TI DLP3000

DLP3000
DLPS022 – JANUARY 2012
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®
DLP 0.3 WVGA Series 220 DMD
Check for Samples: DLP3000
FEATURES
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0.3-Inch (7.62 mm) Diagonal Micromirror Array
– 608 × 684 Array of Aluminum,
Micrometer-Sized Mirrors
– 7.6-µm Micromirror Pitch
– ±12° Micromirror Tilt Angle (Relative to Flat
State)
– Side Illumination for Optimized Efficiency
– 3-µs Micromirror Cross Over Time
Highly Efficient in Visible Light (420 nm–720
nm):
– Window Transmission 97% (Single Pass,
Through Two Window Surfaces)
– Micromirror Reflectivity 88%
– Array Diffraction Efficiency 86%
– Array Fill Factor 92%
– Polarization Independent
Up to WVGA Resolution (854x480) Wide
Aspect Ratio Display
Low Power Consumption, only 200 mW
(Typical)
15-Bit, Double Data Rate (DDR) Input Data Bus
60-MHz to 80-MHz Input Data Clock Rate
Integrated Micromirror Driver Circuitry
Supports –10 °C to 70 °C
16.6-mm by 7-mm by 5-mm Package Footprint
Dedicated DLPC300 Controller for Reliable
Operation
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Package Mates to PANASONIC AXT550224
Socket
APPLICATIONS
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Machine Vision
Industrial Inspection
3D Scanning
3D Optical Metrology
Automated Fingerprint Identification
Face Recognition
Augmented Reality
Embedded Display
Interactive Display
Information Overlay
Spectroscopy
Chemical Analyzers
Medical Instruments
Photo-Stimulation
Virtual Gauges
DESCRIPTION
The DLP3000 digital micromirror device (DMD) is a digitally controlled MOEMS (micro-opto-electromechanical
system) spatial light modulator (SLM). When coupled to an appropriate optical system, the DLP3000 can be used
to modulate the amplitude, direction, and/or phase of incoming light. The DLP3000 creates light patterns with
speed, precision, and efficiency.
Architecturally, the DLP3000 is a latchable, electrical-in/optical-out semiconductor device. This architecture
makes the DLP3000 well suited for use in applications such as 3D scanning or metrology with structured light,
augmented reality, microscopy, medical instruments, and spectroscopy. The compact physical size of the
DLP3000 is well-suited for portable equipment where small form factor and lower cost are important. The
compact package compliments the small size of LEDs to enable highly efficient, robust light engines.
The DLP3000 is one of two devices in the DLP 0.3 WVGA chipset (see Figure 1). Proper function and reliable
operation of the DLP3000 requires that it be used in conjunction with the DLPC300 controller. See the DLP 0.3
WVGA Chip-set data sheet (TI literature number DLPZ005) for further details. Figure 2 shows a typical system
application using the DLP 0.3-inch WVGA chipset.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DLP is a registered trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
DLP3000
DLPS022 – JANUARY 2012
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DLPC300
DATA(14:0)
LOADB
TRC
SCTRL
SAC_BUS
CONTROL
SAC_CLK
DRC_BUS
SDRAM
INTERFACE
Serial
FLASH
FLASH
INTERFACE
VCC
VSS
VOFFSET
VBIAS
VRESET
VDD10
VCC18
VCC_INTF
GND
VDD_PLL
RTN_PLL
SPICLK
SPICSZ0
SPIDOUT
SPIDIN
VCC_FLSH
DRC_OE
DRC_STROBE
LED DRIVER
Memory
Interface
CAMERA
TRIGGER
CMOS
MEMORY
ARRAY
MICROMIRROR
ARRAY
MICROMIRROR ARRAY
RESET CONTROL
SCL
SDA
PARK
RESET
GPIO4_INTF
PLL_REFCLK
DATA & CONTROL RECEIVER
PARALLEL
RGB
Data
Interface
DLP3000
VCC
VSS
Illumination
Interface
Camera
Trigger
Figure 1. DLP 0.3 WVGA Chip Set
2
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Data
Control
Address
Mobile DDR RAM
HSYNC,VSYNC
Red PWN,
Green PWM,
Blue PWM
24-Bit RGB Data
LED Strobes
PCLK
LED
Drivers
LEDs
Illumination
Optics
I22 C
I22 C
DLPC300
DMD Control
DLP3000
DMD Data
SPICS
SPIDIN,
SPIDOUT
SPICLK
CTL
OSC
VBIAS
Control
Processor
(MSP430)
VRST
Control
LED
Sensor
VOFF
Digital Video
DVI
Receiver
(TVP5151)
DMD™
Voltage
Supplies
SPI
FLASH
Figure 2. Typical Application
Electrically, the DLP3000 consists of a two-dimensional array of 1-bit CMOS memory cells, organized in a grid of
608 memory cell columns by 684 memory cell rows. The CMOS memory array is addressed on
column-by-column basis, over a 15-bit double data rate (DDR) bus. Addressing is handled via a serial control
bus. The specific CMOS memory access protocol is handled by the DLPC300 digital controller.
Optically, the DLP3000 consists of 415,872 highly reflective, digitally switchable, micrometer-sized mirrors
(micromirrors) organized in a two-dimensional array. The micromirror array consists of 608 micromirror columns
by 684 micromirror rows in diamond pixel configuration (Figure 3). Due to the diamond pixel configuration, the
columns of each odd row are offset by half a pixel from the columns of the even row.
