ETC AF16GSSEL-10P

Version 2.0
ATP Industrial Grade SlimSATA Embedded Module Specification
ATP Industrial Grade SlimSATA Embedded Module
Version 2.0
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Version 2.0
ATP Industrial Grade SlimSATA Embedded Module Specification
Disclaimer
ATP Electronics Inc. shall not be liable for any errors or omissions that may appear in this document, and
disclaims responsibility for any consequences resulting from the use of the information set forth herein.
The information in this manual is subject to change without notice.
ATP general policy does not recommend the use of its products in life support applications where in a failure or
malfunction of the product may directly threaten life or injury.
All parts of the ATP documentation are protected by copyright law and all rights are reserved. This
documentation may not, in whole or in part, be copied, photocopied, reproduced, translated, or reduced to any
electronic medium or machine-readable form without prior consent, in writing, from ATP Corporation.
The information set forth in this document is considered to be “Proprietary” and “Confidential” property
owned by ATP.
Revision History
Date
th
Nov. 17 , 2011
Version
2.0
Changes compared to previous issue
- First release
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Table of Contents
1
INTRODUCTION ...................................................................................................... 5
1.1
1.2
2
Product Overview...................................................................................................... 5
Main Features ............................................................................................................ 5
PRODUCT SPECIFICATION ................................................................................. 6
2.1
2.2
2.3
2.4
Product Image ........................................................................................................... 6
Product Capacities..................................................................................................... 6
Block Diagram .......................................................................................................... 7
Performance .............................................................................................................. 8
2.4.1
IOPS ..................................................................................................................................... 8
2.4.2
Read/Write Performance ...................................................................................................... 8
2.5
Electriacal Characteristics ......................................................................................... 8
2.5.1
Supply Voltage ..................................................................................................................... 8
2.5.2
System Power Requirement .................................................................................................. 9
2.6
Environment Specifications ...................................................................................... 9
2.6.1
Temperature and Humidity ................................................................................................... 9
2.6.2
Vibration and Shock ............................................................................................................. 9
2.6.3
Altitude ................................................................................................................................. 9
2.7
2.8
2.9
3
MTBF ...................................................................................................................... 10
Write/Erase Endurance............................................................................................ 10
Certification ............................................................................................................ 11
SATA EMBEDDED MODULE PIN ASSIGNMENT .......................................... 12
3.1
3.2
4
Pin Location ............................................................................................................ 12
Pin Assignments ...................................................................................................... 13
COMMAND SETS ................................................................................................... 14
4.1
4.2
4.3
ATA Command Set ................................................................................................. 14
Identify Device Data ............................................................................................... 15
SMART Information ............................................................................................... 17
4.3.1
SMART subcommand sets ................................................................................................. 17
4.3.2
SMART Read Data (subcommand D0h) ............................................................................ 17
4.3.3
ATP SMART Tool ............................................................................................................. 19
5
MECHANICAL INFORMATION ......................................................................... 20
5.1
5.2
Physical Dimension Specifications ......................................................................... 20
Mechanical Form Factor ......................................................................................... 20
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1 Introduction
1.1 Product Overview
The ATP Industrial Grade SlimSATA Embedded Module is a high performance and high capacity mass
storage solution in Slim form factor. Utilizing SLC (Single Level Cell) NAND flash components
provides outstanding performance and proven reliability for products operating.
ATP Industrial Grade SlimSATA Embedded Module is perfect for in thin devices, especially
networking, thin clients and embedded appliance and also suit for industrial applications such as
transportation, industrial PC, healthcare, telecommunications, and other harsh environments where data
integrity and consistent performance is mission critical.
1.2 Main Features



Capacities: 2GB to 32GB
SLC NAND flash memory
Operating temperature: -40℃ to 85℃




Power consumption on idle mode is 0.4W/Operational mode is 1.3W
Maximum performance: Sequential read up to 112MB/s, sequential write up to 91MB/s
JEDEC standard: MO-297A (SlimSATA) compliant
Slim form factor for design in thin devices, especially networking, thin clients and embedded
appliance.
Extensive application for storage
Standard 7 + 15 pin SATA interface as the SSD I/O, can be a small density SSD replacement
Compliant with Serial ATA Revision 2.6.
Support PIO mode 0~4, MDMA mode 0~2,UDMA mode 0~6
Compatible with SATA 1.5Gbps and SATA 3.0Gbps interface rates
SMART function support by ATA CMD
ATP SMART tool for Windows 2000/XP/Vista/7 and Linux.
Support TRIM command, Off-line TRIM utility available for Windows XP/2000/2003/Vista/7
Enhanced endurance by Global wear-leveling
Power Protector, data integrity protection during abnormal power outage.
Data integrity under power-cycling
RoHS compliant
CE, FCC certification













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2 Product Specification
2.1 Product Image
2.2 Product Capacities
Table 2-1
ATP P/N
ATP EXTERNAL P/N
CAPACITY
AF2GSSEL-10P
AF4GSSEL-10P
AF8GSSEL-10P
AF16GSSEL-10P
AF32GSSEL-10P
AF2GSSEL-BABXP
AF4GSSEL-BABXP
AF8GSSEL-BABXP
AF16GSSEL-BABXP
AF32GSSEL-BAAXP
2GB
4GB
8GB
16GB
32GB
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2.3 Block Diagram
ATP Industrial Grade SlimSATA Embedded Module consists of below functional blocks.
advanced architecture is optimized to provide highest data reliability and transfer performance.
The
Figure 2
ATP SATA Embedded Module
SATA II
controller
SATA
Host
Device
High
Performance
Processor
Core
SRAM
ECC Engine
ROM
Flash
Controller
Voltage
Regulator (5V to
3.3V/ 1.8V)
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SLC
NAND Flash
Memory
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ATP Industrial Grade SlimSATA Embedded Module Specification
Performance
2.3.1 IOPS
Table 2-2
Type
Value
Random Read IOPS2
4KB Random Read: 2,250 IOPS
Notes: IOPS: Input/Output Operations per Second
2.3.2 Read/Write Performance
Table 2-3
Type
Value
Host Interface Speed
SATA 1.5Gb/s and SATA 3.0 Gb/s
Sequential Read: up to 112MB/s
Sequential Write: up to 91MB/s
Data Transfer Rate1
Notes: The performance may vary according to different product capacity.
2.4 Electrical Characteristics
2.4.1 Supply Voltage
Table 2-4
Parameter
Supply voltage
Symbol
Min
Typ
Max
Unit
VCC
4.75
5.0
5.25
V
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Remark
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2.4.2
ATP Industrial Grade SlimSATA Embedded Module Specification
System Power Requirement
Table 2-5
Parameter
Symbol
Min
Typ
Max
Unit
Remark
PW
PR
PS
-
1.30
1.00
0.40
-
W
W
W
RMS value
RMS value
RMS value
Sustained write power
Sustained read power
Idle power
2.5 Environment Specifications
2.5.1 Temperature and Humidity
Table 2-6
Type
Temperature
Humidity
Value
Operating
Non-Operating
Operating
Non-Operating
-40℃ to 85℃
-45oC to 85oC
25oC,8% to 95%, noncondensing
40oC,8% to 93%, noncondensing
2.5.2 Vibration and Shock
Table 2-7
Type
Vibration
Shock
Value
Operating
Operating
sine 16.4G, 10~2000Hz
Half sine 1500G/0.5ms
2.5.3 Altitude
Table 2-8
Type
Altitude
Value
Operating
Non-Operating
80,000 feet Max.
80,000 feet Max.
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2.6 MTBF
Table 2-9
Type
MTBF (@ 25oC) 1
Value
2GB: 1,090,000 hours
4GB: 1,080,000 hours
8GB: 1,060,000 hours
16GB: 1,030,000 hours
32GB: 1,000,000 hours
Notes:
The Mean Time Between Failures (MTBF) is calculated using a prediction methodology, Telcordia SR-332, which
based on reliability data of the individual components in the SlimSATA embedded module. It assumes nominal voltage, with
all other parameters within specified range.
