DELTA DNS10S0A0R10PFD

FEATURES
Š
High efficiency: [email protected], 3.3V/10A out
Š
Small size and low profile: (SMD)
33.0x 13.5x8.8mm (1.30” x 0.53” x 0.35”)
Š
Surface mount packaging
Š
Standard footprint
Š
Voltage and resistor-based trim
Š
Pre-bias startup
Š
Output voltage tracking
Š
No minimum load required
Š
Output voltage programmable from
0.75Vdc to 3.3Vdc via external resistor
Š
Fixed frequency operation
Š
Input UVLO, output OTP, OCP
Š
Remote ON/OFF
Š
Remote sense
Š
ISO 9001, TL 9000, ISO 14001, QS9000,
OHSAS18001 certified manufacturing facility
Š
UL/cUL 60950-1 (US & Canada) Recognized,
and TUV (EN60950-1) Certified
Š
Delphi DNM, Non-Isolated Point of Load
CE mark meets 73/23/EEC and 93/68/EEC
directives
DC/DC Power Modules: 2.8-5.5Vin, 0.75-3.3V/10Aout
The Delphi Series DNM, 2.8-5.5V input, single output, non-isolated
Point of Load DC/DC converters are the latest offering from a world
leader in power system and technology and manufacturing ― Delta
Electronics, Inc. The DNM04 series provides a programmable output
voltage from 0.75V to 3.3V using an external resistor. The DNM series
has flexible and programmable tracking and sequencing features to
enable a variety of startup voltages as well as sequencing and tracking
between power modules. This product family is available in surface
mount or SIP packages and provides up to 10A of output current in an
industry standard footprint. With creative design technology and
optimization of component placement, these converters possess
outstanding electrical and thermal performance, as well as extremely
high reliability under highly stressful operating conditions.
DATASHEET
DS_DNM04SMD10_03062009
OPTIONS
Š
Negative On/Off logic
Š
Tracking feature
Š
SIP package
APPLICATIONS
Š
Telecom / DataCom
Š
Distributed power architectures
Š
Servers and workstations
Š
LAN / WAN applications
Š
Data processing applications
TECHNICAL SPECIFICATIONS
(TA = 25°C, airflow rate = 300 LFM, Vin = 2.8Vdc and 5.5Vdc, nominal Vout unless otherwise noted.)
PARAMETER
NOTES and CONDITIONS
DNM04S0A0S10PFD
Min.
ABSOLUTE MAXIMUM RATINGS
Input Voltage (Continuous)
Tracking Voltage
Operating Temperature
Storage Temperature
INPUT CHARACTERISTICS
Operating Input Voltage
Input Under-Voltage Lockout
Turn-On Voltage Threshold
Turn-Off Voltage Threshold
Maximum Input Current
No-Load Input Current
Off Converter Input Current
Inrush Transient
Recommended Inout Fuse
OUTPUT CHARACTERISTICS
Output Voltage Set Point
Output Voltage Adjustable Range
Output Voltage Regulation
Over Line
Over Load
Over Temperature
Total Output Voltage Range
Output Voltage Ripple and Noise
Peak-to-Peak
RMS
Output Current Range
Output Voltage Over-shoot at Start-up
Output DC Current-Limit Inception
Output Short-Circuit Current (Hiccup Mode)
DYNAMIC CHARACTERISTICS
Dynamic Load Response
Positive Step Change in Output Current
Negative Step Change in Output Current
Setting Time to 10% of Peak Deviation
Turn-On Transient
Start-Up Time, From On/Off Control
Start-Up Time, From Input
Output Voltage Rise Time
Output Capacitive Load
EFFICIENCY
Vo=3.3V
Vo=2.5V
Vo=1.8V
Vo=1.5V
Vo=1.2V
Vo=0.75V
FEATURE CHARACTERISTICS
Switching Frequency
ON/OFF Control, (Negative logic)
Logic Low Voltage
Logic High Voltage
Logic Low Current
Logic High Current
ON/OFF Control, (Positive Logic)
Logic High Voltage
Logic Low Voltage
Logic Low Current
Logic High Current
Tracking Slew Rate Capability
Tracking Delay Time
Tracking Accuracy
Remote Sense Range
GENERAL SPECIFICATIONS
MTBF
Weight
Over-Temperature Shutdown
DS_DNM04SMD10_03062009
Typ.
