XC8108 Series ETR33004-005a 85mΩ High Function Power Switch ■GENERAL DESCRIPTION The XC8108 series is a P-channel MOSFET power switch IC with a low ON resistance. A current limit, reverse current prevention (prevents reverse current from VOUT to VIN), soft start, thermal shutdown, and an under voltage lockout (UVLO) are incorporated as protective functions. A flag function monitors the power switch status. The flag output has N-channel open drain structure, and outputs Low level signal while over-current or overheating is detected, or while the reverse current prevention is operated. A variable current limiting function is integrated, allowing the current limit value to be set, using an external resistor. The voltage level which is fed to CE pin determines the status of XC8108. The logic level of CE pin is selectable between either one of active high or active low. ■APPLICATIONS ■FEATURES ●Set Top Boxes Input Voltage Output Current ON Resistance Supply Current Stand-by Current Flag Delay Time ●Digital TVs ●PCs ●USB Ports/USB Hubs ●HDMI Protection Circuit Functions Current Limit Response Time Operating Ambient Temperature Packages Environmentally Friendly ■TYPICAL PERFORMANCE CHARACTERISTICS XC8108xC20ER CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 6.0 RILIM=39.2kΩ Output Voltage : VOUT [V] ■TYPICAL APPLICATION CIRCUIT : 2.5V～5.5V : 2A : 85mΩ@VIN=5.0V (TYP.) : 40μA@ VIN=5.0V : 0.1μA (TYP.) : 7.5ms (TYP.) * At over-current detection : 4ms (TYP.) * At reverse voltage detection : Reverse Current Prevention 0.9A～2.4A(TYP.) Thermal Shutdown Under Voltage Lockout(UVLO） Soft-start : Flag Output CE Pin Input Logic Selectable : 2μs (TYP.) *Reference value : -40℃～+105℃ : USP-6C : EU RoHS Compliant, Pb Free 5.0 RILIM=18.4kΩ RILIM=5.76kΩ 4.0 RILIM=0kΩ 3.0 2.0 1.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Output Current : IOUT [A] 1/25 XC8108 Series ■BLOCK DIAGRAM XC8108 Series * Diodes inside the circuit are an ESD protection diode and a parasitic diode. 2/25 XC8108 Series ■PRODUCT CLASSIFICATION ●Ordering Information XC8108①②③④⑤⑥-⑦ DESIGNATOR ITEM ① CE Logic B C Protection Circuits Type ③④ Maximum Output Current 20 Package (Order Unit) ER-G (*1) DESCRIPTION A ② ⑤⑥-⑦ (*1) SYMBOL Refer to Selection Guide D 2.0A (Adjustable current limit range: 900mA～2400mA) USP-6C (3,000/Reel) The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant. ●Selection Guide TYPE CE LOGIC SELECTABLE SOFT-START CURRENT LIMIT ADJUSTABLE AC Active High Yes Yes AD Active High Yes Yes BC Active Low Yes Yes BD Active Low Yes Yes TYPE UVLO FLG OUTPUT REVERSE CURRENT PREVENTION AC Yes Yes Yes AD Yes Yes Yes BC Yes Yes Yes BD Yes Yes Yes TYPE THERMAL SHUT DOWN LATCH PROTECTION AC Yes No AD Yes Yes BC Yes No BD Yes Yes 3/25 XC8108 Series ■PIN CONFIGURATION FLG 3 4 CE ILIM 2 5 VSS VOUT 1 6 VIN USP-6C (BOTTOM VIEW) * The dissipation pad for the USP-6C packages should be solder-plated for mounting strength and heat dissipation. Please refer to the reference mount pattern and metal masking. The dissipation pad should be connected to the VSS (No. 5) pin. ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTIONS 1 VOUT Output 2 ILIM Current Limit Adjustment 3 FLG Fault Report 4 CE ON/OFF Control 5 VSS Ground 6 VIN Power Input USP-6C ■FUNCTION TYPE PIN NAME A CE B SIGNAL STATUS H Active L Stand-by OPEN Undefined State (*1) H Stand-by L Active OPEN Undefined State * Avoid leaving the CE pin open; set to any fixed voltage. 4/25 (*1) XC8108 Series ■ABSOLUTE MAXIMUM RATINGS Ta=25℃ PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN -0.3～+6.0 V Output Voltage VOUT -0.3～+6.0 V Output Current IOUT 2.8 A CE Input Voltage VCE -0.3～+6.0 V FLG Pin Voltage VFLG -0.3～+6.0 V FLG Pin Current IFLG 15 mA ILIM Pin Voltage VILIM -0.3～+6.0 V ILIM Pin Current IILIM ±1 mA Power Dissipation USP-6C Pd 120 1000 (*2) mW Operating Ambient Temperature Topr -40～+105 ℃ Storage Temperature Tstg -55～+125 ℃ * All voltages are described based on the VSS. (*1) Use with IOUT less than Pd/（VIN-VOUT）. (*2) This is a reference data taken by using the test board. Please refer to page 23 for details. 