CY7C1021D 1-Mbit (64 K × 16) Static RAM 1-Mbit (64 K × 16) Static RAM Features Functional Description ■ Temperature Ranges: ❐ Industrial: –40 °C to 85 °C ❐ Automotive-A: –40 °C to 85 °C The CY7C1021D is a high performance CMOS static RAM organized as 65,536 words by 16 bits. This device has an automatic power down feature that significantly reduces power consumption when deselected. The input and output pins (IO0 through IO15) are placed in a high impedance state when the device is deselected (CE HIGH), outputs are disabled (OE HIGH), BHE and BLE are disabled (BHE, BLE HIGH), or during a write operation (CE LOW and WE LOW). ■ Pin and Function Compatible with CY7C1021B ■ High Speed ❐ tAA = 10 ns ■ Low Active Power ❐ ICC = 80 mA at 10 ns ■ Low CMOS Standby Power ❐ ISB2 = 3 mA ■ 2.0 V Data Retention ■ Automatic Power Down when Deselected ■ CMOS for Optimum Speed and Power ■ Independent Control of Upper and Lower Bits ■ Available in Pb-free 44-pin 400-Mil Wide Molded SOJ and 44-pin TSOP II Packages Write to the device by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (IO0 through IO7), is written into the location specified on the address pins (A0 through A15). If Byte High Enable (BHE) is LOW, then data from I/O pins (IO8 through IO15) is written into the location specified on the address pins (A0 through A15). Read from the device by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins appears on IO0 to IO7. If Byte High Enable (BHE) is LOW, then data from memory appears on IO8 to IO15. See the Truth Table on page 10 for a complete description of read and write modes. Logic Block Diagram 64K x 16 RAM Array SENSE AMPS A7 A6 A5 A4 A3 A2 A1 A0 ROW DECODER DATA IN DRIVERS IO0–IO7 IO8–IO15 COLUMN DECODER A8 A9 A10 A11 A12 A13 A14 A15 BHE WE CE OE BLE Cypress Semiconductor Corporation Document Number: 38-05462 Rev. *K • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised March 6, 2012 CY7C1021D Contents Pin Configuration ............................................................. 3 Selection Guide ................................................................ 3 Maximum Ratings ............................................................. 4 Operating Range ............................................................... 4 Electrical Characteristics ................................................. 4 Capacitance ...................................................................... 5 Thermal Resistance .......................................................... 5 AC Test Loads and Waveforms ....................................... 5 Switching Characteristics ................................................ 6 Data Retention Characteristics ....................................... 7 Data Retention Waveform ................................................ 7 Switching Waveforms ...................................................... 7 Document Number: 38-05462 Rev. *K Truth Table ...................................................................... 10 Ordering Information ...................................................... 11 Ordering Code Definitions ......................................... 11 Package Diagrams .......................................................... 12 Acronyms ........................................................................ 14 Document Conventions ................................................. 14 Units of Measure ....................................................... 14 Document History Page ................................................. 15 Sales, Solutions, and Legal Information ...................... 16 Worldwide Sales and Design Support ....................... 16 Products .................................................................... 16 PSoC Solutions ......................................................... 16 Page 2 of 16 CY7C1021D Pin Configuration Figure 1. 44-pin SOJ / 44-pin TSOP II (Top View) [1] A4 A3 A2 A1 A0 CE IO0 IO1 IO2 IO3 VCC VSS IO4 IO5 IO6 IO7 WE A15 A14 A13 A12 NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 A5 A6 A7 OE BHE BLE IO15 IO14 IO13 IO12 VSS VCC IO11 IO10 IO9 IO8 NC A8 A9 A10 A11 NC Selection Guide -10 (Industrial / Automotive-A) Unit Maximum Access Time 10 ns Maximum Operating Current 80 mA Maximum CMOS Standby Current 3 mA Description Note 1. NC pins are not connected on the die. Document Number: 38-05462 Rev. *K Page 3 of 16 CY7C1021D DC Input Voltage [2] ............................ –0.5 V to VCC + 0.5 V Maximum Ratings Current into Outputs (LOW) ........................................ 20 mA Exceeding the maximum ratings may impair the useful life of the device. These user guidelines are not tested. Static Discharge Voltage (per MIL-STD-883, Method 3015) .......................... > 2001 V Storage Temperature ............................... –65 C to +150 C Latch Up Current ................................................... > 200 mA Ambient Temperature with Power Applied ......................................... –55 C to +125 C Operating Range Supply Voltage on VCC to Relative GND[2] ................................–0.5 V to +6.0 V Range DC Voltage Applied to Outputs in High Z State [2] ................................ –0.5 V to VCC + 0.5 V Industrial Ambient Temperature VCC Speed –40 C to +85 C 5 V 10% 10 ns Automotive-A Electrical Characteristics Over the Operating Range Parameter Description -10 (Industrial / Automotive-A) Test Conditions Unit Min Max 2.4 – V – 0.4 V VOH Output HIGH Voltage IOH = –4.0 mA VOL Output LOW Voltage IOL = 8.0 mA VIH Input HIGH Voltage 2.2 VCC + 0.5 V V VIL Input LOW Voltage [2] 0.5 0.8 V IIX Input Leakage Current GND < VI < VCC 1 +1 A IOZ Output Leakage Current GND < VI < VCC, Output Disabled 1 +1 A ICC VCC Operating Supply Current VCC = Max, IOUT = 0 mA, f = fmax = 1/tRC 100 MHz – 80 mA 83 MHz – 72 mA 66 MHz – 58 mA 40 MHz – 37 mA ISB1 Automatic CE Power Down Current –TTL Inputs Max VCC, CE > VIH, VIN > VIH or VIN < VIL, f = fmax – 10 mA ISB2 Automatic CE Power Down Current – CMOS Inputs Max VCC, CE > VCC – 0.3 V, VIN > VCC – 0.3 V, or VIN < 0.3 V, f = 0 – 3 mA Note 2. VIL (min) = –2.0 V and VIH(max) = VCC + 1 V for pulse durations of less than 5 ns. Document Number: 38-05462 Rev. *K Page 4 of 16 CY7C1021D Capacitance Parameter [3] Description CIN Input capacitance COUT Output capacitance Test Conditions Max TA = 25C, f = 1 MHz, VCC = 5.0 V Unit 8 pF 8 pF Thermal Resistance Parameter [3] Description JA Thermal resistance (junction to ambient) JC Thermal resistance (junction to case) Test Conditions 44-pin SOJ 44-pin TSOP II Unit Still Air, soldered on a 3 × 4.5 inch, four-layer printed circuit board 59.52 53.91 C/W 36.75 21.24 C/W AC Test Loads and Waveforms Figure 2. AC Test Loads and Waveforms [4] ALL INPUT PULSES 3.0 V Z = 50 90% OUTPUT 50 * CAPACITIVE LOAD CONSISTS OF ALL COMPONENTS OF THE TEST ENVIRONMENT 30 pF* 90% 10% 10% GND 1.5 V Rise Time: 3 ns (a) (b) Fall Time: 3 ns High-Z characteristics: R1 480 5V OUTPUT INCLUDING JIG AND SCOPE R2 255 5 pF (c) Notes 3. Tested initially and after any design or process changes that may affect these parameters. 4. AC characteristics (except High Z) are tested using the load conditions shown in Figure 2 (a). High Z characteristics are tested for all speeds using the test load shown in Figure 2 (c). Document Number: 38-05462 Rev. *K Page 5 of 16 CY7C1021D Switching Characteristics Over the Operating Range Parameter [5] Description -10 (Industrial / Automotive-A) Min Max Unit Read Cycle tpower [6] VCC(typical) to the first access 100 – s tRC Read Cycle Time 10 – ns tAA Address to Data Valid – 10 ns tOHA Data Hold from Address Change 3 – ns tACE CE LOW to Data Valid – 10 ns tDOE OE LOW to Data Valid – 5 ns tLZOE OE LOW to Low Z [7] 0 – ns – 5 ns 3 – ns – 5 ns OE HIGH to High Z tHZOE tLZCE CE LOW to Low Z [7, 8] [7] [7, 8] tHZCE CE HIGH to High Z tPU CE LOW to Power-Up 0 – ns tPD CE HIGH to Power-Down – 10 ns tDBE Byte Enable to Data Valid – 5 ns tLZBE Byte Enable to Low Z 0 – ns Byte Disable to High Z – 5 ns tWC Write Cycle Time 10 – ns tSCE CE LOW to Write End 7 – ns tAW Address Setup to Write End 7 – ns tHA Address Hold from Write End 0 – ns tSA Address Setup to Write Start 0 – ns tPWE WE Pulse Width 7 – ns tSD Data Setup to Write End 6 – ns tHD Data Hold from Write End tHZBE Write Cycle [9] 0 – ns WE HIGH to Low Z [7] 3 – ns tHZWE WE LOW to High Z [7, 8] – 5 ns tBW Byte Enable to End of Write 7 – ns tLZWE Notes 5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 to 3.0 V, and output loading of the specified IOL/IOH and 30-pF load capacitance. 