Max.
0
Refer to Figure 44 for measuring point
-40
-55
5.8
Vin,max
+125
+125
Vout ≦ Vin –0.5
2.8
5.5
2.2
2.0
Vin=2.8V to 5.5V, Io=Io,max
Vin=5V, Io= Io, max
Vi=Vi,min to Vi,max
Io=Io,min to Io,max
Tc=-40℃ to 100℃
Over sample load, line and temperature
5Hz to 20MHz bandwidth
Full Load, 1µF ceramic, 10µF tantalum
Full Load, 1µF ceramic, 10µF tantalum
Vo,set
+2.0
3.63
% Vo,set
V
+3.0
% Vo,set
% Vo,set
% Vo,set
% Vo,set
0.3
0.4
0.8
-3.0
25
8
220
3.5
mV
mV
A
% Vo,set
% Io
Adc
200
200
25
mV
mV
µs
4
4
4
ms
ms
ms
µF
µF
0
Vout= 3.3V
Io,s/c
10µF Tan & 1µF Ceramic load cap, 2.5A/µs
50% Io, max to 100% Io, max
100% Io, max to 50% Io, max
Io=Io.max
Vin=Vin,min, Vo=10% of Vo,set
Vo=10% of Vo,set
Time for Vo to rise from 10% to 90% of Vo,set
Full load; ESR ≧1mΩ
Full load; ESR ≧10mΩ
Vin=5V, 100% Load
Vin=5V, 100% Load
Vin=5V, 100% Load
Vin=5V, 100% Load
Vin=5V, 100% Load
Vin=5V, 100% Load
Module On, Von/off
Module Off, Von/off
Module On, Ion/off
Module Off, Ion/off
Module On, Von/off
Module Off, Von/off
Module On, Ion/off
Module Off, Ion/off
Delay from Vin.min to application of tracking voltage
Power-up
2V/mS
Power-down 1V/mS
Io=80% of Io, max; Ta=25°C
Refer to Figure 44 for measuring point
V
0.1
15
10
-2.0
0.7525
Vdc
Vdc
°C
°C
V
V
A
mA
mA
A 2S
A
70
5
Vin=2.8V to 5.5V, Io=Io,min to Io,max
Units
50
15
10
1
8
1000
5000
96.0
94.3
92.7
91.7
90.2
86.4
%
%
%
%
%
%
300
kHz
-0.2
1.5
0.2
-0.2
0.2
0.1
10
100
200
22.9
9
130
0.3
Vin,max
10
1
V
V
µA
mA
Vin,max
0.3
1
10
2
V
V
mA
µA
V/msec
ms
mV
mV
V
200
400
0.1
M hours
grams
°C
2
100
100
95
95
90
EFFICIENCY(%)
EFFICIENCY(%)
ELECTRICAL CHARACTERISTICS CURVES
Vin=4.5V
Vin=5.0V
85
Vin=5.5V
80
90
Vin=3.0V
85
Vin=5.0
Vin=5.5V
80
75
1
2
3
4
5
6
7
8
9
75
10
1
2
3
OUTPUR CURRENT(A)
95
95
EFFICIENCY(%)
EFFICIENCY(%)
100
Vin=2.8V
Vin=5.0V
Vin=5.5V
80
7
90
8
9
10
Vin=2.8V
Vin=5.0V
85
Vin=5.5V
80
75
75
1
2
3
4
5
6
7
8
9
10
1
2
3
OUTPUR CURRENT(A)
5
6
7
8
9
10
Figure 4: Converter Efficiency vs. Output Current (1.5V out)
95
90
90
EFFICIENCY(%)
95
85
80
4
OUTPUR CURRENT(A)
Figure 3: Converter Efficiency vs. Output Current (1.8V out)
EFFICIENCY(%)
6
Figure 2: Converter Efficiency vs. Output Current (2.5V out)
100
85
5
OUTPUR CURRENT(A)
Figure 1: Converter Efficiency vs. Output Current (3.3V out)
90
4
Vin=2.8V
75
Vin=5.0
70
Vin=5.5V
85
80
Vin=2.8V
75
Vin=5.0
70
Vin=5.5V
65
65
60
1
2
3
4
5
6
7
8
9
OUTPUR CURRENT(A)
Figure 5: Converter Efficiency vs. Output Current (1.2V out)
DS_DNM04SMD10_03062009
10
1
2
3
4
5
6
7
8
9
10
OUTPUR CURRENT(A)
Figure 6: Converter Efficiency vs. Output Current (0.75V out)
3
ELECTRICAL CHARACTERISTICS CURVES
Figure 7: Output ripple & noise at 3.3Vin, 2.5V/10A out
Figure 8: Output ripple & noise at 3.3Vin, 1.8V/10A out
Figure 9: Output ripple & noise at 5Vin, 3.3V/10A out
Figure 10: Output ripple & noise at 5Vin, 1.8V/10A out
