
mA
Commercial range
0 to +70
°C
Industrial range
–40 to +85
°C
–65 to +150
°C
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
MIN
NOM
MAX
5.0
5.5
UNIT
VCC
Supply voltage
4.5
VIH
High-level input voltage
2.0
VIL
Low-level input voltage
0.8
V
IIK
Input clamp current
–18
mA
IOH
High-level output current
–1
mA
IOL
Low-level output current
20
mA
Tamb
Operating free-air
free air temperature range
July 2, 1993
V
V
Commercial range
0
+70
°C
Industrial range
–40
+85
°C
3
Philips Semiconductors
Product specification
13-input NAND gate
74F133
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
LIMITS
SYMBOL
TEST CONDITIONSNO TAG
PARAMETER
MIN
TYP
NO TAG
MAX
UNIT
VCC = MIN, VIL = MAX
±10%VCC
2.5
VIH = MIN, IOH = MAX
±5%VCC
2.7
VCC = MIN, VIL = MAX
±10%VCC
0.35
0.50
VIH = MIN, IOL = MAX
±5%VCC
0.35
0.50
–0.73
–1.2
V
100
µA
VOH
O
High level output voltage
High-level
VOL
O
Low level output voltage
Low-level
VIK
Input clamp voltage
VCC = MIN, II = IIK
II
Input current at maximum input voltage
VCC = MAX, VI = 7.0V
IIH
High-level input current
VCC = MAX, VI = 2.7V
20
µA
IIL
Low-level input current
VCC = MAX, VI = 0.5V
–0.6
mA
IOS
Short-circuit output currentNO TAG
–150
mA
ICC
VCC = MAX
ICCH
Supply current (total)
ICCL
V
3.4
–60
VCC = MAX
1.0
2.0
2.5
4.0
V
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
AC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL
tPLH
tPHL
PARAMETER
Propagation delay
Dn to Q
TEST
CONDITION
Waveform
NO TAG
VCC = +5.0V
Tamb = +25°C
CL = 50pF, RL = 500Ω
VCC = +5.0V ± 10%
Tamb = 0°C to +70°C
CL = 50pF, RL = 500Ω
MIN
TYP
MAX
MIN
MAX
MIN
MAX
2.0
2.5
4.0
4.5
7.0
7.5
1.5
2.0
7.5
8.0
1.5
2.0
7.5
8.0
AC WAVEFORMS
Dn
VM
VM
tPHL
Q
tPLH
VM
VM
SF00098
Waveform 1. Propagation Delay for Data to Outputs
NOTE:
For all waveforms, VM = 1.5V.
July 2, 1993
VCC = +5.0V ± 10%
Tamb = –40°C to +85°C
CL = 50pF, RL = 500Ω
4
UNIT
ns
Philips Semiconductors
Product specification
13-input NAND gate
74F133
TEST CIRCUIT AND WAVEFORMS
VCC
VIN
tw
90%
NEGATIVE
PULSE
VM
D.U.T.
RT
CL
RL
AMP (V)
VM
10%
VOUT
PULSE
GENERATOR
90%
10%
tTHL (tf )
tTLH (tr )
tTLH (tr )
tTHL (tf )
0V
AMP (V)
90%
90%
POSITIVE
PULSE
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
RL = Load resistor;
see AC ELECTRICAL CHARACTERISTICS for value.
CL = Load capacitance includes jig and probe capacitance;
see AC ELECTRICAL CHARACTERISTICS for value.
RT = Termination resistance should be equal to ZOUT of
pulse generators.
VM
VM
10%
10%
tw
0V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
family
amplitude VM
74F
3.0V
1.5V
rep. rate
tw
tTLH
tTHL
1MHz
500ns
2.5ns
2.5ns
SF00006
July 2, 1993
5
Philips Semiconductors
Product specification
13-input NAND gate
74F133
DIP16: plastic dual in-line package; 16 leads (300 mil)
1993 Jul 02
6
SOT38-4
Philips Semiconductors
Product specification
13-input NAND gate
74F133
SO16: plastic small outline package; 16 leads; body width 3.9 mm
1993 Jul 02
7
SOT109-1
Philips Semiconductors
Product specification
13-input NAND gate
74F133
Data sheet status
Data sheet
status
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
 Copyright Philips Electronics North America Corporation 1993
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Date of release: 10-93
Document order number:
yyyy mmm dd
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9397-750-07371