54F377 54F377 Octal D Flip-Flop with Clock Enable Literature Number: SNOS191A 54F/74F377 Octal D Flip-Flop with Clock Enable General Description Features The ’F377 has eight edge-triggered, D-type flip-flops with individual D inputs and Q outputs. The common buffered Clock (CP) input loads all flip-flops simultaneously, when the Clock Enable (CE) is LOW. The register is fully edge-triggered. The state of each D input, one setup time before the LOW-to-HIGH clock transition, is transferred to the corresponding flip-flop’s Q output. The CE input must be stable only one setup time prior to the LOW-to-HIGH clock transition for predictable operation. Y 74F377PC 54F377DM (QB) Package Number Y Y Y Y Y e Military Y Ideal for addressable register applications Clock enable for address and data synchronization applications Eight edge-triggered D flip-flops Buffered common clock See ’F273 for master reset version See ’F373 for transparent latch version See ’F374 for TRI-STATEÉ version Guaranteed 4000V minimum ESD protection Package Description et Commercial Y N20A 20-Lead (0.300× Wide) Molded Dual-In-Line J20A 20-Lead Ceramic Dual-In-Line M20B 74F377SJ (Note 1) M20D 20-Lead (0.300× Wide) Molded Small Outline, JEDEC 20-Lead (0.300× Wide) Molded Small Outline, EIAJ bs ol 74F377SC (Note 1) 54F377FM (QB) W20A 20-Lead Cerpack 54F377LM (QB) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C Note 1: Devices also available in 13× reel. Use suffix e SCX and SJX. Logic Symbols O IEEE/IEC TL/F/9525 – 1 TL/F/9525 – 4 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9525 RRD-B30M75/Printed in U. S. A. 54F/74F377 Octal D Flip-Flop with Clock Enable May 1995 Connection Diagrams Pin Assignment for DIP, SOIC and Flatpak Pin Assignment for LCC TL/F/9525 – 3 Unit Loading/Fan Out 54F/74F D0 – D7 CE CP Q0 – Q7 Description U.L. HIGH/LOW Data Inputs Clock Enable (Active LOW) Clock Pulse Input Data Outputs 1.0/1.0 1.0/1.0 1.0/1.0 50/33.3 Inputs Operating Mode Load ‘‘1’’ Load ‘‘0’’ 20 mA/b0.6 mA 20 mA/b0.6 mA 20 mA/b0.6 mA b 1 mA/20 mA bs ol Mode Select-Function Table Input IIH/IIL Output IOH/IOL et Pin Names e TL/F/9525–2 Hold (Do Nothing) Output CP CE Dn Qn L I h H L I I L L X h H X X No Change No Change H e HIGH Voltage Level h e HIGH Voltage Level one setup time prior to the LOW-to-HIGH Clock Transition L e LOW Voltage Level I e LOW Voltage Level one setup time prior to the LOW-to-HIGH Clock Transition X e Immaterial L e LOW-to-HIGH Clock Transition O Logic Diagram TL/F/9525 – 5 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. 2 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65§ C to a 150§ C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55§ C to a 125§ C Free Air Ambient Temperature Military Commercial b 55§ C to a 125§ C 0§ C to a 70§ C Supply Voltage Military Commercial b 55§ C to a 175§ C b 55§ C to a 150§ C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin e b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) ESD Last Passing Voltage (Min) 4000V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. DC Electrical Characteristics Symbol Parameter et Note 2: Either voltage limit or current limit is sufficient to protect inputs. 