Figure 11: Turn on delay time at 3.3Vin, 2.5V/10A out
Figure 12: Turn on delay time at 3.3Vin, 1.8V/10A out
DS_DNM04SMD10_03062009
4
ELECTRICAL CHARACTERISTICS CURVES
Figure 13: Turn on delay time at 5Vin, 3.3V/10A out
Figure 14: Turn on delay time at 5Vin, 1.8V/10A out
Figure 15: Turn on delay time at remote turn on 5Vin, 3.3V/16A out
Figure 16: Turn on delay time at remote turn on 3.3Vin, 2.5V/16A
out
Figure 17: Turn on delay time at remote turn on with external
capacitors (Co= 5000 µF) 5Vin, 3.3V/16A out
DS_DNM04SMD10_03062009
Figure 18: Turn on delay time at remote turn on with external
capacitors (Co= 5000 µF) 3.3Vin, 2.5V/16A out
5
ELECTRICAL CHARACTERISTICS CURVES
Figure 19: Typical Transient Response to Step Load Change at
2.5A/μS from 100% to 50% of Io, max at 5Vin, 3.3Vout
(Cout = 1uF ceramic, 10μF Tantalum)
Figure 20: Typical Transient Response to Step Load Change at
2.5A/μS from 50% to 100% of Io, max at 5Vin, 3.3Vout
(Cout =1uF ceramic, 10μF Tantalum)
Figure 21: Typical Transient Response to Step Load Change at
2.5A/μS from 100% to 50% of Io, max at 5Vin, 1.8Vout
(Cout =1uF ceramic, 10μF Tantalum)
Figure 22: Typical Transient Response to Step Load Change at
2.5A/μS from 50% to 100% of Io, max at 5Vin, 1.8Vout
(Cout = 1uF ceramic, 10μF Tantalum)
Figure 23: Typical Transient Response to Step Load Change at
2.5A/μS from 100% to 50% of Io, max at 3.3Vin,
2.5Vout (Cout =1uF ceramic, 10μF Tantalum)
Figure 24: Typical Transient Response to Step Load Change at
2.5A/μS from 50% to 100% of Io, max at 3.3Vin,
2.5Vout (Cout =1uF ceramic, 10μF Tantalum)
DS_DNM04SMD10_03062009
6
ELECTRICAL CHARACTERISTICS CURVES
Figure 25: Typical Transient Response to Step Load Change at
2.5A/μS from 100% to 50% of Io, max at
3.3Vin,1.8Vout (Cout=1uF ceramic, 10μF Tantalum)
Figure 26: Typical Transient Response to Step Load Change
at 2.5A/μS from 50% to 100% of Io, max at
3.3Vin,1.8Vout
(Cout = 1uF ceramic, 10μF
Tantalum)
Figure 27: Output short circuit current 5Vin, 0.75Vout
Figure 28:Turn on with Prebias 5Vin, 3.3V/0A out, Vbias
=1.0Vdc
DS_DNM04SMD10_03062009
7
TEST CONFIGURATIONS
DESIGN CONSIDERATIONS
TO OSCILLOSCOPE
L
VI(+)
2 100uF
Tantalum
BATTERY
VI(-)
To maintain low noise and ripple at the input voltage, it is
critical to use low ESR capacitors at the input to the
module. Figure 32 shows the input ripple voltage (mVp-p)
for various output models using 200 µF(2 x100uF) low
ESR tantalum capacitor (KEMET p/n: T491D107M016AS,
AVX p/n: TAJD107M106R, or equivalent) in parallel with
47 µF ceramic capacitor (TDK p/n:C5750X7R1C476M or
equivalent). Figure 33 shows much lower input voltage
ripple when input capacitance is increased to 400 µF (4 x
100 µF) tantalum capacitors in parallel with 94 µF (2 x 47
µF) ceramic capacitor.
