XC2404A816UR-G ETR0702-005a 1.6GHz Low Noise Amplifier ■GENERAL DESCRIPTION XC2404 series is an ultra-low-noise amplifier (LNA) with low operating voltage, low noise figure, low power consumption. The device offers easy output matching to 50Ω for input and output with less external components. The device operates at 1.2V. For higher power supplies such as 1.8V and 2.85V, the device can operate with a self bias of one adding resister. ■APPLICATIONS .●GPS band RF signal amplified ■FEATURES Noise Figure Low Power Consumption High Gain Operation Voltage Range Output Operating Temperature Range Ultra Small Package Environmentally Friendly ：NF=0.94dB(TYP.) @ 1.575GHz ：12.0mW(TYP.) @ VDD=1.2V, Fixed bias ：|S21|=26.5dB(TYP.) @ 1.575GHz ：1.14V∼1.26V @ Fixed bias ：CMOS Output, 50Ωdriver built-in ：-40℃∼+85℃ ：USP-8A01 ：EU RoHS Compliant, Pb Free ■TYPICAL APPLICATION CIRCUIT ■TYPICAL PERFORMANCE CHARACTERISTICS Figure 1: Fixed Bias Figure 2: Self Bias 40 35 30 25 VDD=1.2V Ta=25℃ 4 3.5 S21 3 2.5 20 15 10 5 0 1.375 2 1.5 1 NF 1.475 1.575 1.675 0.5 0 1.775 Noise Figure : NF (dB) Power Gain : S21 (dB) XC2404A816 Frequency (GHz) VIN [V] RBIAS [Ω] 3.00 2.85 1.80 270 240 82 * RBIAS should be in ±1% tolerance and ±200ppm/℃ temperature stability. CBIAS is 10nF. 1/16 XC2404A816UR-G ■PIN CONFIGURATION VDD1 8 VDD2 7 1 RF_IN VDD3 6 2 VSS1 RF_OUT 5 3 VSS2 4 VSS3 USP-8A01 （BOTTOM VIEW） ■PIN ASSIGNMENT PIN NUMBER USP-8A01 PIN NAME FUNCTION 1 RF_IN RF Signal Input 2 VSS1 Ground 3 VSS2 Ground 4 VSS3 Ground 5 RF_OUT RF Signal Output 6 VDD3 Power Supply 7 VDD2 Power Supply 8 VDD1 Power Supply ■PRODUCT CLASSIFICATION ●Ordering Information XC2404A816①②-③ (*1) DESIGNATOR DESCRIPTION SYMBOL DESCRIPTON ①②-③ Packages Taping Type UR-G USP-8A01 (*1) The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. 2/16 XC2404A816UR-G ■BLOCK DIAGRAMS VDD1 VDD2 VDD3 RF_IN RF_ OUT VSS1 VSS2 VSS3 ■ABSOLUTE MAXIMUM RATINGS Ta=25℃ PARAMETER Supply Voltage Current Circuit RF Input Power Power Dissipation Operating Temperature Range Storage Temperature Range SYMBOL VDD IDD PIN Pd Ta Tstg RATINGS 1.60 42 10 120 -40∼+85 -55∼+125 UNITS V mA dBm mW o C o C 3/16 XC2404A816UR-G ■ELECTRICAL CHARACTERISTICS ●DC Characteristics Fixed Bias (refer to TYPICAL APPLICATION CIRCUIT, Figure 1) Ta=25℃ PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUITS Power Supply Pin Voltage VDD - 1.14 1.20 1.26 V ① Current Circuit IDD VDD=1.2V 4.00 10.0 18 mA ① Ta=25℃ Self Bias (refer to TYPICAL APPLICATION CIRCUIT, Figure 2) PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUITS Input Power Supply Voltage 1 VIN1 RBIAS=270Ω±1％, ±200ppm/℃ 2.850 3.000 3.150 V ① Input Power Supply Voltage 2 VIN2 2.708 2.850 2.992 V ① Input Power Supply Voltage 3 VIN3 1.710 1.800 1.890 V ① Power Supply Pin Voltage VDD VIN = VIN1, VIN2, VIN3 0.90 1.12 1.32 V ① Current Circuit IDD VIN = VIN1, VIN2, VIN3 5.25 7.25 11.0 mA ① RBIAS=240Ω±1％, ±200ppm/℃ RBIAS=82Ω±1％, ±200ppm/℃ * When the device is used in self bias, please use the specified RBIAS and CBIAS. 