5/25 XC8108 Series ■ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL Input Voltage VIN On Resistance RON Supply Current ISS Stand-by Current ISTBY Switch Leakage Current ILEAK Current Limit ILIMT CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT 2.5 - 100 85 5.5 110 104 V mΩ mΩ ① VOUT=OPEN - 40 75 μA ② VIN=5.5V, VOUT=OPEN VCE=VSS (XC8108A series) VCE=VIN (XC8108B series) - 0.01 1.0 μA ② - 0.01 1.0 μA ② 2.16 2.40 2.64 A ① 1.16 1.34 1.52 - 1.20 - A ① - 0.67 - μs ① V ① VIN=3.3V, IOUT=1.0A VIN=5.0V, IOUT=1.0A VIN=5.5V, VOUT=0V VCE=VSS (XC8108A series) VCE=VIN (XC8108B series) VOUT=VIN-0.3V ILIM shorted to VSS VOUT=VIN-0.3V RILIM=18.4kΩ VOUT=0V Short-Circuit Current ISHORT Ta=25℃ ILIM shorted to VSS VOUT=0V RILIM=18.4kΩ VIN=5.0V, VOUT: OPEN→0V Measure from VOUT=0V to when current falls below a certain ILIMT value VIN=5.5V, XC8108A series VIN=5.5V, XC8108B series VIN=5.5V, XC8108A series VIN=5.5V, XC8108B series VIN=5.5V, VCE=5.5V VIN=5.5V, VCE=0V - 2.0 - 1.5 1.5 -0.1 -0.1 - 5.5 0.8 0.8 5.5 0.1 0.1 V ① μA μA ① ① VUVLOD VIN: 2.2V→1.7V 1.8 1.9 2.0 V ① UVLO Released Voltage VUVLOR VIN: 1.7V→2.2V 1.9 2.0 2.1 V ① UVLO Hysteresis VUHYS - - 0.1 - V ① Current Limit Circuit (*2) Response Time tCLR CE "H" Level Voltage VCEH CE "L" Level Voltage VCEL CE "H" Level Current CE "L" Level Current ICEH ICEL UVLO Detected Voltage NOTE: Unless otherwise stated, VIN=5.0V, IOUT=1mA, ILIM=VSS, VCE=VIN (XC8108A series) or VCE=VSS (XC8108B series) (*2) ① Design reference value. This parameter is provided only for reference. 6/25 XC8108 Series ■ELECTRICAL CHARACTERISTICS (Continued) Ta=25℃ PARAMETER SYMBOL turn-on time tDLY(ON) turn-off time tDLY(OFF) FLG output FET On-resistance FLG output FET Leakage Current CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT RLOAD=10Ω, VCE=0V→2.2V - 0.60 1.00 ms ① RLOAD=10Ω, VCE=2.2V→0V - 0.08 0.13 ms ① RFLG IFLG=10mA, VOUT=5.5V - 15 20 Ω ③ IFOFF VIN=5.5V, VFLG=5.5V, VOUT=OPEN - 0.01 0.1 μA ③ tFD1 over-current condition 6.5 7.5 8.5 ms ① tFD2 reverse-voltage condition 2.7 4.0 4.7 ms ① IREV VIN=0V, VOUT=5.5V VCE=5.0V (XC8108A series) VCE=VSS (XC8108B series) - 0.1 1.0 μA ① VIN: 5.0V→4.7V VOUT=5.0V - 140 - mV ① TTSD Junction Temperature - 150 - ℃ ① Thermal Shutdown Release Temperature TTSR Junction Temperature - 130 - ℃ ① Thermal Shutdown Hysteresis Width THYS Junction Temperature - 20 - ℃ ① FLG delay time Reverse Current Reverse Current Prevention Detect Voltage Thermal Shutdown Detect Temperature VREV_D NOTE: Unless otherwise stated, VIN=5.0V, IOUT=1mA, ILIM=VSS, VCE=VIN (XC8108A series) or VCE=VSS (XC8108B series) ■TIMING CHART ●turn-on time, turn-off time XC8108 Series, Type A XC8108 Series, Type B 7/25 XC8108 Series ■TEST CIRCUITS CIN=1.0μF, CL=1.0μF 1) CIRCUIT① 2) CIRCUIT② 3) CIRCUIT③ 8/25 XC8108 Series ■OPERATIONAL EXPLANATION The XC8108 series is a P-channel MOSFET power switch IC. The XC8108 series consists of a CE circuit, UVLO circuit, thermal shutdown circuit, current limiter circuit, reverse current prevention circuit, control block and others. The gate voltage of the power switch transistor is controlled with control block. The current limiter circuit and reverse current prevention circuit will operate based on the output voltage and output current. (See the BLOCK DIAGRAM below) BLOCK DIAGRAM (XC8108 Series) <CE Pin> The voltage level which is fed to CE pin controls the status of this IC. If either “H” level or “L” level which is defined as the electrical specification is fed to CE pin, then XC8108 can operate in standard manner. However, if the middle voltage which is neither “H” level nor “L” level is fed to CE pin, the consumption current will increase due to the shoot-through current at internal circuits. Also if CE pin is open, the status