Each aluminum micromirror is approximately 7.6 microns in size (see Micromirror Pitch in Figure 3), and is
switchable between two discrete angular positions: –12° and +12°. The angular positions are measured relative
to a 0° flat reference when the mirrors are parked in their inactive state, parallel to the array plane (see Figure 4).
The tilt direction is perpendicular to the hinge-axis. The on-state landed position is directed toward the left side of
the package (see DLP3000 Active Mirror Array, Micromirror Pitch, and Micromirror Hinge-Axis Orientation in
Figure 3).
Each individual micromirror is positioned over a corresponding CMOS memory cell. The angular position of a
specific micromirror is determined by the binary state (logic 0 or 1) of the corresponding CMOS memory cell
contents, after the mirror clocking pulse is applied. The angular position (–12° or +12°) of the individual
micromirrors changes synchronously with a micromirror clocking pulse, rather than being coincident with the
CMOS memory cell data update. Therefore, writing a logic 1 into a memory cell followed by a mirror clocking
pulse results in the corresponding micromirror switching to a +12° position. Writing a logic 0 into a memory cell
followed by a mirror clocking pulse results in the corresponding micromirror switching to a –12° position.
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Updating the angular position of the micromirror array consists of two steps. First, updating the contents of the
CMOS memory. Second, application of a mirror reset to all or a portion of the micromirror array (depending upon
the configuration of the system). Mirror reset pulses are generated internally by the DLP3000 DMD, with
application of the pulses being coordinated by the DLPC300 controller. See SWITCHING CHARACTERISTICS
timing specifications.
Around the perimeter of the 608 × 684 array of micromirrors is a uniform band of border micromirrors. The border
micromirrors are not user-addressable. The border micromirrors land in the –12° position once power has been
applied to the device. There are 10 border micromirrors on each side of the 608 by 684 active array.
4
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Incident
Illumination
Package
Pin-1
Corner
Col 0
Col 2
Row
Row
Row
Row
0
1
2
3
680
681
682
683
Row
Row
Row
Row
680
681
682
683
7.
63
7m
10.8 µm
Micromirror Pitch
7m
63
7.
10.8 µm
Col 3
Col 1
0
1
2
3
Col 607
Row
Row
Row
Row
(Border micromirrors omitted for clarity)
Col 605
Row
Row
Row
Row
Col 604
Col 606
DLP3000 Active Mirror Array
Micromirror Hinge-Axis Orientation
“Off-State”
Tilt Direction
“On-State”
Tilt Direction
Figure 3. Micromirror Array, Pitch, and Hinge-Axis Orientation
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–a ± b
a±b
Figure 4. Micromirror Landed Positions and Light Paths
6
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Related Documents
The following documents contain additional information related to the use of the DLP3000 device:
Table 1. Related Documents
DOCUMENT
TI LITERATURE
NUMBER
DLP 0.3 WVGA Chipset data sheet
DLPZ005
DLPC300 Digital Controller data sheet
DLPS023
DLPC300 Software Programmer's Guide
DLPU004
Device Part Number Nomenclature
Figure 5 provides a legend for reading the complete device name for any DLP device.
DLP3000FQB
Package Type
Device Descriptor
Figure 5. Device Nomenclature
Device Marking
The device marking consists of the fields shown in Figure 6.
Lot Trace Code
GHJJJJKHVVVV
Encoded Device Part Number
Figure 6. Device Marking
Device Terminals
This section describes the input/output characteristics of signals that interface to the DLP3000, organized by
functional groups. Table 2 includes I/O, Type, Internal Termination, Clock Domain, and Data Rate characteristics
which are further described in subsequent sections.
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Figure 7. Package Connector Signal Names (Device Bottom View)
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Table 2. Connector Pins
TERMINAL
NAME
CONNECTOR
PINS
I/O/P
TYPE
INTERNAL
TERMINATION
CLOCKED
BY
DATA
RATE
DATA(0)
D2
Input
LVCMOS
None
DCLK
DDR
DATA(1)
D4
Input
LVCMOS
None
DCLK
DDR
DATA(2)
D5
Input
LVCMOS
None
DCLK
DDR
DATA(3)
D6
Input
LVCMOS
None
DCLK
DDR
DATA(4)
D8
Input
LVCMOS
None
DCLK
DDR
DATA(5)
D10
Input
LVCMOS
None
DCLK
DDR
DATA(6)
D12
Input
LVCMOS
None
DCLK
DDR
DATA(7)
D14
Input
LVCMOS
None
DCLK
DDR
DATA(8)
E16
Input
LVCMOS
None
DCLK
DDR
DATA(9)
E14
Input
LVCMOS
None
DCLK
DDR
DATA(10)
E12
Input
LVCMOS
None
DCLK
DDR
DATA(11)
E10
Input
LVCMOS
None
DCLK
DDR
DATA(12)
E5
Input
LVCMOS
None
DCLK
DDR
DATA(13)
E6
Input
LVCMOS
None
DCLK
DDR
DATA(14)
E8
Input
LVCMOS
None
DCLK
DDR
DCLK
E18
Input
LVCMOS
None
–
–
LOADB
E20
Input