4/16 XC2404A816UR-G ■ELECTRICAL CHARACTERISTICS (Continued) ●AC Characteristics VDD=1.2V, Ta=25℃ PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUITS Power Gain S21 f=1.575GHz 24 26.5 - dB ② Input Return Loss S11 f=1.575GHz - 10 - dB ② Output Return Loss S22 f=1.575GHz - 17 - dB ② Isolation S12 f=1.575GHz - -36 - dB ② Noise Figure (*1) NF f=1.575GHz - 0.9４ - dB ③ Input Power IP3 IIP3 f=1.575GHz, 1.576GHz - -14.5 - dBm ④ Input Power @ 1dB Gain Compression P1dB f=1.575GHz - -25.5 - dBm ② *1: NF is the value excluding the substrate loss. Note 1. This series is structurally weak in electrostatic discharge. Please eliminate static electricity from the operational table, people, and soldering iron. 2. Please use noiseless power supply for stable operation. 3. Please use ±1% Rbias with ±200ppm/℃ temperature stability and 10nF Cbias. 4. Please connect Cbias to VDD pin as close as possible. 5. Please refer to the pattern layout. VDD pins （VDD1, VDD2, VDD3） should be connected each other outside. Also, VSS pins （VSS1, VSS2, VSS3） should be connected as well. 6. Please ensure to use an external component which does not depend on bias or temperature too much. 5/16 XC2404A816UR-G ■TEST CIRCUITS ●Circuit ①（DC Characteristics: Power Supply Pin Voltage, Circuit Current, Input Power Supply Voltage） * Fixed Bias: Rbias=0Ω, VIN=VDD ** Pin / Pout is 50Ω ●Circuit ②（Power Gain, Input Return Loss, Output Return Loss, Isolation, Input Power @ 1dB Gain Compression） XC2404 *1 *1: Refer to the circuit ⑤ for the block detail. ●Circuit ③（Noise Figure） *1: Refer to the circuit ⑤ for the block detail. 6/16 XC2404A816UR-G ■TEST CIRCUITS (Continued) ●Circuit ④（Input Power IIP3） *1: Refer to the circuit ⑤ for the block detail. ●Circuit ⑤（XC2404 series, the circuit of the block） VIN(V) Rbias(Ω) 3.00 2.85 1.80 270 240 82 * Fixed Bias: Rbias=0Ω, VIN=VDD ** Rbias: Should be in ±1% tolerance and ±200ppm/℃ temperature stability. Cbias is 10nF. *** Please refer to the EVALUATION BOARD layout. VDD pin (VDD1, VDD2, VDD3) and VSS pin (VSS1,VSS2,VSS3) are connected respectively on the board. 7/16 XC2404A816UR-G ■EVALUATION BOARD 17.5mm ＶＤＤ R1 ＧＮＤ C3 C4 L1 C2 L3 Pin Pout L2 SYMBOL C1 SPEC C1, C2 100pF C3,C4 10nF L1 9.1nH L2,L3 R1 (*1) (Rbias) 8/16 20mm 2.7nH - (*1) COMMENT MURATA (GRM1552C1H) - PCB (FR-4) MICROSTRIPLINE WIDTH =1.25mm t=0.8mm PCB size = 20mm×17.5mm TAIYO YUDEN AQseries (AQ1059N1J) TAIYO YUDEN AQseries (AQ1052N7J) Less than ±1% tolerance, Less than ±200ppm/℃ temperature stability *1: Fixed Bias: Rbias=0Ω * Please use an external component which does not