of XC8108 cannot be fixed and the behavior will be unstable. <Thermal Shutdown> For protection against heat damage of the ICs, thermal shutdown function is built in. When the internal junction temperature reaches the temperature limit, the thermal shutdown circuit operates and the power switch transistor will turn OFF. The IC resumes its operation when the thermal shutdown function is released and the IC’s operation is automatically restored because the junction temperature drops to the level of the thermal shutdown release temperature. When the thermal shutdown circuit detects higher junction temperature than the detect temperature, the voltage level of FLG pin is low level. When the thermal shutdown circuit detects lower junction temperature than the release temperature, the thermal shutdown function is released and the voltage level of FLG pin is high level. <Under Voltage Lockout (UVLO) > When the VIN pin voltage goes down to lower voltage than UVLO detected voltage, the power switch transistor turns OFF by UVLO function in order to prevent false output caused by unstable operation of the internal circuitry. When the VIN pin voltage goes up to higher voltage than UVLO released voltage, the UVLO function is released and the power switch transistor can turn ON. <Soft-start Function> The soft-start circuit can reduce the in-rush current charged on the output capacitor when IC starts up. Additionally, due to the reduction of the in-rush current, the circuit can reduce the fluctuation of the input voltage as well. The soft-start time is optimized internally and defined as turn-on time. (TYP: 0.6ms) 9/25 XC8108 Series ■OPERATIONAL EXPLANATION (Continued) <Current limiter, short-circuit protection> When the output current reaches the current limit value, the constant current limit circuit activates and as a result, the output voltage goes down. If the short circuit comes at the VOUT pin, the output current is limited to the current which is specified as the short-circuit current value. If the over-current state lasts for 7.5ms (TYP.), the FLG pin changes to Low level output. Two types are available for the current limiter circuit: an auto recovery type (product type C) and a latch off type (product type D). After the current limiter circuit activates and the FLG pin outputs low level, the operation is different between these two types. The auto recovery type continuously limits the output current by the current limit value. When the over-current status finishes and the status of that the output current is less than the current limit value continues for 7.5ms (TYP.) or more, the voltage of FLG pin goes up “H” level again. The latch off type turns off the power switch transistor after the FLG pin outputs Low level. The off state is maintained regardless of whether the over-current state is released. Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below the UVLO detected voltage once and after that raising it higher than UVLO released voltage. <Current limit external adjustment function> By connecting a resistor to the current limit external adjustment pin（ILIM pin）, the current limit can be set to any value. By the following equation, the current limit value can be set to any value within a range of 900mA to 2400mA. When the ILIM pin is open, the switch transistor is forcibly turned off. RILIM(kΩ) = 57207 / ILIMIT(T)(mA) - 24.32(kΩ) RILIM: External resistance value ILIMIT(T): Current limit set value Table1. Current limit set value ILIMIT(T) (mA) RILIM (kΩ) E96 External resistance value (kΩ) Current limit value when use E96 external resistance (mA) 900 39.24 39.2 901 1000 32.89 33.2 995 1100 27.69 28.0 1093 1200 23.35 23.2 1204 1300 19.69 19.6 1303 1400 16.54 16.5 1401 1500 13.82 13.7 1505 1600 11.43 11.5 1597 1700 9.33 9.31 1701 1800 7.46 7.5 1798 1900 5.79 5.76 1902 2000 4.28 4.32 1997 2100 2.92 2.94 2099 2200 1.68 1.69 2199 2300 0.55 0.549 2300 ILIM shorted