TOSHIBA TLP371F

TLP371,TLP372
TOSHIBA Photocoupler
GaAs Ired & Photo−Transistor
TLP371, TLP372
Office Machine
Household Use Equipment
Telecommunication
Solid State Relay
Programmable Controllers
Unit in mm
The TOSHIBA TLP371 and TLP372 consists of a gallium arsenide
infrared emitting diode optically coupled to a darlington connected
photo−transistor which has an integrated base−emitter resistor to
optimize switching speed and elevated temperature characteristics in a
six lead plastic DIP package.
TLP372 is no−base internal connection for high−EMI environments.
•
Current transfer ratio: 1000% (min) (IF = 1mA)
•
Isolation voltage: 5000 Vrms (min)
•
UL recognized: UL1577, file no. E67349
TOSHIBA
11−7A8
Weight: 0.4g (typ.)
Pin Configurations (top view)
TLP372
TLP371
1
6
2
5
3
4
1 : Anode
2 : Cathode
3 : NC
4 : Emitter
5 : Collector
6 : Base
1
6
2
5
3
4
1 : Anode
2 : Cathode
3 : NC
4 : Emitter
5 : Collector
6 : NC
1
2007-10-01
TLP371,TLP372
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
IF
60
mA
ΔIF / °C
−0.7
mA / °C
Peak forward current (100μs pulse, 100pps)
IFP
1
A
Reverse voltage
VR
5
V
Junction temperature
Tj
125
°C
Collector−emitter voltage
VCEO
300
V
Collector−base voltage (TLP371)
VCBO
300
V
Emitter−collector voltage
VECO
0.3
V
Emitter−base voltage (TLP371)
VEBO
7
V
Collector current
IC
150
mA
Power dissipation
PC
300
mW
ΔPC / °C
−3.0
mW / °C
Tj
125
°C
Storage temperature range
Tstg
−55~125
°C
Operating temperature range
Topr
−55~100
°C
Lead soldering temperature (10 s)
Tsold
260
°C
PT
350
mW
ΔPT / °C
−3.5
mW / °C
BVS
5000
Vrms
Forward current
Detector
LED
Forward current derating (Ta ≥ 39°C)
Power dissipation derating (Ta ≥ 25°C)
Junction temperature
Total package power dissipation
Total package power dissipation derating (Ta ≥ 25°C)
Isolation voltage (AC, 1min., R.H. ≤ 60%)
(Note 1)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two terminal device: Pins 1, 2 and 3 shorted together and pins 4,5 and 6 shorted
together.
Recommended Operating Conditions
Characteristic
Symbol
Min
Typ.
Max
Unit
Supply voltage
VCC
―
―
200
V
Forward current
IF
―
16
25
mA
Collector current
IC
―
―
120
mA
Topr
−25
―
85
°C
Operating temperature
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
2
2007-10-01
TLP371,TLP372
Individual Electrical Characteristics (Ta = 25°C)
Detector
LED
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Forward voltage
VF
IF = 10 mA
1.0
1.15
1.3
V
Reverse current
IR
VR = 5 V
―
―
10
μA
Capacitance
CT
V = 0, f = 1 MHz
―
30
―
pF
Collector−emitter
breakdown voltage
V(BR) CEO
IC = 0.1 mA
300
―
―
V
Emitter−collector
breakdown voltage
V(BR) ECO
IE = 0.1 mA
0.3
―
―
V
Collector−base
breakdown voltage (TLP371)
V(BR) CBO
IC = 0.1 mA
300
―
―
V
Emitter−base
breakdown voltage (TLP371)
V(BR) EBO
IE = 0.1 mA
7
―
―
V
VCE = 200 V
―
10
200
nA
VCE = 200 V
Ta = 85 °C
―
―
20
μA
Collector dark current
ICEO
Collector dark current (TLP371)
ICER
VCE = 200 V
Ta = 85 °C,
RBE = 10 MΩ
―
0.5
10
μA
Collector dark current (TLP371)
ICBO
VCE = 200 V
―
0.1
―
nA
DC forward current gain (TLP371)
hFE
VCE = 5 V,
IC = 10 mA
―
7000
―
―
Capacitance (collecter to emitter)
CCE
V = 0, f = 1 MHz
―
10
―
pF
Coupled Electrical Characteristics (Ta = 25°C)
Characteristic
Current transfer ratio
Saturated CTR
Base photo−current (TLP371)
Collector−emitter
saturation voltage
Symbol
Test Condition
MIn
Typ.
Max
Unit
%
IC / IF
IF = 1 mA, VCE = 1 V
1000
4000
―
IC / IF (sat)
IF = 10 mA, VCE = 1 V
500
―
―
%
IPB
IF = 1 mA, VCB = 1 V
―
6
―
μA
IC = 10 mA, IF = 1 mA
―
―
1.0
IC = 100 mA, IF = 10 mA
0.3
―
1.2
VCE (sat)
3
V
2007-10-01
TLP371,TLP372
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Capacitance
(input to output)
CS
VS = 0, f = 1 MHz
Isolation resistance
RS
VS = 500 V
BVS
Typ.
