PL IA NT CO M *R oH S Features Applications ■ Monolithic construction offering high ■ DC/DC converters for: ■ ■ ■ ■ reliability Magnetically shielded construction providing low radiation Low DC resistance Low profile, 1008 size (2.5 x 2 x 0.9 mm) RoHS compliant* - Smart phones - DVCs / DSCs - Tablets - HDDs / SSDs - Mobile electronic devices CVH252009 Series Multilayer Power Chip Inductors Electrical Specifications Bourns® Part No. General Specifications Inductance @ 1 MHz SRF (MHz) DCR (Ohms) Max. IDC (mA) L (µH) Tol. Typ. CVH252009-R47M 0.47 ±20 % 100 0.04 1800 CVH252009-1R0M 1.0 ±20 % 60 0.055 1600 CVH252009-1R5M 1.5 ±20 % 50 0.07 1500 CVH252009-2R2M 2.2 ±20 % 40 0.08 1300 CVH252009-3R3M 3.3 ±20 % 30 0.10 1200 CVH252009-4R7M 4.7 ±20 % 25 0.11 1100 Operating Temperature ................................-55 °C to +125 °C (Temperature rise included) Storage Temperature .....................+40 °C max. at 70 % RH Resistance to Soldering Heat ...............................................+260 °C Temperature Rise ......................... 40 °C at rated current Materials Core ..............................................Ferrite Terminal ......................................... Ni/Sn Packaging ....... 3000 pcs. per 7 inch reel Soldering Profile (Lead Free Solder) PRE-HEATING SOLDERING Product Dimensions FERRITE Temperature (°C) 260 TERMINAL ELECTRODE 217 200 0.5 ± 0.3 (.020 ± .012) 2.5 ± 0.2 (.098 ± .008) 150 0.5 ± 0.3 (.020 ± .012) 25 ≥30 SECONDS 60~120 SECONDS 60~150 SECONDS 0.9 ± 0.1 (.035 ± .004) 2.0 ± 0.20 (.079 ± .008) Recommended Layout Time (Seconds) 1.35 (.053) 1.75 (.069) 3.75 (.148) DIMENSIONS: Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Schematic MM (INCHES) CVH252009 Series Multilayer Power Chip Inductors L vs. Idc L vs. Frequency 10 10 L -3R3M Inductance (µH) Inductance (µH) -3R3M -2R2M -1R5M 1 L -4R7M -4R7M -1R0M -R47M -2R2M -1R5M 1 -1R0M -R47M 0.1 0.1 1 10 1000 100 10000 1 10 100 Frequency (MHz) DC Current (mA) Packaging Specifications DIA. 178 ± 1.0 (7.008 ± .039) 2.0 ± 0.5 (.079 ± .020) 12.0 ± 0.15 (.472 ± .006) 13.0 ± 0.2 (.512 ± .008) DIA. 60.0 +0.5/-0.0 (2.362 +.020/-0) 13.0 ± 0.2 DIA. (.512 ± .008) 9.0 ± 0.5 (.354 ± .020) 4.00 ± 0.1 (.157 ± .004) END 2.00 ± 0.1 (.079 ± .004) 1.75 ± 0.1 (.069 ± .004) DIA. 1.55 ± 0.05 (.061 ± .002) 0.22 ± 0.05 (.009 ± .002) START 8.00 ± 0.1 (.315 ± .004) 3.5 ± 0.1 (.138 ± .004) DIA. 1.00 ± 0.05 (.039 ± .002) 4.00 ± 0.1 (.157 ± .004) NO COMPONENT 200 (7.874) MIN. 4.00 ± 0.1 (.157 ± .004) NO COMPONENT COMPONENTS 2.80 ± 0.1 (.110 ± .004) 400 (15.748) MIN. 1.35 ± 0.1 (.053 ± .004) DIMENSIONS: MM (INCHES) USER DIRECTION OF FEED 3000 PCS. PER REEL 06/12 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.