LVCMOS
None
DCLK
DDR
Parallel data load enable
TRC
E4
Input
LVCMOS
None
DCLK
DDR
Input data toggle rate control
SCTRL
E2
Input
LVCMOS
None
DCLK
DDR
Serial control bus
SAC_BUS
E24
Input
LVCMOS
None
SAC_CLK
DDR
Stepped address control serial bus
data
SAC_CLK
D24
Input
LVCMOS
None
–
–
Stepped address control serial bus
clock
DESCRIPTION
Data Inputs
Input data bus
Input data bus clock
Data Control Inputs
Mirror Reset Control Inputs
DRC_BUS
D22
Input
LVCMOS
None
SAC_CLK
DRC_OE
D20
Input
LVCMOS
None
–
DRC_STROBE
E22
Input
LVCMOS
None
SAC_CLK
DMD reset-control serial bus
–
Active-low output enable signal for
internal DMD Reset driver circuitry
Strobe signal for DMD Reset
Control inputs
Power
VBIAS
D16
Power
Analog
None
–
–
Mirror reset bias voltage
VOFFSET
D21
Power
Analog
None
–
–
Mirror reset offset voltage
VRESET
D18
Power
Analog
None
–
–
Mirror reset voltage
VREF
E21
Power
Analog
None
–
–
Power supply for double-data-rate
low-voltage CMOS logic terminals
VCC
D1, D13, D25,
E1, E13, E25
Power
Analog
None
–
–
Power supply for single-data-rate
LVCMOS logic terminals
VSS
D3, D7, D9,
D11, D15,
D17, D19,
D23, E3, E7,
E9, E11, E15,
E17, E19, E23
Power
Analog
None
–
–
Common return for all power
inputs
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Table 2. Connector Pins (continued)
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TERMINAL
NAME
CONNECTOR
PINS
I/O/P
TYPE
INTERNAL
TERMINATION
CLOCKED
BY
DATA
RATE
DESCRIPTION
No connect
A3, A5, A7,
A9, A11, A13,
A15, A17, A19,
A21, A23, A25,
A27, A29 A31,
B2, B4, B6,
B8, B10, B12,
B14, B16, B18,
B20, B22, B24,
B26, B28, B30,
C1, C3, C31,
F1, F3, F31,
G2, G4, G6,
G8, G10, G12,
G14, G16,
G18, G20,
G22, G24,
G26, G28,
G30, H1, H3,
H5, H7, H9,
H11, H13,
H15, H17,
H19, H21,
H23, H25,
H27, H29, H31
–
–
–
–
–
No connection (Any connection to
these terminals may result in
undesirable effects)
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted). Stresses beyond those listed under Absolute Maximum
Ratings may cause permanent damage to the device. The Absolute Maximum Ratings are stress ratings only, and functional
performance of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PARAMETER
CONDITIONS
MIN
MAX
UNIT
Electrical
VCC
Voltage applied to VCC (1) (2)
–0.5
4
V
VREF
Voltage applied to VREF (1) (2)
–0.5
4
V
(1) (2) (3)
VOFFSET
Voltage applied to VOFFSET
–0.5
8.75
V
VBIAS
Voltage applied to VBIAS (1) (2) (3)
–0.5
17
V
VRESET
Voltage applied to VRESET
(1) (2)
–11
0.5
V
8.75
V
–0.5
VREF + 0.3
Supply voltage delta |VBIAS – VOFFSET|
(3)
Voltage applied to all other input terminals (1)
V
Current required from a high-level output
VOH = 2.4 V
–20
mA
Current required from a low-level output
VOL = 0.4 V
15
mA
Environmental
Storage temperature range (4) (5)
Storage humidity (4) (5)
-40
80
°C
0
95
% RH
Non-condensing
< 420 nm
Illumination power density (4) (6)
420 nm to 700 nm
> 700 nm
Electrostatic discharge immunity
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(8)
All pins
2
See
(7)
mW/cm2
10
2000
V
All voltages referenced to VSS (ground).
Voltages VCC, VREF, VOFFSET, VBIAS, and VRESET are required for proper DMD operation.
Exceeding the recommended allowable absolute voltage difference between VBIAS and VOFFSET may result in excessive current draw.
Optimal, long-term performance of the Digital Micromirror Device (DMD) can be affected by various application parameters, including
illumination spectrum, illumination power density, micromirror landed duty cycle, ambient temperature (both storage and operating), case
temperature, ambient humidity (both storage and operating), and power on/off duty cycle. TI recommends that application-specific
effects be considered as early as possible in the design cycle. Contact your local Texas Instruments representative for additional
information related to optimizing the DMD performance.
Simultaneous exposure to high storage temperature and high storage humidity may affect device reliability.
Total integrated illumination power density, above or below the indicated wavelength threshold.
Limited only by the resulting array temperature. Refer to the Thermal Characteristics for information related to calculating the micromirror
array temperature.
Tested in accordance with JESD22-A114-B electrostatic discharge (ESD) sensitivity testing, human-body model (HBM).
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RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted). The functional performance of the device specified in this
data sheet is achieved when operating the device within the limits defined by the Recommended Operating Conditions. No
level of performance is implied when operating the device above or below the Recommended Operating Conditions limits.
