TI TPS76901SHKQ

TPS76901-HT
www.ti.com
SLVS959C – JUNE 2009 – REVISED APRIL 2012
ULTRALOW-POWER 100-mA LOW DROPOUT LINEAR REGULATORS
Check for Samples: TPS76901-HT
FEATURES
1
•
•
•
•
•
•
100-mA Low-Dropout Regulator
Available in Adjustable Versions
Only 335-μA Quiescent Current With 100 mA
at 210°C
1-μA Quiescent Current in Standby Mode
Dropout Voltage Typically 71 mV at 100 mA
Over Current Limitation
APPLICATIONS
•
•
Down-Hole Drilling
High Temperature Environments
SUPPORTS EXTREME TEMPERATURE
APPLICATIONS
•
•
•
•
•
•
•
•
(1)
1
GND
2
EN
3
5
4
Custom temperature ranges available
HKJ PACKAGE
(TOP VIEW)
DBV PACKAGE
(TOP VIEW)
IN
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Extreme (–55°C/210°C)
Temperature Range (1)
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
Texas Instruments' high temperature products
utilize highly optimized silicon (die) solutions
with design and process enhancements to
maximize performance over extended
temperatures.
OUT
NC/FB
NC
FB
EN
GND
1
2
8
7
3
6
4
5
HKQ PACKAGE
(TOP VIEW)
NC
OUT
IN
NC
NC
8
1
OUT
NC
FB
EN
IN
GND
NC
5
4
HKQ as formed or HKJ mounted dead bug
DESCRIPTION
The TPS76901 low-dropout (LDO) voltage regulator offers the benefits of low dropout voltage, ultralow-power
operation, and miniaturized packaging. This regulator features low dropout voltages and ultralow quiescent
current compared to conventional LDO regulators. The TPS76901 is ideal for micropower operations and where
board space is at a premium.
A combination of new circuit design and process innovation has enabled the usual PNP pass transistor to be
replaced by a PMOS pass element. Because the PMOS pass element behaves as a low-value resistor, the
dropout voltage is very low, and is directly proportional to the load current. Since the PMOS pass element is a
voltage-driven device, the quiescent current is ultralow (28 μA maximum) and is stable over the entire range of
output load current (0 mA to 100 mA). Intended for use in portable systems such as laptops and cellular phones,
the ultralow-dropout voltage feature and ultralow-power operation result in a significant increase in system
battery operating life.
The TPS76901 also features a logic-enabled sleep mode to shut down the regulator, reducing quiescent current
to 1 μA, typical at TJ = 25°C. The TPS76901 is a variable version programmable over the range of 1.2 V to
4.5 V).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2012, Texas Instruments Incorporated
TPS76901-HT
SLVS959C – JUNE 2009 – REVISED APRIL 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
15 mils.
Silicon with backgrind
GND
Al-Si-Cu (0.5%)
Origin
a
c
b
d
Table 1. BOND PAD COORDINATES
DESCRIPTION
(1)
2
(1)
PAD NUMBER
a
b
c
d
IN
1
91.55
764.45
176.55
849.45
OUT
2
130.10
91.50
215.10
176.50
DNC
3
177.10
91.50
253.10
176.50
FB
4
1130.75
91.50
1215.75
176.50
DNC
5
1180.00
229.00
1256.00
305.00
DNC
6
1180.00
330.00
1256.00
406.00
DNC
7
1180.00
431.00
1256.00
507.00
DNC
8
1180.00
532.00
1256.00
608.00
DNC
9
1180.00
633.00
1256.00
709.00
DNC
10
1180.00
734.00
1256.00
810.00
EN
11
1058.50
864.50
1143.50
949.50
GND
12
700.00
881.00
785.00
966.00
IN
13
202.50
864.50
287.50
949.50
DNC = Do not connect
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
TPS76901-HT
www.ti.com
SLVS959C – JUNE 2009 – REVISED APRIL 2012
½
½
½
1062 mm
IN
IN
GND
1368 mm
OUT
EN
½
FB
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
3
TPS76901-HT
SLVS959C – JUNE 2009 – REVISED APRIL 2012
www.ti.com
ORDERING INFORMATION (1)
TA
PACKAGE (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
PCFS
–55°c to 175°C
–55°c to 210°C
(1)
(2)
DBV
TPS76901HDBVT
KGD
TPS76901SKGD1
NA
HKJ
TPS76901SHKJ
TPS76901SHKJ
HKQ
TPS76901SHKQ
TPS76901SHKQ
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTIONAL BLOCK DIAGRAM
OUT
IN
EN
Current Limit
VREF
FB
GND
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VREF
VALUE
UNIT
Input voltage range (2)
–0.3 to 13.5
V
Voltage range at EN
–0.3 to VI + 0.3
V
Voltage on OUT, FB
7
V
Peak output current
Internally limited
ESD rating, HBM
2
Continuous total power dissipation
TJ
(1)
(2)
4
kV
See Dissipation Ratings Table
Operating virtual junction temperature range
–55 to 210
°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
TPS76901-HT
www.ti.com
SLVS959C – JUNE 2009 – REVISED APRIL 2012
THERMAL CHARACTERISTICS FOR DBV PACKAGE
(1)
(2)
BOARD
RθJC
RθJA
DERATING FACTOR
ABOVE TA = 25°C
Low K (1)
65.8 °C/W
259 °C/W
3.9 mW/°C
High K (2)
65.8 °C/W
180 °C/W
5.6 mW/°C
The JEDEC Low K (1s) board design used to derive this data was a 3-inch x 3-inch, two layer board with 2-ounce copper traces on top
of the board.