Note: Input reflected-ripple current is measured with a
simulated source inductance. Current is measured at
the input of the module.
The input capacitance should be able to handle an AC
ripple current of at least:
Figure 29: Input reflected-ripple test setup
Irms = Iout
Vo
1uF
10uF
SCOPE
tantalum ceramic
Resistive
Load
GND
Input Ripple Voltage (mVp-p)
COPPER STRIP
150
100
50
VI
Vo
II
SUPPLY
Io
Vo
Vin
LOAD
GND
CONTACT RESISTANCE
Figure 31: Output voltage and efficiency measurement test
setup
Note: All measurements are taken at the module
terminals. When the module is not soldered (via
socket), place Kelvin connections at module
terminals to avoid measurement errors due to
contact resistance.
η =(
5.0Vin
3.3Vin
0
0
1
2
3
4
Output Voltage (Vdc)
Figure 32: Input voltage ripple for various output models, IO =
10 A (CIN = 2×100 µF tantalum // 47 µF ceramic)
Input Ripple Voltage (mVp-p)
CONTACT AND
DISTRIBUTION LOSSES
Arms
200
Note: Use a 10μF tantalum and 1μF capacitor. Scope
measurement should be made using a BNC cable.
Figure 30: Peak-peak output noise and startup transient
measurement test setup.
Vout ⎛ Vout ⎞
⎜1 −
⎟
Vin ⎝
Vin ⎠
200
150
100
5.0Vin
50
3.3Vin
0
0
1
2
3
4
Output Voltage (Vdc)
Figure 33: Input voltage ripple for various output models, IO =
10 A (CIN = 4×100 µF tantalum // 2×47 µF ceramic)
Vo × Io
) × 100 %
Vi × Ii
DS_DNM04SMD10_03062009
8
DESIGN CONSIDERATIONS (CON.)
FEATURES DESCRIPTIONS
The power module should be connected to a low
ac-impedance input source. Highly inductive source
impedances can affect the stability of the module. An
input capacitance must be placed close to the modules
input pins to filter ripple current and ensure module
stability in the presence of inductive traces that supply
the input voltage to the module.
Remote On/Off
Safety Considerations
For safety-agency approval the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standards.
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the
input must meet SELV requirements. The power
module has extra-low voltage (ELV) outputs when all
inputs are ELV.
The input to these units is to be provided with a
maximum 15A time-delay fuse in the ungrounded lead.
The DNM/DNL series power modules have an On/Off pin
for remote On/Off operation. Both positive and negative
On/Off logic options are available in the DNM/DNL series
power modules.
For positive logic module, connect an open collector
(NPN) transistor or open drain (N channel) MOSFET
between the On/Off pin and the GND pin (see figure 34).
Positive logic On/Off signal turns the module ON during
the logic high and turns the module OFF during the logic
low. When the positive On/Off function is not used, leave
the pin floating or tie to Vin (module will be On).
For negative logic module, the On/Off pin is pulled high
with an external pull-up 5kΩ resistor (see figure 35).
Negative logic On/Off signal turns the module OFF during
logic high and turns the module ON during logic low. If the
negative On/Off function is not used, leave the pin floating
or tie to GND. (module will be On)
Vo
Vin
ION/OFF
RL
On/Off
GND
Figure 34: Positive remote On/Off implementation
Vo
Vin
Rpull-up
ION/OFF
On/Off
RL
GND
Figure 35: Negative remote On/Off implementation
Over-Current Protection
To provide protection in an output over load fault
condition, the unit is equipped with internal over-current
protection. When the over-current protection is triggered,
the unit enters hiccup mode. The units operate normally
once the fault condition is removed.
DS_DNM04SMD10_03062009
9
FEATURES DESCRIPTIONS (CON.)