PARAMETER
CONDITIONS
MIN
NOM
MAX
UNIT
1.65
1.8
1.95
V
2.375
2.5
2.625
V
8.25
8.5
8.75
V
15.5
16
16.5
V
– 9.5
–10
–10.5
V
8.75
V
Electrical
LVCMOS interface supply voltage (1) (2)
VREF
VCC
LVCMOS logic supply voltage
VOFFSET
VBIAS
VRESET
(1) (2)
Mirror electrode and HVCMOS supply voltage
(1) (2) (3)
Mirror electrode voltage (1) (2) (3)
Mirror electrode voltage
(1) (2)
Delta supply voltage |VBIAS – VOFFSET|
(3)
VT+
Positive-going threshold voltage
0.4 × VREF
0.7 × VREF
V
VT–
Negative-going threshold voltage
0.3 × VREF
0.6 × VREF
V
Vhys
Hysteresis voltage (VT+ – VT–)
0.1 × VREF
0.4 × VREF
fDCLK
DCLK clock frequency
60
80
MHz
45
N
100
N
V
Mechanical
Static load applied to the package electrical
connector area (4) (5)
Static load applied to the DMD mounting area (6)
(5)
Environmental
Operating Case Temperature (7) (8)
Operating Humidity (7)
non-condensing
25
°C
50
% RH
Operating Device Temperature Gradient (9)
Operating Landed Duty-Cycle (7) (10)
10
25
°C
%
(1)
(2)
(3)
All voltages referenced to VSS (ground)
Voltages VCC, VREF, VOFFSET, VBIAS, VRESET are required for proper DMD operation.
Exceeding the recommended voltage difference between VBIAS and VOFFSET may result in excessive current draw. See the Absolute
Maximum Ratings for further details.
(4) Load should be uniformly distributed across the entire connector area.
(5) See Figure 8.
(6) Load should be uniformly distributed across the three datum-A surfaces.
(7) Optimal, long-term performance of the Digital Micromirror Device (DMD) can be affected by various application parameters, including
illumination spectrum, illumination power density, micromirror landed duty cycle, ambient temperature (both storage and operating), case
temperature, ambient humidity (both storage and operating), and power on/off duty cycle. TI recommends that application-specific
effects be considered as early as possible in the design cycle. Contact your local Texas Instruments representative for additional
information related to optimizing the DMD performance.
(8) Refer to the Thermal Characteristics for the calculation of the micromirror array temperature from the thermal test point TC3 shown in
Figure 15.
(9) As measured between any two points on the exterior of the package, or as predicted between any two points inside the micromirror
array cavity. Refer to the Thermal Characteristics for information related to calculating the micromirror array temperature.
(10) "Landed Duty-Cycle" refers to the percentage of time an individual micromirror spends landed in one state (+12 or -12 degrees) versus
the other state (-12 or +12 degrees).
12
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Datum ‘A’ Area (3 Places)
DMD Mounting Area (3 Places Opposite Datum ‘A’)
100 N Maximum Uniformly Distributed Over 3 Areas
(See Mechanical ICD for Dimensions of Datum ‘A’)
Connector Area
45 N Maximum
Figure 8. System Interface Loads
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ELECTRICAL CHARACTERISTICS
over the range of recommended supply voltage and recommended case operating temperature (unless otherwise noted)
PARAMETER
CONDITIONS
MIN
VOH
High-level output voltage
(1)
VCC = 2.5 V,
IOH = –21 mA
VOL
Low-level output voltage (1)
VCC = 2.5 V,
IOH = 15 mA
IOH
High-level output current
IOL
MAX
1.7
UNIT
V
0.4
V
VOH = 1.7 V
–15
mA
Low-level output current
VOL = 0.4 V
14
mA
IIL
Low-level input current
VREF = 1.95 V,
VI = 0 V
IIH
High-level input current
VREF = 1.95 V,
VI = VREF
1.9
nA
IREF
Current into VREF terminal
VREF = 1.95 V,
fDCLK = 77 MHz
0.7
mA
ICC
Current into VCC terminal
VCC = 2.625 V,
fDCLK = 77 MHz
55
mA
IOFFSET
Current into VOFFSET terminal (2)
VOFFSET = 8.75 V
1
mA
IBIAS
Current into VBIAS terminal
1.6
mA
(2)
–1.6
VBIAS = 17 V
(2)
VRESET = –11 V
nA
IRESET
Current into VRESET terminal
1.5
mA
PREF
Power into VREF terminal (3)
VREF = 1.95 V,
fDCLK = 77 MHz
1.5
mW
PCC
Power into VCC terminal
(3)
VCC = 2.625 V,
fDCLK = 77 MHz
144
mW
POFFSET
Power into VOFFSET terminal (3)
9
mW
(3)
PBIAS
Power into VBIAS terminal
PRESET
Power into VRESET terminal
CI
CO
(1)
(2)
(3)
VOFFSET = 8.75 V
VBIAS = 17 V
27.2
mW
VRESET = –11 V
18
mW
Input capacitance
f = 1 MHz
10
pF
Output capacitance
f = 1 MHz
10
pF
(3)
Applies to LVCMOS pins only
Exceeding the maximum allowable absolute voltage difference between VBIAS and VOFFSET may result in excesses current draw. (See
Absolute Maximum Ratings for details.)
In some applications, the total DMD heat load can be dominated by the amount of incident light energy absorbed. See the Thermal
Characteristics for further details.
Measurement Conditions
The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its
transmission line effects must be taken into account. Figure 9 shows an equivalent test load circuit for the output
under test. The load capacitance value stated is only for characterization and measurement of ac timing signals.
This load capacitance value does not indicate the maximum load the device is capable of driving.
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks, VOL MAX
and VOH MIN for output clocks.