2.7 Write/Erase Endurance
Table 2-10
Type
Endurance Technology
SlimSATA Endurance
Value
Enhanced Global Wear Leveling algorithm
SLC flash block: 100,000 program/erase cycles
2GB:
80 terabyte random write
4GB:
160 terabyte random write
8GB:
320 terabyte random write
16GB: 640 terabyte random write
32GB: 1,280 terabyte random write
Note:
Endurance for the SlimSATA can be predicted based on the usage conditions applied to the device, the internal NAND
component cycles, the write amplification factor, and the wear leveling efficiency of the drive.
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2.8 Certification
Table 2-11
Mark/Approval
Documentation
Compliant
The CE marking (also known as CE mark) is a mandatory conformance mark on many
products placed on the single market in the European Economic Area (EEA). The CE
marking certifies that a product has met EU consumer safety, health or environmental
requirements. CE stands for Conformité Européenne, "European conformity" in French.
Yes
FCC Part 15 Class B was used for Evolution of United States (US) Emission Standards for
Commercial Electronic Products, The United States (US) covers all types of unintentional
radiators under Subparts A and B (Sections 15.1 through 15.199) of FCC 47 CFR Part 15,
usually called just FCC Part 15
Yes
RoHS is the acronym for Restriction of Hazardous Substances. RoHS, also known as
Directive 2002/95/EC, originated in the European Union and restricts the use of specific
hazardous materials found in electrical and electronic products. All applicable products in
the EU market after July 1, 2006 must pass RoHS compliance. For the complete directive,
see Directive 2002/95/EC of the European Parliament.
Yes
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3 SATA Embedded Module Pin Assignment
3.1 Pin Location
The following figure shows the pin location of the SlimSATA embedded module, the connector is
with both signal and power segments
Figure 3
P15
Power
Segment
P1 Signal
S7 Segment
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3.2 Pin Assignments
There are total of 7 pins in the signal segment and 15 pins in the power segment. The pin
definitions are shown in Table 3-1
Table 3-1
Group
Signal
Segment
Pin No.
1
Function
Description
Ground
S1
GND
S2
A+
S3
A-
S4
GND
Differential signal pair A
Ground
S5
B-
S6
B+
S7
GND
P1
NC/V33
3.3V power (Not used)
P2
NC/V33
3.3V power (Not used)
P3
NC/V33
3.3V power (Not used)
P4
GND
Ground
P5
GND
Ground
P6
GND
Ground
P7
V5
5V power, pre-charge
P8
V5
5V power
P9
V5
5V power
P10
GND
Ground
P11
DAS
Device Activity Signal
Differential signal pair B
Ground
Key & Spacing
Power
Segment
P12
GND
Ground
P13
NC/V12
12V power (Not used)
P14
NC/V12
12V power (Not used)
P15
NC/V12
12V power (Not used)
Notes:
1. All pins are in a single row, with a 1.27 mm (0.050”) pitch.
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4 Command Sets
4.1 ATA Command Set
ATP SlimSATA Embedded module support the commands show in the following table
Table 4-1
Command
Code
Protocol
Execute Drive Diagnostic
90h
Device diagnostic
Flush Cache
E7h
Non-data
Identify Device
ECh
PIO data-in
Read DMA
C8h
DMA
Read Multiple
C4h
PIO data-in
Read Sector(s)
20h
PIO data-in
Read Verify Sector(s)
40h or 41h
Non-data
Set Feature
EFh
Non-data
Set Multiple Mode
C6h
Non-data
Write DMA
CAh
DMA
Write Multiple
C5h
PIO data-out
Write Sector(s)
30h
PIO data-out
NOP
00h
Non-data
Read Buffer
E4h
PIO data-in
Write Buffer
E8h
PIO data-out
Check Power Mode
E5h or 98h
Non-data
Idle
E3h or 97h
Non-data
Idle Immediate
E1h or 95h
Non-data
Sleep
E6h or 99h
Non-data
Standby
E2h or 96h
Non-data
Standby Immediate
E0h or 94h
Non-data
Security Set Password
F1h
PIO data-out
Security Unlock
F2h
PIO data-out
Security Erase Prepare
F3h
Non-data
Security Erase Unit
F4h
PIO data-out
Security Freeze Lock
F5h
Non-data
Security Disable Password
F6h
PIO data-out
SMART Disable Operation
B0h
Non-data
SMART Enable/Disable Autosave
B0h
Non-data
SMART Enable Operations
B0h
Non-data
SMART Return Status
B0h
Non-data
SMART Execute Off-Line Immediate
B0h
Non-data
General Feature Set
Power Management Feature Set
Security Mode Feature Set
SMART Feature Set
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Command
Code
Protocol
SMART Read Data
B0h
PIO data-in
Read Native Max Address
F8h
Non-data
Set Max Address
F9h
Non-data
Host Protected Area Feature Set
Set Max Set Password
F9h
PIO data-out
Set Max Lock
F9h
Non-data
Set Max Freeze Lock
F9h
Non-data
Set Max Unlock
F9h
PIO data-out
4.2 Identify Device Data
Table 4-2
Word
Default Value Total
Address
Bytes
Data Field Type lnformation
0
044Ah
2
General Configuration
1
XXXXh
2
Default number of cylinders
2
0000h
2
Reserved
3
00XXh
2
Default number of heads
4
0000h
2
Obsolete
5
0240h
2
Obsolete
6
XXXXh
2
Default number of sectors per track
7-8
XXXXh
4
Number of sectors per card (Word 7 = MSW, Word 8 = LSW)
9
0000h
2
Obsolete
10-19
XXXXh
20
Serial number in ASCII (Right justified)
20
0002h
2
Obsolete
21
0002h
2
Obsolete
22
0000h
2
Obsolete
23-26
XXXXh
8
Firmware revision in ASCII. Big Endian Byte Order in Word
40
27-46
47
8001h
2
Model number in ASCII (Left justified) Big Endian Byte Order in
Word
Maximum number of sectors on Read/Write Multiple command
48
0000h
2
Reserved
49
XXXXh
0F00h
2
Capabilities
50
4000h
2
Capabilities
51
0200h
2
PIO data transfer cycle timing mode
52
0000h
2
Obsolete
53
0007h
2
Field validity
54
XXXXh
2
Current numbers of cylinders
55
XXXXh
2
Current numbers of heads
56
XXXXh
2
Current sectors per track
4
Current capacity in sectors (LBAs)
(Word57=LSW, Word58=MSW)
2
Multiple sector setting
57-58
XXXXh
59
0100h
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Word
Default Value
Address
Total
Bytes
60-61
Data Field Type lnformation
XXXXh
4
Total number of sectors addressable in LBA Mode
(Word60=LSW, Word61=MSW)
62
0000h
2
Reserved
63
0007h
2
Multiword DMA transfer
64
0003h
2
Advanced PIO modes supported
65
0078h
2
Minimum Multiword DMA transfer cycle time per word
66
0078h
2
Recommended Multiword DMA transfer cycle time
67
0078h
2
Minimum PIO transfer cycle time without flow control
68
0078h
2
Minimum PIO transfer cycle time with lORDY flow control
69~75
0000h
20
76
0060h
2
Reserved
Serial ATA capabilities
Support Serial ATA Gen1
Support Serial ATA Gen2
77~79
0000h
6
Reserved
80
0080h
2
Major version number (ATAPI-7)
81
0000h
2
Minor version number
82
742Bh
2
Command sets supported 0
83
5500h
2
Command sets supported 1
84
4002h
2
Command sets supported 2
85~87
XXXXh
6
Command set/feature enabled
88
007Fh
2
Ultra DMA supported and selected
89
0003h
2
Time required for Security erase unit completion
90
0000h
2
Time required for Enhanced security erase unit completion
91
0000h
2
Current Advanced power management value
92
FFFEh
2
Master Pasword Revision Code
93~127
0000h
70
Reserved
128
0001h
2
Security status
129~159
0000h
62
Vendor unique bytes
160
0000h
2
Power requirement description
161
0000h
2
Reserved
162
0000h
2
Key management schemes supported
163
0000h
2
CFA True lDE Timing Mode Capability and Setting
164
0000h
2
Reserved
165~175
0000h
22
Reserved
176~216
0000h
82
Reserved
217
0100h
2
Non-rotating media(SSD)
218~255
0000h
76
Reserved
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4.3 SMART Information
ATP Industrial Grade SlimSATA Embedded Module Support S.M.A.R.T. ATA feature set in IDE
mode, not support in RAID mode and AHCI mode.
4.3.1 SMART subcommand sets
In order to select a subcommand the host must write the subcommand code to the device's Features
Register before issuing the SMART Function Set command. The subcommands are listed below.
Table 4-3
Command
Command Code
SMART READ DATA
D0h
SMART SAVE ATTRIBUTE THRESHOLD
D1h
SMART ENABLE/DISABLE AUTOSAVE
D2h
SMART SAVE ATTRIBUTE VALUES
D3h
SMART EXECUTE OFF-LINE IMMIDIATE
D4h
RESERVED
D5h
RESERVED
D6h
SMART ENABLE OPERATIONS
D8h
SMART DISABLE OPERATIONS
D9h
SMART RETURN STATUS
DAh
Note:
If the reserved size is below a threshold, status can be read from the Cylinder Register using the Return
Status command (DAh)
4.3.2 SMART Read Data (subcommand D0h)
The following 512 bytes make up the device SMART data structure. Users can obtain the data using
the “Read Data” command (D0h).
Table 4-4
Byte
F/V
Description
0~1
X
Revision code
2~361
X
Vendor Specific
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362
Byte
ATP Industrial Grade SlimSATA Embedded Module Specification
V
Off-line data collection status
F/V
Description
363
X
Self-test execution status byte
364~365
V
Total time in seconds to complete off-line data collection activity
366
X
Vendor Specific
367
F
Off-line data collection capability
368~369
F
SMART capability
370
F
Error logging capability:7-1 Reserved
0 -1 = Device error logging supported
371
X
Vendor Specific
372
F
Short self-test routine recommended polling time(in minutes)
373
F
Extended self-test routine recommended polling time(in minutes)
374
F
Conveyance self-test routine recommended polling time(in minutes)
375~385
R
386~395
F
Firmware Version/Date Code
396~397
F
Number of initial invalid block (396=MSB, 397=LSB)
398~399
V
Number of run time bad block (398=MSB, 399=LSB)
400~406
F
SMI2242
407~415
X
Vendor specific
416
F
Reserved
417
F
Program/write the strong page only
418~419
V
Number of spare block
420
F
Reserved
421~423
V
Average erase count
424~425
V
Number of child pair
426~428
V
Maximum erase count
429~431
V
Minimum erase count
432~445
F
Reserved
446~510
X
Vendor specific
511
V
Data structure checksum
Reserved
Notes:
F=content (byte) is fixed and does not change
V=content (byte) is variable and maybe change depending on the state of the device or the command executed by the device
X= content (byte) is vendor specific and maybe fixed or variable
R=content (byte) is reserved and shall be zero
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4.3.3 ATP SMART Tool
ATP provides SMART Tool for Windows 2000/XP/Vista/7 and Linux, it can monitor the state of
SlimSATA Embedded Module, the following picture shows SMART tool operation. This tool
supports that users read spare and bad block information. Users can thus evaluate drive health at run
time and receive an early warning before the drive life ends.
Figure 4
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5 Mechanical Information
5.1 Physical Dimension Specifications
Table 5-1
Type
Embedded module
(Without housing)
Value
Length
Width
Thickness
54.0 mm +/- 0.15mm
39.0 mm +/- 0.15mm
4.0 mm +/- 0.15mm
5.2 Mechanical Form Factor (Units in mm)
Figure 5
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