Over-Temperature Protection
The over-temperature protection consists of circuitry that
provides protection from thermal damage. If the
temperature exceeds the over-temperature threshold the
module will shut down. The module will try to restart after
shutdown. If the over-temperature condition still exists
during restart, the module will shut down again. This
restart trial will continue until the temperature is within
specification
Vtrim = 0.7 − 0.1698 × (Vo − 0.7525)
For example, to program the output voltage of a DNL
module to 3.3 Vdc, Vtrim is calculated as follows
Vtrim = 0.7 − 0.1698 × (3.3 − 0.7525) = 0.267V
Vo
RLoad
TRIM
Rtrim
Remote Sense
GND
The DNM/DNL provide Vo remote sensing to achieve
proper regulation at the load points and reduce effects of
distribution losses on output line. In the event of an open
remote sense line, the module shall maintain local sense
regulation through an internal resistor. The module shall
correct for a total of 0.5V of loss. The remote sense line
impedance shall be < 10Ω.
Distribution Losses
Vo
Vin
using an external resistor
Vo
Vtrim
RL
GND
Distribution
L
Figure 36: Effective circuit configuration
for remote sense
operation
Output Voltage Programming
The output voltage of the DNM/DNL can be programmed
to any voltage between 0.75Vdc and 3.3Vdc by
connecting one resistor (shown as Rtrim in Figure 37)
between the TRIM and GND pins of the module. Without
this external resistor, the output voltage of the module is
0.7525 Vdc. To calculate the value of the resistor Rtrim
for a particular output voltage Vo, please use the
following equation:
⎡ 21070
⎤
Rtrim = ⎢
− 5110⎥ Ω
⎣Vo − 0.7525
⎦
For example, to program the output voltage of the DNL
module to 1.8Vdc, Rtrim is calculated as follows:
⎡ 21070
⎤
Rtrim = ⎢
− 5110⎥ Ω = 15KΩ
⎣1.8 − 0.7525
⎦
DNL can also be programmed by apply a voltage
between the TRIM and GND pins (Figure 38). The
following equation can be used to determine the value of
Vtrim needed for a desired output voltage Vo:
DS_DNM04SMD10_03062009
RLoad
TRIM
GND
Distribution Losses
Sense
Distribution
Figure 37: Circuit configuration for programming output voltage
+
_
Figure 38: Circuit Configuration for programming output voltage
using external voltage source
Table 1 provides Rtrim values required for some common
output voltages, while Table 2 provides value of external
voltage source, Vtrim, for the same common output
voltages. By using a 1% tolerance trim resistor, set point
tolerance of ±2% can be achieved as specified in the
electrical specification.
Table 1
Vo(V)
Rtrim(KΩ)
0.7525
Open
1.2
41.97
1.5
23.08
1.8
15.00
2.5
6.95
3.3
3.16
Table 2
Vo(V)
Vtrim(V)
0.7525
Open
1.2
0.624
1.5
0.573
1.8
0.522
2.5
0.403
3.3
0.267
10
FEATURE DESCRIPTIONS (CON.)
The amount of power delivered by the module is the
voltage at the output terminals multiplied by the output
current. When using the trim feature, the output voltage
of the module can be increased, which at the same
output current would increase the power output of the
module. Care should be taken to ensure that the
maximum output power of the module must not exceed
the maximum rated power (Vo.set x Io.max ≤ P max).
Voltage Margining
The output voltage tracking feature (Figure 40 to Figure
42) is achieved according to the different external
connections. If the tracking feature is not used, the
TRACK pin of the module can be left unconnected or tied
to Vin.
For proper voltage tracking, input voltage of the tracking
power module must be applied in advance, and the
remote on/off pin has to be in turn-on status. (Negative
logic: Tied to GND or unconnected. Positive logic: Tied to
Vin or unconnected)
Output voltage margining can be implemented in the
DNL modules by connecting a resistor, R margin-up, from the
Trim pin to the ground pin for margining-up the output
voltage and by connecting a resistor, Rmargin-down, from the
Trim pin to the output pin for margining-down. Figure 39
shows the circuit configuration for output voltage
margining. If unused, leave the trim pin unconnected. A
calculation tool is available from the evaluation
procedure which computes the values of R margin-up and
Rmargin-down for a specific output voltage and margin
percentage.