RL
From Output
Under Test
Tester Channel
CL = 50 pF
CL = 5 pF for Disable Time
Figure 9. Test Load Circuit for AC Timing Measurements
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SWITCHING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
TYP
MAX
UNIT
Setup time: DATA before rising or falling edge of DCLK
1
Setup time: TRC before rising or falling edge of DCLK
1
Setup time: SCTRL before rising or falling edge of DCLK
1
ts2
Setup time: LOADB low before rising edge of DCLK
1
ns
ts3
Setup time: SAC_BUS low before rising edge of SAC_CLK
1
ns
ts4
Setup time: DRC_BUS high before rising edge of SAC_CLK
1
ns
ts5
Setup time: DRC_STROBE high before rising edge of SAC_CLK
1
ns
Hold time: DATA after rising or falling edge of DCLK
1
Hold time: TRC after rising or falling edge of DCLK
1
Hold time: SCTRL after rising or falling edge of DCLK
1
th2
Hold time: LOADB low after falling edge of DCLK
1
ns
th3
Hold time: SAC_BUS low after rising edge of SAC_CLK
1
ns
th4
Hold time: DRC_BUS after rising edge of SAC_CLK
1
ns
th5
Hold time: DRC_STROBE after rising edge of SAC_CLK
1
ns
tc1
Clock cycle: DCLK
12.5
16.67
ns
tc3
Clock cycle: SAC_CLK
12.5
16.67
ns
tw1
Pulse width high or low: DCLK
5
ns
tw2
Pulse width low: LOADB
7
ns
tw3
Pulse width high or low: SAC_CLK
5
ns
tw5
Pulse width high: DRC_STROBE
7
ns
ts1
th1
tr
tf
ns
ns
Rise time: DCLK / SAC_CLK
2.5
Rise time: DATA / TRC / SCTRL / LOADB
2.5
Fall time: DCLK / SAC_CLK
2.5
Fall time: DATA / TRC / SCTRL / LOADB
2.5
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ns
ns
15
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DLPS022 – JANUARY 2012
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tc1
tf
tr
DCLK
tw1
tw1
ts2
th2
LOADB
tw2
th1
ts1
th1
ts1
SCTRL
DATQA_(0:14)
TRC
tc3
tf
tr
SAC_CLK
tw3
SAC_BUS
th3
DRC_BUS
DRC_STROBE
tw3
tw5
ts3
ts4
th4
ts5
th5
Figure 10. Switching Characteristics
16
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POWER SUPPLY SEQUENCING REQUIREMENTS
DLP3000 includes four voltage-level supplies (VCC, VREF, VOFFSET, VBIAS, and VRESET). For reliable operation of
DLP3000, the following power supply sequencing requirements must be followed.
CAUTION
Reliable performance of the DMD requires that the following conditions be met:
1. That the VCC, VREF, VOFFSET, VBIAS, and VRESET power supply inputs all be present
during operation.
2. That the VCC, VREF, VOFFSET, VBIAS, and VRESET power supplies be sequenced on
and off in the manner prescribed below.
Repeated failure to adhere to the prescribed power-up and power-down procedures
may affect device reliability
DMD Power Supply Power-Up Procedure
Step 1:
Power up VCC and VREF in any order
Step 2:
Wait for VCC and VREF to each reach a stable level within their respective recommended operating ranges.
Step 3:
Power up VBIAS, VOFFSET, and VRESET in any order, provided that the maximum delta-voltage between VBIAS
and VOFFSET is not exceeded (see Absolute Maximum Ratings for details).
Note 1:
During the power-up procedure, the DMD LVCMOS inputs should not be driven high until after Step 2
has been completed.
Note 2:
Power supply slew rates during power up are unrestricted, provided that all other conditions are met.
DMD Power Supply Power-Down Procedure
Step 1:
Command the chipset controller to execute a mirror-parking sequence. See the controller data sheet
(listed in Related Documents) for details.
Step 2:
Power down VBIAS, VOFFSET, and VRESET in any order, provided that the maximum delta voltage between VBIAS
and VOFFSET is not exceeded (see Absolute Maximum Ratings for details).
Step 3:
Wait for VBIAS, VOFFSET, and VRESET to each discharge to a stable level within 4 V of the reference ground.
Step 4:
Power down VCC and VREF in any order.
Note 1:
During the power-down procedure, the DMD LVCMOS inputs should be held at a level less than
VREF + 0.3 volts.
Note 2:
Power-supply slew rates during power down are unrestricted, provided that all other conditions
are met.
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VBIAS , VOFFSET ,
and VRESET
Disabled by Software
Control
Power
Off
VCC/ VREF
Mirror Park Sequence
RESET
VSS
RESET AND PARK
VCC/ VREF
VCC/
VREF
VSS
VSS
VBIAS
VBIAS
...… ... ...… ... ...… ... … …
D V < 8.75 V
Note1
DV < 8.75
Note1
VBIAS< 4 V
VSS
VOFFSET
VSS
... … ... ...… ... ...… ...… …
VOFFSET
VOFFSET< 4 V
VSS
VRESET< 0.5 V
VSS
VSS
VSS
VRESET> - 4 V
VRESET
VRESET
... … ... ...… ... ...… ...… …
VCC/ VCCI
LVCMOS
Inputs
VSS
VSS
NOTE 1: Delta supply voltage |VBIAS – VOFFSET| < 8.75 V
Figure 11. Power-Up / Power-Down Timing
18
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Micromirror Array Physical Characteristics
Physical characteristics of the micromirror array are provided in Table 3.
Table 3. Micromirror Array Physical Characteristics
PARAMETER
VALUE
Number of active micromirror rows (1)
Number of active micromirror columns (1)
Micromirror pitch, diagonaL
(2)
Micromirror active array height
Micromirror active array width
Micromirror array border
(1)
(2)
(3)
(4)
micromirrors
608
micromirrors
7.637
Micromirror pitch, vertical and horizontal
(2)
(3)
µm
684
micromirrors
604
6.5718
(4)
µm
10.8
3.699
(3)
UNITS
684
10
mm
micromirrors
mm
mirrors/side
See Figure 14
See Figure 12
SeeFigure 13
The mirrors that form the array border are hard-wired to tilt in the –12° (“Off”) direction once power is applied to the DMD (see Figure 3
and Figure 4).