The JEDEC High K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and
ground planes and 2-ounce copper traces on top and bottom of the board.
THERMAL CHARACTERISTICS FOR HKJ OR HKQ PACKAGE
over operating free-air temperature range (unless otherwise noted)
PARAMETER
θJC
Junction-to-case thermal resistance
MIN
TYP
to ceramic side of case
MAX
UNIT
5.7
to top of case lid (metal side of case)
°C/W
13.7
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
(1)
VI
Input votlage
VO
Ouput voltage range
IO
Continuous output current (2)
TJ
Operating junction temperature
(1)
(2)
NOM
MAX
UNIT
5
10
1.2
4.5
V
V
0
100
mA
–55
210
°C
To calculate the minimum input voltage for your maximum output current, use the following formula:
XXXX VI(min) = VO(max) + VDO(max load).
Continuous output current and operating junction temperature are limited by internal protection circuitry, but it is not recommended that
the device operate under conditions beyond those specified in this table for extended periods of time.
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TJ = 25°C
VO
Output voltage
(10 μA to 100 mA load) (1)
1.2 V ≤ VO ≤ 4.5 V
EN = 0 V,
0 mA < IO < 100 mA
IQ
Quiescent Current
(GND current) (1) (2)
0.95VO
1.03VO
TJ = 175°C
0.84VO
1.03VO
TJ = 210°C
0.84VO
1.03VO
TJ = 25°C
VN
(1)
(2)
EN = 0 V,
IO = 0 to 100 mA
Output voltage line regulation
(ΔVO/VO) (2)
5 V ≤ VI ≤ 10 V (1)
Output noise voltage
BW = 300 Hz to 50 kHz,
CO = 10 μF
V
28
TJ = 175°C
23
TJ = 210°C
335
μA
28
12
TJ = 175°C
16.5
TJ = 210°C
23.4
TJ = 25°C
0.04
TJ = –55°C to 125°C
mV
0.1
TJ = 175°C
0.275
TJ = 210°C
0.34
TJ = 25°C
UNIT
17
TJ = –55°C to 125°C
EN = 4 V,
IO = 100 mA
MAX
VO
TJ = –55°C to 125°C
TJ = 25°C
Load regulation
TYP
190
%
μVms
Minimum IN operating voltage is 5V. Maximum IN voltage 10 V, minimum output current 10 μA, maximum output current 100 mA.
Line Regulation (%) = (Δ VOUT) / (Δ VIN) x 100
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
5
TPS76901-HT
SLVS959C – JUNE 2009 – REVISED APRIL 2012
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TJ = 25°C
VO = 0 V (1)
Output current limit
EN = VI, 5 V ≤ VI ≤ 10 V
Standby current
750
TJ = 175°C
350
TJ = 210°C
505
FB = 1.224 V
VIH
High level enable input voltage
5 V ≤ VI ≤ 10 V
8.8
PSRR
5 V ≤ VI ≤ 10 V
Power supply ripple rejection
f = 1 kHz,
CO = 10 μF (3)
IIN
0.2
V
0.6
TJ = 210°C
0.4
TJ = 25°C
60
–1
TJ = 25°C
0
V
dB
1
0.14
TJ = 210°C
EN = VI
(3)
0.9
TJ = 175°C
Input current
μA
1.7
TJ = 175°C
TJ = 25°C
EN = 0 V
μA
1
TJ = 25°C
Low level enable input voltage
11.85
0.02
TJ = 210°C
VIL
mA
150
–1
TJ = 175°C
TJ = 25°C
750
2
TJ = 175°C
TJ = –55°C to 125°C
FB input current
UNIT
1
TJ = –55°C to 125°C
TJ = 210°C
IFB
MAX
350
TJ = –55°C to 125°C
TJ = 25°C
ISTDBY
TYP
3.5
–1
1
TJ = 175°C
3.8
TJ = 210°C
5.5
μA
Minimum IN operating voltage is 5V. Maximum IN voltage 10 V, minimum output current 10 μA, maximum output current 100 mA.