Vin
Vo
Rmargin-down
PS1
PS1
PS2
PS2
Figure 40: Sequential
Q1
On/Off Trim
Rmargin-up
Rtrim
Q2
PS1
PS1
PS2
PS2
GND
Figure 39: Circuit configuration for output voltage margining
Voltage Tracking
Figure 41: Simultaneous
The DNM family was designed for applications that have
output voltage tracking requirements during power-up
and power-down. The devices have a TRACK pin to
implement three types of tracking method: sequential
start-up, simultaneous and ratio-metric. TRACK
simplifies the task of supply voltage tracking in a power
system by enabling modules to track each other, or any
external voltage, during power-up and power-down.
By connecting multiple modules together, customers can
get multiple modules to track their output voltages to the
voltage applied on the TRACK pin.
DS_DNM04SMD10_03062009
+△V
PS1
PS1
PS2
PS2
Figure 42: Ratio-metric
11
FEATURE DESCRIPTIONS (CON.)
Sequential Start-up
Sequential start-up (Figure 40) is implemented by placing
an On/Off control circuit between VoPS1 and the On/Off pin
of PS2.
PS1
PS2
Vin
Vin
VoPS1
VoPS2
R3
On/Off
R1
Q1
On/Off
R2
C1
Simultaneous
Simultaneous tracking (Figure 41) is implemented by
using the TRACK pin. The objective is to minimize the
voltage difference between the power supply outputs
during power up and down.
The simultaneous tracking can be accomplished by
connecting VoPS1 to the TRACK pin of PS2. Please note
the voltage apply to TRACK pin needs to always higher
than the VoPS2 set point voltage.
PS2
PS1
Vin
Vin
VoPS1
VoPS2
TRACK
On/Off
On/Off
DS_DNM04SMD10_03062009
12
THERMAL CONSIDERATIONS
Thermal management is an important part of the system
design. To ensure proper, reliable operation, sufficient
cooling of the power module is needed over the entire
temperature range of the module. Convection cooling is
usually the dominant mode of heat transfer.
Hence, the choice of equipment to characterize the
thermal performance of the power module is a wind
tunnel.
Thermal Testing Setup
Delta’s DC/DC power modules are characterized in
heated vertical wind tunnels that simulate the thermal
environments encountered in most electronics
equipment. This type of equipment commonly uses
vertically mounted circuit cards in cabinet racks in which
the power modules are mounted.
The following figure shows the wind tunnel
characterization setup. The power module is mounted
on a test PWB and is vertically positioned within the
wind tunnel. The height of this fan duct is constantly kept
at 25.4mm (1’’).
Thermal Derating
Heat can be removed by increasing airflow over the
module. The module’s maximum hot spot temperature is
125°C. To enhance system reliability, the power
module should always be operated below the maximum
operating temperature. If the temperature exceeds the
maximum module temperature, reliability of the unit may
be affected.
PWB
FACING PWB
MODULE
AIR VELOCITY
AND AMBIENT
TEMPERATURE
MEASURED BELOW
THE MODULE
50.8 (2.0”)
AIR FLOW
12.7 (0.5”)
25.4 (1.0”)
Note: Wind Tunnel Test Setup Figure Dimensions are in millimeters and (Inches)
Figure 43: Wind tunnel test setup
DS_DNM04SMD10_03062009
13
THERMAL CURVES
12
DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity
@ Vin = 3.3V, Vo = 2.5V (Either Orientation)
Output Current(A)
10
8
6
Natural
Convection
4
2
0
60
Figure 44: Temperature measurement location
* The allowed maximum hot spot temperature is defined at 125℃
12
65
70
75
80
85
Ambient Temperature (℃)
Figure 47: DNM04S0A0S10(Standard) Output Current vs.
Ambient Temperature and Air [email protected]=3.3V,
Vo=2.5V(Either Orientation)
DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity
@ Vin = 5V, Vo = 3.3V (Either Orientation)
Output Current(A)
12
DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity
@ Vin = 3.3V, Vo = 0.75V (Either Orientation)
Output Current(A)
10
10
8
8
6
6
Natural
Convection
Natural
Convection
4
4
2
2
0
60
65
70
75
80
85
Ambient Temperature (℃)
Figure 45: DNM04S0A0S10(Standard) Output Current vs.