10.8 mm
6
7.
37
10.8 mm
7.
63
7
mm
mm
Figure 12. DLP3000 Pixel Pitch Dimensions
Pin 1
6571.8 mm
(0,0)
3699 mm
Illumination
On
Off
(607,683)
Figure 13. DLP3000 Micromirror Active Area
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DLP3000
DLPS022 – JANUARY 2012
Col 1
Col 0
Col 4
Col 3
Pin 1
Col 604
Col 606
Col 605
Col 607
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Row 0
Row 1
Row 2
Row 3
Row 4
Row 5
Row 6
Row 7
Incoming Light
Row 607
Row 677
Row 678
Row 679
Row 680
Row 681
Row 682
Row 683
Figure 14. DLP3000 Pixel Arrangement
20
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Micromirror Array Optical Characteristics
TI assumes no responsibility for end-equipment optical performance. Achieving the desired end-equipment
optical performance involves making trade-offs between numerous component and system design parameters.
See the related application reports (listed in Related Documents) for guidelines.
Table 4. Optical Parameters
PARAMETER
DMD parked state
see Figure 4
α
Micromirror tilt angle
β
Micromirror tilt angle variation
Micromirror crossover time
CONDITIONS
MIN
,
See Figure 4
12
Micromirror switching time (9)
Orientation of the micromirror axis-of-rotation
Micromirror array optical efficiency (12) (13)
degrees
–1
1
(9)
5
µs
16
µs
Non-adjacent micromirrors
Non-operating micromirrors (10)
10
Adjacent micromirrors
(11)
0
89
420 nm to 700 nm,
with all micromirrors in the ON state
Mirror metal specular reflectivity
(420 nm – 700 nm)
UNIT
0
DMD “landed” state (1) (4) (5),
see Figure 4
(1) (4) (6) (7) (8)
NOM MAX
(1) (2) (3)
90
91
micromirrors
degrees
68
%
89.4
%
(1)
(2)
Measured relative to the plane formed by the overall micromirror array
Parking the micromirror array returns all of the micromirrors to an essentially flat (0˚) state (as measured relative to the plane formed by
the overall micromirror array).
(3) When the micromirror array is parked, the tilt angle of each individual micromirror is uncontrolled.
(4) Additional variation exists between the micromirror array and the package datums.
(5) When the micromirror array is landed, the tilt angle of each individual micromirror is dictated by the binary contents of the CMOS
memory cell associated with each individual micromirror. A binary value of 1 results in a micromirror landing in an nominal angular
position of +12 degrees. A binary value of 0 results in a micromirror landing in an nominal angular position of –12 degrees.
(6) Represents the landed tilt angle variation relative to the nominal landed tilt angle
(7) Represents the variation that can occur between any two individual micromirrors, located on the same device or located on different
devices.
(8) For some applications, it is critical to account for the micromirror tilt angle variation in the overall system optical design. With some
system optical designs, the micromirror tilt angle varation within a device may result in perceivable non-uniformities in the light field
reflected from the micromirror array. With some system optical designs, the micromirror tilt angle variation between devices may result in
colorimetry variations and/or system contrast varations.
(9) Performance as measured at the start of life.
(10) Non-operating micromirror is defined as a micromirror that is unable to transition nominally from the –12 degree position to +12 degrees
or vice versa.
(11) Measured relative to the package datums B and C, shown in the Package Mechanical Data section at the end of this document.
(12) The minimum or maximum DMD optical efficiency observed in a specific application depends on numerous application-specific design
variables, such as:
(a) Illumination wavelength, bandwidth/line-width, degree of coherence
(b) Illumination angle, plus angle tolerance
(c) Illumination and projection aperture size, and location in the system optical path
(d) IIllumination overfill of the DMD micromirror array
(e) Aberrations present in the illumination source and/or path
(f) Aberrations present in the projection path
(g) Etc.
The specified nominal DMD optical efficiency is based on the following use conditions:
(a) Visible illumination (420 nm–700 nm)
(b) Input illumination optical axis oriented at 24° relative to the window normal
(c) Projection optical axis oriented at 0° relative to the window normal
(d) f/3 illumination aperture
(e) f/2.4 projection aperture
Based on these use conditions, the nominal DMD optical efficiency results from the following four components:
(a) Micromirror array fill factor: nominally 92.5%
(b) Micromirror array diffraction efficiency: nominally 86%
(c) Micromirror surface reflectivity: nominally 88%
(d) Window transmission: nominally 97% (single pass, through two surface transitions)
(13) Does not account for the effect of micromirror switching duty cycle, which is application dependant. Micromirror switching duty cycle
represents the percentage of time that the micromirror is actually reflecting light from the optical illumination path to the optical projection
path. This duty cycle depends on the illumination aperture size, the projection aperture size, and the micromirror array update rate.
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Table 4. Optical Parameters (continued)
PARAMETER
CONDITIONS
Illumination overfill (14)
NOM MAX
10
Window material
Window refractive index
MIN
UNIT
%
Corning Eagle XG
At 546.1 nm
1.5119
See
Window aperture
(15)
(14) The active area of the DLP3000 is surrounded by an aperture on the inside of the DMD window surface that masks structures of the
DMD device assembly from normal view. The aperture is sized to anticipate several optical conditions. Overfill light illuminating the area
outside the active array can create artifacts from the mechanical features that surround the active array and other surface anomalies
that may be visible on the projected image. The illumination optical system should be designed to limit light flux incident anywhere
outside the active array less than 10% of the average flux level in the active area. Depending on the particular system's optical
architecture and assembly tolerances, the amount of overfill light on the outside of the active array may cause visible artifacts.
(15) See the Package Mechanical Characteristics for details regarding the size and location of the window aperture.
22
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Thermal Characteristics
Achieving optimal DMD performance requires proper management of the maximum DMD case temperature, the
maximum temperature of any individual micromirror in the active array, the maximum temperature of the window
aperture, and the temperature gradient between any two points on or within the package.
See the Absolute Maximum Ratings and Recommended Operation Conditions for applicable temperature limits.
Package Thermal Resistance
The DMD is designed to conduct the absorbed and dissipated heat back to the Series 220 package where it can
be removed by an appropriate system thermal management. The system thermal management must be capable
of maintaining the package within the specified operational temperatures at the Thermal Test Point location, see
Figure 15. The total heat load on the DMD is typically driven by the incident light absorbed by the active area;
although other contributions can include light energy absorbed by the window aperture, electrical power
dissipation of the array, and/or parasitic heating.
Table 5. Package Thermal Resistance
Min
Nom
Thermal resistance from active micromirror array to TC3
Max
Units
5
°C/W
Case Temperature
The temperature of the DMD case can be measured directly. For consistency, a thermal test point location is
defined, as shown in Figure 15.
Figure 15. Thermal Test Point Location
Micromirror Array Temperature Calculation
Micromirror array temperature cannot be measured directly. Therefore, it must be computed analytically from:
Thermal test point location (See Figure 15)
Package thermal resistance
Electrical power dissipation
Illumination heat load
The relationship between the micromirror array and the case temperature is provided by the following equations:
TArray = TCeramic + (QArray × RArray-To-Ceramic)
QArray = QElec + QIllum
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QIllum = CL2W × SL
where the following elements are defined as:
TArray = computed micromirror array temperature (°C)
TCeramic = ceramic case temperature (°C) (TC3 location)
QArray = Total DMD array power (electrical + absorbed) (W)
RArray-to-Ceramic = thermal resistance of DMD package from array to TC3 (°C/W)
QElec = nominal electrical power (W)
QIllum = absorbed illumination heat (W)
CL2W = Lumens-to-watts constant, estimated at 0.00274 watt/lumen, based on array charasteristics. It
assumes a spectral efficiency of 300 lumens/watt for the projected light, illumination distribution of 83.7% on
the active array, and 16.3% on the array border and window aperture.
SL = Screen lumens
These equations are based on traditional 1-chip DLP system with a total projection efficiency from the DMD to
the screen of 87%. An example calculation is provided below. DMD electrical power dissipation varies and is
dependent on the voltage, data rates, and operating frequencies. The nominal electrical power dissipation used
in this calculation is 0.15 watts. Screen lumens is nominally 20 lumens. The ceramic case temperature at TC3 is
55 °C. Using these values in the above equations, the following values are computed:
QArray = QElec + CL2W × SL = 0.144 W + (0.00274 W/Lumen × 20 Lumen) = 0.1988 W
TArray = TCeramic + (QArray * RArray-To-Ceramic) = 55 °C + (0.1988 W × 5 °C/W) = 55.99 °C
24
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PACKAGE OPTION ADDENDUM
www.ti.com
19-Jan-2012
PACKAGING INFORMATION
Orderable Device
DLP3000FQB
Status
(1)
ACTIVE
Package Type Package
Drawing
LCCC
FQB
Pins
Package Qty
50
10
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
Call TI
MSL Peak Temp
(3)
Samples
(Requires Login)
Level-1-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
8
5
6
7
3
4
C
NOTES UNLESS OTHERWISE SPECIFIED:
1 DIE PARALLELISM TOLERANCE APPLIES TO DMD ACTIVE ARRAY ONLY.
DWG NO.
COPYRIGHT 2009 TEXAS INSTRUMENTS
UN-PUBLISHED, ALL RIGHTS RESERVED. REV
A
2 ROTATION ANGLE OF DMD ACTIVE ARRAY IS A REFINEMENT OF THE LOCATION
TOLERANCE AND HAS A MAXIMUM ALLOWED VALUE OF 0.6 DEGREES.
B
2510388
1
1
SH
REVISIONS
DESCRIPTION
ECO 2097098 INITIAL RELEASE
DATE
03/02/09
BY
J. HOLM
ECO 2098984 TIGHTEN DIE ROTATION, NOTE 2; ADD 'DD1'
SUFFIX TO CONNECTOR PART#; CHG DWG TO INVENTOR
08/27/09
BMH
3 BOUNDARY MIRRORS SURROUNDING THE DMD ACTIVE ARRAY.
D
4 DMD MARKING TO APPEAR ON BOTTOM OF CONNECTOR.
D
5 NOTCH DIMENSIONS ARE DEFINED BY UPPERMOST LAYERS OF CERAMIC,
AS SHOWN IN SECTION A-A.
6 ENCAPSULANT TO BE CONTAINED WITHIN DIMENSIONS SHOWN IN VIEWS C
AND G (SHEET 2).