DEVICE INFORMATION
TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
I/O
DESCRIPTION
NC
1, 5, 8
FB
2
I
Feedback voltage
EN
3
I
Enable input
GND
4
IN
6
I
Input supply voltage
OUT
7
O
Regulated output voltage
6
No connection
Ground
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
TPS76901-HT
www.ti.com
SLVS959C – JUNE 2009 – REVISED APRIL 2012
TYPICAL CHARACTERISTICS
(VIN
VOUT
vs
TEMPERATURE
= 5 V , Load = 100 mA)
3.8
3.7
VOUT - V
3.6
3.5
3.4
3.3
3.2
25
125
150
180
200
210
Temperature - °C
Figure 1.
OUTPUT IMPEDANCE
vs
FREQUENCY
2
1.8
ZO - Output Impedance - Ω
1.6
VI = 4.3 V
CO = 4.7 µF
ESR = 0.3 Ω
TA = 25°C
1.4
1.2
1
0.8
IO = 1 mA
0.6
0.4
IO = 100 mA
0.2
0
10
100
1k
10 k
100 k
1M
f - Frequency - Hz
Figure 2.
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
7
TPS76901-HT
SLVS959C – JUNE 2009 – REVISED APRIL 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
LDO STARTUP TIME
EN
VO
0
20
40
60
80
100 120 140 160 180 200
t - Time - µs
Figure 3.
8
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
TPS76901-HT
www.ti.com
SLVS959C – JUNE 2009 – REVISED APRIL 2012
TYPICAL CHARACTERISTICS (continued)
1000
Estimated Life - Years
100
10
Electromigration Fail Mode
1
0
110
130
150
170
190
210
230
Continuous T J - °C
Note:
1.
See datasheet for absolute maximum and minimum recommended operating conditions.
2.
Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package
interconnect life).
Figure 4. TPS76901HDBVT / TPS76901SKGD1 / TPS76901SHKJ / TPS76901SHKQ
Operating Life Derating Chart
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
9
TPS76901-HT
SLVS959C – JUNE 2009 – REVISED APRIL 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
10000000
1000000
Estimated Life (Hours)
Wirebond Voiding
Fail Mode
100000
10000
1000
100
100
110
120
130
140
150
160
170
180
Continuous T J (°C)
Note:
1.
See datasheet for absolute maximum and minimum recommended operating conditions.
2.
Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package
interconnect life).
Figure 5. TPS76901HDBVT Operating Life Derating Chart
10
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
TPS76901-HT
www.ti.com
SLVS959C – JUNE 2009 – REVISED APRIL 2012
APPLICATION INFORMATION (1)
The TPS76901 low-dropout (LDO) regulator has been optimized for use in battery-operated equipment. It
features extremely low dropout voltages, low quiescent current (17 μA nominally), and enables inputs to reduce
supply currents to 1 μA when the regulators are turned off.
DEVICE OPERATION
The TPS76901 uses a PMOS pass element to dramatically reduce both dropout voltage and supply current over
more conventional PNP-pass-element LDO designs. The PMOS pass element is a voltage-controlled device and,
unlike a PNP transistor, it does not require increased drive current as output current increases. Supply current in
the TPS76901 is essentially constant from no load to maximum load.
Current limiting prevents damage by excessive output current. The device switches into a constant-current mode
at approximately 350 mA; further load reduces the output voltage instead of increasing the output current. The
PMOS pass element includes a back gate diode that conducts reverse current when the input voltage level drops
below the output voltage level.
A voltage of 1.7 V or greater on the EN input will disable the TPS76901 internal circuitry, reducing the supply
current to 1 μA. A voltage of less than 0.9 V on the EN input will enable the TPS76901 and will enable normal
operation to resume. The EN input does not include any deliberate hysteresis, and it exhibits an actual switching
threshold of approximately 1.5 V.
A typical application circuit is shown in Figure 6.
TPS76901
1
VI
IN
FB 4
OUT
C1
1 µF
5
VO
3
EN
+
4.7 µF
GND
2
ESR = 0.2 Ω
Figure 6. Typical Application Circuit
EXTERNAL CAPACITOR REQUIREMENTS
Although not required, a 0.047-μF or larger ceramic input bypass capacitor, connected between IN and GND and
located close to the TPS76901, is recommended to improve transient response and noise rejection. A highervalue electrolytic input capacitor may be necessary if large, fast-rise-time load transients are anticipated and the
device is located several inches from the power source.