Max
Unit
―
0.8
―
pF
―
Ω
10
5×10
AC, 1 minute
Isolation voltage
Min
10
14
5000
―
―
AC, 1 second, in oil
―
10000
―
DC, 1 minute, in oil
―
10000
―
Vdc
Min
Typ.
Max
Unit
―
40
―
―
15
―
―
50
―
―
15
―
―
3
―
―
45
―
―
90
―
―
5
―
―
40
―
―
80
―
Vrms
Switching Characteristics (Ta = 25°C)
Characteristic
Symbol
Rise time
tr
Fall time
tf
Turn−on time
ton
Turn−off time
toff
Turn−on time
tON
Storage time
ts
Turn−off time
tOFF
Turn−on time
tON
Storage time
ts
Turn−off time
tOFF
Test Condition
VCC = 10 V
IC = 10 mA
RL = 100Ω
RL = 180Ω
RBE = OPEN
VCC = 5 V, IF = 16 mA
(Fig.1)
RL = 180Ω
RBE = 10 MΩ(TLP371)
VCC = 10 V, IF = 16 mA
(Fig.1)
μs
μs
μs
Fig.1: Switching time test circuit
IF
RL
RBE
VCC
VCE
IF
VCE
tON
4
ts
VCC
9V
1V
tOFF
2007-10-01
TLP371,TLP372
IF – Ta
80
60
40
20
0
−20
0
20
40
PC – Ta
400
Allowable collector power
dissipation PC (mW)
Allowable forward current
IF (mA)
100
60
80
100
320
240
160
80
0
−20
120
0
Ambient temperature Ta (℃)
IFP – DR
5000
40
60
100
80
120
IF – VF
Ta = 25°C
IF (mA)
50
1000
500
Forward current
Pulse forward current
IFP (mA)
100
Pulse width
≤ 100μs
Ta = 25°C
3000
20
Ambient temperature Ta (℃)
300
100
50
30
30
10
5
3
1
0.5
0.3
10
3
10
−3
3
10
−2
3
10
−1
3
10
0
0.1
0.6
Duty cycle ratio DR
0.8
1.0
1.2
Forward
ΔVF / ΔTa
– IF
1.8
2.6
3.0
IFP – VFP
−2.8
−2.4
−2.0
−1.6
−1.2
−0.8
−0.4
0.1
1.6
1000
Pulse forward current IFP (mA)
Forward voltage temperature
coefficient ΔVF / ΔTa (mV / ℃)
−3.2
1.4
voltage VF (V)
500
300
100
50
30
10
Pulse width ≤ 10μs
5
Repetitive frequency
3
=100Hz
Ta = 25°C
0.3 0.5
1
Forward
3
current
10
IF
30
1
0.6
50
(mA)
1.0
1.4
Pulse forward
5
1.8
2.2
voltage VFP (V)
2007-10-01
TLP371,TLP372
IC – VCE
10mA
140
4mA
I C – IF
300
Ta = 25°C
VCE = 1.2V
Collector current IC (mA)
Collector current IC (mA)
1V
2mA
120
100
80
1mA
60
40
50
30
10
5
3
IF = 0.5mA
20
100
Ta = 25°C
0
0.6
0.8
1.0
1.2
1.4
1.6
Collector−emitter voltage
1.8
1
0.2
2.0
0.5
1
VCE (V)
Switching Time – RL
OFF (IF = 16mA)
100
t
OFF (IF = 1.6mA)
50
30
t
ON (IF = 1.6mA)
10
5
30
50
Ta = 25°C
10000
5000
3000
VCE = 1.2V
1000
1V
500
300
3
t
1
30
50
30000
Current transfer ration IC / IF (%)
(μs)
Switching time
t
30
IF (mA)
50000
Ta = 25°C
VCC = 10V
300
10
current
I C / IF – I F
1000
500
3
Forward
50
100
300 500
Load
ON (IF = 16mA)
1K
3K
5K
100
0.3
10K
resistance RL (Ω)
0.5
3
1
Forward
6
5
current
10
IF (mA)
2007-10-01
TLP371,TLP372
10
ICEO – VCE
1
ICEO – Ta
Ta = 25°C
10
10
Collector dark current ICEO (μA)
Collector dark current ICEO (μA)
RBE = OPEN
0
RBE = 10 MΩ
(TLP371)
10
10
0
−1
VCE = 200V
10
10
1
150V
−2
80V
−1
10
10
30
50
300
100
Collector−emitter voltage
−3
500
0
20
VCE (V)
40
Ambient temperature Ta
IC – Ta
VCE = 1V
IF = 10mA
100
60
1mA
20
0
(℃)
VCE = 1V
1.2
80
40
100
IC – Ta
1.4
Collector current IC
Collector current IC (mA)
120
80
60
IF = 10mA
1.0
1mA
0.8
0.6
0.4
−20
0.2
0
20
40
60
80
100
Ambient temperature Ta (℃)
−20
0
20
40
60
80
100
Ambient temperature Ta (℃)
7
2007-10-01
TLP371,TLP372
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
8
2007-10-01