depend on bias or temperature too much. XC2404A816UR-G ■TYPICAL PERFORMANCE CHARACTERISTICS (2) Power Gain vs. Supply Voltage (1) Current Circuit vs. Supply Voltage XC2404A816 XC2404A816 Ta = 25℃ 14 12 10 8 32 30 28 26 24 22 6 4 1.12 1.14 1.16 1.18 1.2 20 1.12 1.14 1.16 1.18 1.22 1.24 1.26 1.28 XC2404A816 -14 Output Return Loss : S22 (dB) Input Return Loss : S11 (dB) XC2404A816 Ta = 25℃ -6 -8 -10 -12 -14 -16 -18 -20 1.12 1.14 1.16 1.18 1.2 -18 -20 -22 -24 -26 -28 -30 1.12 1.14 1.16 1.18 1.22 1.24 1.26 1.28 Ta = 25℃ -16 1.2 1.22 1.24 1.26 1.28 Supply Voltage : VDD (V) Supply Voltage : VDD (V) (6) Noise Figure vs. Supply Voltage (5) Isolation vs. Supply Voltage XC2404A816 XC2404A816 VDD = 1.2V Ta = 25℃ -35 1.22 1.24 1.26 1.28 (4) Output Return Loss vs. Supply Voltage (3) Input Return Loss vs. Supply Voltage -4 1.2 Supply Voltage : VDD (V) Supply Voltage : VDD (V) Ta = 25℃ 1.8 1.6 Noise Figure : NF (dB) -36 Isolation : S12 (dB) Ta = 25℃ 34 Power Gain : S21 (dB) Current Circuit : IDD (mA) 16 -37 -38 -39 -40 -41 1.4 1.2 1 0.8 0.6 0.4 0.2 -42 1.12 1.14 1.16 1.18 1.2 1.22 1.24 1.26 1.28 Supply Voltage : VDD (V) 0 1.12 1.14 1.16 1.18 1.2 1.22 1.24 1.26 1.28 Supply Voltage : VDD (V) 9/16 XC2404A816UR-G ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7) Input 3 Order Intercept Point vs. Supply Voltage (8) Input Power @ 1dB Gain compression vs. Power Supply Voltage Input 3Order Intercept Point: IIP3(dBm XC2404A816 XC2404A816 Ta=25℃、f =1.575+1.576GHz,Pin=-45dBm -12 -14 -16 -18 Ta = 25℃ -23 Input Power @ 1dB Gain Compression : P1dB [dBm] -10 -24 -25 -26 -27 -28 1.12 1.14 1.16 1.18 -20 1.12 1.14 1.16 1.18 1.2 1.22 1.24 1.26 1.28 (10) Power Gain vs. Ambient Temperature (9) Supply Current vs. Ambient Temperature XC2404A816 XC2404A816 VD D = 1.2V Pin=-40dBm 20 32 17 30 Power Gian ： S21[dB] Supply Current: IDD [mA] VD D =1.2V 14 11 8 5 2 28 26 24 22 20 -1 -50 -25 0 25 50 75 -50 100 -25 0 25 50 75 100 A mbient Temperature:Ta( ℃ ) A mbient Temperature:Ta( ℃ ) (11) Input Return Loss vs. Ambient Temperature (12) Output Return Loss vs. Ambient Temperature XC2404A816 XC2404A816 VD D = 1.2V Pin=-40dBm VD D = 1.2V Pin=-40dBm 2 Output Return Loss ：S22 [dB] 1 Intput Return Loss ： S11 [dB] 1.22 1.24 1.26 1.28 Supply Voltage : VDD (V) Supply Voltage: V DD(V) -2 -5 -8 -11 -14 -17 -20 -50 -25 0 25 50 75 A mbient Temperature:Ta( ℃ ) 10/16 1.2 100 -4 -10 -16 -22 -28 -34 -40 -50 -25 0 25 50 75 A mbient Temperature:Ta( ℃ ) 100 XC2404A816UR-G ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (14) Noise Figure vs. Ambient Temperature (13) Reverse Isolation vs. Ambient Temperature XC2404A816 XC2404A816 VD D = 1.2V Pin=-40dBm 1.4 -33 -35 -38 -40 -43 -45 -48 1.0 0.8 0.6 0.4 0.2 -50 -50 -25 0 25 50 75 0.0 100 -50 -25 0 A mbient Temperature:Ta( ℃ ) -12 -14 -16 -18 -20 25 50 