BOURNS 2QSP16-TJ2

Models 2QSP-XX2 and 2NBS-XX2
are obsolete and not recommended
for new designs.
PL
IA
NT
Features
CO
M
■
*R
oH
S
■
■
■
■
Lead free
RoHS compliant*
Multiple resistors tied to a common node
Stable thin-film-on-silicon technology
Ultra-miniature packages to JEDEC
standards
Applications
■
■
■
Bus termination
Pull-up/pull-down
Ideal for space-constrained applications
Thin Film on Silicon 2QSP / 2NBS-XX2 Bussed Resistors
General Information
Package Schematic
Bussed Resistor networks are typically used in DC pull-up
and pull-down applications where system data or control lines
must be tied to a fixed potential. Fabricated with a Tantalum
Nitride and Nickel Chromium on Silicon process, these
resistors feature excellent stability, TCR and tracking
performance. Bussed Resistor Networks are available in a
range of miniature package types conforming to JEDEC
standards.
16
15
14
13
12
E
T
E
L
O
S
B
O
1
2
3
4
5
11
10
9
6
7
8
Electrical & Environmental Characteristics
Electrical Characteristics
Resistance Range
Tolerance:
Absolute
Ratio
TCR:
Absolute
Tracking
Operating Voltage
Symbol
Minimum
Maximum
Unit
R
100
Nominal
100 K
Ω
±0.5 %
±0.1 %
±5 %
±2 %
Ω
Ω
150
25
50
ppm/°C
ppm/°C
V
+125
+150
0.1
V
°C
°C
Watt
0.75
1.00
1.12
Watt
Watt
Watt
0.60
1.00
Watt
Watt
100
Environmental Characteristics
ESD
Operating Temperature
Storage Temperature
Power Rating per Resistor @ 70 °C
Power Rating per Package @ 70 °C:
QSOP:
16 Pin
20, 24 Pin
28 Pin
TJ
Tstg
NBSOIC: 8 Pin
14, 16 Pin
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
2K
-55
-65
Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors
Mechanical Characteristics
QSOP Package Dimensions
Narrow-Body SOIC Package Dimensions
A
.635
TYP.
(.025)
A
1.27
TYP.
(.050)
3.81 - 3.99
(.150 - .157)
3.81 - 3.99
(.150 - .157)
E
T
E
L
O
S
B
O
.21 - .31
(.008 - .012)
PIN 1
0.36 - 0.46
(.014 - .018)
PIN 1
1.35 - 1.75
(.053 - .069)
1.35 - 1.75
(.053 - .069)
.10 - .25
(.004 - .010)
.10 - .25
(.004 - .010)
0-8 °
.19 - .25
(.007 - .010)
0-8 °
5.80 - 6.20
(.228 - .244)
Model
2QSP16
2QSP20
2QSP24
2QSP28
4.80
8.56
8.56
9.80
-
5.80 - 6.20
(.228 - .244)
.41 - 1.27
(.016 - .050)
4.98
8.74
8.74
9.98
A
(.189
(.337
(.337
(.386
-
.196)
.344)
.344)
.393)
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
Model
2NBS08
2NBS14
2NBS16
.19 - .25
(.007 - .010)
.41 - 1.27
(.016 - .050)
A
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-012.
JEDEC Reference Number MO-137.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors
QSOP Package Power Temperature Derating Curve
1.0
.75
1.0
2QSP28
2QSP20, 2QSP24
WATTS
WATTS
1.25
Narrow-Body SOIC Package Power Temperature Derating Curve
2QSP16
.50
.6
2NBS08
.4
.2
.25
0
25
50
75
0
125
150
AMBIENT TEMPERATURE ( ° C )
100
25
50
75
100
125
150
AMBIENT TEMPERATURE ( ° C )
E
T
E
L
O
S
B
O
Standard Resistance Values
Schematic
R1
2NBS14, 2NBS16
.8
R2
R4
R6
R8
R10
R12
R14
R16
R18
R20
R22
R24
R26
R3
R5
R7
R9
R11
R13
R15
R17
R19
R21
R23
R25
R27
8 PIN
14 PIN
16 PIN
20 PIN
24 PIN
28 PIN
Typical Part Marking
Represents total content. Layout may vary.
PIN COUNT
MODEL
QSP16J
2-103
YYWW
CIRCUIT
PIN 1 INDICATOR
(MOLDED INDENT)
GRADE
RESISTANCE
CODE
DATE CODE
MANUFACTURER'S
TRADEMARK
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Resistance
(ohms)
100
120
220
Resistance
Code
101
121
221
270
330
390
271
331
391
470
510
680
471
511
681
1K
1.5 K
2K
102
152
202
2.2 K
2.7 K
3.3 K
222
272
332
4.7 K
5.1 K
10 K
472
512
103
20 K
27 K
47 K
203
273
473
51
75
82
100
K
K
K
K
513
753
823
104
Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors
Dispensing
For large quantities, the product will be dispensed in Tape and Reel (see diagram below).
A0
DIMENSIONS = MM (INCHES)
E
T
E
L
O
S
B
O
B0
Package
QSOP
16 Pin
20, 24 Pin
28 Pin
NBSOIC
8 Pin
14 Pin
16 Pin
How To Order
K0
No. of Pieces No. of Pieces
per 13 reel
per tube
A0
B0
K0
Width
Pitch
6.4 (0.252)
6.5 (0.256)
6.5 (0.256)
5.2 (0.205)
9.0 (0.354)
10.3 (0.406)
2.1 (0.083)
2.1 (0.083)
2.1 (0.083)
12 (0.472)
16 (0.630)
16 (0.630)
8 (0.315)
8 (0.315)
8 (0.315)
3,500
3,500
3,500
98
56
49
6.4 (0.252)
6.5 (0.256)
6.5 (0.256)
9.0 (0.354)
9.0 (0.354)
9.0 (0.354)
2.1 (0.083)
2.1 (0.083)
2.1 (0.083)
12 (0.472)
16 (0.630)
16 (0.630)
8 (0.315)
8 (0.315)
8 (0.315)
3,500
3,500
3,500
98
56
49
2 QSP 20 - T J 2 - 472 LF
Product Class
Thin-Film-on-Silicon
Standard Package Style
QSP = QSOP
NBS = Narrow-Body SOIC
Pin Count
QSP = 16, 20, 24, 28
NBS = 8, 14, 16
Dispensing
R = Reel
T = Tube
Standard Grade
Tolerance
J=
±5 %
G=
±2 %
F=
±1 %
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
Circuit
2 = Bussed
Resistance Value Code
1st two digits are significant,
3rd digit = number of zeros to follow to give resistance value in ohms.
Terminations
LF = 100 % Sn (lead free)
04/10
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.