6. tPOWER gives the minimum amount of time that the power supply should be at typical VCC values until the first memory access can be performed. 7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 8. tHZOE, tHZBE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in (c) of Figure 2 on page 5. Transition is measured when the outputs enter a high impedance state. 9. The internal write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE/BLE LOW. CE, WE and BHE/BLE must be LOW to initiate a write, and the transition of these signals can terminate the write. The input data setup and hold timing should be referenced to the leading edge of the signal that terminates the write. Document Number: 38-05462 Rev. *K Page 6 of 16 CY7C1021D Data Retention Characteristics Over the Operating Range Parameter Description Conditions VDR VCC for Data Retention ICCDR Data Retention Current tCDR [10] Chip Deselect to Data Retention Time tR [11] VCC = VDR = 2.0 V, CE > VCC – 0.3 V, VIN > VCC – 0.3 V or VIN < 0.3 V Operation Recovery Time Min Max Unit 2.0 – V – 3 mA 0 – ns tRC – ns Data Retention Waveform DATA RETENTION MODE 4.5 V VCC VDR > 2 V 4.5 V tR tCDR CE Switching Waveforms Figure 3. Read Cycle No. 1 (Address Transition Controlled) [12, 13] tRC RC ADDRESS tOHA DATA OUT tAA PREVIOUS DATA VALID DATA VALID Notes 10. VIL (min) = –2.0 V and VIH(max) = VCC + 1 V for pulse durations of less than 5 ns. 11. Full device operation requires linear VCC ramp from VDR to VCC(min) > 50 s or stable at VCC(min) > 50 s. 12. Device is continuously selected. OE, CE, BHE and/or BLE = VIL. 13. WE is HIGH for read cycle. Document Number: 38-05462 Rev. *K Page 7 of 16 CY7C1021D Switching Waveforms (continued) Figure 4. Read Cycle No. 2 (OE Controlled) [14, 15] ADDRESS tRC CE tACE OE tHZOE tDOE tLZOE BHE, BLE tHZCE tDBE tLZBE DATA OUT HIGH IMPEDANCE tLZCE VCC SUPPLY CURRENT tHZBE DATA VALID HIGH IMPEDANCE tPD tPU 50% 50% ICC ISB Notes 14. WE is HIGH for read cycle. 15. Address valid prior to or coincident with CE transition LOW. Document Number: 38-05462 Rev. *K Page 8 of 16 CY7C1021D Switching Waveforms (continued) Figure 5. Write Cycle No. 1 (CE Controlled) [16, 17] tWC ADDRESS tSA tSCE CE tAW tHA tPWE WE tBW BHE, BLE tSD tHD DATA I/O Figure 6. Write Cycle No. 2 (BLE or BHE Controlled) tWC ADDRESS BHE, BLE tSA tBW tAW tHA tPWE WE tSCE CE tSD tHD DATA I/O Notes 16. Data I/O is high impedance if OE or BHE and/or BLE = VIH. 17. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high impedance state. Document Number: 38-05462 Rev. *K Page 9 of 16 CY7C1021D Switching Waveforms (continued) Figure 7. Write Cycle No. 3 (WE Controlled, OE LOW) tWC ADDRESS tSCE CE tAW tHA tSA tPWE WE tBW BHE, BLE tHZWE tSD tHD DATA I/O tLZWE Truth Table CE OE WE BLE BHE IO0–IO7 IO8–IO15 H X X X X High Z High Z L L H L L Data Out Data Out L H Data Out H L L L X L Mode Power Power Down Standby (ISB) Read – All bits Active (ICC) High Z Read – Lower bits only Active (ICC) High Z Data Out Read – Upper bits only Active (ICC) L Data In Data In Write – All bits Active (ICC) L H Data In High Z Write – Lower bits only Active (ICC) H L High Z Data In Write – Upper bits only Active (ICC) L H H X X High Z High Z Selected, Outputs Disabled Active (ICC) L X X H H High Z High Z Selected, Outputs Disabled Active (ICC) Document Number: 38-05462 Rev. *K Page 10 of 16 CY7C1021D Ordering Information Speed (ns) 10 Package Diagram Ordering Code Package Type CY7C1021D-10VXI 51-85082 44-pin (400-Mil) Molded SOJ (Pb-free) CY7C1021D-10ZSXI 51-85087 44-pin TSOP Type II (Pb-free) CY7C1021D-10ZSXA Operating Range Industrial Automotive-A Shaded areas contain advance information. Contact your local Cypress sales representative for availability of these parts. Ordering Code Definitions CY 7 C 1 02 1 D - 10 XX X X Temperature Range: X = I or A I = Industrial; A = Automotive-A Pb-free Package Type: XX = V or ZS V = 44-pin Molded SOJ ZS = 44-pin TSOP Type II Speed: 10 ns D = C9, 90 nm Technology 1 = Data width × 16-bits 02 = 1-Mbit density 1 = Fast Asynchronous SRAM family Technology Code: C = CMOS Marketing Code: 7 = SRAM Company ID: CY = Cypress Document Number: 38-05462 Rev. *K Page 11 of 16 CY7C1021D Package Diagrams Figure 8. 44-pin SOJ (400 Mils) V44.4 Package Outline, 51-85082 51-85082 *D Document Number: 38-05462 Rev. *K Page 12 of 16 CY7C1021D Package Diagrams (continued) Figure 9. 44-pin TSOP Z44-II Package Outline, 51-85087 51-85087 *D Document Number: 38-05462 Rev. *K Page 13 of 16 CY7C1021D Acronyms Acronym Document Conventions Description Units of Measure CE chip enable CMOS complementary metal oxide semiconductor °C degree Celsius I/O input/output MHz megahertz OE output enable µA microampere SOJ small outline J-lead µs microsecond SRAM static random access memory mA milliampere TSOP thin small outline package mm millimeter TTL transistor-transistor logic ms millisecond WE write enable ns nanosecond ohm % percent pF picofarad V volt W watt Document Number: 38-05462 Rev. *K Symbol Unit of Measure Page 14 of 16 CY7C1021D Document History Page Document Title: CY7C1021D, 1-Mbit (64 K × 16) Static RAM Document Number: 38-05462 Rev. ECN No. Orig. of Change Submission Date Description of Change ** 201560 SWI See ECN Advance Information data sheet for C9 IPP *A 233695 RKF See ECN DC parameters modified as per EROS (Spec # 01-02165) Pb-free Offering in the Ordering Information *B 263769 RKF See ECN Added Data Retention Characteristics Table Added Tpower Spec in Switching Characteristics Table Shaded Ordering Information *C 307601 RKF See ECN Reduced Speed bins to –10 and –12 ns *D 520647 VKN See ECN Changed status from Preliminary to Final. Removed Commercial Operating range Added ICC values for the frequencies 83MHz, 66MHz and 40MHz Updated Thermal Resistance table Added Automotive Product Information Updated Ordering Information Table Changed Overshoot spec from VCC+2V to VCC+1V in footnote #4 *E 802877 VKN See ECN Changed Commercial operating range ICC spec from 60 mA to 80 mA for 100MHz, 55 mA to 72 mA for 83MHz, 45 mA to 58 mA for 66MHz, 30 mA to 37 mA for 40MHz Changed Automotive operating range ICC spec from 100 mA to 120 mA for 83MHz, 90 mA to 100 mA for 66MHz, 60 mA to 63 mA for 40MHz *F 2751755 VKN / PYRS 08/14/09 For 12 ns speed, changed ICC spec from 120 mA to 90 mA For 12 ns speed, changed ISB1 spec from 50 mA to 10 mA and ISB2 spec from 15 mA to 10 mA *G 2898399 AJU 03/24/2010 Updated Package Diagrams. *H 3109897 AJU 12/14/2010 Added Ordering Code Definitions. *I 3245199 PRAS 04/30/2011 Dislodged Automotive information to new datasheet (001-68372). Removed the Note “Automotive Product Information is Preliminary.” in page 3. Added Acronyms and Units of Measure. Updated in new template. *J 3086499 AJU 06/07/2011 Updated Functional Description (Removed “For best practice recommendations, refer to the Cypress application note AN1064, SRAM System Guidelines.”). *K 3540685 TAVA / AJU 03/06/2012 Updated Features (Included Automotive-A Range information). Updated Selection Guide (Included Automotive-A Range information). Updated Operating Range (Included Automotive-A Range information). Updated Electrical Characteristics (Included Automotive-A Range information). Updated Switching Characteristics (Included Automotive-A Range information). Updated Ordering Information (included the part number CY7C1021D-10ZSXA). Updated Package Diagrams. Document Number: 38-05462 Rev. *K Page 15 of 16 CY7C1021D Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at cypress.com/sales. Products Automotive Clocks & Buffers Interface Lighting & Power Control PSoC Solutions cypress.com/go/automotive cypress.com/go/clocks psoc.cypress.com/solutions cypress.com/go/interface PSoC 1 | PSoC 3 | PSoC 5 cypress.com/go/powerpsoc cypress.com/go/plc Memory Optical & Image Sensing cypress.com/go/memory cypress.com/go/image PSoC cypress.com/go/psoc Touch Sensing cypress.com/go/touch USB Controllers Wireless/RF cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2004-2012. The information contained herein is subject to change without notice. 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Document Number: 38-05462 Rev. *K Revised March 6, 2012 All products and company names mentioned in this document may be the trademarks of their respective holders. Page 16 of 16