TI TSU6721YFFR

TSU6721
www.ti.com
SCDS338B – JANUARY 2013 – REVISED JUNE 2013
MCPC Compatible USB Port Multimedia Switch
Supports USB, UART, Audio, ID, MIC, and Load Switch
Check for Samples: TSU6721
FEATURES
•
1
•
•
•
•
Switch Matrix
– USB and UART Switch support USB 2.0 HS
– Audio Switch with Negative Signal
Capability
– ID Bypass Switch
– VBUS to MIC Switch
– DP to MIC Switch to Support MCPC
Load Switch
– 100 mΩ Load Switch
– OTG Support
– 28 V VBUS Rating with Over-voltage
Protection
– Programmable Overcurrent
Limiter/Protection
Charger Detection
– USB BCDv1.2 compliant
– VBUS Detection
– Data Contact Detection
– Primary and Secondary Detection
Compatible Accessories
– USB Chargers (DCP, CDP)
– Apple Charger
– USB Data Port
– Audio Headset with MIC and Remote
– Docking Support
– Factory Cable
•
•
•
Surge Protection on VBUS/DP/DM
– USB Connector Pins Without External
Component
Additional Features
– I2C Interface with Host Processor
– Switches Controlled by Automatic
Detection or Manual Control
– Interrupts Generated for Plug/Unplug
– Decoupling FET Switch to VBUS Added to
Reduce Degradation on MIC Line
– Support Control Signals used In
Manufacturing (JIG, BOOT)
ESD Performance Tested Per JESD 22
– 4000-V Human-Body Model (A114-B, Class
II)
– 1500-V Charged-Device Model (C101)
IEC ESD Performance
– ±8 kV Contact Discharge (IEC 61000-4-2) for
VBUS/DP/DM/ID to GND
APPLICATIONS
•
•
•
•
•
Cell Phones and Smart Phones
Tablet PCs
Digital Cameras and Camcorders
GPS Navigation Systems
Micro USB Interface with USB/UART/AUDIO
APPLICATION DIAGRAM
BATTERY
CHG IC
IEC ESD
VBAT
USB
inside
DP_HT
DM_HT
UART/USB
VBUS
DP
TxD
RxD
TSU6721
Negative signal
capability for cap-free
Amp or Codec
MIC
S_R
AUDIO
DM
ID
S_L
MIC
outside
VBUS
DP_CON
DM_CON
ID_CON
ID Bypass
Switch
JIG
BOOT
INTB
ISET
IDBP
I2C_SDA
I2C_SCL
MIC to VBUS
or DP (MCPC
Spec)
Support
USB CONNECTOR
USB2.0 High
Speed
OUT
I2C
Control
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
TSU6721
SCDS338B – JANUARY 2013 – REVISED JUNE 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION
TSU6721 is a high performance USB port multimedia switch featuring automatic switching and accessory
detection. The device connects a common USB port to pass audio, USB data, charging, On The Go (OTG) and
factory mode signals. The audio path has negative signal capability includes left (mono/stereo), right (stereo) as
well as microphone signals. Furthermore, TSU6721 is compatible with the MCPC specification.
TSU6721 features impedance detection which supports the detection of various accessories that are attached
through DP, DM and ID pins of the USB connector. The switch is controlled by automatic switching or manually
through I2C.
TSU6721 has an integrated low resistive Load Switch that is used to isolate the charger from the external
connector. OverVoltage Protection and programmable OverCurrent Limiter/Protection are additional features
included to the Load Switch.
The charger detection satisfies USB charger specification v1.2. In addition to DCP, CDP and SDP, the device
also detects Apple Chargers.
Power for this device is supplied through VBAT of the system or through VBUS when attached. TSU6721
supports factory mode testing when a USB/UART JIG cable is used in development and manufacturing.
2
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Product Folder Links :TSU6721
TSU6721
www.ti.com
SCDS338B – JANUARY 2013 – REVISED JUNE 2013
BLOCK DIAGRAM
VDDIO
I2C
Interface
SCL
Switch
Ctrl
SDA
Load
Switch
Sense &
Ctrl.
Switches
I2C Interface
&
Hardware
Control
INTB
JIG
OUT
State Machine
DP_HT
DM_HT
TxD
BOOT
ISET
RxD
S_L
S_R
MIC
Buffers and/or
Comparators
IDBP
VBUS_CAP
VBUS
DP
DM
ID
Charger
Detection
Sources
And
Comp’s
Accessory
ID
Detection
ADC
TSU6721 SWITCH
MATRIX
PMIC
OUT
VBUS
USB
DM_HT
DP_HT
DM
Micro
USB
DP
UART
TxD
RxD
ID
S_L
AUDIO
S_R
MIC
IDBP
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links :TSU6721
3
To request a full data sheet, please send an email to:
[email protected]
PACKAGE OPTION ADDENDUM
www.ti.com
2-Jul-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
TSU6721YFFR
ACTIVE
Package Type Package Pins Package
Drawing
Qty
DSBGA
YFF
25
3000
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
SNAGCU
Level-1-260C-UNLIM
(4/5)
-40 to 85
TSU6721
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TSU6721YFFR
Package Package Pins
Type Drawing
SPQ
DSBGA
3000
YFF
25
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
180.0
8.4
Pack Materials-Page 1
2.17
B0
(mm)
K0
(mm)
P1
(mm)
2.17
0.57
4.0
W
Pin1
(mm) Quadrant
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TSU6721YFFR
DSBGA
YFF
25
3000
182.0
182.0
17.0
Pack Materials-Page 2
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