to VSS 2400 2400 10/25 XC8108 Series ■OPERATIONAL EXPLANATION (Continued) <Current limit external adjustment function> (Continued) Fig1. Current limit set value limit set value IILIMIT(T) (mA) Current ： 電流制限設定値 LIMIT (mA): XC8108 電流制限設定値 － 外部抵抗値 XC8108 Current limit set value vs. External resistor 2500 2400 2300 2200 2100 2000 1900 1800 1700 1600 1500 1400 1300 1200 1100 1000 900 800 0 5 10 15 20 25 30 35 40 RILIMR(kΩ): External resistor ： 外部抵抗値 ILIM (kΩ) <Reverse current prevention> An internal circuit is built in that prevents reverse current from the VOUT pin to the VIN pin. When the difference between input voltage and VOUT pin voltage is higher than the detect voltage set internally, the reverse current prevention circuit activates, and the power switch transistor turns off, then the reverse current from the VOUT pin to the VIN pin is reduced to 0.1μA (TYP.). If the reverse-voltage state lasts for 4ms (TYP.), the FLG pin changes to Low level output. Two types are available for the reverse current prevention circuit: the auto recovery type (product type C) and the latch off type (product type D). After the reverse current prevention circuit activates and the FLG pin outputs low level, the operation is different between these two types. On the auto recovery type, when the output voltage drops below the input voltage, the reverse current prevention circuit stops immediately, and the power switch transistor turns on again. If the output voltage remains lower than the input voltage for 4ms (TYP.), the FLG pin returns to High level output. On the latch off type, the power switch transistor remains in the off state even if the reverse voltage state is released. Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below the UVLO detected voltage once and after that raising it higher than UVLO released voltage. 11/25 XC8108 Series ■OPERATIONAL EXPLANATION (Continued) <Flag function> The flag circuit is built in which monitors the state of the power switch. The FLG pin outputs Low level when the reverse current prevention function is operating. is recommended for the FLG pin pull-up resistance. A resistance of 10kΩ to 100kΩ Auto recovery type (product type C) Protective function FLG pin Low level output Return to FLG pin High level output Current limiter 7.5ms after over-current detection 7.5ms after over-current release Reverse current prevention 4.0ms after reverse voltage detection 4.0ms after reverse voltage release Thermal shutdown Same time as overheat state is detected Same time as overheat state is released Protective function FLG pin Low level output Return to FLG pin High level output Current limiter 7.5ms after over-current detection When latch operation is released Reverse current prevention 4.0ms after reverse voltage detection When latch operation is released Thermal shutdown Same time as overheat state is detected Same time as overheat state is released Latch off type (product type D) 12/25 XC8108 Series ■NOTES ON USE 1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated if IC is used beyond the absolute MAX. specifications. 2. Where wiring impedance is high, operations may become unstable due to noise depending on output current. Please keep the resistance low between VIN and VSS wiring in particular. 3. Please place the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible. For the input or output capacitor, a capacitance of 1.0μF or higher is recommended. 4. When the voltage which is higher than the maximum input voltage is fed to the VIN pin, and VOUT is shorted to the VSS level, in this case the short circuit may cause a fatal impact to operation for the IC. Please use within the operational voltage range. 5. The current limit value can be adjusted by external resistor (RLIM). The characteristic of the resistor influence the current limit value, please choose the resistor with small tolerance and temperature coefficient. 6. 80％ of current limit set value is the recommended value of maximum output current. 7. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. 13/25 XC8108 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) UVLO detect Voltage vs. Input Voltage (2) UVLO release Voltage vs. Input Voltage XC8108xx20ER XC8108xx20ER Ta=105℃ Ta=25℃ Ta=-40℃ 2.5 CIN=1.0μF(ceramic), CL=1.0μF(ceramic) UVLO release Voltage : UVLO [V] UVLO detect Voltage : UVLO [V] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 2.0 1.5 1.0 0.5 0.0 3.0 Ta=105℃ Ta=25℃ Ta=-40℃ 2.5 2.0 1.5 1.0 0.5 0.0 1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 Input Voltage : VIN [V] 1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 Input Voltage : VIN [V] (3) UVLO threshold Voltage vs. Ambient Temperature XC8108xx20ER UVLO threshold Voltage : UVLO [V] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 2.5 2.0 1.5 1.0 UVLO detect UVLO release 0.5 0.0 -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 (4) Stand-by Current vs. Input Voltage (5) Stand-by Current vs. Ambient Temperature XC8108xx20ER XC8108xx20ER Ta=105℃ 2.5 Ta=25℃ Ta=-40℃ 2.0 1.5 1.0 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Input Voltage : VIN [V] 14/25 CIN=1.0μF(ceramic), CL=1.0μF(ceramic) Stand-by Current : Istby [μA] Stand-by Current : Istby [μA] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 3.0 Istby 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 XC8108 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6) Supply Current vs. Input Voltage（sweep up） (7) Supply Current vs. Ambient Temperature XC8108xx20ER XC8108xx20ER CIN=1.0μF(ceramic), CL=1.0μF(ceramic) Supply Current : ISS [μA] Supply Current : ISS [μA] VIN=5.0V, CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 50 45 40 35 30 25 20 15 10 5 0 Ta=105℃ Ta=25℃ Ta=-40℃ 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 50 45 40 35 30 25 20 15 10 5 0 -50 Input Voltage : VIN [V] (8) CE "H" Level Voltage vs. Input Voltage VIN=5.0V -25 0 25 50 75 100 Ambient Temperature : Ta [℃] (9) CE "L" Level Voltage vs. Input Voltage XC8108xx20ER XC8108xx20ER 2.5 2.0 1.5 1.0 Ta=105℃ Ta=25℃ 0.0 Ta=-40℃ 0.0 0.5 1.0 1.5 2.0 Input Voltage : VIN [V] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) CE "L" Level Voltage : VCEL [V] CE "H" Level Voltage : VCEH [V] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 3.0 0.5 125 2.5 3.0 2.5 2.0 1.5 1.0 0.5 Ta=105℃ Ta=25℃ 0.0 0.0 0.5 Ta=-40℃ 1.0 1.5 2.0 Input Voltage : VIN [V] 2.5 (10) CE threshold Voltage vs. Ambient Temperature XC8108xx20ER CIN=1.0μF(ceramic), CL=1.0μF(ceramic) CE threshold Voltage : VCE [V] 3.0 2.5 CE"H"Level 2.0 CE"L"Level 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 15/25 XC8108 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (11) On Resistance vs. Input Voltage (12) On Resistance vs. Ambient Temperature XC8108xx20ER XC8108xx20ER CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 180 180 160 160 On Resistance : Ron [mΩ] On Resistance : Ron [mΩ] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 140 120 100 80 60 Ta=105℃ Ta=25℃ 40 20 Ta=-40℃ 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : VIN [V] 5.5 140 120 100 80 VIN=3.5V 40 VIN=4.5V 20 VIN=5.0V 0 -50 6.0 (13) turn-on time vs. Input Voltage VIN=2.5V 60 CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 0.7 0.6 0.6 turn-on time : tDLY(ON) [ms] turn-on time : tDLY(ON) [ms] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 0.5 0.4 0.3 Ta=105℃ Ta=25℃ Ta=-40℃ 0.0 0.5 0.4 0.3 VIN=2.5V 0.2 VIN=3.5V VIN=4.5V 0.1 VIN=5.0V VIN=5.5V 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : VIN [V] 5.5 6.0 -50 -25 0 25 50 75 100 125 Ambient Temperature : Ta [℃] (15) turn-off time vs. Input Voltage (16) turn-off time vs. Ambient Temperature XC8108xx20ER XC8108xx20ER CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 0.09 0.08 0.08 turn-off time : tDLY(OFF) [ms] turn-off time : tDLY(OFF) [ms] VIN=4.3V, CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 