FAIRCHILD 74VHC14_10

74VHC14
Hex Schmitt Inverter
General Description
Features
The VHC14 is an advanced high speed CMOS Hex
Schmitt Inverter fabricated with silicon gate CMOS technology. It achieves the high speed operation similar to equivalent Bipolar Schottky TTL while maintaining the CMOS low
power dissipation. Pin configuration and function are the
same as the VHC04 but the inputs have hysteresis
between the positive-going and negative-going input
thresholds, which are capable of transforming slowly
changing input signals into sharply defined, jitter-free output signals, thus providing greater noise margin than conventional inverters.
■ High Speed: tPD = 5.5 ns (typ) at VCC = 5V
■ Low power dissipation: ICC = 2 μA (Max) at TA = 25°C
■ High noise immunity: VNIH = VNIL = 28% VCC (Min)
■ Power down protection is provided on all inputs
■ Low noise: VOLP = 0.8V (Max)
■ Pin and function compatible with 74HC14
An input protection circuit ensures that 0V to 7V can be
applied to the input pins without regard to the supply voltage. This device can be used to interface 5V to 3V systems
and two supply systems such as battery back up. This circuit prevents device destruction due to mismatched supply
and input voltages.
Ordering Code:
Order Number
Package
Number
Package Description
74VHC14M
(Note 1)
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74VHC14MX_NL
(Note 2)
M14A
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150"
Narrow
74VHC14SJ
(Note 1)
M14D
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74VHC14MTC
(Note 1)
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74VHC14MTC_NL
(Note 3)
MTC14
Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
74VHC14MTCX_NL
(Note 2)
MTC14
Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
74VHC14N
(Obsolete)
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Pb-Free package per JEDEC J-STD-020B.
Note 1: Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Note 2: “_NL” indicates Pb-Free product (per JEDEC J-STD-020B). Device is available in Tape and Reel only.
Note 3: “_NL” indicates Pb-Free product (per JEDEC J-STD-020B).
© 2010 Fairchild Semiconductor Corporation
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Logic Symbol/s
Connection Diagram/s
IEEE/IEC
Pin Descriptions
Truth Table/s
Pin Names
Description
An
Inputs
On
Outputs
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2
A
O
L
H
H
L
Absolute Maximum Ratings(Note 4)
Recommended Operating
Conditions (Note 5)
−0.5V to +7.0V
Supply Voltage (VCC)
−0.5V to +7.0V
DC Input Voltage (VIN)
DC Output Voltage (VOUT)
+2.0V to +5.5V
Supply Voltage (VCC)
−0.5V to VCC + 0.5V
0V to +5.5V
Input Voltage (VIN)
Input Diode Current (IIK)
−20 mA
Output Voltage (VOUT)
Output Diode Current (IOK)
±20 mA
Operating Temperature (TOPR)
DC Output Current (IOUT)
±25 mA
DC VCC/GND Current (ICC)
±50 mA
Note 4: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. The data book specifications should be met, without exception, to ensure that the system design is
reliable over its power supply, temperature, and output/input loading variables. Fairchild does not recommend operation outside databook specifications.
−65°C to +150°C
Storage Temperature (TSTG)
Lead Temperature (TL)
Soldering (10 seconds)
0V to VCC
−40°C to +85°C
260°C
Note 5: Unused inputs must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
Symbol
VP
VN
VH
VOH
VOL
TA = 25°C
TA = −40°C to +85°C
Parameter
VCC
Positive Threshold Voltage
3.0
2.20
2.20
4.5
3.15
3.15
5.5
3.85
3.85
Negative Threshold Voltage
Hysteresis Voltage
HIGH Level Output Voltage
LOW Level Output Voltage
IIN
Input Leakage Current
ICC
Quiescent Supply Current
Min
Typ
Max
Min
Max
3.0
0.90
0.90
4.5
1.35
1.35
5.5
1.65
1.65
3.0
0.30
1.20
0.30
1.20
4.5
0.40
1.40
0.40
1.40
5.5
0.50
1.60
0.50
1.60
2.0
1.9
2.0
1.9
3.0
2.9
3.0
2.9
4.5
4.4
4.5
4.4
3.0
2.58
2.48
4.5
3.94
3.80
Units
Conditions
V
V
V
VIN =VIL
IOH = −50 μA
V
IOH = −4 mA
V
IOH = −8 mA
VIN = VIH
2.0
0.0
0.1
0.1
3.0
0.0
0.1
0.1
4.5
0.0
0.1
0.1
3.0
0.36
0.44
4.5
0.36
0.44
0–5.5
±0.1
±1.0
μA
VIN = 5.5V or GND
5.5
2.0
20.0
μA
VIN = VCC or GND
IOL = 50 μA
V
IOL = 4 mA
V
IOL = 8 mA
Noise Characteristics
Symbol
Parameter
TA = 25°C
VCC
Typ
Limits
Units
Conditions
VOLP
(Note 6)
Quiet Output Maximum Dynamic VOL
5.0
0.4
0.8
V
CL = 50 pF
VOLV
(Note 6)
Quiet Output Minimum Dynamic VOL
5.0
−0.4
−0.8
V
CL = 50 pF
VIHD
(Note 6)
Minimum HIGH Level Dynamic Input Voltage
5.0
3.5
V
CL = 50 pF
VILD
(Note 6)
Maximum LOW Level Dynamic Input Voltage
5.0
1.5
V
CL = 50 pF
Note 6: Parameter guaranteed by design.