Like all low dropout regulators, the TPS76901 requires an output capacitor connected between OUT and GND to
stabilize the internal control loop. The minimum recommended capacitance is 4.7 μF. The ESR (equivalent series
resistance) of the capacitor should be between 0.2 Ω and 10 Ω. to ensure stability. Capacitor values larger than
4.7 μF are acceptable, and allow the use of smaller ESR values. Capacitances less than 4.7 μF are not
recommended because they require careful selection of ESR to ensure stability. Solid tantalum electrolytic,
aluminum electrolytic, and multilayer ceramic capacitors are all suitable, provided they meet the requirements
described above. Most of the commercially available 4.7-μF surface-mount solid tantalum capacitors, including
devices from Sprague, Kemet, and Nichico, meet the ESR requirements stated above. Multilayer ceramic
capacitors may have very small equivalent series resistances and may thus require the addition of a low value
series resistor to ensure stability.
(1)
Application information is provided for commercial temperature as a reference and not for high temperature.
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
11
TPS76901-HT
SLVS959C – JUNE 2009 – REVISED APRIL 2012
www.ti.com
Table 2. CAPACITOR SELECTION
(1)
PART NO.
MANUFACTURER
VALUE
MAX ESR (1)
SIZE (H x L x W) (1)
T494B475K016AS
KEMET
4.7 μF
1.5 Ω
1.9 x 3.5 x 2.8
195D106x0016x2T
SPRAGUE
10 μF
1.5 Ω
1.3 x 7.0 x 2.7
695D106x003562T
SPRAGUE
10 μF
1.3 Ω
2.5 x 7.6 x 2.5
TPSC475K035R0600
AVX
4.7 μF
0.6 Ω
2.6 x 6.0 x 3.2
Size is in mm. ESR is maximum resistance in Ohms at 100 kHz and TA = 25°C. Contact manufacturer for minimum ESR values.
OUTPUT VOLTAGE PROGRAMMING
The output voltage of the TPS76901 adjustable regulator is programmed using an external resistor divider as
shown in Figure 7. The output voltage is calculated using:
(
R1
VO = VREF • 1 + −
R2
)
(1)
Where:
VREF = 1.16 V typ (the internal reference voltage)
Resistors R1 and R2 should be chosen for approximately 7-μA divider current. Lower value resistors can be
used but offer no inherent advantage and waste more power. Higher values should be avoided as leakage
currents at FB increase the output voltage error. The recommended design procedure is to choose R2 = 169 kΩ
to set the divider current at 7 μA and then calculate R1 using:
(
VO
-1
R1 = −
VREF
) R2
•
(2)
TPS76901
1
VI
1 µF
IN
OUT
≥ 1.7 V
3
5
VO
R1
EN
≤
0.9 V
FB
GND
2
4
4.7 µF
R2
ESR = 0.2 Ω
Note:
1.
The above calculations hold good for room temperature values only.
Figure 7. Adjustable LDO Reulator Programming
REGULATOR PROTECTION
The TPS76901 PMOS-pass transistor has a built-in back diode that conducts reverse current when the input
voltage drops below the output voltage (e.g., during power down). Current is conducted from the output to the
input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be
appropriate.
The TPS76901 features internal current limiting protection. During normal operation, the TPS76901 limits output
current to approximately 350 mA. When current limiting engages, the output voltage scales back linearly until the
over current condition ends.
12
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
PACKAGE OPTION ADDENDUM
www.ti.com
29-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
TPS76901HDBVT
ACTIVE
SOT-23
Pins
Package Qty
DBV
5
250
Green (RoHS
& no Sb/Br)
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
TPS76901SHKJ
ACTIVE
CFP
HKJ
8
1
TBD
Call TI
N / A for Pkg Type
TPS76901SHKQ
ACTIVE
CFP
HKQ
8
1
TBD
AU
N / A for Pkg Type
TPS76901SKGD1
ACTIVE
XCEPT
KGD
0
400
TBD
Call TI
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS76901-HT :
• Catalog: TPS76901
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
29-Aug-2012
• Automotive: TPS76901-Q1
• Enhanced Product: TPS76901-EP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Sep-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPS76901HDBVT
Package Package Pins
Type Drawing
SPQ
SOT-23
250
DBV
5
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
179.0
8.4
Pack Materials-Page 1
3.2
B0
(mm)
K0
(mm)
P1
(mm)
3.2
1.4
4.0
W
Pin1
(mm) Quadrant
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Sep-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS76901HDBVT
SOT-23
DBV
5
250
203.0
203.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated