TECHNICAL DATA SHEET 1/4 RIGHT ANGLE JACK RECEPTACLE FOR PCB R124.681.000 Series : SMA-COM SMT TYPE All dimensions are in mm. . pn . ao COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS - PLATINGS (µm) MATERIALS BRASS BERYLLIUM COPPER PTFE - GOLD 0.2 OVER NICKEL 2 GOLD 0.5 OVER NICKEL 2 - - Issue : 0430 B In the effort to improve our products, we reserve the right to make changes judged to be necessary. TECHNICAL DATA SHEET 2/4 R124.681.000 RIGHT ANGLE JACK RECEPTACLE FOR PCB Series : SMA-COM SMT TYPE PACKAGING Standard 100 SPECIFICATION Unit ‘W’ option Other Contact us ELECTRICAL CHARACTERISTICS Impedance Frequency VSWR 1.16 + Insertion loss RF leakage -( Voltage rating Dielectric withstanding voltage Insulation resistance 50 0-6 0.000 0.07 60 500 1000 5000 Ω GHz x F(GHz) Maxi ENVIRONMENTAL Operating temperature Hermetic seal Panel leakage √F(GHz) dB Maxi - F(GHz)) dB Maxi Veff Maxi Veff mini MΩ mini OTHERS CHARACTERISTICS Assembly instruction Others : - MECHANICAL CHARACTERISTICS Center contact retention Axial force – Mating end Axial force – Opposite end Torque Recommended torque Mating Panel nut Mating life Weight -65/+165 ° C NA Atm.cm3/s NA 15 N mini 15 N mini 1 N.cm mini 40 N.cm NA N.cm 100 Cycles mini 3.000 g Issue : 0430 B In the effort to improve our products, we reserve the right to make changes judged to be necessary. NA TECHNICAL DATA SHEET RIGHT ANGLE JACK RECEPTACLE FOR PCB SMT TYPE 3/4 R124.681.000 Series : SMA-COM SERIE SMA - INFORMATION COPLANAR LINE Pattern and signal are on the same side Thickness of PCB : .063 (1.6 mm) The material of PCB : epoxy resin (Er=4.8) The solder resist should be printed except for the land pattern on the PCB SHADOW OF RECEPTACLE FOR VIDEO CAMERA Issue : 0430 B In the effort to improve our products, we reserve the right to make changes judged to be necessary. TECHNICAL DATA SHEET 4/4 RIGHT ANGLE JACK RECEPTACLE FOR PCB R124.681.000 Series : SMA-COM SMT TYPE SOLDER PROCEDURE 1. Deposition of solder paste ‘Sn Ag4 Cu0.5’ on mounting zone by screen printing application. We recommend a low residue flux. We advise a thickness of 150 microns ( 5.850 microinch ). Verify that the edges of the zone are clean. 2. Placement of the receptacle on the mounting zone with an automatic machine of ‘pick and place’ type. Video camera is recommended for the positioning of the component. Adhesive agents must not be used on the receptacle. 3. Soldering by infra-red reflow. Below, please find the typical profile to use. 4. Cleaning of printed circuit boards. 5. Checking of solder joints and position of the component by visual inspection. TEMPERATURE PROFILE Parameter Temperature rising Area Max Peak Temperature Max dwell time @260°C Min dwell time @235°C Max dwell time @235°C Temperature drop in cooling Area Max dwell time above 100°C Value 1 -4 260 10 20 60 -1 to - 4 420 Issue : 0430 B In the effort to improve our products, we reserve the right to make changes judged to be necessary. Unit °C/sec °C sec sec sec °C/sec sec