3
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AC Electrical Characteristics
Symbol
Parameter
tPLH
Propagation Delay
tPHL
Time
VCC
3.3 ± 0.3
5.0 ± 0.5
TA = 25°C
Min
TA = −40°C to +85°C
Typ
Max
Min
Max
8.3
12.8
1.0
15.0
10.8
16.3
1.0
18.5
5.5
8.6
1.0
10.0
7.0
10.6
1.0
12.0
10
CIN
Input Capacitance
4
CPD
Power Dissipation Capacitance
21
10
Units
ns
Conditions
CL = 15 pF
CL = 50 pF
ns
CL = 15 pF
CL = 50 pF
pF
VCC = Open
pF
(Note 7)
Note 7: CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average
operating current can be obtained by the equation: ICC (Opr) = CPD * VCC * fIN + ICC/6 (per Gate)
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4
Physical Dimensions
8 .7 5
8 .5 0
0 .6 5
A
7 .6 2
14
8
B
5 .6 0
4 .0 0
3 .8 0
6 .0 0
P IN O N E
IN D IC A T O R
1
1 .7 0
7
0 .5 1
0 .3 5
1 .2 7
0 .2 5
(0 .3 3 )
1 .7 5 M A X
1 .5 0
1 .2 5
1 .2 7
L A N D P A T T E R N R E C O M M E N D A T IO N
M
C B A
S E E D E T A IL A
0 .2 5
0 .1 0
0 .2 5
0 .1 9
C
0 .1 0 C
N O T E S : U N LE S S O T H E R W IS E S P E C IF IE D
R 0 .1 0
A ) T H IS P A C K A G E C O N F O R M S T O JE D E C
M S -0 1 2 , V A R IA T IO N A B , IS S U E C ,
B ) A L L D IM E N S IO N S A R E IN M ILLIM E T E R S .
C ) D IM E N S IO N S D O N O T IN C LU D E M O L D
G AG E PLANE
FLASH O R BU R R S.
D ) LA N D P A T T E R N S T A N D A R D :
S O IC 1 2 7 P 6 0 0 X 1 4 5 -1 4 M
0 .3 6
E ) D R A W IN G C O N F O R M S T O A S M E Y 14.5M -1994
F ) D R A W IN G F IL E N A M E : M 14A R E V 13
0 .5 0
0 .2 5 X 4 5 °
R 0 .1 0
8°
0°
0 .9 0
0 .5 0
(1 .0 4 )
S E A T IN G P L A N E
D E T A IL A
S C A L E : 2 0 :1
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package Number M14A
5
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Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
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6
0 .6 5
0 .4 3 T Y P
1 .6 5
6 .1 0
0 .4 5
12 .00°T O P
& BOTTOM
R 0.09 m in
A . C O N F O R M S T O JE D E C R E G IS T R A T IO N M O -15 3,
V A R IA T IO N A B , R E F N O T E 6
B . D IM E N S IO N S A R E IN M ILL IM E T E R S
C . D IM E N S IO N S A R E E X C LU S IV E O F B U R R S , M O LD F LA S H ,
A N D T IE B A R E X T R U S IO N S
D . D IM E N S IO N IN G A N D T O L E R A N C E S P E R A N S I
Y 14.5M , 1982
E . LA N D P A T T E R N S T A N D A R D : S O P 6 5P 640X 110-14M
F . D R A W IN G F ILE N A M E : M T C 14 R E V 6
1.00
R 0 .0 9m in
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
7
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14
1 9 .5 6
1 8 .8 0
8
6 .6 0
6 .0 9
1
7
(1 .7 4 )
8 .1 2
7 .6 2
1 .7 7
1 .1 4
3 .5 6
3 .3 0
0 .3 5
0 .2 0
5 .3 3 M A X
0 .3 8 M IN
3 .8 1
3 .1 7
0 .5 8
0 .3 5
8 .8 2
2 .5 4
N O T E S : U N LE S S O T H E R W IS E S P E C IF IE D
T H IS P A C K A G E C O N F O R M S T O
A ) JE D E C M S -001 V A R IA T IO N B A
B ) A L L D IM E N S IO N S A R E IN M ILLIM E T E R S .
D IM E N S IO N S A R E E X C L U S IV E O F B U R R S ,
C ) M O LD F LA S H , A N D T IE B A R E X T R U S IO N S .
D ) D IM E N S IO N S A N D T O LE R A N C E S P E R
A S M E Y 14.5-1994
E ) D R A W IN G F ILE N A M E : M K T -N 14 A R E V 7
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N14A
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8
9
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