54F/74F Min Input HIGH Voltage VIL Input LOW Voltage VCD VOH VOL IIH IBVI IIL IOS ICEX 2.0 0.8 Input Clamp Diode Voltage VCC Conditions V Recognized as a HIGH Signal V Recognized as a LOW Signal V Min IIN e b18 mA V Min IOH e b1 mA IOH e b1 mA IOH e b1 mA 0.5 0.5 V Min IOL e 20 mA IOL e 20 mA Input HIGH Current 5.0 mA Max VIN e 2.7V Input HIGH Current Breakdown Test 7.0 mA Max VIN e 7.0V Output HIGH Voltage 54F 10% VCC 74F 10% VCC 74F 5% VCC Output LOW Voltage 54F 10% VCC 74F 10% VCC b 1.2 2.5 2.5 2.7 Input LOW Current Output Short-Circuit Current b 60 Output HIGH Leakage Current Input Leakage Test O VID Units Max bs ol VIH Typ IOD Output Leakage Circuit Current ICCH ICCL Power Supply Current b 0.6 mA Max VIN e 0.5V b 150 mA Max VOUT e 0V 50 mA Max VOUT e VCC V 0.0 IID e 1.9 mA All Other Pins Grounded 3.75 mA 0.0 VIOD e 150 mV All Other Pins Grounded 46 56 mA Max CP e L Dn e MR e HIGH 4.75 35 44 3 AC Electrical Characteristics Symbol Parameter 74F 54F 74F TA e a 25§ C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Min fMax Maximum Clock Frequency 130 tPLH tPHL Propagation Delay CP to Qn 3.0 4.0 Typ Max Min Max 85 7.0 9.0 Min Max 105 2.0 3.0 8.5 10.5 Units MHz 2.5 3.5 7.5 9.0 ns AC Operating Requirements Parameter 54F 74F TA, VCC e Mil TA, VCC e Com Min Min Min Max Setup Time, HIGH or LOW Dn to CP 3.0 3.5 3.5 4.0 th(H) th(L) Hold Time, HIGH or LOW Dn to CP 0.5 1.0 1.0 1.0 ts(H) ts(L) Setup Time, HIGH or LOW CE to CP 4.1 3.5 th(H) th(L) Hold Time, HIGH to LOW CE to CP 0.5 2.0 tw(H) tw(L) Clock Pulse Width, HIGH or LOW 6.0 6.0 Max Max 3.0 3.5 ns 0.5 1.0 ns et ts(H) ts(L) Units e Symbol 74F TA e a 25§ C VCC e a 5.0V 4.1 4.0 ns 1.5 2.5 0.5 2.0 ns 5.0 5.0 6.0 6.0 ns bs ol 4.0 5.0 Ordering Information The device number is used to form part of a simplified purchasing code where a package type and temperature range are defined as follows: 74F 377 S Temperature Range Family 74F e Commercial 54F e Military C X Special Variations X e Devices shipped in 13× reels QB e Military grade with environmental and burn-in processing shipped in tubes Device Type Package Code P e Plastic DIP D e Ceramic DIP S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ O Temperature Range C e Commercial (0§ C to a 70§ C) M e Military (b55§ C to a 125§ C) 4 5 e et bs ol O et e Physical Dimensions inches (millimeters) O bs ol 20-Lead Ceramic Dual-In-Line Package (D) NS Package Number J20A 20-Lead (0.300× Wide) Molded Small Outline Package, JEDEC (S) NS Package Number M20B 6 et e Physical Dimensions inches (millimeters) (Continued) O bs ol 20-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ) NS Package Number M20D 7 e et 20-Lead (0.300× Wide) Molded Dual-In-Line Package (P) NS Package Number N20A bs ol 54F/74F377 Octal D Flip-Flop with Clock Enable Physical Dimensions inches (millimeters) (Continued) LIFE SUPPORT POLICY O NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052-8090 Tel: 1(800) 272-9959 TWX: (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str. 10 D-82256 F4urstenfeldbruck Germany Tel: (81-41) 35-0 Telex: 527649 Fax: (81-41) 35-1 National Semiconductor Japan Ltd. Sumitomo Chemical Engineering Center Bldg. 7F 1-7-1, Nakase, Mihama-Ku Chiba-City, Ciba Prefecture 261 Tel: (043) 299-2300 Fax: (043) 299-2500 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Hong Kong Ltd. 13th Floor, Straight Block, Ocean Centre, 5 Canton Rd. Tsimshatsui, Kowloon Hong Kong Tel: (852) 2737-1600 Fax: (852) 2736-9960 National Semiconductores Do Brazil Ltda. Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel: (55-11) 212-5066 Telex: 391-1131931 NSBR BR Fax: (55-11) 212-1181 National Semiconductor (Australia) Pty, Ltd. Building 16 Business Park Drive Monash Business Park Nottinghill, Melbourne Victoria 3168 Australia Tel: (3) 558-9999 Fax: (3) 558-9998 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated