100323 Low Power Hex Bus Driver General Description The 100323 is a monolithic device containing six bus drivers capable of driving terminated lines with terminations as low as 25Ω. To reduce crosstalk, each output has its own respective ground connection. Transition times were designed to be longer than on other F100K devices. The driver itself performs the positive logic AND of a data input (D1–D6) and the OR of two select inputs (E and either DE1, DE2, or DE3). Enabling of data is possible in multiples of two, i.e., 2, 4 or all 6 paths. All inputs have 50 kΩ pull-down resistors. The output voltage LOW level is designed to be more negative than normal ECL outputs (cut off state). This allows an emitter-follower output transistor to turn off when the termination supply is −2.0V and thus present a high impedance to the data bus. Features n n n n 50% power reduction of the 100123 2000V ESD protection −4.2V to −5.7V operating range Drives 25Ω load Logic Symbol Pin Names Description D1–D6 Data Inputs DE1–DE3 Dual Enable Inputs E Common Enable Input O1–O6 Data Outputs DS100312-7 © 1998 National Semiconductor Corporation DS100312 www.national.com 100323 Low Power Hex Bus Driver August 1998 Connection Diagrams 24-Pin DIP 24-Pin Quad Cerpak DS100312-4 DS100312-3 Logic Diagram DS100312-1 Truth Table E DEn Dn Dn+1 On On+1 L L X X Cutoff Cutoff X H L L Cutoff Cutoff X H L H Cutoff H X H H L H Cutoff X H H H H H H X L L Cutoff Cutoff H X L H Cutoff H H X H L H Cutoff H X H H H H H = High Cutoff = Lower-than-LOW state L = Low X = Don’t Care www.national.com 2 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Storage Temperature Maximum Junction Temperature Ceramic VEE Pin Potential to Ground Pin Input Voltage (DC) Output Current (DC Output High) ESD Case Temperature Military Supply Voltage (VEE) −65˚C to +150˚C −55˚C to +125˚C −5.7V to −4.2V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. +175˚C −7.0V to +0.5V VEE to +0.5V −50 mA ≥2000V Note 2: ESD testing conforms to MIL-STD-883, Method 3015. Military Version DC Electrical Characteristics VEE = −4.2V to −5.7V, VCC = VCCA = GND, TC = −55˚C to +125˚C Symbol VOH VOHC VOLC VOLZ VIH Parameter Conditions Min Max Units TC Output HIGH −1025 −870 mV 0˚C to +125˚C Voltage −1085 −870 mV −55˚C Output HIGH −1035 mV 0˚C to +125˚C Voltage −1085 mV −55˚C 0˚C to +125˚C Output LOW −1610 mV Voltage −1555 MV −55˚C Cut-Off LOW −1950 mV 0˚C to +125˚C Voltage −1850 Input HIGH −1165 −870 −55˚C mV −55˚C to +125˚C Voltage VIL Input LOW IIH IEE Input LOW Current −1830 −1475 mV (Notes 3, 4, 5) or VIL (min) VIN = VIH (min) or VIL (max) 25Ω to −2.0V Loading with 25Ω to −2.0V (Notes 3, 4, 5) VIN = VIH Loading with (Notes 3, 4, 5) (min) or VIL (max) 25Ω to −2.0V Guaranteed HIGH Signal −55˚C to +125˚C Guaranteed LOW Signal µA −55˚C to +125˚C for All Inputs VEE = 4.2V, VIN = VIL 0.50 Input HIGH 240 µA 0˚C to +125˚C Current 340 µA −55˚C −53 mA −55˚C to +125˚C Power Supply Current (max) Notes Loading with (Notes 3, 4, 5, 6) for All Inputs Voltage IIL VIN = VIH −155 (min) VEE = −5.7V, VIN = VIH (max) Inputs Open VEE = −4.2V to −5.7V (Notes 3, 4, 5, 6) (Notes 3, 4, 5) (Notes 3, 4, 5) (Notes 3, 4, 5) Note 3: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case condition at cold temperatures. Note 4: Screen tested 100% on each device at −55˚C, +25˚C, and +125˚C, Subgroups 1, 2, 3, 7, and 8. Note 5: Sample tested (Method 5005, Table I) on each manufactured lot at −55˚C, +25˚C, and +125˚C, Subgroups A1, 2, 3, 7, and 8. Note 6: Guaranteed by applying specified input condition and testing VOH/VOL. 3 www.national.com AC Electrical Characteristics VEE = −4.2V to −5.7V, VCC = VCCA = GND Symbol Parameter TC = −55˚C TC = +25˚C TC = +125˚C Min Max Min Max Min Max tPZH Propagation Delay 0.70 3.70 1.10 3.60 1.20 3.60 tPHZ Data to Output 0.50 3.60 1.10 3.10 1.20 3.50 tPZH Propagation Delay 0.60 3.60 1.10 3.60 1.30 3.80 tPHZ Data Enable to Output 1.00 4.20 1.50 3.60 1.60 4.00 tPZH Propagation Delay 0.70 3.60 1.00 3.50 1.20 3.60 tPHZ Common Enable to Output 0.90 4.00 1.40 3.40 1.40 3.80 tTZH Transition Time 0.20 2.00 0.20 2.00 0.20 2.00 tTHZ 20% to 80%, 80% to 20% 0.20 1.80 0.20 1.60 0.20 1.60 Units Conditions ns Figures 1, 2 ns ns ns Note 7: The specified limits represent the “worst case” value for the parameter. Since these “worst case” values normally occur at the temperature extremes, additional noise immunity and guard banding can be achieved by decreasing the allowable system operating ranges. Note 8: Conditions for testing shown in the tables are chosen to guarantee operation under “worst case” conditions. Test Circuitry DS100312-5 Notes: VCC, VCCA = +2V, VEE = −2.5V L1 and L2 = equal length 50Ω impedance lines RT = 50Ω terminator internal to scope Decoupling 0.1 µF from GND to VCC and VEE All unused outputs are loaded with 25Ω to GND CL = Fixture and stray capacitance ≤ 3 pF Pin numbers shown are for flatpak; for DIP see logic symbol FIGURE 1. AC Test Circuit www.national.com 4 Timing Waveform DS100312-6 FIGURE 2. Propagation Delay and Transition Times 5 www.national.com 6 Physical Dimensions inches (millimeters) unless otherwise noted 24 Lead Ceramic Dual-In-Line Package (0.400" Wide) (D) NS Package Number J24E 24 Lead Quad Cerpak (F) NS Package Number W24B 7 www.national.com 100323 Low Power Hex Bus Driver LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support 1. Life support devices or systems are devices or sysdevice or system whose failure to perform can be reatems which, (a) are intended for surgical implant into sonably expected to cause the failure of the life support the body, or (b) support or sustain life, and whose faildevice or system, or to affect its safety or effectiveness. ure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: [email protected] www.national.com National Semiconductor Europe Fax: +49 (0) 1 80-530 85 86 Email: [email protected] Deutsch Tel: +49 (0) 1 80-530 85 85 English Tel: +49 (0) 1 80-532 78 32 Français Tel: +49 (0) 1 80-532 93 58 Italiano Tel: +49 (0) 1 80-534 16 80 National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: [email protected] National Semiconductor Japan Ltd. Tel: 81-3-5620-6175 Fax: 81-3-5620-6179 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.