5
2X 0.8 `0.1
4X R0.2 `0.05
5
C
(ILLUMINATION
DIRECTION)
R0.6 `0.1
5
+0.3
70.1
5
90° `1°
3 `0.075
+0.2 5
2X 2 0.1
A
5
+0.2
1 - 0.1
5
B
0 MIN
(3)
5
A
+0.2
3.5 0.1
(1.4)
C
2X R0.4 `0.1
(1)
14.6 `0.08
+0.3
16.6 0.1
WINDOW APERTURE
5
1.359 `0.079
D
0.65 `0.05
2X ENCAPSULANT
6
B
0.4 MIN
(2.139)
1
SECTION A-A
NOTCH OFFSETS
f
0.038 A
0.02 D
ACTIVE ARRAY
A
3 SURFACES INDICATED
IN VIEW B (SHEET 2)
0.78 `0.063
1.4 `0.1
(1.05)
c 0.05
E
(SHEET 3)
E
(SHEET 3)
(PANASONIC AXT650224DD1, 50-CONTACT,
0.4 mm PITCH BOARD-TO-BOARD HEADER)
INTERFACE TO PANASONIC AXT550224DD1 SOCKET
A
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
THIRD ANGLE
PROJECTION
NONE
0314DA
NEXT ASSY
USED ON
DRAWN
2/25/2009
ENGINEER
2/25/2009
ANGLES `1~
B. HASKETT
2 PLACE DECIMALS `0.25
QA/CE
1 PLACE DECIMALS `0.50
DIMENSIONAL LIMITS APPLY BEFORE PROCESSES
INTERPRET DIMENSIONS IN ACCORDANCE WITH ASME
Y14.5M-1994
REMOVE ALL BURRS AND SHARP EDGES
PARENTHETICAL INFORMATION FOR REFERENCE ONLY
DATE
J. HOLM
P. KONRAD
8
7
6
5
4
TITLE
CM
J. GRIMMETT
3/9/2009
3
2
ICD, MECHANICAL, DMD,
.3 WVGA DDR SERIES 220
0.4 mm PITCH CONNECTOR
REV
DWG NO
SIZE
D
SCALE
APPLICATION
INV11-2006a
Dallas Texas
3/9/2009
APPROVED
A
TEXAS
INSTRUMENTS
B
2510388
15:1
SHEET
1
1
OF
3
8
D
0.812
5
6
7
3
4
DWG NO.
2510388
SH
1
2
3X (1)
2X 14.6
A3
D
A2
C
3X 1.7
(3)
n1.5
B
3X (1.8)
VIEW B
DATUMS A, B, AND C
C
6
A1
6
0.812
14.6
C
(FROM SHEET 1)
(n1.5)
6
B
7.3
3.7
6
VIEW C
ENCAPSULANT MAXIMUM X/Y DIMENSIONS
B
B
(FROM SHEET 1)
6
A
2X 40°
A
VIEW G
ENCAPSULANT HEIGHT LIMITS
TEXAS
INSTRUMENTS
Dallas Texas
INV11-2006a
8
7
6
5
4
3
DRAWN
J. HOLM
DATE
2/25/2009
SIZE
D
SCALE
2
DWG NO
REV
2510388
SHEET
1
2
OF
B
3
8
5
6
7
3
4
2510388
DWG NO.
SH
1
3
D
D
(6.5718)
ACTIVE ARRAY
5.188 `0.075
2
4X (0.108)
3
1.624 `0.075
0.377 `0.0885
1.602 `0.05
(6.516)
WINDOW
4.914 `0.05
C
3.946 `0.0885
(3.699)
ACTIVE ARRAY
(n1.5)
(4.323)
APERTURE
(3)
F
B
C
C
0.64 `0.0885
6.963 `0.0885
CL
(7.603)
APERTURE
2.2 `0.05
CL
8.039 `0.05
67X TEST PADS
(10.239)
WINDOW
j
0.314
VIEW D
WINDOW AND ACTIVE ARRAY
n0.1 A
15 X 1.04 = 15.6
(0.52)
4
(0.47)
(n0.52) TYP.
(FROM SHEET 1)
B
n0.2 A B C
H
CL
G
F
(3)
4.22
(n1.5)
25
20
15
10
5
1
B
D
(42°) TYP.
(0.15) TYP.
2X 0.93
E
2.11
(42°) TYP.
B
C
C
B
2X (1.86)
j 0.4 A B C
A
2 X 0.47
= 0.94
(0.068) TYP.
30
31
26
27
24
25
22
23
20
21
18
19
16
17
14
15
12
13
10
11
8
9
6
7
4
5
2
3
1
BACK INDEX MARK
(11.8)
2.212
CL
j 0.4 A B C
DETAIL F
APERTURE SHORT EDGES
A
28
29
VIEW E-E
TEST PADS AND
LE
A
C
S
: CONNECTOR
5
1
SCALE 50 : 1
A
(FROM SHEET 1)
TEXAS
INSTRUMENTS
Dallas Texas
INV11-2006a
8
7
6
5
4
3
DRAWN
J. HOLM
DATE
2/25/2009
SIZE
D
SCALE
2
DWG NO
REV
2510388
SHEET
1
3
OF
B
3
PACKAGE OPTION ADDENDUM
www.ti.com
19-Jan-2012
PACKAGING INFORMATION
Orderable Device
DLP3000FQB
Status
(1)
ACTIVE
Package Type Package
Drawing
LCCC
FQB
Pins
Package Qty
50
10
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
Call TI
MSL Peak Temp
(3)
Samples
(Requires Login)
Level-1-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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