Ambient Temperature and Air [email protected]=5V, Vo=3.3V(Either
Orientation)
12
DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity
@ Vin = 5.0V, Vo = 0.75V (Either Orientation)
0
60
65
70
75
80
85
Ambient Temperature (℃)
Figure 48: DNM04S0A0S10(Standard) Output Current vs.
Ambient Temperature and Air [email protected]=3.3V,
Vo=0.75V(Either Orientation)
Output Current(A)
10
8
6
Natural
Convection
4
2
0
60
65
70
75
80
85
Ambient Temperature (℃)
Figure 46: DNM04S0A0S10(Standard) Output Current vs.
Ambient Temperature and Air [email protected]=5V,
DS_DNM04SMD10_03062009
Vo=0.75V(Either Orientation)
14
PICK AND PLACE LOCATION
SURFACE-MOUNT TAPE & REEL
LEAD (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE
Temperature (°C )
250
200
150
Ramp-up temp.
0.5~3.0°C /sec.
Peak temp.
2nd Ramp-up temp.
210~230°C 5sec.
1.0~3.0°C /sec.
Pre-heat temp.
140~180°C 60~120 sec.
Cooling down rate <3°C /sec.
100
Over 200°C
40~50sec.
50
0
60
120
Time ( sec. )
180
240
300
LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE
Temp.
Peak Temp. 240 ~ 245 ℃
220℃
Ramp down
max. 4℃ /sec.
200℃
150℃
Preheat time
90~120 sec.
Ramp up
max. 3℃ /sec.
Time Limited 75 sec.
above 220℃
25℃
Time
Note: All temperature refers to assembly application board, measured on the land of assembly application board.
DS_DNM04SMD10_03062009
15
MECHANICAL DRAWING
SMD PACKAGE
DS_DNM04SMD10_03062009
SIP PACKAGE (OPTIONAL)
16
PART NUMBERING SYSTEM
DNM
04
S
0A0
S
10
P
Product
Series
Input Voltage
Numbers of
Outputs
Output
Voltage
Package
Type
Output
Current
On/Off logic
DNL - 16A
04 - 2.8~5.5V
S - Single
0A0 -
R - SIP
16 -16A
N- negative
DNM - 10A
10 – 8.3~14V
Programmable
S - SMD
10 -10A
(Default)
DNS - 6A
F
D
Option Code
F- RoHS 6/6
D - Standard Function
(Lead Free)
P- positive
MODEL LIST
Output Voltage Output Current
Efficiency
5.0Vin, 3.3Vdc @ 100% Load
Model Name
Packaging
Input Voltage
DNM04S0A0S10PFD
SMD
2.8 ~ 5.5Vdc
0.75 V~ 3.3Vdc
10A
96.0%
DNM04S0A0S10NFD
SMD
2.8 ~ 5.5Vdc
0.75 V~ 3.3Vdc
10A
96.0%
DNM04S0A0R10PFD
SIP
2.8 ~ 5.5Vdc
0.75 V~ 3.3Vdc
10A
96.0%
DNM04S0A0R10NFD
SIP
2.8 ~ 5.5Vdc
0.75 V~ 3.3Vdc
10A
96.0%
CONTACT: www.delta.com.tw/dcdc
USA:
Telephone:
East Coast: (888) 335 8201
West Coast: (888) 335 8208
Fax: (978) 656 3964
Email: [email protected]
Europe:
Phone: +41 31 998 53 11
Fax: +41 31 998 53 53
Email: [email protected]
Asia & the rest of world:
Telephone: +886 3 4526107
ext 6220~6224
Fax: +886 3 4513485
Email: [email protected]
WARRANTY
Delta offers a two (2) year limited warranty. Complete warranty information is listed on our web site or is available upon
request from Delta.
Information furnished by Delta is believed to be accurate and reliable. However, no responsibility is assumed by Delta
for its use, nor for any infringements of patents or other rights of third parties, which may result from its use. No license
is granted by implication or otherwise under any patent or patent rights of Delta. Delta reserves the right to revise these
specifications at any time, without notice.
DS_DNM04SMD10_03062009
17