75 100 Input Power @ 1dB Giancompression : P1dB(dBm) Input 3Order Intercept Point: IIP3(dBm) -10 0 -24 -25 -26 -27 -28 -29 -30 -50 -25 0 25 50 75 100 A mbient Temperature:Ta( ℃ ) (18) Input Return Loss vs. Frequency (17) Power Gain vs. Frequency XC2404A816 XC2404A816 VDD =1.20V VDD =1.20V 0 Input Return Loss : S11 (dB) 40 35 Ta = -40℃ Ta=25℃ 25 100 VD D = 1.2V, f=1.575GHz -23 Am bient Tem perature:Ta(℃ ) 30 75 XC2404A816 VD D =1.2V、f =1.575+1.576GHz,Pin=-45dBm -25 50 (16) Input Power @ 1dB Gain Compression vs. Ambient Temperature XC2404A816 -50 25 Ambient Temperature:Ta( ℃) (15) Input 3 Order intercept point vs. Ambient Temperature Power Gian： S21(dB) VDD =1.2V、f =1.575GHz 1.2 Noise Figure: NF [dB] Reverse Isolation: S12 [dB] -30 Ta = 85℃ 20 15 -5 Ta = -40℃ Ta=25℃ -10 -15 Ta = 85℃ -20 1 1.2 1.4 1.6 Frequency: ｆ (GHz) 1.8 2 1 1.2 1.4 1.6 1.8 2 Frequency： f (GHz) 11/16 XC2404A816UR-G ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (20) Isolation vs. Frequency (19) Output Return Loss vs. Frequency XC2404A816 -10 85℃ -20 -40℃ -30 VDD = 1.20V -20 Isolation: S12 [dB] Output Return Loss：S22 [dB] XC2404A816 VDD = 1.2V 0 Ta = 25℃ -40 85℃ -30 Topr=25℃ -40 -40℃ -50 -60 1 1.2 1.4 1.6 1.8 2 1 1.2 Frequency ： f (GHz) 1.4 1.6 Frequency ： f (GHz) 1.8 2 (22) Output Return Loss vs. Frequency (Smith Chart) XC2404A816 (21) Input Return Loss vs. Frequency (Smith Chart) XC2404A816 Ta = 25℃ VDD=1.2V Ta = 25℃ VDD=1.2V f = 1.575GHz f = 1.575GHz (24) Power Gain vs. Input Power (23) Noise Figure vs. Frequency XC2404A816 XC2404A816 VDD=1.2V 4 2.5 Ta = 85℃ 2 Ta=25℃ 1.5 1 Ta = -40℃ 0.5 1.2 1.4 Frequency (GHz) 12/16 25 20 15 10 5 0 1 Power Gain : S21 (dB) Noise Figure : NF (dB) 3.5 3 VDD = 1.2V Ta = 25℃ 30 1.6 1.8 0 -50 -40 -30 -20 Input Power : Pin (dB) -10 0 0.3±0.05 0.2±0.05 8 5 2 6 1 7 0.3±0.05 0.2±0.05 0.2±0.05 0.2±0.05 0.1±0.05 3 0.1±0.05 75 4 .0 0.5±0.05 0.5±0.05 0.1±0.05 R0 0.3±0.05 0.4±0.05 0.10±0.03 +0.026 0.05 -0.014 MAX0.60(0.575) 1.5±0.08 XC2404A816UR-G ■ PACKAGING INFORMATION ●USP-8A01 1.5±0.08 1PIN INDENT 0.1±0.05 13/16 XC2404A816UR-G ■ PACKAGING INFORMATION (Continued) ●USP-8A01 Reference Pattern Layout ※0.35 0.25 Is cupper area. は銅箔線を表す。 ※印はﾚｼﾞｽﾄ開口寸法とする。 Mark ※ is opening of resist. 0.5 0.5 ※0.6 ※0.6 0.2 (0.25) (※0.35) 1.9 ※2.0 0.28 1.8 0.28 0.28 0.5 0.5 0.28 0.65 0.28 0.5 0.65 0.35 ●USP-8A01 Reference Metal Mask Design 14/16 XC2404A816UR-G ■MARKING RULE USP-8A01 ① represents product series. ②③ represents product. MARK ② ③ A 0 3 PRODUCT SERIES 6 ③ 1 2 7 ② XC2404******-G ① 4 8 ⑤ PRODUCT SERIES ④ MARK 5 4 XC2404A816**-G ④⑤ represents production lot number. 01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order. (G, I, J, O, Q, W excepted) *No character inversion used. 15/16 XC2404A816UR-G 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 16/16