PACDN1404 ESD Protection Arrays in Chip Scale Package Product Description The PACDN1404 and PACDN1408 are 4− and 8−channel transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD. These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000−4−2 international standard (Level 4, 8 kV contact discharge). All I/Os are rated at 25 kV using the IEC 61000−4−2 contact discharge method. Using the MIL−STD−883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than 30 kV. The Chip Scale Package format of these devices provide extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachments to laminate boards without the use of underfill. The PACDN1404 and PACDN1408 are packaged in RoHS−compliant, lead−free finishing. http://onsemi.com WLCSP6 CG SUFFIX CASE 567BD WLCSP10 CG SUFFIX CASE 567BM ELECTRICAL SCHEMATIC B1 B2 B3 A2 A3 Features Four or Eight Transient Voltage Suppressors in a Single Package In−System Electrostatic Discharge (ESD) Protection to 25 kV Contact Discharge per IEC 61000−4−2 International Standard Compact Chip Scale Package (CSP) in a 0.65 mm Pitch Format Saves Board Space and Eases Layout in Space Critical Applications Compared to Discrete Solutions and Traditional Wire Bonded Packages 6− and 10−Bump WLCSPs These Devices are Pb−Free and are RoHS Compliant A1 PACDN1404 B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 PACDN1408 Applications MARKING DIAGRAM ESD Protection for Sensitive Electronic Equipment I/O Port, Keypad and Button Circuitry Protection for Portable Devices Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Cameras and Camcorders Notebooks Desktop PCs D14 DN1408 D14 = PACDN1404CG DN1408 = PACDN1408CG ORDERING INFORMATION Device Package Shipping† PACDN1404CG WLCSP6 (Pb−Free) 3500/Tape & Reel PACDN1408CG WLCSP10 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2011 October, 2011 − Rev. 4 1 Publication Order Number: PACDN1404/D PACDN1404 PACKAGE / PINOUT DIAGRAMS Top View (Bumps Down View) 1 2 3 Orientation Marking + A Bottom View (Bumps Up View) D14 B B1 B2 B3 A1 A2 A3 PACDN1404 6−Bump WLCSP Package Top View (Bumps Down View) Orientation Marking 1 A + 2 3 Bottom View (Bumps Up View) 4 5 DN1408 B B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 PACDN1408 10−Bump WLCSP Package SPECIFICATIONS Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Storage Temperature Range Rating Units −65 to +150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 2. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units −40 to +85 C Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions VREV Reverse Standoff Voltage IDIODE = 10 mA ILEAK Leakage Current VIN = 3.3 V DC VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 (Note 2) Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV Positive Transients Negative Transients (Note 2) Channel Capacitance At 2.5 V DC, f = 1 MHz VCL C Min Typ Max 5.5 V 100 5.6 −1.2 Units 6.8 −0.8 8.0 −0.4 nA V kV 30 25 V +12 −8 39 47 1. TA = 25C unless otherwise specified. GND in this document refers to the lower supply voltage. 2. ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. http://onsemi.com 2 pF PACDN1404 APPLICATION INFORMATION Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask Defined Pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 mm − 0.150 mm Solder Stencil Aperture Opening (Laser Cut, 5% Tapered Walls) 0.300 mm Round Solder Flux Ratio 50/50 by Volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball 50 mm Solder Ball Side Coplanarity 20 mm Maximum Dwell Time Above Liquidous (183C) 60 seconds Maximum Soldering Temperature for Lead−free Devices Using a Lead−free Solder Paste 260C Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 1. Recommended Non−Solder Mask Defined Pad Illustration Temperature (5C) 250 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 2. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 3 PACDN1404 PACKAGE DIMENSIONS WLCSP6, 1.80x1.15 CASE 567BD−01 ISSUE O È È PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E e TOP VIEW A2 MILLIMETERS MIN MAX 0.60 0.69 0.23 0.29 0.38 REF 0.34 0.39 1.80 BSC 1.15 BSC 0.65 BSC 0.05 C RECOMMENDED SOLDERING FOOTPRINT* A 0.05 C NOTE 3 6X e b 0.05 C A B C SIDE VIEW A1 A1 SEATING PLANE e 0.65 PITCH B 0.03 C A PACKAGE OUTLINE 6X 0.65 PITCH 0.25 DIMENSIONS: MILLIMETERS 1 2 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 3 BOTTOM VIEW http://onsemi.com 4 PACDN1404 PACKAGE DIMENSIONS WLCSP10, 3.10x1.15 CASE 567BM−01 ISSUE O PIN A1 REFERENCE 2X 0.05 C 2X ÈÈ ÈÈ D A E 0.05 C DIM A A1 A2 b D E e TOP VIEW ÉÉÉÉÉÉÉÉ OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B A2 RECOMMENDED SOLDERING FOOTPRINT* A A1 0.05 C NOTE 3 10X e b 0.05 C A B C SIDE VIEW A1 MILLIMETERS MIN MAX 0.60 0.75 0.23 0.29 0.40 REF 0.34 0.39 3.10 BSC 1.15 BSC 0.65 BSC SEATING PLANE e 0.65 PITCH B 0.03 C PACKAGE OUTLINE 10X 0.25 0.65 PITCH DIMENSIONS: MILLIMETERS A 1 2 3 4 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 5 BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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