0.09 0.07 0.06 0.05 0.04 Ta=105℃ 0.03 Ta=25℃ 0.02 Ta=-40℃ 0.01 0.00 0.07 0.06 0.05 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V 0.04 0.03 0.02 0.01 0.00 2.0 16/25 125 XC8108xx20ER 0.7 0.1 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] (14) turn-on time vs. Ambient Temperature XC8108xx20ER 0.2 VIN=5.5V 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : VIN [V] 5.5 6.0 -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 XC8108 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (17) FLG delay time over-current vs. Ambient Temperature (18) FLG delay time reverse-voltage vs. Ambient Temperature XC8108xx20ER XC8108xx20ER CIN=1.0μF(ceramic), CL=1.0μF(ceramic) FLG reverse-voltage : tFD [ms] FLG over-current : tFD [ms] CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 9.0 8.5 8.0 7.5 7.0 6.5 6.0 5.5 5.0 4.5 4.0 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 125 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 (19) Output Voltage vs. Output Current XC8108xD20ER XC8108xC20ER CIN=1.0μF(ceramic), CL=1.0μF(ceramic) CIN=1.0μF(ceramic), CL=1.0μF(ceramic) 6.0 RILIM=39.2kΩ RILIM=18.4kΩ RILIM=5.76kΩ RILIM=0kΩ 4.0 3.0 2.0 1.0 4.0 3.0 2.0 1.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Output Current : IOUT [A] 3.5 0.0 4.0 (20) turn-on Delay vs. Rise Time (CL=1.0μF) Voltage : [V] 8.0 3.0 6.0 2.5 4.0 2.0 3.5 Output Voltage 2.0 1.5 0.0 -2.0 1.0 -4.0 0.5 -6.0 Supply Current 0.0 Time [100μs/div] 3.5 4.0 VCE=5.0V→0V, tf=5μs, RL=10Ω, Ta=25℃ VIN=5.0V, CIN=CL=1.0μF(ceramic), RILIM=18.4kΩ 3.0 Output Voltage 2.5 2.0 2.0 1.5 0.0 -2.0 3.5 CE Input Voltage 1.0 0.5 -4.0 0.0 -6.0 Supply Current -0.5 -8.0 4.0 Voltage : [V] CE Input Voltage 1.0 1.5 2.0 2.5 3.0 Output Current : IOUT [A] XC8108xx20ER Supply Current : Isupply [A] VCE=0V→5.0V, tr=5μs, RL=10Ω, Ta=25℃ VIN=5.0V, CIN=CL=1.0μF(ceramic), RILIM=18.4kΩ 0.5 (21) turn-oｆｆ Delay vs. Fall Time (CL=1.0μF) XC8108xx20ER 6.0 If the over-current state lasts for 7.5ms, the latch off type turns off the power switch t i t 0.0 0.0 8.0 RILIM=39.2kΩ RILIM=18.4kΩ RILIM=5.76kΩ RILIM=0kΩ 5.0 Supply Current : Isupply [A] 5.0 Output Voltage : VOUT [V] Output Voltage : VOUT [V] 6.0 -0.5 -8.0 Time [100μs/div] 17/25 XC8108 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (22) turn-on Delay vs. Rise Time (CL=120μF) (23) turn-oｆｆ Delay vs. Fall Time (CL=120μF) XC8108xx20ER Voltage : [V] 4.0 CE Input Voltage Output Voltage 8.0 3.5 3.0 6.0 3.0 2.5 2.0 2.0 0.0 1.5 -2.0 1.0 -4.0 0.5 -6.0 0.0 Supply Current -8.0 4.0 Voltage : [V] 6.0 3.5 Supply Current : Isupply [A] 8.0 VCE=5.0V→0V, tf=5μs, RL=10Ω, Ta=25℃ VIN=5.0V, CIN=1.0μF, CL=120μF(ceramic), RILIM=18.4kΩ 2.0 2.5 Output Voltage 2.0 0.0 1.5 CE Input Voltage -2.0 1.0 -4.0 0.5 -6.0 0.0 Supply Current -8.0 -0.5 Supply Current : Isupply [A] XC8108xx20ER VCE=0V→5.0V, tr=5μs, RL=10Ω, Ta=25℃ VIN=5.0V, CIN=1.0μF, CL=120μF(ceramic), RILIM=18.4kΩ -0.5 Time [500μs/div] Time [500μs/div] (24) Short Circuit Current, Device Enabled Into Short XC8108xx20ER 8.0 XC8108xx20ER VCE=0V→5.0V, tr=5μs, Ta=25℃ VIN=5.0V, CIN=CL=1.0μF(ceramic), RILIM=18.4kΩ VCE=5.0V→0V, tf=5μs, Ta=25℃ VIN=5.0V, CIN=1.0μF, CL=120μF(ceramic), RILIM=18.4kΩ 8.0 3.5 3.5 3.0 4.0 2.5 2.0 2.0 0.0 -4.0 -6.0 1.0 0.5 Supply Current -8.0 6.0 3.0 4.0 2.5 2.0 2.0 Output Voltage Supply Current -6.0 -0.5 -8.0 （26） Short-Curcuit Transient Response (VOUT=short→5.0Ω, CL=1.0μF) 3.5 6.0 2.0 2.0 0.0 1.5 Output Voltage -4.0 1.0 0.5 Supply Current -8.0 Time [2ms/div] 4.0 Voltage : [V] 2.5 Supply Current : Isupply [A] Voltage : [V] 8.0 3.0 VOUT = Short circuit to Vss FLG Voltage 18/25 -0.5 XC8108xC20ER VIN=5.0V, tf=100μs, Ta=25℃ FLG=100kΩ, CIN=CL=1.0μF(ceramic), RILIM=18.4kΩ 4.0 -6.0 0.0 Time [40μs/div] XC8108xC20ER -2.0 0.5 -4.0 0.0 （25） Short-Curcuit Transient Response (VOUT=5.0Ω→short, CL=1.0μF) 6.0 1.0 -2.0 Time [40μs/div] 8.0 1.5 0.0 VIN=5.0V, tr=100μs, Ta=25℃ FLG=100kΩ, CIN=CL=1.0μF(ceramic), RILIM=18.4kΩ VOUT = Removed Short circuit 3.5 3.0 2.5 Output Voltage 2.0 2.0 FLG Voltage 0.0 1.5 -2.0 1.0 -4.0 0.0 -6.0 -0.5 -8.0 Supply Current 0.5 0.0 -0.5 Time [2ms/div] Supply Current : Isupply [A] -2.0 1.5 Output Voltage Voltage : [V] CE Input Voltage Supply Current : Isupply [A] Voltage : [V] 6.0 Supply Current : Isupply [A] CE Input Voltage XC8108 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) （27） Short-Curcuit Transient Response (VOUT=open→short, CL=1.0μF) （28） Short-Curcuit Transient Response (VOUT=short→open, CL=1.0μF) XC8108xC20ER VIN=5.0V, tf=100μs, Ta=25℃ FLG=100kΩ, CIN=CL=1.0μF(ceramic), RILIM=18.4kΩ 3.5 8.0 VOUT = Short circuit to Vss FLG Voltage 2.5 2.0 2.0 1.5 0.0 Output Voltage -2.0 1.0 -4.0 0.5 Supply Current -8.0 VOUT = Short circuit to Vss 1.5 -2.0 1.0 -4.0 0.5 -6.0 -0.5 -8.0 （30） Short-Curcuit Transient Response (VOUT=short→5.0Ω, CL=120μF) VIN=5.0V, tr=100μs, Ta=25℃ FLG=100kΩ, CIN=1.0μF, CL=120μF(ceramic), RILIM=18.4kΩ 8.0 3.5 6.0 1.5 0.0 Output Voltage 1.0 -2.0 0.5 -4.0 Supply Current -6.0 -8.0 4.0 Voltage : [V] 2.5 2.0 1.0 -0.5 -8.0 0.5 0.0 -0.5 Time [2ms/div] （32） Short-Curcuit Transient Response (VOUT=short→open, CL=120μF) XC8108xC20ER VIN=5.0V, tr=100μs, Ta=25℃ FLG=100kΩ, CIN=1.0μF, CL=120μF(ceramic), RILIM=18.4kΩ 8.0 6.0 3.0 2.0 1.5 -2.0 1.0 -4.0 0.5 0.0 -0.5 4.0 Voltage : [V] 2.5 Supply Current : Isupply [A] Voltage : [V] 2.0 -2.0 -6.0 0.0 Time [2ms/div] FLG Voltage Supply Current 3.5 -8.0 2.5 Output Voltage -4.0 VIN=5.0V, tf=100μs, Ta=25℃ FLG=100kΩ, CIN=1.0μF, CL=120μF(ceramic), RILIM=18.4kΩ FLG Voltage 3.0 1.5 XC8108xC20ER VOUT = Short circuit to Vss 3.5 0.0 0.0 （31） Short-Curcuit Transient Response (VOUT=open→short, CL=120μF) 8.0 VOUT = Removed Short circuit 2.0 Time [2ms/div] Supply Current -0.5 Time [2ms/div] Supply Current : Isupply [A] Voltage : [V] FLG Voltage 2.0 -6.0 0.0 Supply Current 3.0 Output Voltage 2.0 Supply Current : Isupply [A] 8.0 2.0 2.5 Output Voltage XC8108xC20ER VIN=5.0V, tf=100μs, Ta=25℃ FLG=100kΩ, CIN=1.0μF, CL=120μF(ceramic), RILIM=18.4kΩ 4.0 3.0 0.0 XC8108xC20ER 6.0 3.5 FLG Voltage 0.0 （29） Short-Curcuit Transient Response (VOUT=5.0Ω→short, CL=120μF) 4.0 VOUT = Removed Short circuit 2.0 Time [2ms/div] 6.0 VIN=5.0V, tr=100μs, Ta=25℃ FLG=100kΩ, CIN=CL=1.0μF(ceramic), RILIM=18.4kΩ VOUT = Removed Short circuit 3.5 3.0 2.5 Output Voltage 2.0 2.0 FLG Voltage 0.0 1.5 -2.0 1.0 -4.0 0.5 Supply Current : Isupply [A] -6.0 4.0 Voltage : [V] 4.0 Voltage : [V] 6.0 3.0 Supply Current : Isupply [A] 6.0 8.0 Supply Current : Isupply [A] XC8108xC20ER 0.0 -6.0 Supply Current -0.5 -8.0 Time [2ms/div] 19/25 XC8108 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (33) UVLO Transient Response (CL=1.0μF) XC8108xx20ER VIN=0V→5.0V, tr=3ms, Ta=25℃ RL=5Ω, CIN=CL=1.0μF(ceramic), RILIM=18.4kΩ VIN=5.0V→0V, tf=3ms, Ta=25℃ RL=5Ω, CIN=CL=1.0μF(ceramic), RILIM=18.4kΩ 3.0 6.0 2.5 2.0 Output Voltage 0.0 2.0 1.5 -2.0 1.0 -4.0 0.5 -6.0 Supply Current -8.0 3.5 3.0 Input Voltage 4.0 2.5 2.0 2.0 0.0 1.5 Output Voltage -2.0 -4.0 0.0 -6.0 -0.5 -8.0 1.0 0.5 Supply Current : Isupply [A] Voltage : [V] 4.0 Input Voltage 8.0 Voltage : [V] 6.0 3.5 Supply Current : Isupply [A] 8.0 XC8108xx20ER 0.0 Supply Current -0.5 Time [500μs/div] Time [500μs/div] (34) UVLO Transient Response (CL=120μF) Input Voltage Voltage : [V] 4.0 3.5 8.0 3.0 6.0 2.5 2.0 Output Voltage 0.0 2.0 1.5 -2.0 1.0 -4.0 0.5 -6.0 Supply Current -8.0 2.5 2.0 2.0 0.0 -2.0 1.0 -4.0 0.5 -6.0 -0.5 -8.0 (36) Reverse Voltage Released Voltage (CL=1.0μF) Input Voltage 2.0 0.0 FLG Voltage 2.0 0.0 Supply Current -8.0 -1.0 -2.0 Time [500μs/div] 20/25 4.0 1.0 -4.0 8.0 6.0 5.0 3.0 -2.0 -6.0 6.0 4.0 Voltage : [V] Voltage : [V] 4.0 -0.5 XC8108xC20ER Supply Current : Isupply [A] 6.0 Output Voltage 0.0 Supply Current Time [500μs/div] XC8108xC20ER VOUT=5.5V forced 1.5 Input Voltage 0.0 (35) Reverse Voltage Detected Voltage (CL=1.0μF) 8.0 3.0 Output Voltage 4.0 Time [500μs/div] VIN=5.0V, RL=5Ω, Ta=25℃ CIN=CL=1.0μF(ceramic), RILIM=18.4kΩ 3.5 VIN=5.0V, RL=5Ω, Ta=25℃ CIN=CL=1.0μF(ceramic), RILIM=18.4kΩ VOUT = 5.5V Removed Input Voltage Output Voltage 2.0 6.0 5.0 4.0 3.0 FLG Voltage 0.0 2.0 -2.0 1.0 -4.0 Supply Current -6.0 0.0 -1.0 -8.0 -2.0 Time [500μs/div] Supply Current : Isupply [A] 6.0 VIN=5.0V→0V, tf=3ms, Ta=25℃ RL=5Ω, CIN=1.0μF, CL=120μF(ceramic), RILIM=18.4kΩ Voltage : [V] 8.0 XC8108xx20ER Supply Current : Isupply [A] VIN=0V→5.0V, tr=3ms, Ta=25℃ RL=5Ω, CIN=1.0μF, CL=120μF(ceramic), RILIM=18.4kΩ Supply Current : Isupply [A] XC8108xx20ER XC8108 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (37) Reverse Voltage Detected Voltage (CL=120μF) (38) Reverse Voltage Released Voltage (CL=120μF) Voltage : [V] 4.0 Output Voltage 6.0 8.0 5.0 6.0 4.0 Input Voltage 3.0 2.0 FLG Voltage 0.0 2.0 1.0 -2.0 0.0 -4.0 Supply Current -6.0 -1.0 VOUT = 5.5V Removed Input Voltage 2.0 6.0 5.0 4.0 Output Voltage FLG Voltage 3.0 0.0 2.0 -2.0 1.0 0.0 -4.0 Supply Current -1.0 -6.0 -2.0 -8.0 -2.0 -8.0 VIN=5.0V, Ta=25℃ CIN=1.0μF, CL=120μF(ceramic), RILIM=18.4kΩ 4.0 Voltage : [V] 6.0 VOUT=5.5V forced XC8108xC20ER Supply Current : Isupply [A] 8.0 VIN=5.0V, Ta=25℃ CIN=1.0μF, CL=120μF(ceramic), RILIM=18.4kΩ Supply Current : Isupply [A] XC8108xC20ER Time [500μs/div] Time [500μs/div] （39） CE Transient Response XC8108xx20ER XC8108xx20ER VCE=0→5.0V, tr=5μs, Ta=25℃ VIN=5.0V, CIN=1.0μF, CL=120μF(ceramic) VCE=0→5.0V, tr=5μs, Ta=25℃ VIN=5.0V, CIN=CL=1.0μF(ceramic) 0.030 0.025 Voltage : [V] 4.0 2.0 RILIM=39.2kΩ RILIM=18.4kΩ 0.0 RILIM=5.76kΩ RILIM=0kΩ -2.0 0.020 0.015 0.010 -4.0 0.005 -6.0 0.000 2.5 2.0 RILIM=18.4kΩ 0.0 RILIM=0kΩ -2.0 1.0 0.5 0.0 -6.0 In Rush Current -8.0 -0.5 Time [500μs/div] (41) Current Limit adapted time XC8108xx20ER XC8108xx20ER 14.0 12.0 10.0 8.0 2.0 Output Voltage 0.0 6.0 -2.0 4.0 2.0 -4.0 In Rush Current 0.0 -6.0 -2.0 -8.0 Time [2μs/div] Current Limit Response : [μs] VOUT = Short circuit to Vss In Rush Current : [A] VIN=5.0V, Ta=25℃ CL=open, RILIM=18.4kΩ 4.0 Voltage : [V] 1.5 RILIM=5.76kΩ -4.0 -0.005 (40) Short Applied 6.0 2.0 RILIM=39.2kΩ Time [500μs/div] 8.0 3.0 4.0 In Rush Current -8.0 CE Voltage 6.0 Voltage : [V] 6.0 3.5 8.0 In Rush Current : IRUSH [A] CE Voltage In Rush Current : IRUSH [A] 0.035 8.0 VIN=5.0V, Ta=25℃ CL=open, RILIM=18.4kΩ 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0.0 1.0 2.0 3.0 4.0 5.0 Peak Limit Current [A] 6.0 21/25 XC8108 Series ■PACKAGING INFORMATION ●USP-6C (unit:mm) 1.8±0.05 1pin INDENT 0.05 0.30±0.05 (0.1) (0.50) 0.10±0.05 ●USP-6C 22/25 0.20±0.05 1.4±0.05 Reference Pattern Layout (unit: mm) ●USP-6C Reference Metal Mask Design (unit: mm) XC8108 Series ■PACKAGING INFORMATION (Continued) ● USP-6C Power Dissipation Power dissipation data for the USP-6C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition: Ambient: Soldering: Board: Mount on a board Natural convection Lead (Pb) free 2 Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Thickness: Through-hole Glass Epoxy (FR-4) 1.6mm 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature (105℃) Board Mount (Tjmax=125℃) Ambient Temperature (℃) Power Dissipation Pd (mW) 25 1000 105 200 Thermal Resistance (℃/W) 100.00 Power Dissipation: Pd (mW) 許容損失Pd（mW） Pd vs. Ta Pd-Ta特性グラフ 1200 1000 800 600 400 200 0 25 45 65 85 周囲温度Ta（℃） Ambient Temperature: Ta (℃) 105 125 23/25 XC8108 Series ■MARKING RULE ① represents products series USP-6C ② ⑤ ③ 3 ④ 2 ① 1 6 5 4 MARK PRODUCT SERIES Z XC8108******-G ② represents product type MARK CE LOGIC PROTECTION CIRCUIT TYPE PRODUCT 1 Active High Auto-recovery XC8108AC****-G 2 Active High Latch-off XC8108AD****-G 3 Active Low Auto-recovery XC8108BC****-G 4 Active Low Latch-off XC8108BD****-G ③ represents maximum output current MARK CURRENT (A) PRODUCT SERIES 5 2.0 XC8108**20**-G ④⑤ represents production lot number 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. 24/25 XC8108 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 25/25